CN104835897B - Light-emitting device and method of manufacturing the same - Google Patents

Abstract

The invention discloses a light-emitting device and a manufacturing method thereof. The manufacturing method includes: providing a plurality of physically separated supports; providing a first light-emitting element and a second light-emitting element, respectively fixed on the support; and changing The relative positions of the first light-emitting element and the second light-emitting element are such that the first light-emitting element and the second light-emitting element are not substantially located on the same straight line.

Description

Light-emitting device and method of manufacturing the same

technical field

The present invention relates to a manufacturing method of a light-emitting device.

Background technique

Light-emitting diodes (LEDs) have good optoelectronic properties such as low energy consumption, low heat generation, long operating life, shock resistance, small size, fast response and stable output light wavelengths. Lighting Products. With the development of optoelectronic technology, solid-state lighting has made significant progress in lighting efficiency, operating life, and brightness. Therefore, light-emitting diodes have been used in general household lighting in recent years. At present, the cost of LED bulbs is still higher than that of traditional incandescent bulbs. How to reduce the manufacturing cost of LED bulbs is still an important issue.

SUMMARY OF THE INVENTION

Therefore, an object of the present invention is to provide a method for manufacturing a light-emitting device to solve the above problems.

In order to achieve the above objects, the present invention provides a method for manufacturing a light-emitting device, comprising: providing a plurality of physically separated supports; providing a first light-emitting element and a second light-emitting element, respectively fixed on the support; and The relative positions of the first light-emitting element and the second light-emitting element are changed so that the first light-emitting element and the second light-emitting element are not substantially located on the same straight line.

In order to make the above-mentioned and other objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below, and are described in detail as follows in conjunction with the accompanying drawings.

Description of drawings

1A-1D are a manufacturing flow chart of a light-emitting device according to the first embodiment of the present invention;

2A-2E are a manufacturing flow chart of a light-emitting device according to a second embodiment of the present invention;

2F is a schematic diagram of a light-emitting device in another embodiment of the present invention;

2G is a schematic diagram of a light-emitting device in another embodiment of the present invention;

3A-3B are cross-sectional views of a manufacturing process of a light-emitting element disposed between two extending brackets;

3C is a cross-sectional view of a light-emitting element disposed between two extending brackets in another embodiment of the present invention;

3D is a cross-sectional view of a light-emitting element disposed between two extending brackets in another embodiment of the present invention;

3E is a cross-sectional view of a light-emitting element disposed between two extending brackets in another embodiment of the present invention;

4A-4B are a manufacturing flow chart of a light-emitting device in a third embodiment of the present invention;

4C is a schematic diagram of a light-emitting device in the third embodiment of the present invention;

4D is a schematic diagram of a light-emitting device in another embodiment of the present invention;

4E is a schematic diagram of the light-emitting device of FIG. 4D being disposed in a light bulb;

5A is a schematic diagram of a light-emitting element being fixed on a carrier according to the fourth embodiment of the present invention;

5B is a schematic diagram of the light-emitting element being fixed on the carrier according to the fifth embodiment of the present invention;

5C is a schematic diagram of the light-emitting element being fixed on the carrier according to the sixth embodiment of the present invention;

5D is a schematic diagram of a light-emitting device in the sixth embodiment of the present invention;

6A is a schematic diagram of a light-emitting element being fixed on a carrier according to a seventh embodiment of the present invention;

6B is a schematic diagram of a light-emitting device in a seventh embodiment of the present invention;

FIG. 6C is a schematic diagram of the light-emitting device of FIG. 6B disposed in a light bulb;

6D is a schematic diagram of a circuit;

6E is a schematic diagram of another circuit;

FIG. 6F is a schematic diagram of the light-emitting element fixed on the carrier according to the eighth embodiment of the present invention;

6G is a schematic diagram of the light-emitting device of FIG. 6F being disposed in a light bulb;

7A-7B are partial cross-sectional views of a manufacturing process of a light-emitting device according to a ninth embodiment of the present invention;

FIG. 8 is a schematic diagram of the light-emitting element being fixed on the carrier according to the tenth embodiment of the present invention;

9A-9F are cross-sectional views of a manufacturing process of a light-emitting device according to an eleventh embodiment of the present invention;

9G is a schematic diagram of the light-emitting device being bonded to a base in the eleventh embodiment;

10A to 10C are top views of the metal layer;

11A-11D are cross-sectional views of a manufacturing process of a light-emitting device according to a twelfth embodiment of the present invention;

12A to 12C are cross-sectional views of the middle light emitting unit of the present invention.

Symbol Description

10, 21 Vehicles

100, 200, 300, 600, 700, 800, 900, 1000, 1100 light-emitting devices

101 Support bracket

102, 102A, 102B, 102C, 102D Extension Brackets

1021 First area

1022 Second area

1023 Holes

1025 Contact part

103 Attachment bracket

104 Intermediate bracket

11 The first light-emitting group

12 The second light-emitting group

111, 111A, 121, 121A Light-emitting unit

20, 20A, 20B, 20C, 20D, 20E, 20F light-emitting element

201, 7000 substrates

202 Lighting unit

2021, 7001 Type 1 semiconductor layer

2022, 7002 active layer

2023, 7003 Type II semiconductor layer

203 Electrode pad

204 Electrical connection structure

205 Insulation structure

221 Patterned seed layer

2211 First area

2212 Second area

2213 Third area

222 Patterned metal layer

222A, 222B metal layer

2221 First area

2222 Second area

2223 Third area

211 First Vehicle Department

2111 First surface

2112 Second surface

212 Second Vehicle Department

2121 Third surface

2122 Fourth surface

23 Conductive parts

30 The first cladding structure

301, 401 Protrusion

40 Second cladding structure

7004 The first conductive part

7005 Second conductive part

70041, 70051 Electrode Contact Surface

7006 Protective layer

7008 Pore

7015 Wire Construction

7024 The first enlarged electrode part

7025 Second enlarged electrode part

7026 The first transparent structure

7027 Second transparent structure

70241, 70251, 70061, 70062 Side

80 base

81 groove

90, 901 lamp housing

902, 91 Wire Holder

903 base

904, 92 Electrical connectors

Detailed ways

The following embodiments will illustrate the concept of the present invention with the accompanying drawings, in which similar or identical parts use the same reference numerals, and in the drawings, the shapes or thicknesses of elements may be enlarged or reduced. It should be noted that the elements not shown or described in the figures may be in the form known to those skilled in the art.

1A-1D show a manufacturing flow chart of a light-emitting device 100 according to the first embodiment of the present invention. Referring to FIG. 1A , a carrier 10 and a plurality of light-emitting elements 20 are provided. The carrier 10 includes a pair of support brackets 101 and a plurality of pairs of extension brackets 102, each pair of extension brackets 102 are arranged in parallel with each other and are physically connected to the support brackets 101. A plurality of light-emitting elements 20 are respectively placed and fixed on each pair of extension brackets 102 , and the light-emitting elements 20 have a width larger than that of the extension brackets 102 . Of course, according to the actual design application, the light emitting element 20 may have a width smaller than or equal to the extension bracket 102 . The extension bracket 102 serves as a support to support the light-emitting element 20 . Referring to FIG. 1B , a first cladding structure 30 is formed on the light emitting element 20 and part of the extending bracket 102 to completely cover and cover the light emitting element 20 . Part of the extending bracket 102 is not covered or covered by the first covering structure 30 and is exposed to the external environment (eg, air). Referring to FIG. 1C , a second cladding structure 40 is formed on the first cladding structure 30 and completely covers and wraps the first cladding structure 30 to provide further protection (eg, can be waterproof or dustproof). Referring to FIG. 1D , the extension bracket 102 and the support bracket 101 are separated to form the light emitting device 100 . In this embodiment, the light-emitting device 100 only includes a pair of extending brackets 102 and a light-emitting element 20 . It should be noted that the extension bracket 102 and the light-emitting element 20 can be adjusted according to the actual needs of the length of the light-emitting device 100. For example, the length of the light-emitting element 20 is 1 cm, and when the light-emitting element 20 is arranged on the extension bracket 102, the design is extended. The length of the bracket 102 makes the total length of the light-emitting device 4 cm; or when the light-emitting element 20 is 0.5 cm, the length of the extension bracket 102 is increased so that the total length of the light-emitting device is still 4 cm; or when the light-emitting element 20 is 3 cm, the length of the extension bracket 102 is designed. The length is such that the total length of the light-emitting device is 4 cm. It should be noted that the total length of the above-mentioned light-emitting device is 4 cm only for illustration and not for limiting the present invention.

2A-2D show a manufacturing flow chart of a light-emitting device 200 according to the second embodiment of the present invention. Referring to FIG. 2A , a carrier 10 and a plurality of light-emitting elements 20 are provided. The carrier 10 includes a pair of support brackets 101 and a plurality of extension bracket groups. Each extension bracket group is arranged in parallel with each other and is physically connected to the support bracket 101 . Each extension bracket group includes a plurality of extension brackets 102, and a plurality of light-emitting elements 20 are respectively placed between the two extension brackets 102 and fixed on the two extension brackets 102 (in this embodiment, each extension bracket group includes five extension brackets, And four light-emitting elements are arranged on the extension bracket). The light emitting elements 20 are electrically connected to each other in series through the extension bracket 102 . The extension bracket 102 serves as a support to support the light-emitting elements 20 and the light-emitting elements 20 are arranged on the same straight line. Referring to FIG. 2B , the first cladding structure 30 is formed on the plurality of light emitting elements 20 and part of the extending bracket 102 to completely cover and cover the light emitting elements 20 . Part of the extending bracket 102 is not covered or covered by the first covering structure 30 and is exposed to the external environment (eg, air). Referring to FIG. 2C , a second cladding structure 40 is formed on the first cladding structure 30 and completely covers and wraps the first cladding structure 30 to provide further protection. Referring to FIG. 2D , the extension brackets 102A and the support brackets 101 at opposite ends of each extension bracket group are separated to form the light-emitting device 200 . In each extension bracket group, the extension bracket 102B that is not connected to the support bracket 101 and the light emitting element 20 fixed thereon are connected to each other and are not separated from each other. Referring to FIG. 2E , the bending extension bracket 102B forms an angle (θ ₁ is an acute angle) between the light-emitting elements 20 , thereby forming a light-emitting device 200 having an M-type structure and the light-emitting elements 20 are arranged on non-identical straight lines . It should be noted that, as shown in FIG. 2E , the light-emitting elements 20 are substantially located on the same plane, and the side with the light-emitting unit (please refer to FIG. 3A ) all face the same direction. In other embodiments, the extension bracket 102B can be bent so that the light emitting elements 20 are located on different planes (please refer to FIG. 2F ), and the side with the light emitting unit can be oriented in different directions. As shown in FIG. 2G , the light emitting device 200 may also have a diamond shape (θ ₂ is an acute angle and θ ₃ is an obtuse angle) or other shapes. Likewise, the bent extension bracket 102B and part of the extension bracket 102A are not covered or covered by the first cladding structure 30 and the second cladding structure 40 and are exposed to the external environment (eg, air). The number of the extension brackets 102 and the light-emitting elements 20 can be increased or decreased according to actual needs or according to the desired shape. The support bracket and the extension bracket include bendable, flexible, extensible and deformable metals. The material of the support stent can be the same or different from the material of the extension stent. In this embodiment, the support bracket is used to support the extension bracket, and only the extension bracket is bent, so the ductility of the support bracket can be lower than that of the extension bracket. The material supporting the stent may comprise copper, gold, platinum, silver, steel, iron, aluminum or alloys thereof. The material of the extension stent may comprise copper, gold, platinum, silver, aluminum or alloys thereof. Generally speaking, the crystal lattice of a metal material that is bendable or ductile is classified as a face-centered cubic lattice (FCC); the lattice of a metal material that is less bendable or less malleable is classified as a hexagonal close-packed lattice (HCP).

In FIG. 2A , since the extension brackets 102 of each extension bracket group are not connected to each other, the carrier 10 is disposed on a carrier board (not shown), so that the support bracket 101 and the extension bracket 102 can be fixed on the carrier board . Next, the light-emitting element 20 is fixed on the extension bracket 102 . Alternatively, the carrier plate has a plurality of grooves for disposing the support bracket 101 and the extension bracket 102 therein. After fixing the light-emitting element 20 on the extension bracket 102, the carrier plate is removed. After that, the first cladding structure and/or the second cladding structure are formed (FIG. 2B and FIG. 2C). The first cladding structure and the second cladding structure can be formed by dispensing, spraying, or casting (eg, injection casting or extrusion casting).

3A-3B only illustrate that a light-emitting element 20 is disposed between the two extending brackets 102 . Referring to FIG. 3A , the light-emitting element 20 includes a substrate 201 ; a plurality of light-emitting units 202 are formed on the substrate 201 ; Each light-emitting unit 202 includes a first-type semiconductor layer 2021, an active layer 2022, and a second-type semiconductor layer 2023. The first-type semiconductor layer 2021 and the second-type semiconductor layer 2023 are, for example, cladding layers. Or a confinement layer, which can provide electrons and holes, respectively, so that the electrons and holes are combined in the active layer 2022 to emit light. In this embodiment, the substrate 201 is a growth substrate and a plurality of light emitting units 202 are jointly epitaxially formed on the substrate 201 . The light emitting element 20 further includes an electrical connection structure 204 formed on the substrate 201 ; and an insulating structure 205 formed between the electrical connection structure 204 and the light emitting unit 202 and the substrate 201 . The electrical connection structure 204 electrically connects the light emitting unit 202 and the electrode pad 203, thereby being connected to each other in series. In another embodiment, the light emitting units 202 can be electrically connected in parallel, anti-parallel, or in a bridge structure. It is noted that each light emitting unit 202 can be formed with positive and negative electrodes (not shown), and the positive and negative electrodes of each light emitting unit 202 are connected to each other in series through the electrical connection structure 204 . The electrode pads 203 and the extension bracket 102 can be fixed to each other and electrically connected by a soldering process or an adhesive process. During the soldering process, the material of the electrode pads 203 can be alloy, metal or solder, and the light emitting element 20 and the extension bracket 102 are connected through an eutectic soldering process. During the adhesive manufacturing process, an adhesive, such as anisotropically conductive adhesive (ACA) in the form of a paste or a film, can be formed between the electrode pad 203 and the extension support 102, that is, an anisotropic conductive film (anisotropically conductive film). film; ACF), under the combined action of combined pressure and heat, completes the electrical connection and permanently cures and thermally stabilizes the adhesive. Adhesives also contain silver glue or solder paste. In one embodiment, the light emitting unit 202 can be fixed on the substrate 201 by a bonding layer to form the light emitting element 20 . The materials of the first type semiconductor layer 2021, an active layer 2022, and a second type semiconductor layer 2023 may include III-V semiconductor materials, such as _{AlxInyGa ( 1-xy) N} or _{AlxInyGa ( 1-xy)} P, where 0≦x, y≦1; (x+y)≦1. Depending on the material of the active layer 2022, the light emitting element 20 can emit red light with wavelengths between 610 nm and 650 nm, green light with wavelengths between 530 nm and 570 nm, or blue light with wavelengths between 450 nm and 490 nm. The method for forming the first-type semiconductor layer 2021, an active layer 2022, and a second-type semiconductor layer 2023 is not particularly limited. In addition to metal organic chemical vapor deposition (MOCVD), molecular beam epitaxy (MBE), hydride Vapor Deposition (HVPE), Evaporation or Ion Plating. In one embodiment, the substrate 201 is elongated and has a length and a width; the length is at least 10 times the width.

Referring to FIG. 3A , the first cladding structure 30 completely envelops the light emitting element 20 and covers part of the extending bracket 102 , so that the light emitting element 20 is not exposed and is not in contact with the external environment (air). In addition, the first cladding structure 30 directly contacts the growth substrate 201 . Referring to FIG. 3B , the second cladding structure 40 also completely clads the first cladding structure 30 and covers a portion of the extension stent 102 for further protection. The first cladding structure 30 or/and the second cladding structure 40 may include wavelength conversion materials, diffusion powders, heat dissipation particles, or combinations thereof. When the second cladding structure 40 contains the wavelength conversion material, a third cladding structure can be further formed to coat the second cladding structure 40 to achieve the function of waterproofing or dustproofing. The number of cladding structures can be changed according to actual needs. The wavelength conversion material is used for absorbing the light of the first wavelength emitted by the light-emitting unit 202 to emit light of the first wavelength and a second wavelength different from the first wavelength. The wavelength conversion materials include, but are not limited to, yellow-green phosphors and red phosphors. The composition of the yellow-green phosphor is, for example, aluminum oxide (YAG or TAG), silicate, vanadate, alkaline earth metal selenide, or metal nitride. The components of the red phosphor are, for example, silicates, vanadates, alkaline earth metal sulfides, metal oxynitrides, or tungsten molybdate group mixtures. The diffusing powder contains inorganic particles (eg, silica) or organic particles (eg, high molecular polymers). The heat-dissipating particles include metals, metal oxides (eg, aluminum oxide), or non-metal oxides (eg, boron oxide or boron nitride). In this embodiment, the first cladding structure 30 has a first thickness (t1) (which may be an average thickness, or a maximum or minimum thickness), and the second cladding structure 40 has a second thickness (t2) formed on the On a cladding structure 30; wherein the second thickness is a uniform thickness, and the first thickness (t1) is greater than the second thickness (t2). In another embodiment, the first thickness may be less than or equal to the second thickness. Alternatively, the second thickness may be a non-uniform thickness. The first cladding structure 30 and the second cladding structure 40 can be formed by dispensing, spraying, or casting (eg, injection casting or extrusion casting). It should be noted that when the first cladding structure 30 and the second cladding structure 40 are formed by dispensing or spraying, the cross section thereof may be in an oval or semicircular shape (eg, as shown in FIG. 3B ). When the first cladding structure 30 and the second cladding structure 40 are formed by molding, the cross-section of the first cladding structure 30 and the second cladding structure 40 can be shaped like a rectangle (as shown in FIG. 3C ). The shape of the mold can also be designed so that the first cladding structure 30 or/and the second cladding structure 40 have an ellipse, a semicircle or other shapes. Furthermore, the shape of the mold can be designed so that the first cladding structure 30 or/and the second cladding structure 40 have the protruding parts 301 and 401 . The positions of the protruding parts 301 and 401 correspond to each light-emitting unit 202 to change the light-emitting shape of the light-emitting element 20 (as shown in FIG. 3D ). The protrusions 301, 401 have a semicircular cross-section, but may also have an arcuate, triangular, trapezoidal, or other polygonal cross-section. In another embodiment, as shown in FIG. 3E , the positions of the protrusions 301 and 401 do not correspond to the positions of each light-emitting unit 202 , that is, the protrusions 301 and 401 and the light-emitting unit 202 are staggered and do not substantially overlap each other. Therefore, the total reflection of light at the interface of different materials can be reduced, so as to increase the light extraction efficiency.

The first cladding structure 30 includes epoxy resin, silicone rubber (eg, PDMS), silicone rubber, silicone resin, elastic PU, porous PU, acrylic rubber, or glass. The second cladding structure 40 includes epoxy resin, silicone rubber (eg, PDMS), silicone rubber, silicone resin, elastic PU, porous PU, acrylic rubber, or glass. The materials of the first cladding structure 30 and the second cladding structure 40 may be the same or different. It should be noted that when the light-emitting device has a multi-layered cladding structure, the materials of the cladding structure of each layer may be the same or different.

4A to 4C show a manufacturing flow chart of a light-emitting device 300 according to the third embodiment of the present invention. The carrier 10 includes a pair of support brackets 101 and a plurality of extension bracket groups. Each extension bracket group is arranged in parallel with each other and is physically connected to the support bracket 101 . Each extension bracket set includes a plurality of extension brackets 102 . The carrier 10 also includes a plurality of connecting brackets 103 . The connecting brackets 103 are arranged with each other in a direction parallel to the supporting bracket 101 and physically connect the extending brackets 102 , so that the carrier 10 forms a net structure. The plurality of light-emitting elements 20 are respectively placed between the two extending brackets 102 and fixed on the two extending brackets 102 . The light emitting elements 20 may be electrically connected to each other through the extension bracket 102 . In this embodiment, the light-emitting element 20 is not disposed on the connecting bracket 103 . The extending bracket 102 or/and the connecting bracket 103 can be used as a support to support the light emitting elements 20 and the light emitting elements 20 are arranged on the same straight line. Referring to FIG. 4B , a first cladding structure 30 is formed on the plurality of light emitting elements 20 and part of the extending bracket 102 to completely cover and cover the light emitting elements 20 . Part of the extending bracket 102 and the connecting bracket 103 are exposed to the external environment (eg, air). In this embodiment, the first cladding structure 30 may include wavelength conversion material, diffusing powder, heat dissipating particles, or a combination thereof. Optionally, the second cladding structure 40 (not shown) can also completely encapsulate the first cladding structure 30 and cover a portion of the extension stent 102 for further protection. Next, the extension brackets 102A and the support brackets 101 at opposite ends of each extension bracket group are separated, and the connecting brackets 103 are selectively separated, thereby forming light-emitting devices 300 of different shapes. For example, in this embodiment, referring to FIG. 4C , the light emitting device 300 includes four light emitting elements 20 that are arranged parallel to each other and located on the same plane but on different straight lines and are electrically connected; then, referring to FIG. 4D , the connecting bracket 103 is bent so as to extend The brackets 102C are approached in the direction of extending the brackets 102B, so that the light-emitting elements 20 are not located on the same plane with each other, and the side with the light-emitting units faces in different directions. Optionally, the extension bracket 102 or/and the connecting bracket 103 can be bent so that the light emitting elements 20 are located on the same plane. Of course, in another embodiment, the extension bracket 102 or/and the connection bracket 103 can be selectively cut, and the uncut extension bracket 102 or/and the connection bracket 103 can be bent according to the desired shape. Likewise, the bent extension bracket 102 and the connecting bracket 103 are not covered or covered by the first covering structure 3 and are exposed to the external environment (eg, air).

FIG. 4E shows a schematic diagram of the light-emitting device 300 of FIG. 4D being disposed in a light bulb. The light bulb includes a lamp housing 90 , a light-emitting device 300 , a wire support 91 and an electrical connector 92 . The lead holder 91 is electrically connected to the light emitting device 300 so that the light emitting elements 20 are connected to each other in series. In addition, the wire support 91 is also used to support the light emitting device 300 so that the light emitting device 300 can be located in a specific position in the bulb in a predetermined shape. The light-emitting element 20 emits light in all directions so that the bulb has a full-circumferential light with a light-emitting angle greater than 270 degrees. The lead holder 91 comprises copper, gold, platinum, silver, steel, iron, aluminum or alloys thereof. The electrical connector 92 is used for electrical connection with an external circuit. The electrical connector 92 can be a screw type (eg, E12, E14, E72, etc.) lamp holder, or a connector type (eg, B22) lamp holder.

FIG. 5A shows a schematic diagram of a light-emitting element 20 on the carrier 10 according to the fourth embodiment of the present invention. The carrier 10 includes a pair of support brackets 101 and a plurality of extension bracket groups. Each extension bracket group is arranged in parallel with each other and is physically connected to the support bracket 101 . Each extension bracket set includes a plurality of extension brackets 102 . It should be noted that the extension bracket 102 connected to the support bracket 101 has a T-shape, while the extension bracket 102 not connected to the support bracket 101 has a cross shape, that is, each extension bracket 102 has a first area 1021 and a The second area 1022 and the width of the second area 1022 is greater than the width of the first area 1021 . The plurality of light emitting elements 20 are respectively placed between the two extending brackets 102 and fixed on the first regions 1021 of the two extending brackets 102 . Through the design of the width of the second region 1022, the heat dissipation area of the light emitting device can be increased, thereby helping the heat generated by the light emitting element 20 to be transferred to the outside. Similarly, as shown in FIG. 2A, since the extension brackets 102 of each extension bracket group are not connected to each other, the carrier 10 is disposed on a carrier plate (not shown), so that the support bracket 101 and the extension bracket 102 can be fixed on the carrier. board. Next, the light-emitting element 200 is fixed on the extension bracket 102 . Alternatively, the carrier plate has a plurality of grooves for disposing the support bracket 101 and the extension bracket 102 therein. After fixing the light-emitting element 200 on the extension bracket 102, the carrier plate is removed. Then, referring to FIGS. 2B to 2G , the first cladding structure 30 and/or the second cladding structure 40 can be formed; then the extension bracket 102 and the support bracket 101 are separated and the extension bracket 102 is bent to form a light emitting device with a predetermined structure device.

FIG. 5B shows a schematic diagram of the light-emitting element 20 on the carrier 10 according to the fifth embodiment of the present invention. The carrier 10 includes a pair of support brackets 101 and a plurality of extension bracket groups. Each extension bracket group is arranged in parallel with each other and is physically connected to the support bracket 101 . Each extension bracket set includes a plurality of extension brackets 102 . The carrier 10 also includes a plurality of connecting brackets 103 . The connecting brackets 103 are arranged with each other in a direction parallel to the supporting bracket 101 and physically connect the extending brackets 102 , thereby, the carrier 10 forms a net structure. The plurality of light-emitting elements 20 are respectively placed between the two extending brackets 102 and fixed on the two extending brackets 102 . The light emitting elements 20 may be electrically connected to each other through the extension bracket 102 . In this embodiment, the light-emitting element 20 is not disposed on the connecting bracket 103 . The extension bracket 102 or/and the connection bracket 103 can be used as a support to support the light emitting elements 20 and the light emitting elements 20 are arranged on the same line. As shown in FIG. 5A , the extension brackets 102 connected to the support bracket 101 have a T-shape, while the extension brackets 102 not connected to the support bracket 101 have a cross shape, that is, each extension bracket 102 has a first area 1021 and a first area 1021 There are two areas 1022 and the width of the second area 1022 is greater than the width of the first area 1021 . The plurality of light-emitting elements 20 are respectively placed between the two extending brackets 102 and fixed on the first regions 1021 of the two extending brackets 102 . Through the design of the width of the second region 1022, the heat dissipation area of the light emitting device can be increased, thereby helping the heat generated by the light emitting element 20 to be transferred to the outside. Of course, the width of the connecting bracket 103 can also be designed, which can also help the heat generated by the light-emitting element 20 to be transferred to the outside. Similarly, referring to FIGS. 4B to 4D , the first cladding structure 30 or/and the second cladding structure 40 can be formed; then, the extension bracket 102 and the connecting bracket 103 can be selectively separated and the extension bracket 102 or/or can be bent. And the bracket 103 is connected to form a light emitting device with a predetermined structure.

FIG. 5C shows a schematic diagram of the light-emitting element 20 on the carrier 10 according to the sixth embodiment of the present invention. The carrier 10 includes a pair of support brackets 101 and a plurality of extension bracket groups. Each extension bracket group is arranged in parallel with each other and is physically connected to the support bracket 101 . Each extension bracket set includes a plurality of extension brackets 102 . The light-emitting element 20 includes a first light-emitting group 20A and a second light-emitting group 20B. The first light-emitting group 20A is placed and fixed between the two extension brackets 102 of each extension bracket group; the second light-emitting group 20B is perpendicular to the first light-emitting group 20A and is disposed on the two extension brackets 102 of the adjacent extension bracket group Thus, the light emitting elements 20 form a net structure and can be electrically connected to each other in a bridge manner. The first light-emitting groups 20A are arranged along the first direction ( D1 ), and the second light-emitting groups 20B are arranged along the second direction ( D2 ), and the first direction is perpendicular to the second direction. Similarly, the first cladding structure 30 and/or the second cladding structure 40 can be formed; then the extension bracket 102 is selectively separated and the extension bracket 102 is bent to form a light emitting device having a predetermined structure. Referring to FIG. 5D , the light emitting device 600 is electrically connected in a bridge manner, and the side with the light emitting unit faces the same direction. As with Figure 5A, the design of the extension bracket 102 also aids in heat dissipation.

FIG. 6A shows a schematic diagram of the light-emitting element 20 located on the carrier 10 according to the seventh embodiment of the present invention. The carrier 10 includes a pair of support brackets 101 and a plurality of extension bracket groups. Each extension bracket group is arranged in parallel with each other and is physically connected to the support bracket 101 . Each extension bracket set includes a plurality of extension brackets 102 . In this embodiment, four extension bracket groups are taken as an example, and each extension bracket group includes three extension brackets 102 and two light-emitting elements 20 disposed on the extension brackets 102 . The carrier 10 also includes a plurality of connecting brackets 103 . The connecting brackets 103 are arranged with each other in a direction parallel to the supporting bracket 101 and physically connect the extending brackets 102 . It should be noted that the connecting brackets 103 only connect two adjacent extension bracket groups. Next, the extension bracket 102 and the support bracket 101 are separated to form a light-emitting device 700 . As shown in FIG. 6B , the extension bracket 102 or/and the connecting bracket 103 are bent to make the light emitting device 700 into a predetermined shape. The light-emitting device 700 includes two sets of extending brackets and four light-emitting elements 20 . As shown in FIG. 6C, the light-emitting device 700 is disposed in a candle light. The candle lamp includes a lamp housing 901 , a wire support 902 , a base 903 and an electrical connector 904 . The electrical connector 904 can be a screw-type (eg, E12, E14, E72, etc.) lamp holder, or a connector-type (eg, B22) lamp holder.

The light emitting device 700 is fixed to and electrically connected to the wire support 902 using the extension support 102 . The wire support 902 is also used to support the light emitting device 700 so that the light emitting device 700 can be positioned in a specific position in the candle light in a predetermined shape. FIG. 6D shows a schematic circuit diagram of the light emitting device 700 in FIG. 6C . The light-emitting elements 20C and 20D are connected in parallel; the light-emitting elements 20E and 20F are connected in parallel; after that, they are connected in series with each other. Alternatively, the light-emitting device 700 can be electrically connected to an AC power source and FIG. 6E shows another schematic circuit diagram of the light-emitting device 700. In a positive cycle, the light-emitting elements 20C and 20F will emit light; in a negative cycle, the light-emitting elements 20D and 20E will emit light. glow.

FIG. 6F shows a schematic diagram of the light-emitting element 20 on the carrier 10 according to the eighth embodiment of the present invention. The carrier 10 includes a pair of support brackets 101 and a plurality of extension bracket groups. Each extension bracket group is arranged in parallel with each other and is physically connected to the support bracket 101 . Each extension bracket set includes a plurality of extension brackets 102 . The extension bracket 102 has a first area 1021 and a second area 1022, and the width or area of the second area 1022 is larger than the width or area of the first area 1021. The second area 1022 is physically connected to the support bracket 101 . Similarly, as in FIG. 2A , since the extension brackets 102 of each extension bracket group are not connected to each other, the carrier 10 is disposed on a carrier plate (not shown), so that the support bracket 101 and the extension bracket 102 can be fixed on the carrier board. Next, the light-emitting element 20 is fixed on the extension bracket 102. Alternatively, the carrier plate has a plurality of grooves for disposing the support bracket 101 and the extension bracket 102 therein. After fixing the light-emitting element 20 on the extension bracket 102, the carrier plate is removed. Next, the extension bracket 102 and the support bracket 101 are separated to form a light-emitting device 800 , and the extension bracket 102 is bent so that the light-emitting device 800 has a predetermined shape. As shown in FIG. 6G, the light-emitting device 800 is disposed in a candle light. In this embodiment, since the second area 1022 of the extension bracket has a larger area, in addition to increasing the heat dissipation area of the light emitting device 800 , it can also be used as a support so that the light emitting device 800 can be directly fixed on the base 903 . The candle light also includes a lamp housing 901 and an electrical connector 904 .

7A-7B are schematic diagrams illustrating a manufacturing process of a light-emitting device 900 according to the ninth embodiment of the present invention. 7A is similar to FIG. 1C , the difference is that the contact portion 1025 between the extension bracket 102 and the support bracket 101 has a tapered structure, so that the connection strength between the extension bracket 102 and the support bracket 101 is smaller than that in FIG. 1C . Therefore, as shown in FIG. 7B, when a force is applied to the contact portion 1025, the extension bracket 102 and the support bracket 101 can be easily separated. Through the arrangement of the contact portion 1025, the manufacturing process flow can be simplified. Furthermore, the extension bracket 102 further includes a hole 1023 . A connecting wire (not shown) can pass through the hole 1023 and fix the light emitting device 900 in a light bulb. Alternatively, when a plurality of light-emitting devices 900 are disposed in a light bulb, the connecting wires may pass through the holes of each light-emitting device 900, thereby fixing and supporting each light-emitting device into a predetermined shape. The connecting wire contains metal, and can connect multiple light-emitting devices in parallel, in series, or in series and parallel.

FIG. 8 shows a schematic diagram of the light-emitting element 20 on the carrier 10 according to the tenth embodiment of the present invention. The plurality of light-emitting elements 20 are respectively placed between the two extending brackets 102 and fixed on the two extending brackets 102 . The light emitting elements 20 are electrically connected to each other in series through the extension bracket 102 . The extension bracket 102 serves as a support to support the light-emitting elements 20 and the light-emitting elements 20 are arranged on the same straight line. Furthermore, the first cladding structure 30 (not shown) can be formed on the plurality of light emitting elements 20 and part of the extending bracket 102 to completely cover and cover the light emitting elements 20 . Part of the extending bracket 102 is not covered or covered by the first covering structure 30 and is exposed to the external environment (eg, air). The second cladding structure 40 (not shown) can completely cover and wrap the first cladding structure 30 to provide further protection. In this embodiment, the carrier 10 further includes a connecting bracket 103 arranged in a direction parallel to the supporting bracket 101 ; and an intermediate bracket 104 for physically connecting the extension brackets 102 , 102D and the connecting bracket 103 , thereby The carrier 10 forms a net structure. In addition, part of the extending bracket 102D is only used for supporting, and the light-emitting element 20 is not disposed thereon. The contact portion of the connection bracket 103 and the extension brackets 102 and 102D has a tapered structure, and the contact portion of the intermediate bracket 104 with the extension brackets 102 and 102D and the connection bracket 103 also has a tapered structure. Therefore, When a force is applied to the contact portion, the connecting bracket 103 and the extending brackets 102 and 102D can be easily separated, thereby forming a light emitting device. The arrangement of the intermediate support 104 can also simplify the manufacturing process.

9A-9F are cross-sectional views showing the manufacturing process of a light-emitting device 1000 according to the eleventh embodiment of the present invention. Referring to FIG. 9A , a patterned seed crystal structure 221 may be formed on a carrier 21 using a photolithographic etching process. The patterned seed structure 221 includes a first region 2211 , a second region 2212 and a third region 2213 . The first region 2211 and the third region 2213 include a plurality of seed layers that are physically separated from each other. The second area 2212 is provided between the first area 2211 and the third area 2213 and electrically connects the first area 2211 and the third area 2213 (see FIG. 10A ). 9B , similarly, a photolithographic etching process can also be used to form a patterned metal layer 222 on the corresponding patterned seed crystal structure 221 . The area and shape of the metal layer 222 are the same as the area and shape of the seed crystal structure 221 The shapes are substantially equal. The metal layer 222 also includes a first region 2221, corresponding to the first region 2211 of the seed structure 221; a second region 2222, corresponding to the second region 2212 of the seed structure 221; and a third region 2223, corresponding to The third region 2213 of the seed structure 221 . 9C , a first light-emitting group 11 includes a plurality of light-emitting units 111 disposed in the first region 2221 of the metal layer 222 respectively; and a second light-emitting group 12 includes a plurality of light-emitting units 121 disposed in the metal layer 222 respectively. The third region 2223 ; the second region 2222 of the metal layer 222 is not provided with the light emitting units 111 and 121 . By designing the relative positions of the metal layers, the light emitting units 111 and 121 disposed thereon can be connected to each other in series, parallel, series-parallel connection, bridge connection, or anti-parallel connection. Referring to FIG. 9D , an etching step is performed to remove the seed structure 221 . In this embodiment, because the line width (or area) of the seed layer in the second region 2212 of the seed structure 221 is smaller than the line width (or area) of the seed layer in the first region 2211 (refer to FIG. 10A ), when the second region 2212 has a smaller line width (or area) When the region 2212 is completely etched or removed, only a part of the first region 2211 is etched and a part of the first region 2211 is still formed on the carrier 21 , so that the light emitting units 111 and 121 are still fixed on the carrier 21 . Furthermore, since the second region 2212 of the seed structure 221 is completely etched or removed, the second region 2222 of the metal layer 222 is in a floating state, that is, the second region 2222 of the metal layer 222 is not in direct contact with the carrier 21 . , but still electrically connected to the first region 2221 and the third region 2223 of the metal layer 222 . In contrast, the first region 2211 of the seed structure 221 is not completely etched or removed, so the first region 2221 of the metal layer 222 is still connected to the carrier 21 and does not appear in a floating state. It should be noted that, after the step of removing the seed structure 221, the line width (area) of the first region 2211 (third region 2213) of the seed structure 221 is smaller than that of the first region 2221 of the metal layer 222 formed thereon The line width (area) of the (third region 2223). The metal layer 222 and the corresponding seed structure 221 together form a T-shaped cross-section. Referring to FIGS. 9E and 10B , the carrier 21 is cut to form a first carrier portion 211 and a second carrier portion 212 relative to the position of the second region 2222 of the suspended metal layer 222 . The first carrier part 211 has a first surface 2111 and a second surface 2112 , and the second carrier part 212 has a third surface 2121 and a fourth surface 2122 . The first light-emitting group 11 is located on the second surface 2112 and the second light-emitting group 12 is located on the fourth surface 2122. Referring to FIG. 9F , the relative positions of the first light-emitting group 11 and the second light-emitting group 12 are changed, so that the first light-emitting group 11 and the second light-emitting group 12 are not substantially located on the same straight line. In addition, because the second region 2222 of the metal layer 222 is suspended and has extensibility, when the relative positions of the first light-emitting group 11 and the second light-emitting group 12 are changed, the second region 2222 of the metal layer 222 is stretched and stretched. Bend and cause a change in shape (see Figure 10C). It should be noted that the second region 2222 of the metal layer 222 is still electrically connected to the first region 2221 and the third region 2223 of the metal layer 222 after the stretching step. In this embodiment, the first light-emitting group 11 and the second light-emitting group 12 face different directions and are electrically connected in series with each other. The first surface 2111 and the third surface 2121 are parallel to each other and face each other. It should be noted that before the step of changing the relative position, the first surface 2111 (the second surface 2212 ) and the third surface 2121 (the fourth surface 2122 ) are substantially in the same line, but after the step of changing the relative position, the first surface 2111 (the second surface 2212) and the third surface 2121 (the fourth surface 2122) are not located on the same straight line. Furthermore, before the step of changing the relative position, the metal layer 222A on the first carrier portion 211 and the metal layer 222B on the second carrier portion 212 face the same direction and are on the same side of the carrier 21, but after changing the relative position After the step, the metal layer 222A and the metal layer 222B face different directions. Since the metal layers 222A and 222B face in different directions, the light emitting device 1000 can be regarded as being electrically connected to external circuits (eg, power supplies, circuit boards, or electronic components) on different sides of the same side of the carrier. For example, as shown in FIG. 9G , a base 80 has a pair of grooves 81 . The light emitting device 1000 is bonded into the corresponding grooves 81 with the metal layers 222A, 222B to form electrical connections. In one embodiment, the base 80 may be a circuit board in a light bulb, and the light emitting device 1000 may be a light bar in the light bulb.

FIG. 10A shows a top view of the metal layer 222 before the step of changing the relative positions of the first light-emitting group 11 and the second light-emitting group 12 (corresponding to FIG. 9D , but only the metal layer 222 is drawn for clarity of the drawing) . The second region 2222 of the metal layer 222 has a plurality of meanders. FIG. 10B shows a top view of the carrier 21 after cutting. Referring to FIG. 10C , the first carrier part 211 and the second carrier part 212 move in opposite directions, whereby the second region 2222 of the metal layer 222 is elongated and compared with FIG. 10A , the meandering part of the second region 2222 has A larger radius of curvature means that the inflection portion is gentler. Furthermore, the distance between the first carrier portion 211 and the second carrier portion 212 in FIG. 10C is greater than the distance between the first carrier portion 211 and the second carrier portion 212 in FIG. 10B . In FIG. 10C, only the second region 2222 of the metal layer 222 is stretched but not bent, and then the second region 2222 of the metal layer 222 can be bent to form the light emitting device 1000 in FIG. 9F. In another embodiment, the second region 2222 of the metal layer 222 can be directly bent to form the light emitting device 1000 in FIG. 9F. In another embodiment, the pattern of the second region 2222 of the unstretched metal layer 222 may be spiral, zigzag, or semicircular.

11A-11D are cross-sectional views showing a manufacturing process of the light-emitting device 1100 according to the twelfth embodiment. 11A , the light-emitting device 1100 includes a carrier 21 ; a patterned metal layer 222 is formed on the carrier 21 , and the first light-emitting group 11 and the second light-emitting group 12 are located on the patterned metal layer 222 . Each light-emitting group includes a plurality of light-emitting units 111 and 121 that are electrically connected to each other. In the first light-emitting group 11, the light-emitting unit 111A closest to the second light-emitting group 12 and the light-emitting unit 121A closest to the first light-emitting group 11 in the second light-emitting group 12, between the two light-emitting units 111A, 121A The distance ( D1 ) is greater than the distance ( D2 ) between the adjacent light-emitting units 111 and 121 in the first light-emitting group 11 or the second light-emitting group 12 . Referring to FIG. 11B, an extendable and flexible conductive member 23 is disposed between the light-emitting units 111A, 121A and electrically connects the light-emitting units 111A, 121A. Referring to FIG. 11C , the carrier 21 is cut to form a first carrier portion 211 and a second carrier portion 212 relative to the position of the conductive member 23 . The first carrier part 211 and the second carrier part 212 are not connected to each other and are separated by a distance. Furthermore, a part of the conductive member 23 is not connected to the carrier 21 and is in a suspended state. The first carrier part 211 has a first surface 2111 and a second surface 2112 , and the second carrier part 212 has a third surface 2121 and a fourth surface 2122 . The first light emitting group 11 is located on the second surface 2112 and the second light emitting group 12 is located on the fourth surface 2122 . 11D, the relative positions of the first light-emitting group 11 and the second light-emitting group 12 are changed, so that the first light-emitting group 11 and the second light-emitting group 12 are not substantially located on the same straight line. In addition, since the conductive member 23 is suspended and has extensibility, when the relative positions of the first light-emitting group 11 and the second light-emitting group 12 are changed, the conductive member 23 is stretched and bent to change the shape. It should be noted that the conductive member 23 is still electrically connected to the first light-emitting group 11 and the second light-emitting group 12 after the stretching step. In this embodiment, the first light-emitting group 11 and the second light-emitting group 12 face different directions and are electrically connected in series with each other. The first surface 2111 and the third surface 2121 are parallel to each other and face each other. It should be noted that before the step of changing the relative position, the first surface 2111 (the second surface 2212 ) and the third surface 2121 (the fourth surface 2122 ) are substantially in the same line, but after the step of changing the relative position, the first surface 2111 (the second surface 2212 ) and the third surface 2121 (the fourth surface 2122 ) are not located on the same straight line. Furthermore, before the step of changing the relative position, the metal layer 222A on the first carrier portion 211 and the metal layer 222B on the second carrier portion face the same direction and are on the same side of the carrier 21, but before the step of changing the relative position Afterwards, the metal layer 222A and the metal layer 222B face different directions. Since the metal layers 222A and 222B face in different directions, the light emitting device 1100 can be regarded as being electrically connected to external circuits (such as power supplies, circuit boards, or electronic components) on two different sides of the same side of the carrier 21 . Likewise, as shown in FIG. 9G , the light emitting device 1100 is also connected to the groove of the substrate 80 and disposed in the bulb. The conductive member 23 can be fixed on the carrier 21 by means of wire bonding and surface mount technology (SMT). The top-view pattern of the unstretched conductive member 23 may be meandering, spiral, zigzag, or semicircular.

The carriers 10, 21 comprise organic materials, inorganic materials, or combinations thereof. Organic materials, such as epoxy resin (Epoxy), polyimide (PI), benzocyclobutene (BCB), perfluorocyclobutane (PFCB), Su8, acrylic resin (AcrylicResin), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), polycarbonate (PC), polyetherimide (Polyetherimide), Fluorocarbon Polymer. Inorganic materials such as sapphire, zinc oxide, diamond, glass, quartz or aluminum nitride. The carriers 10, 21 may be transparent or opaque. The metal layer contains copper, gold, platinum, silver, aluminum or alloys thereof. The seed layer contains titanium, copper or alloys thereof. The conductive member includes copper, gold, platinum, silver, aluminum or alloys thereof.

The detailed structures of the light-emitting units 111 and 121 may not only have the structures shown in FIG. 3A , but also the structures shown in FIGS. 12A to 12C . The light-emitting units 111 and 121 include a substrate 7000, a first-type semiconductor layer 7001, an active layer 7002, and a second-type semiconductor layer 7003. The first-type semiconductor layer 7001 and the second-type semiconductor layer 7003 are, for example, cladding layers The cladding layer or the confinement layer can respectively provide electrons and holes, so that the electrons and holes are combined in the active layer 7002 to emit light. A first conductive portion 7004 and a second conductive portion 7005 are formed on the second-type semiconductor layer 7003 and the first-type semiconductor layer 7001, respectively. The LED unit 2000 is a flip-chip LED. There is a hole 7008 between the first conductive part 7004 and the second conductive part 7005, and the first conductive part 7004 has an electrode contact surface 70041 and the second conductive part 7005 has an electrode contact surface 70051; the electrode contact surface 70041 and the electrode contact surface The 70051 is essentially at the same level. A transparent colloid covers the substrate 7000 , the first-type semiconductor layer 7001 , the active layer 7002 , and the second-type semiconductor layer 7003 and fills the pores 7008 to form the first transparent structure 7026 . In another embodiment, the transparent colloid does not completely fill the pores 7008 , so air is formed between the first conductive portion 7004 and the second conductive portion 7005 . The first transparent structure 7026 has a surface 70261 which is substantially flush with the electrode contact surfaces 70041 and 70051 . Next, a protective layer 7006 is formed on the surface of the first transparent structure 7026 and exposes the first conductive portion 7004 and the second conductive portion 7005 . The first enlarged electrode portion 7024 and the second enlarged electrode portion 7025 are formed on the first conductive portion 7004 and the second conductive portion 7005 , respectively, and are also formed on the protective layer 7006 . The light emitting units 111 and 121 are in direct contact with the metal layer 222 by using the first enlarged electrode portion 7024 and the second enlarged electrode portion 7025 to form electrical connection. In this embodiment, one side 70241 of the first enlarged electrode portion 7024 is not flush with one side 70061 of the protective layer 7006 ; the other side 70251 of the second enlarged electrode portion 7025 is not flush with the other side of the protective layer 7006 Side 70062 flush. In another embodiment, one side 70241 of the first enlarged electrode portion 7024 can be flush with one side 70061 of the protective layer 7006 ; one side 70251 of the second enlarged electrode portion 7025 can be flush with the other side of the protective layer 7006 Side 70062 flush. The light-emitting unit further includes a second transparent structure 7027 formed on the first transparent structure 7026 . In another embodiment, the light emitting unit may not have the second transparent structure 7027 . The first transparent structure 7026 or the second transparent structure 7027 includes epoxy resin (Epoxy), polyimide (PI), benzocyclobutene (BCB), perfluorocyclobutane (PFCB), SU8, acrylic resin (Acrylic Resin), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), polycarbonate (PC), polyetherimide (Polyetherimide), fluorocarbon polymer (Fluorocarbon Polymer), Alumina (Al ₂ O ₃ ), SINR, spin-on-glass (SOG). The second transparent structure 7027 includes sapphire, diamond, glass, epoxy, quartz, acrylic resin, silicon oxide (SiO _x ), aluminum oxide ( Al ₂ O ₃ ), zinc oxide (ZnO), or silica gel (Silicone). The protective layer 7006 is a transparent and non-conductive material with high thermal conductivity (eg, carbon-like diamond), or may also include a material with high reflectivity (eg, titanium dioxide, silicon dioxide, or aluminum oxide). The first transparent structure 7026 or/and the second transparent structure 7027 may include wavelength conversion material, diffusing powder, heat dissipation particles, or a combination thereof.

The light emitting unit of FIG. 12B has a structure similar to that of the light emitting structure of FIG. 12A . The light-emitting unit of FIG. 12A includes only one light-emitting diode, however, the light-emitting unit of FIG. 12B includes a plurality of light-emitting diodes. In this embodiment, each light emitting diode has its own substrate 7000 . In other embodiments, as shown in FIG. 3A , a plurality of light emitting diodes are jointly epitaxially formed on a substrate. The light-emitting diodes are electrically connected (series, parallel, or series-parallel) by using an electrical connection structure 204 . In this embodiment, the second conductive portion 7005 of the light emitting diode and the first conductive portion 7004 of the adjacent light emitting diode are in direct contact with each other through a wire structure 7015 and form a series connection. The first transparent structure 7026 covers the plurality of light emitting diodes. It should be noted that the plurality of light emitting diodes can be made to emit light only through the electrical connection between the first enlarged electrode portion 7024 and the second enlarged electrode portion 7025 and the metal layer 222 .

The light-emitting unit of FIG. 12C has a similar structure to the light-emitting structure of FIG. 12B , the difference is that in the light-emitting unit of FIG. 12B , each light-emitting diode has its own first enlarged electrode portion 7024 and second enlarged electrode portion 7025 , and No electrical connection is made to each other. Through the design of the metal layer 222 , the plurality of light emitting diodes in the light emitting unit are electrically connected to each other on the carrier, and can be electrically connected in series, in parallel, in reverse parallel, or in a bridge structure.

It should be noted that the above-described light-emitting device can be regarded as a small light-emitting light bar, when installed in a lighting device (eg: A-type bulb, B-type bulb, searchlight, bean lamp, lamp tube or lamp) At this time, the extension bracket 102 or the metal layer can form an electrical connection with the circuit structure of the light bulb. According to different needs, the lighting device can have different structures by extending the bracket 102 or/and connecting the bracket 103, so that the lighting device can achieve the effect of all-round light.

It should be understood that the above-mentioned embodiments of the present invention can be combined or replaced with each other under appropriate circumstances, and are not limited to the specific embodiments described. The embodiments listed in the present invention are only used to illustrate the present invention, but not to limit the scope of the present invention. Any obvious modifications or changes made by anyone to the present invention do not depart from the spirit and scope of the present invention.

Claims (10)

1. A method for manufacturing a light-emitting device, comprising in sequence: providing a support body, the support body includes at least a pair of support brackets and a plurality of extension brackets, each extension bracket and the at least one pair of support brackets are physically connected to each other detachably; A first light-emitting element and a second light-emitting element are provided, each of the first light-emitting element and the second light-emitting element has two electrode pads, and the two electrode pads are respectively butt-fixed to two adjacent extension brackets among the plurality of extension brackets , wherein the first light-emitting element and the second light-emitting element are arranged in a substantially straight line on the extension bracket; and A cladding structure comprising wavelength conversion material is formed to completely cover the first light-emitting element and the second light-emitting element, wherein, viewed from above, the cladding structure and the extension support have a similar shape, and the extension support project only on two corresponding sides of the cladding structure; separating the extension bracket and the at least one pair of support brackets; The relative positions of the first light-emitting element and the second light-emitting element are changed so that the first light-emitting element and the second light-emitting element are not substantially located on the same straight line. 2 . The manufacturing method of claim 1 , wherein the changing step comprises bending at least one of the plurality of extending brackets. 3 . 3 . The manufacturing method of claim 1 , wherein the first light-emitting element and the second light-emitting element are electrically connected to each other through the plurality of extending brackets. 4 . 4. The manufacturing method of claim 1, wherein one of the plurality of supports has a tapered structure. 5. The manufacturing method of claim 1, wherein the plurality of extension stents comprise metal. 6. The manufacturing method of claim 1, wherein the plurality of extension supports have a face-centered cubic lattice. 7 . The manufacturing method of claim 1 , wherein before the changing step, a coating material is formed to cover the first light-emitting element and the second light-emitting element. 8 . 8 . The manufacturing method of claim 7 , wherein the first light-emitting element comprises a substrate, and a plurality of light-emitting stacks are jointly epitaxially formed on the substrate. 9 . 9. The manufacturing method of claim 8, wherein the cladding material directly contacts the substrate. 10 . The manufacturing method of claim 7 , wherein a portion of the extending stent is not covered by the covering material. 11 .

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