CN104880437A - Semi-transparent dielectric material photo-thermal character measuring system and method - Google Patents
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Abstract
本发明公开了一种半透明介质材料光热特性测量系统与方法,所述测量系统由计算机、二维移动台、支架、小离轴抛物镜、准直镜、光纤、半导体激光器、大离轴抛物镜、电源线、激光器电源、HCT热探测器、BNC数据线、前置放大器、激光器控制线、锁相放大器、锁相放大器控制线、数据采集信号线构成,所述测量方法基于光热辐射测量原理,采用计算机控制函数发生器产生调制信号,信号控制激光器使其光强按调制规律变化,调制变化的激光照射到样件后由于存在光热效应,样件出现温度涨落与红外辐射,光热辐射信号与样件光热特性参数相关,信号被HCT热探测器接收,进而通过数学运算提取样件光热特性参数。本发明可以实现材料完全无损伤、非接触、高效测量。
The invention discloses a system and method for measuring photothermal characteristics of translucent medium materials. Parabolic mirror, power line, laser power supply, HCT thermal detector, BNC data line, preamplifier, laser control line, lock-in amplifier, lock-in amplifier control line, data acquisition signal line, the measurement method is based on photothermal radiation The measurement principle uses a computer-controlled function generator to generate a modulation signal, and the signal controls the laser so that the light intensity changes according to the modulation law. After the modulated and changed laser is irradiated on the sample, due to the photothermal effect, the sample has temperature fluctuations and infrared radiation. The thermal radiation signal is related to the photothermal characteristic parameters of the sample, and the signal is received by the HCT thermal detector, and then the photothermal characteristic parameters of the sample are extracted through mathematical operations. The invention can realize completely non-damage, non-contact and high-efficiency measurement of materials.
Description
技术领域 technical field
本发明涉及一种半透明介质材料光热特性测量系统与方法,适用于航空航天、微电子、薄层结构等领域的半透明介质材料光热特性测量。 The invention relates to a system and method for measuring the photothermal characteristics of translucent dielectric materials, which are suitable for measuring the photothermal characteristics of translucent dielectric materials in the fields of aerospace, microelectronics, and thin-layer structures.
背景技术 Background technique
材料的光热物理参数能定量客观的评价材料性能,一般情况下,材料光学特性与热学特性是采用不同的仪器分别进行测量,仪器造价昂贵且测量过程繁琐,同时在测量过程中易受到材料材质、尺寸等因素限制,从而限制了传统测量方法的使用范围。 The photothermal physical parameters of the material can quantitatively and objectively evaluate the material performance. Generally, the optical and thermal properties of the material are measured separately by different instruments. The instrument is expensive and the measurement process is cumbersome. , size and other factors limit the scope of use of traditional measurement methods.
半透明介质,诸如单晶金刚石、纤维薄膜等材料,由于具有良好的力学性能与热学性能被广泛用于工业各个领域。但是由于半透明介质尺寸及材质的特殊性使得传统的光热物理参数检测方法对于大多数半透明介质无法测量。 Translucent media, such as single crystal diamond, fiber film and other materials, are widely used in various fields of industry due to their good mechanical and thermal properties. However, due to the particularity of the size and material of translucent media, traditional photothermal physical parameter detection methods cannot measure most translucent media.
发明内容 Contents of the invention
本发明的目的在于克服现在技术的不足,提供一种半透明介质材料光热特性测量系统与方法。 The purpose of the present invention is to overcome the deficiencies of the current technology and provide a system and method for measuring the photothermal characteristics of translucent dielectric materials.
本发明的目的是通过以下技术方案实现的: The purpose of the present invention is achieved through the following technical solutions:
一种半透明介质材料光热特性测量系统,包括计算机、二维移动台、支架、小离轴抛物镜、准直镜、光纤、半导体激光器、大离轴抛物镜、电源线、激光器电源、HCT热探测器、BNC数据线、前置放大器、激光器控制线、锁相放大器、锁相放大器控制线、数据采集信号线,其中:计算机通过锁相放大器控制信号线与锁相放大器相连接,锁相放大器参考信号输出端通过激光器控制线与激光器电源连接,半导体激光器通过激光器电源控制线与激光器电源相连,半导体激光器通过光纤与准直镜相连,准直镜固定在小离轴抛物镜的中心孔中,小离轴抛物镜通过螺栓连接固定在支架上,二维移动台放置于小离轴抛物镜正下方,大离轴抛物镜与小离轴抛物镜相对平行放置,HCT热探测器放置于大离轴抛物镜焦点位置,前置放大器通过BNC数据线与HCT热探测器相连接,前置放大器通过信号线与锁相放大器相连接,锁相放大器输出信号端通过数据采集信号线与计算机相连接。 A system for measuring photothermal properties of translucent dielectric materials, including a computer, a two-dimensional mobile stage, a bracket, a small off-axis parabolic mirror, a collimating mirror, an optical fiber, a semiconductor laser, a large off-axis parabolic mirror, a power cord, a laser power supply, and HCT Thermal detector, BNC data line, preamplifier, laser control line, lock-in amplifier, lock-in amplifier control line, data acquisition signal line, among which: the computer is connected to the lock-in amplifier through the lock-in amplifier control signal line, and the lock-in amplifier The amplifier reference signal output terminal is connected to the laser power supply through the laser control line, the semiconductor laser is connected to the laser power supply through the laser power control line, the semiconductor laser is connected to the collimating mirror through the optical fiber, and the collimating mirror is fixed in the central hole of the small off-axis parabolic mirror , the small off-axis parabolic mirror is fixed on the bracket by bolt connection, the two-dimensional mobile stage is placed directly below the small off-axis parabolic mirror, the large off-axis parabolic mirror is placed relatively parallel to the small off-axis parabolic mirror, and the HCT thermal detector is placed on the large The focus position of the off-axis parabolic mirror, the preamplifier is connected to the HCT thermal detector through the BNC data line, the preamplifier is connected to the lock-in amplifier through the signal line, and the output signal end of the lock-in amplifier is connected to the computer through the data acquisition signal line .
一种半透明介质材料光热特性测量方法,基于光热辐射测量(Photothermal radiometry, PTR)原理,采用计算机控制函数发生器产生调制信号,信号控制激光器使其光强按调制规律变化,调制变化的激光照射到样件后由于存在光热效应,样件出现温度涨落与红外辐射,光热辐射信号与样件光热特性参数相关,信号被HCT热探测器接收,进而通过数学运算提取样件光热特性参数。具体实施步骤如下: A method for measuring photothermal properties of translucent media materials, based on the principle of photothermal radiometry (PTR), using a computer-controlled function generator to generate a modulation signal, the signal controls the laser to make the light intensity change according to the modulation law, and the modulation changes After the laser irradiates the sample, due to the photothermal effect, the sample has temperature fluctuations and infrared radiation. The photothermal radiation signal is related to the photothermal characteristic parameters of the sample. The signal is received by the HCT thermal detector, and then the sample light is extracted through mathematical operations. Thermal characteristic parameters. The specific implementation steps are as follows:
步骤(1):确定要测量的半透明介质材料; Step (1): Determine the translucent medium material to be measured;
步骤(2):开启半透明介质光热特性测量试验系统; Step (2): Start the test system for measuring the photothermal characteristics of translucent media;
步骤(3):半导体激光器开启后,将反光镜放置于小离轴抛物镜焦点上,以此调节HCT热探测器,使其处于大离轴抛物镜焦点上; Step (3): After the semiconductor laser is turned on, place the reflector on the focal point of the small off-axis parabolic mirror to adjust the HCT thermal detector so that it is on the focal point of the large off-axis parabolic mirror;
步骤(4):开启HCT热探测器,首先需使探测器制冷半小时后进行试验,以使其达到最好的探测效果; Step (4): To turn on the HCT thermal detector, the detector needs to be refrigerated for half an hour before testing to achieve the best detection effect;
步骤(5):将具有良好镜面反射的钢件放置于二维移动台上,移动二维移动台,使钢件处于小离轴抛物镜焦点上; Step (5): Place the steel piece with good specular reflection on the two-dimensional mobile platform, and move the two-dimensional mobile platform so that the steel piece is at the focus of the small off-axis parabolic mirror;
步骤(6):计算机控制软件设置频率扫描的起始频率、终止频率、扫描频率个数; Step (6): The computer control software sets the start frequency, stop frequency, and number of scan frequencies of the frequency scan;
步骤(7):计算机控制软件信号通过函数发生器输出,使其控制半导体激光器光强按调制规律变化,进行频率扫描试验; Step (7): The computer control software signal is output through the function generator, so that it can control the light intensity of the semiconductor laser to change according to the modulation law, and perform a frequency sweep test;
步骤(8):计算机控制软件自动记录不同频率下的钢件光热辐射信号,作为后续试验系统修正数据; Step (8): The computer control software automatically records the light and heat radiation signals of steel parts at different frequencies as the subsequent test system correction data;
步骤(9):测试完毕后,将半透明介质测试材料放置于小离轴抛物镜焦点上,重复步骤(5)、(6)、(7),直至测试完毕; Step (9): After the test is completed, place the translucent medium test material on the focal point of the small off-axis parabolic mirror, and repeat steps (5), (6), and (7) until the test is completed;
步骤(10):步骤(9)获取的试验数据通过步骤(8)的修正数据进行修正处理,修正过程为:步骤(8)获取的修正数据为了排除光强影响,将幅值进行归一化处理记为Am 1,相位值记为Ph 1,步骤(9)获取的试验样品的频域响应幅值及相位分别记为Am 2、Ph 2,则真实的试验样品频响信号(Am,Ph)为 Step (10): The test data obtained in step (9) is corrected by the corrected data in step (8). The correction process is: the corrected data obtained in step (8) is normalized in order to exclude the influence of light intensity The treatment is denoted as Am 1 , the phase value is denoted as Ph 1 , and the frequency domain response amplitude and phase of the test sample obtained in step (9) are denoted as Am 2 and Ph 2 respectively, then the real frequency response signal of the test sample ( Am,Ph )for
(1); (1);
(2)。 (2).
步骤(11):通过根据材料特性建立的热波数学模型对修正后的半透明介质材料光热辐射信号(幅频-相频)进行最小二乘法参数拟合,从而得到半透明介质材料光热特性参数。 Step (11): Through the thermal wave mathematical model established according to the material characteristics, the least square method parameter fitting is carried out on the corrected photothermal radiation signal (amplitude frequency-phase frequency) of the semitransparent medium material, so as to obtain the photothermal radiation signal of the semitransparent medium material Feature parameters.
本发明中,测试材料针对半透明介质材料。 In the present invention, the test material is for the translucent medium material.
本发明中,激光器波长根据材料吸收特性而定。 In the present invention, the wavelength of the laser is determined according to the absorption characteristics of the material.
本发明中,频率扫描范围根据材料材质及尺寸厚度而定。 In the present invention, the frequency scanning range is determined according to the material, size and thickness of the material.
本发明的优点在于: The advantages of the present invention are:
(1)本发明采用半透明介质材料光热特性测量方法可以实现材料完全无损伤、非接触、高效测量,同时不受半透明材料尺寸限制。 (1) The invention adopts the measurement method of photothermal characteristics of translucent medium materials, which can realize complete non-damage, non-contact and high-efficiency measurement of materials, and is not limited by the size of translucent materials.
(2)本发明采用半透明介质材料光热特性测量系统可以对材料光热特性实现一次性测量。 (2) The present invention adopts the photothermal characteristic measurement system of the translucent medium material to realize one-time measurement of the photothermal characteristic of the material.
附图说明 Description of drawings
图1为本发明所涉及的半透明介质材料光热特性测量系统的结构示意图。 FIG. 1 is a schematic structural diagram of a measurement system for photothermal characteristics of translucent dielectric materials involved in the present invention.
具体实施方式 Detailed ways
下面结合附图对本发明的技术方案作进一步的说明,但并不局限于此,凡是对本发明技术方案进行修改或者等同替换,而不脱离本发明技术方案的精神和范围,均应涵盖在本发明的保护范围中。 The technical solution of the present invention will be further described below in conjunction with the accompanying drawings, but it is not limited thereto. Any modification or equivalent replacement of the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention should be covered by the present invention. within the scope of protection.
如图1所示,本发明提供的半透明介质材料光热特性测量系统由计算机1、二维移动台2、支架3、小离轴抛物镜4、准直镜5、光纤6、半导体激光器7、大离轴抛物镜8、电源线9、激光器电源10、HCT热探测器(HgCdTe,响应波长2μm~14μm)11、BNC数据线12、前置放大器(响应频率10Hz~1MHz)13、激光器控制线14、信号线15、锁相放大器16(内置函数发生器)、锁相放大器控制线17、数据采集信号线18构成。计算机1通过锁相放大器控制信号线17与锁相放大器16相连接,锁相放大器16参考信号输出端通过激光器控制线14与激光器电源10连接,半导体激光器7通过激光器电源控制线与激光器电源10相连,半导体激光器7通过光纤6与准直镜5相连,准直镜5固定在小离轴抛物镜4的中心孔中,小离轴抛物镜4通过螺栓连接固定在支架3上,二维移动台2处于小离轴抛物镜4正下方,大离轴抛物镜8与小离轴抛物镜4轴线重合,HCT红外探测器11处于大离轴抛物镜8焦点位置,前置放大器13通过BNC数据线12与HCT热探测器11相连接,前置放大器13通过信号线15与锁相放大器16相连接,锁相放大器16输出信号端通过数据采集信号线18与计算机1相连接。 As shown in Figure 1, the system for measuring photothermal properties of translucent dielectric materials provided by the present invention consists of a computer 1, a two-dimensional mobile platform 2, a support 3, a small off-axis parabolic mirror 4, a collimating mirror 5, an optical fiber 6, and a semiconductor laser 7 , Large off-axis parabolic mirror 8, power line 9, laser power supply 10, HCT thermal detector (HgCdTe, response wavelength 2μm~14μm) 11, BNC data line 12, preamplifier (response frequency 10Hz~1MHz) 13, laser control Line 14, signal line 15, lock-in amplifier 16 (built-in function generator), lock-in amplifier control line 17, and data acquisition signal line 18. The computer 1 is connected to the lock-in amplifier 16 through the lock-in amplifier control signal line 17, the reference signal output end of the lock-in amplifier 16 is connected to the laser power supply 10 through the laser control line 14, and the semiconductor laser 7 is connected to the laser power supply 10 through the laser power supply control line , the semiconductor laser 7 is connected with the collimating mirror 5 through the optical fiber 6, and the collimating mirror 5 is fixed in the center hole of the small off-axis parabolic mirror 4, and the small off-axis parabolic mirror 4 is fixed on the support 3 through bolt connection, and the two-dimensional mobile stage 2 is directly below the small off-axis parabolic mirror 4, the axis of the large off-axis parabolic mirror 8 coincides with the axis of the small off-axis parabolic mirror 4, the HCT infrared detector 11 is at the focus position of the large off-axis parabolic mirror 8, and the preamplifier 13 passes through the BNC data line 12 is connected with the HCT thermal detector 11, the preamplifier 13 is connected with the lock-in amplifier 16 through the signal line 15, and the output signal end of the lock-in amplifier 16 is connected with the computer 1 through the data acquisition signal line 18.
具体实施方式中半透明介质材料以厚度为200μm、尺寸为1cm×1cm的多晶金刚石为例。 In the specific embodiment, the translucent dielectric material is polycrystalline diamond with a thickness of 200 μm and a size of 1 cm×1 cm as an example.
测量系统采用808nm半导体激光器7(激光功率32mW,光斑直径600μm);红外探测器为内置前置放大器的HCT探测器11(波兰Vigo公司,探测波段2μm~14μm,探测面积100μm×100μm);锁相放大器16为Stanford公司的SR830(响应频率0.01Hz~102KHz)。 The measurement system adopts 808nm semiconductor laser 7 (laser power 32mW, spot diameter 600μm); infrared detector is HCT detector 11 with built-in preamplifier (Poland Vigo Company, detection band 2μm~14μm, detection area 100μm×100μm); phase-locked The amplifier 16 is SR830 of Stanford Company (response frequency 0.01Hz~102KHz).
开启半透明介质光热特性测量试验系统,此时需包括计算机1、锁相放大器16、半导体激光器7及HCT热探测器11等设备的开启。首先需使HCT探测器11制冷半小时后进行试验,以使其达到最好的探测效果。将具有较高反光度的钢件(用于系统修正)放置于二维移动台2上,移动二维移动台2,使钢件处于小离轴抛物镜4焦点上;计算机控制软件设置频率扫描的起始频率、终止频率、扫描频率个数,此处扫描范围为100Hz~100KHz,扫描点数为30;计算机控制软件信号通过锁相放大器16内置函数发生器输出,使其控制半导体激光器7光强按调制规律变化,半导体激光器7通过准直镜5照射到修正钢件上,进行频率扫描试验;计算机控制软件自动记录不同频率下的钢件光热辐射信号,作为后续试验系统修正数据;测试完毕后,将多晶金刚石测试材料放置于小离轴抛物镜4焦点上,重复实施以上测试步骤,直至测试完毕;获取的试验数据通过测试钢件获取的修正数据进行修正处理;通过根据材料特性建立的热波数学模型对修正后的半透明介质材料光热辐射信号(幅频-相频)进行最小二乘法参数拟合,从而得到半透明介质材料光热特性参数,如表1所示。 To start the test system for measuring photothermal characteristics of translucent media, it is necessary to start the computer 1, lock-in amplifier 16, semiconductor laser 7, HCT thermal detector 11 and other equipment. First, the HCT detector 11 needs to be refrigerated for half an hour before testing, so as to achieve the best detection effect. Place the steel piece with high reflectivity (for system correction) on the two-dimensional mobile platform 2, move the two-dimensional mobile platform 2, so that the steel piece is at the focal point of the small off-axis parabolic mirror 4; the computer control software sets the frequency scan The number of start frequency, stop frequency, and scan frequency, the scan range here is 100Hz~100KHz, and the number of scan points is 30; the computer control software signal is output by the built-in function generator of the lock-in amplifier 16, so that it can control the light intensity of the semiconductor laser 7 According to the change of the modulation law, the semiconductor laser 7 is irradiated on the corrected steel piece through the collimating mirror 5, and the frequency scanning test is carried out; the computer control software automatically records the light and heat radiation signals of the steel piece at different frequencies, as the correction data of the subsequent test system; the test is completed Finally, the polycrystalline diamond test material is placed on the 4 focal points of the small off-axis parabolic mirror, and the above test steps are repeated until the test is completed; the obtained test data is corrected by the correction data obtained from the test steel piece; The thermal wave mathematical model of the modified translucent medium material photothermal radiation signal (amplitude frequency - phase frequency) is fitted with the least square method parameters, so as to obtain the semitransparent medium material photothermal characteristic parameters, as shown in Table 1.
表1 Table 1
至此,完成了对半透明介质材料的光热特性测量。 So far, the measurement of the photothermal characteristics of the translucent dielectric material has been completed.
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CN106568733A (en) * | 2016-10-26 | 2017-04-19 | 北京雪迪龙科技股份有限公司 | Infrared light source system, adjusting system and method based on closed-loop digital controller |
CN106989860A (en) * | 2017-05-22 | 2017-07-28 | 哈尔滨工业大学 | A kind of material internal stress measurement system and method based on light-heat radiation survey |
CN108362733A (en) * | 2018-02-11 | 2018-08-03 | 哈尔滨工业大学 | The trnaslucent materials Photothermal characterisation distribution measurement method being combined with optical chromatography based on locking phase heat wave |
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CN112556890A (en) * | 2020-12-14 | 2021-03-26 | 中国空气动力研究与发展中心超高速空气动力研究所 | High-frequency response heat flow sensor calibration device and calibration method |
CN112556890B (en) * | 2020-12-14 | 2025-03-18 | 中国空气动力研究与发展中心超高速空气动力研究所 | A high-frequency response thermal flow sensor calibration device and calibration method |
CN113218872A (en) * | 2021-04-08 | 2021-08-06 | 北华航天工业学院 | Method for simultaneously identifying multiple parameters of optical characteristics of high-temperature semitransparent material |
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