JP2008186834A - Long light-emitting device and its fabrication process - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a long light-emitting device in which a plurality of light-emitting diode units consisting of upper/lower electrode type light-emitting diodes are provided on a long metal die having a substantially U-shaped cross-section, and also to provide its fabrication process. <P>SOLUTION: In the long light-emitting device, a plurality of light-emitting diode units are arranged in series and/or parallel on a long metal die having a substantially U-shaped cross-section. In the long metal die having a substantially U-shaped cross-section, at least two separated metal substrates are provided under an insulated state. In the upper/lower electrode type light-emitting diodes, the lower electrode is bonded to one metal substrate, and the upper electrode is bonded to the other metal substrate by a conductive connection member. The conductive connection member not only passes a high current but also enhances heat dissipation effect. The upper/lower electrode type light-emitting diode is attached to the inside of the long metal die having a substantially U-shaped cross-section, and its periphery is sealed by a sealing material. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a long light emitting device in which a plurality of light emitting diode units composed of upper and lower electrode type light emitting diodes and the like are provided on a metal mold having a substantially U-shaped cross section, and a method for manufacturing the long light emitting device. is there. In particular, the present invention is capable of flowing a large current through the upper and lower electrode type light emitting diodes, and is a long light emitting device and a long light source that take into account heat dissipation generated at that time or expansion and contraction due to thermal stress of a metal member due to the heat. The present invention relates to a method for manufacturing a light emitting device. In addition, the present invention can prevent damage to the light emitting layer due to vibration or heat by connecting a gold wire to a conductive connecting member made of a metal plate member by eutectic solder instead of connecting by wire bonding. The present invention relates to a long light emitting device composed of upper and lower electrode type light emitting diodes and a method for manufacturing the long light emitting device.

  FIG. 6A is a schematic sectional view for explaining a light emitting diode assembly in a conventional example, and FIG. 6B is a plan view for explaining the light emitting diode assembly in the conventional example. 6A and 6B, the light-emitting diode assembly 60 surrounds a printed wiring board 61, a submount board 62 provided on the printed wiring board 61, and the periphery of the submount board 62. A plastic cylinder 63, an upper and lower electrode type light emitting diode 65, and a transparent sealing resin 66 covering the upper and lower electrode type light emitting diode 65 are formed.

  The plastic cylinder 63 is integrally formed with the lead frame 64 by using, for example, a thermosetting resin mainly composed of an epoxy resin. On the printed wiring board 61, a printed wiring 611 for connecting to a control circuit (not shown) for blinking the upper and lower electrode type light emitting diodes 65 is formed in a desired pattern by etching or the like. A pair of wirings 622 is formed on the upper surface of the submount substrate 62 by, for example, forming an evaporation pattern using etching or a mask.

  In the plastic cylinder 63, the lead frame 64 penetrates the inside (embedded portion 641). The plastic cylinder 63 reflects light emitted from the upper and lower electrode type light emitting diodes 65 from the inner periphery. Further, the plastic cylinder 63 is integrally manufactured by so-called insert or outsert molding (injection molding) in which the lead frame 64 is embedded in the injection molding.

  The upper and lower electrode type light emitting diode 65 includes two electrodes 623 in the lower part, cut out by dicing from the submount substrate 62 made of a semiconductor wafer, and the electrodes are connected to the wiring 622 of the submount substrate 62. The transparent sealing resin 66 has heat resistance, is filled in the plastic cylindrical body 63, and forms a flat or convex lens.

In the light emitting diode package described in Japanese Patent Laid-Open No. 2001-244508, the lower electrode of the upper and lower electrode type light emitting diode is attached to one side of a metal substrate, and the upper electrode of the upper and lower electrode type light emitting diode is insulated with the other by a bonding wire. Connected to the metal substrate. Some conventional light emitting diode packages have a resin inserted in an insulating portion of a metal core. For example, the manufacturing method of the said package for light emitting diodes is described in Unexamined-Japanese-Patent No. 2005-116579. Further, in the conventional surface mount type light emitting diode, the metal core substrate is divided by an insulating adhesive and the submount substrate is mounted. For example, Japanese Unexamined Patent Publication No. 2003-303999 discloses the surface-mount light emitting diode.
JP 2001-244508 A JP 2005-116579 A JP 2003-303999 A

  The sub-mount type flip-chip type light emitting diode has an advantage that all the emitted light is irradiated to the outside because there is no electrode on the upper part. However, in recent years, upper and lower electrode type light emitting diodes have been developed having performances superior to the above-described flip chip type light emitting diodes. The upper and lower electrode type light emitting diodes can flow a large amount of current and can improve luminance, but the submount type structure has poor heat conduction, and the heat of the flip chip type light emitting diodes is hardly dissipated. However, the package tends to be hot, and there are drawbacks such as disconnection of wiring when used for years. Further, the submount type has a problem that productivity for mass production is poor.

  The upper and lower electrode type light emitting diodes are large, have high luminous efficiency, and have high illuminance. However, when the upper and lower electrode type light emitting diodes are used for illumination, the upper electrode is wired with a gold wire, and if a large amount of current is passed, the wiring is disconnected due to heat stress due to heat generation, or the upper electrode and the gold wire are not connected. There is a problem that the upper and lower electrode type light emitting diodes are burned due to the connection resistance between them. Moreover, the light emitting diode attached to the metal board | substrate provided with the slit is sealed with transparent resin, and the thing with high hardness is used in order to give intensity | strength with the said transparent resin. However, the sealing material having a high hardness has a problem that the thermal stress generated from the light emitting diode is large. The thermal stress may break the wiring that supplies power to the light emitting diode.

  In order to solve the problems as described above, the present invention provides a substantially U-shaped metal mold having an open upper surface and an end face, an insulating member, a metal substrate, an upper and lower electrode type light emitting diode, and the metal substrate. It is an object of the present invention to provide a long light emitting device and a method for manufacturing the long light emitting device at least composed of a conductive connecting member that connects the upper electrode of the upper and lower electrode type light emitting diode and a sealing material. An object of the present invention is to provide a long light-emitting device that is excellent in mass productivity, can withstand a large current and thermal stress, and is maintained at high strength, and a method for manufacturing the long light-emitting device.

(First invention)
In the long light emitting device of the first invention, a plurality of light emitting diode units are installed on a metal mold having a substantially U-shaped cross section, and at least two insulated metal substrates and a lower electrode on one of the metal substrates. Bonded upper / lower electrode type light emitting diode, conductive connecting member for bonding the upper electrode of the upper / lower electrode type light emitting diode and the other of the metal substrate, and sealing material for sealing the periphery of the upper / lower electrode type light emitting diode The light-emitting diode unit composed at least from the above is installed through an insulating layer on the metal mold having a substantially U-shaped cross section, and is connected in series and / or in parallel.

(Second invention)
The long light emitting device of the second invention is characterized in that a phosphor-containing film is provided on the upper surface of the sealing material of the first invention.

(Third invention)
In the long light emitting device of the third invention, the metal material of the first invention or the second invention, which is substantially U-shaped in cross section, is made of aluminum, iron, copper, or an alloy thereof, and the upper part is open, It is characterized by spreading upward.

(Fourth invention)
According to a fourth aspect of the present invention, there is provided a long light emitting device according to any one of the first to third aspects of the present invention, wherein one metal substrate is joined to the lower electrode of the upper and lower electrode type light emitting diode, the upper electrode of the upper and lower electrode type light emitting diode Eutectic solder is used for joining the connecting member and joining the conductive connecting member and the other metal substrate.

(Fifth invention)
The long light emitting device of the fifth invention is characterized in that the insulating layer on the metal mold material having a substantially U-shaped cross section in the first to fourth inventions is a one-liquid condensation type silicone adhesive having good thermal conductivity. .

(Sixth invention)
A long light emitting device according to a sixth aspect of the present invention is a light emitting diode in another long cross-sectional substantially U-shaped metal mold material at both ends of the long cross-section substantially U-shaped metal mold material according to the first to fifth aspects of the invention. A connector that is electrically connected to the unit or the power source is provided.

(Seventh invention)
According to a seventh aspect of the present invention, there is provided a method for manufacturing a long light emitting device, wherein a plurality of light emitting diodes are provided on an inner bottom surface of a long metal section having a substantially U-shaped cross section, and has at least two insulated metal substrates. The upper and lower electrode type light emitting diodes are bonded to one of the metal substrates with eutectic solder, and the upper and lower electrode type light emitting diodes and the other of the metal substrate are bonded to each other with eutectic solder via a conductive connecting member, Furthermore, a step of manufacturing a light emitting diode unit by sealing the periphery of the upper and lower electrode type light emitting diodes with a sealing material, and a plurality of the light emitting diode units on an inner bottom surface of the metal mold member with an insulating adhesive layer The light emitting diode units are connected in series and / or in parallel.

(Eighth invention)
The long light-emitting device manufacturing method according to the eighth invention is characterized in that a phosphor-containing film body is formed on the sealing material according to the sixth invention.

(9th invention)
According to a ninth aspect of the present invention, there is provided a method for manufacturing a long light emitting device, wherein at least two insulated metal substrates are integrally held by joining a substantially cylindrical reflector so as to straddle the insulating portion. To do.

(10th invention)
According to a tenth aspect of the present invention, there is provided a method for manufacturing a long light emitting device, wherein the cylindrical reflector is made of a ceramic or a resin material.

(11th invention)
In the method for manufacturing a long light emitting device according to the eleventh aspect of the invention, at least two insulated metal substrates are coated and cured so that a curable resin is circular, linear, or partially enclosed so as to straddle the insulating portion. Therefore, it is held integrally.

(Twelfth invention)
The long light emitting device manufacturing method according to the twelfth aspect of the present invention is characterized in that a phosphor-containing film body is contained in a curable resin material.

  According to the present invention, a plurality of light emitting diode units made of a metal substrate, upper and lower electrode type light emitting diodes, a conductive connecting member, and a sealing material are housed in a metal mold member having a substantially U-shaped cross section through an insulating layer. Therefore, if the metal mold with the substantially U-shaped cross section is made of aluminum, iron, copper, or an alloy thereof, not only can it be mass-produced with an inexpensive mold, but also a desired length can be easily obtained. be able to.

  According to the present invention, since the plurality of light emitting diode units are provided in series and / or in parallel in a metal mold member having a U-shaped cross section or a substantially U-shaped cross section in which the cross section expands upward, the light emission A linear light source having a desired length can be easily obtained by using an arbitrary number of diode units.

  According to this invention, it can be set as arbitrary surface light sources by arrange | positioning the said linear light source in parallel, and it is optimal as a backlight for advertisement.

  According to the present invention, since the upper electrode of the upper and lower electrode type light emitting diodes connected to one metal substrate and the other metal substrate are connected by, for example, a plate-like conductive connecting member, a large current flows. In addition to being excellent in heat dissipation, it can be relieved even if thermal stress occurs. In particular, according to the present invention, when eutectic solder is used for each connection portion, it is possible to obtain a light emitting device composed of upper and lower electrode type light emitting diodes without vibrations applied to the joint portion and / or the light emitting layer and free from defective products. I can do it now.

  According to the present invention, since the wire bonding is not used for the connection between the upper electrode of the upper and lower electrode type light emitting diode and the metal substrate, the metal substrate and the conductive connection member and / or the light emission even when a large current is passed over a long period of time. A reliable light-emitting device was obtained in which the layers were not damaged.

  According to the present invention, since the two insulated metal substrates are connected by the cylindrical reflector or the hard curable resin, it can be firmly held at a predetermined interval. Moreover, the said cylindrical reflector can irradiate the light from a light emitting diode unit to a side part by making transparent or putting a fluorescent substance containing film body.

  According to the present invention, the upper and lower electrode type light emitting diode can be easily converted into a desired color only by changing the kind of the phosphor-containing film body.

  According to the present invention, when a light emitting diode unit is attached to a metal mold material having a substantially U-shaped cross section, since a one-liquid condensation type silicone adhesive having good thermal conductivity is used, heat dissipation from a long light emitting device is good. Productivity can be improved.

(First invention)
In the long light emitting device of the first invention, a plurality of light emitting diode units are arranged in series and / or in parallel on a metal mold having a substantially U-shaped cross section. At least two insulated metal substrates made of, for example, copper or a copper alloy are provided in an insulated state inside the metal mold having a substantially U-shaped cross section. In the vertical electrode type light emitting diode, the lower electrode is joined to one of the metal substrates, and the upper electrode and the other of the metal substrates are joined to each other by a conductive connecting member. By making the said conductive connection member into plate shape, not only can a large current flow, but it can also improve the heat dissipation effect. Further, the upper and lower electrode type light emitting diodes are mounted inside the metal mold material having a substantially U-shaped cross section, and the periphery thereof is sealed with a sealing material.

  The light emitting diode unit includes the two separated metal substrates, the one upper and lower electrode type light emitting diode, the conductive connecting member, the eutectic solder for joining them, and the sealing for sealing the periphery thereof. And at least the material. A desired number of the light emitting diode units are connected in series and / or in parallel via an insulating layer on the metal mold having a substantially U-shaped cross section to form a long light emitting device. The upper and lower electrode type light emitting diodes dissipate the generated heat, for example, from both an insulating layer made of a thermosetting, one-pack condensation type silicone adhesive and a metal substrate with a high current ( For example, 350 mmA or more) can be applied, so that the long light emitting device with high luminance was obtained.

(Second invention)
The long light emitting device of the second invention is provided with a desired number of light emitting diode units, and a phosphor-containing film is provided on the upper surface of the metal mold material having a substantially U-shaped cross section or the sealing material. The sealing material can be filled either inside the metal mold having a substantially U-shaped cross section, or provided only around the light emitting diode unit, or both. Moreover, the said fluorescent substance containing film body is provided in the surface of the said sealing material as needed, and converts the light emitted from the said upper-and-lower electrode type light emitting diode into a desired color.

(Third invention)
The metal mold material having a substantially U-shaped cross section according to the third aspect of the invention is made of aluminum, iron, copper, or an alloy thereof, and is formed into a U-shaped cross section or a shape that expands upward, with both ends and upper portions being open. A metal mold having a substantially U-shaped cross section made of aluminum, iron, copper, or an alloy thereof can irradiate light from the upper and lower electrode type light emitting diodes in a desired direction without forming a reflective film.

(Fourth invention)
In the long light emitting device according to the fourth aspect of the present invention, the connection portion between the metal substrate, the upper and lower electrodes of the upper and lower electrode type light emitting diodes, and the conductive connecting member is joined by eutectic solder. In the long light emitting device, when a plurality of light emitting diode units are attached to the wiring, even if normal solder is used, the melting point of the eutectic solder is higher, so that the junction of the light emitting diode units does not leave. .

(Fifth invention)
The long light emitting device according to the fifth aspect of the invention insulates the substantially U-shaped metal mold from the metal substrate and the entire surface of the substantially U-shaped metal mold or the lower part of the metal substrate. A layer is provided. The insulating layer uses a thermosetting, one-component condensation type silicone adhesive with good thermal conductivity, so that the metal plate with a substantially U-shaped cross section is bonded to the metal substrate in an insulating state in a short time. Not only can it be made easy, but also its heat dissipation is good, so that a high luminance can be obtained by passing a large amount of current through the upper and lower electrode type light emitting diodes.

(Sixth invention)
In the long light emitting device of the sixth aspect of the present invention, connectors for electrically connecting to light emitting diode units or power sources in other substantially U-shaped metal mold members are provided at both ends of the approximately U-shaped metal mold material. ing. The connector may have a structure that can be connected to each other, or a structure that can be connected via a lead wire or a cable. The connector can be provided at one end and the other end of the long cross-sectional substantially U-shaped metal mold material, and lead wires for connecting these are provided inside or outside the long cross-section approximately U-shaped metal mold material. It can be provided along.

(Seventh invention)
In the method for manufacturing a long light emitting device according to the seventh aspect of the present invention, at least the following steps are required to install a plurality of light emitting diode units on a metal mold having a substantially U-shaped cross section. In the first step, an aluminum, iron, copper, or alloy thereof is extruded from a mold to form a substantially U-shaped metal mold having an open top and end faces. In particular, since the mold used for the extrusion process of aluminum alloy is very inexpensive as compared with the mold for molding synthetic resin, the metal mold material having a substantially U-shaped cross section can be produced at low cost. In addition, light from the light emitting diode can be irradiated in a desired direction without providing a special reflective film.

  In addition, an insulating layer made of, for example, a one-pack condensation type silicone adhesive having a high thermal conductivity, which is a thermosetting adhesive, is provided on the inner bottom surface of the metal mold member having a substantially U-shaped cross section. The insulating layer can be provided on the entire bottom surface of the metal mold having a substantially U-shaped cross section or only on the two separated metal substrates. Furthermore, the long cross-section substantially U-shaped metal mold material and the metal substrate can be simultaneously bonded with the one-component condensation type silicone adhesive. Since the insulating layer uses a material with high thermal conductivity by using a thermosetting adhesive, the heat of the upper and lower electrode type light emitting diodes is substantially U-shaped in cross section. Heat can be easily dissipated through the metal mold, and a large current can flow through the upper and lower electrode type light emitting diodes.

  Also, one of the metal substrates and the lower electrode of the upper and lower electrode type light emitting diode are joined, and the upper electrode of the upper and lower electrode type light emitting diode and the other of the metal substrate are joined via a metal plate-like conductive connecting member. Eutectic solder is used for the above. It is desirable that the bonding is performed simultaneously by placing eutectic solder on the bonding portion, placing a member to be connected on the eutectic solder, and passing it through a reflow furnace. In this way, the light emitting diode unit is manufactured.

  In the second step, the light emitting diode units produced in the step are attached to a metal mold having a substantially U-shaped cross section at a desired number and position via the adhesive. Thereafter, a sealing material is sealed around the light emitting diode unit. When the light emitting diode unit and the light emitting diode unit are spaced apart from each other, the sealing material does not need to be filled in the entire metal mold having a substantially U-shaped cross section.

(Eighth invention)
According to an eighth aspect of the present invention, there is provided a method of manufacturing a long light emitting device, wherein a phosphor-containing film body is formed on a sealing material in a light emitting diode unit manufactured according to the seventh aspect of the invention. The phosphor-containing film body can convert the color of light emitted from the upper and lower electrode type light emitting diodes into a desired color.

(9th invention)
According to a ninth aspect of the present invention, there is provided a method of manufacturing a long light emitting device, wherein a substantially cylindrical reflector that straddles the insulated portion is joined to at least two insulated metal substrates of the seventh or eighth invention. Two metal substrates are held together. The two metal substrates are integrally held by a cylindrical reflector made of an insulating member having a strength that is not separated from each other.

(10th invention)
According to a tenth aspect of the present invention, there is provided a method for manufacturing a long light emitting device. Since the cylindrical reflector according to the ninth aspect is made of a ceramic material or a resin material, the light emitted from the light emitting diode unit has a substantially U-shaped cross section. Irradiated in the vertical direction.

(11th invention)
According to an eleventh aspect of the present invention, there is provided a method of manufacturing a long light emitting device, wherein a hard curable resin is circularly or linearly formed so as to straddle the insulating portion with respect to at least two insulated metal substrates according to the seventh to ninth aspects. Alternatively, it is applied so as to surround a part and then cured. The hard curable resin is held integrally with the two metal substrates while maintaining a predetermined interval and maintaining necessary insulation.

(Twelfth invention)
According to a twelfth aspect of the present invention, there is provided a method of manufacturing a long light emitting device, wherein a phosphor-containing film body is placed in a ceramic material or a curable resin material constituting the cylindrical reflector according to the tenth aspect of the invention, so After conversion to color, the cross-sectional substantially U-shaped metal mold can be irradiated in the length direction.

  FIGS. 1A to 1D are first embodiments of the present invention, and FIG. 1A is a schematic plan view of a long light emitting device in which three upper and lower electrode type light emitting diodes are attached to three pairs of metal substrates, (B) is a schematic sectional view in the longitudinal direction of (a), (c) is an example in which a pair of metal substrates are connected by two insulating members, and (d) is a pair of metal substrates connected by a circular cylindrical member. In this example, (e) is an example in which a pair of metal substrates are connected by an insulating member surrounding the light emitting diode. The schematics shown in FIGS. 1A and 1B are different from the actual dimensional ratio. In particular, the length direction is drawn in a contracted manner. 1 (a) and 1 (b), the long light emitting device 11 in the present embodiment is obtained by extruding aluminum, iron, copper, or an alloy thereof, for example, to one side using a mold not shown. Further, a metal mold 111 having a substantially U-shaped cross section, or expanding in the upward direction and having the upper and end faces opened, is produced.

  The metal mold 111 having a substantially U-shaped cross section has an insulating layer or insulating film 15 formed on the inner bottom surface. The insulating layer 15 can be provided with at least one layer by a known technique such as adhesion, coating, vapor deposition, or sputtering. In addition, at least one of the insulating sheets 15 can be attached with an adhesive. Further, when a one-pack condensation type liquid silicone adhesive blended with a special filler is used to increase the thermal conductivity, the insulating layer 15 is paste-like when uncured and reacts with moisture in the air to cause a slight amount of condensation. It hardens while releasing objects. Furthermore, the insulating layer 15 may be a heat dissipation sheet having a multilayer structure including a face change (PCS) layer, a graphite layer, a heat conductive layer, and a heat conductive vulcanized sheet layer. The adhesive and the sheet are those sold by Shin-Etsu Chemical.

  On the insulating layer, insulating film, or adhesive 15, a plurality of metal substrates 121, 122, 123 are arranged in series and / or in parallel via slits or gaps having a predetermined width. Lower electrodes (not shown) of upper and lower electrode type light emitting diodes 131, 132, and 133 are joined to the metal substrates 121, 122, and 123 by eutectic solder, for example. The upper electrode (no symbol) of the upper and lower electrode type light emitting diode 131 is a metal substrate or the like disposed adjacent to each other via a slit (no symbol) by conductive connecting members 141, 142, and 143 made of a plate-like metal member. Bonded by eutectic solder.

  Three upper and lower electrode type light emitting diodes 131, 132, and 133 in FIGS. 1A and 1B are provided on a metal mold 111 having a substantially U-shaped cross section through an insulating layer 15. It is not limited. However, it is convenient that the long light emitting device 11 is a multiple of three on the basis of three. The upper and lower electrode type light emitting diodes, the two metal substrates, and the conductive connecting member constitute one light emitting diode unit. The light emitting diode units are connected to connectors 161 and 164 in series by wirings 144, 145, 146 and 147. Connectors 161 and 163 are connected by a lead wire 171. The connector 162 is connected to the connector 164 by a lead wire 172.

  In the long light emitting device 11 connected as shown in FIG. 1A, upper and lower electrode type light emitting diodes 131, 132, and 133 are connected in series. It should be noted that the connectors 161 to 164 are provided at four locations so that any of both ends can be connected to a power source or another long light emitting device. Further, since the connector 161 and the connector 163 and the connector 162 and the connector 164 are connected by lead wires 171 and 172, the upper and lower electrode type light emitting diodes can be connected in parallel. As the connectors 161, 162, 163, 164, for example, a connector that is used for connection of illumination, etc., that is fitted by unevenness, or that is connected by a lead wire can be applied.

  As shown in FIG. 1C, the two insulated metal substrates 121 and 121 ′ are connected to each other by insulating members 181 and 182 that straddle them. In addition, as shown in FIG. 1 (d), the two insulated metal substrates 121 and 121 'are joined together by a substantially circular cylindrical reflector 183 straddling them. , Can be held together. The cylindrical reflector can be irradiated with light emitted from the light emitting diode unit in the lateral direction by being made of a transparent resin material. Furthermore, the cylindrical reflector can convert light from the upper and lower electrode type light emitting diodes into a desired color by putting a phosphor-containing film body in the transparent resin material. The insulated at least two metal substrates 121 and 121 ′ are coated with a hard curable resin in a circular shape, a straight shape, and a part of the metal substrate 121 and 121 ′ so as to straddle the insulating portion (see FIG. 1 (e)). By curing, each is held together.

  The plurality of upper and lower electrode type light emitting diodes connected in series are sealed with a sealing material filled in the metal mold 111 having a substantially U-shaped cross section. On the sealing material, for example, a phosphor-containing film body is provided to convert the light color of the upper and lower electrode type light emitting diodes into a desired color.

  As the upper and lower electrode type light emitting diode, a gallium nitride based upper and lower electrode type light emitting diode is used. For example, an active layer is provided between a p-type gallium nitride semiconductor layer and an n-type gallium nitride semiconductor layer. The gallium nitride-based upper / lower electrode type light emitting diode can obtain high luminance by flowing a large current.

  The pair of metal substrates 121, 122, and 123 can be plated with gold after the surface is silver-plated and has a high strength by containing a small amount of zinc in copper, for example. Further, the inside of the metal mold 111 having a substantially U-shaped cross section can be filled with a sealing material. Furthermore, the sealing material can seal only the periphery of the upper and lower electrode type light emitting diodes. The sealing material 17 can be of an elastomer type. The elastomer type resin preferably has a Shore A (rubber hardness) of 15 to 85, preferably 20 to 80. The sealing material having the hardness can relieve the thermal stress applied to the connection portion and the like.

  2 (a) to 2 (c) are schematic cross-sectional views in the width direction of the long light emitting device according to the second embodiment of the present invention. In FIG. 2 (a), a metal mold 111 having a substantially U-shaped cross section is extruded so that the cross section expands along the top and a flange 111-1 is formed at the bottom. The same insulating layer 15 as that of the first embodiment is formed on the bottom of the metal mold 111 having a substantially U-shaped cross section. On the insulating layer 15, the metal substrate 121, the upper and lower electrode type light emitting diodes 13, and the conductive connection member 142 are joined by eutectic solder or the like as in FIG. 1. A sealing material 18 is sealed inside the metal mold 111 having a substantially U-shaped cross section, and a phosphor-containing film body 19 is provided on the sealing material 18. The flange 111-1 of the metal mold 111 having a substantially U-shaped cross section is provided with lead wires 171 and 172 at the top.

  In FIG. 2 (b), a metal mold 211 having a substantially U-shaped cross section has a U-shaped cross section and is extruded so that a flange 211-1 is formed at the bottom. The embodiment shown in FIG. 2 (b) has a U-shaped cross section, and, for example, a lens 26 is provided between the sealing material 28 and the phosphor-containing film body 29. This is different from the long light emitting device shown in (a). Lead wires 271 and 272 connected to the connector are provided on the flange 211-1.

  In FIG. 2C, a metal mold 311 having a substantially U-shaped cross section is extruded so that the cross section has a U shape. In the embodiment shown in FIG. 2 (c), for example, a light reflecting member 36 is provided between the sealing material 28 and the phosphor-containing film body 29 in that the flange portion is not provided at the bottom. 2 is different from the long light emitting device shown in FIGS. Lead wires 371 and 372 connected to the connector are provided inside the metal mold 311 having a substantially U-shaped cross section.

  In the long light emitting device 31, the irregular reflection member 36 is not particularly limited in shape and material as long as light can diffuse in a desired direction. For example, the irregular reflection member 36 may be a small lens assembly, a member in which embossed lenses are continuously provided, or an embossed sheet. The shapes of the metal molds 111, 211, and 311 having a substantially U-shaped cross section, the lens, the irregular reflection member, the types of the upper and lower electrode type light emitting diodes, and the like are arbitrarily combined with each other in the examples shown in FIGS. be able to. The upper and lower electrode type light emitting diodes 13, 231 and 331 have a size of about 1.0 mm × 1.0 mm and a thickness of about 0.1 mm.

  FIGS. 3A to 3C are schematic plan views showing connection examples of light emitting diode units according to the third embodiment of the present invention. In FIG. 3A, the long light emitting device 31 includes three light emitting diode units, which are connected in parallel between a lead wire 371 connecting the connectors 161 and 163 and a lead wire 372 connecting the connectors 162 and 164. . The long light emitting device 31 composed of the three light emitting diode units can be connected to each other as one unit.

  In FIG. 3 (b), a long light emitting device 31 'is formed by connecting three light emitting diode units in series to form one unit. 3C, in the long light emitting device 31 ″, a unit long light emitting device in which a light emitting diode unit is connected in series is connected between a lead wire 371 and a lead wire 372 in parallel. The scale light emitting devices 31, 31 ′, 31 ″ can be connected to an arbitrary length, and thus are optimal as advertising backlights or lighting devices.

  4A to 4C are cross-sectional views for explaining the connection between the upper electrode bonded to one metal substrate and the other metal substrate. 4A, the light emitting device includes a metal mold 41 having a substantially U-shaped cross section, an insulating film 42 on the metal mold 41 having a substantially U-shaped cross section, metal substrates 43 and 46 on the insulating film 42, The upper and lower electrode type light emitting diodes 44 on the metal substrate 43, the upper electrode 442 of the upper and lower electrode type light emitting diode 44, and the conductive connection member 45 that connects the metal substrate 46.

  The metal substrate 46 is provided with bent convex portions 461 and concave portions 462. The metal substrate 46 may be provided with a convex portion on the upper portion by pressing instead of being bent into an approximately L shape as described above. The shape of the metal substrate 46 may be the same height as the upper electrode 442 of the upper and lower electrode type light emitting diode 44. Since the conductive connecting member 45 can be wired at the same height, it not only becomes the shortest distance wiring, but also has a small electric resistance and excellent heat dissipation even when a large current flows.

  In FIG. 4B, the conductive connecting member 451 connects the upper current 442 attached to the upper and lower electrode type light emitting diodes 44 by bending in a substantially L shape and the other metal substrate 46 ′. In FIG. 4C, a recess 47 is formed in the metal substrate 43 ′, and an upper and lower electrode type light emitting diode 44 is inserted into the recess 47 and a lower electrode 441 is joined. The conductive connection member 451 is bonded to a metal substrate 46 ′ having the same height as the upper electrode 442 of the upper and lower electrode type light emitting diode 44.

  FIG. 5 is an enlarged plan view for explaining a conductive connecting member for connecting the upper electrode of the upper and lower electrode type light emitting diode and the other metal substrate. In FIG. 5, a slit or gap 53 is provided between one metal substrate 51 and the other metal substrate 52. The upper electrode 55 of the upper and lower electrode type light emitting diode 54 has a wide area 552 connected to the opening 551 and the conductive connection member 56 in a square shape. The opening 551 has various deformations such as a letter shape, a square shape, and a U shape in addition to the square shape, and light can be efficiently emitted upward from this space.

  In addition, the conductive connection member 56 has, for example, two integrated connection portions 561, and the end portions thereof are connected to the spreading region 552 of the upper electrode 55 of the upper and lower electrode type light emitting diode 54. . The conductive connection member 56 has a large area on the metal substrate 52 side and is connected to the metal substrate 52. The conductive connection member 56 connects the upper electrode 54 of the upper and lower electrode type light emitting diode 54 and the metal substrate 52 by eutectic solder, for example. In the connection using the eutectic solder, the bonding strength can be increased by applying gold plating to each other.

  For example, in the long light emitting device shown in FIG. 1, three upper and lower electrode type light emitting diodes are incorporated in a metal mold material having a substantially U-shaped cross section. In the long light emitting device composed of the three upper and lower electrode type light emitting diodes, 3n upper and lower electrode type light emitting diodes can be connected in series and / or in parallel by connecting a metal substrate. In this case, the number of metal substrates is 3n + 1. However, when the both ends of the metal substrate are halved, the total length of the light emitting device is approximately the length of the metal substrate × 3n. However, n = 1, 2, 3,...

  In the method for manufacturing a light emitting device of the present invention, aluminum, iron, copper, or an alloy thereof is extruded with a die, for example, in a U-shaped cross section to produce a metal mold material having a substantially U-shaped cross section. The metal mold having a substantially U-shaped cross section is cut to a predetermined length, and an insulating film is formed on the bottom of the inside. The insulating film may be a heat conductive and thermosetting adhesive. On the insulating film, a desired number of metal substrates are arranged in series at a predetermined interval. One of the metal substrates is bonded to the lower electrode of the upper / lower electrode type light emitting diode by eutectic solder. The upper electrode of the upper and lower electrode type light emitting diode and the other of the metal substrate are joined with a conductive connecting member by eutectic solder. Thereafter, a sealing material and a phosphor-containing film body are provided on the upper part of the metal mold member having a substantially U-shaped cross section.

  The light emitting device having a predetermined length is convenient for mass production. The metal mold member having a substantially U-shaped cross section is formed so that the metal substrate protrudes or can be connected. When the light emitting device having the predetermined length is continued, the metal substrate may be connected before sealing the sealing material or may be connected after sealing the sealing material. The connection of the metal substrate after sealing the sealing material needs to be sealed with a mold that exposes the portion to be connected when sealing.

  The long light emitting device in which the upper and lower electrode type light emitting diodes made by the above method are a set of three, for example, has a metal substrate length of 90 mm, a space between the metal substrate of 0.5 mm, and the entire length. By setting the size to about 300 mm, it can be used for a light guide plate of a liquid crystal display device or a backlight of an advertisement display device or the like. In addition, the light emitting device can supply a power of 350 mmA or more to the gallium nitride-based upper / lower electrode type light emitting diode, and the luminance can be higher than that of the conventional device.

Comparative example

  The conventional gallium nitride upper / lower electrode type light emitting diode in which gold wires are connected by ultrasonic waves and the gallium nitride upper / lower electrode type light emitting diode of the present invention joined by eutectic solder and a metal member will be compared. In the conventional example, two gold wires with a diameter of 30 μm are used, and the defect of light emission is not caused by ultrasonic vibration of a wire bonder in which the upper electrode of the gallium nitride based upper and lower electrode type light emitting diode and the other of the metal substrate are connected by ultrasonic wire bonding. About 10% of non-defective products were generated. Furthermore, when 350 mA was energized, burning due to an energization abnormality of about 4% occurred. In the examples of the present invention, no defective product was generated even in the connection step and in the energization of 350 mA to 500 mA.

  As mentioned above, although the Example of this invention was explained in full detail, this invention is not limited to the said Example. The present invention can be modified in various ways without departing from the scope of the claims. The upper and lower electrodes of the upper and lower electrode type light emitting diode of the present invention, the metal substrate, the metal member, etc. are connected by eutectic solder, eutectic solder paste, eutectic solder and flux, gold-tin eutectic solder paste, indium eutectic solder A publicly known or well-known thing can be used. The eutectic solder includes, for example, gold and tin (20%), gold and tin (90%), gold and silica (3.15%), gold and germanium (12%), and others, tin-copper-nickel system , Tin-silver, tin-silver-copper, tin-silver-bismuth-indium, and tin-zinc eutectic solder. As the upper and lower electrode type light emitting diodes of the present invention, known or known ones can be used as described above. As the connector, sealing material, phosphor-containing film body, insulating layer, adhesive, and the like used in the present invention, known or well-known ones can be used.

(A) to (e) are the first embodiment of the present invention. (A) is a schematic plan view of a long light emitting device in which three upper and lower electrode type light emitting diodes are attached to three pairs of metal substrates. ) Is a schematic sectional view in the longitudinal direction of (A), (C) is an example in which a pair of metal substrates are connected by two insulating members, and (D) is an example in which a pair of metal substrates are connected by a circular cylindrical member. (E) is an example in which a pair of metal substrates are connected by an insulating member surrounding the light emitting diode. (Example 1) (A) to (c) are schematic cross-sectional views in the width direction of the long light emitting device according to the second embodiment of the present invention. (Example 2) (A) to (c) are schematic plan views showing connection examples of light emitting diode units according to a third embodiment of the present invention. (Example 3) (A) to (C) are cross-sectional views for explaining the connection between the upper electrode joined to one metal substrate and the other metal substrate. It is an enlarged plan view for demonstrating the electroconductive connection member which connects the upper electrode of a vertical electrode type light emitting diode, and the other metal substrate. (A) is a schematic sectional drawing for demonstrating the light emitting diode assembly in a prior art example, (b) is a top view for demonstrating the light emitting diode assembly in the said prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11, 21, 31 ... Long light-emitting device 111 ... Metal mold material 121, 122, 123 ... Metal substrate 131, 132, 133 ... Upper and lower electrode type light emitting diode 141, 142 , 143, 144, 145 ... conductive connecting member 15 ... insulating layer (insulating sheet, insulating film, adhesive)
161, 162, 163, 164, 165, 166 ... connectors 171, 172, 271, 272, 371, 372 ... phosphor-containing film bodies 18, 28, 38 ... sealing materials 19, 29, 39 ... Phosphor-containing film body 26 ... Lens 36 ... Light reflector

Claims (12)

In a long light-emitting device in which a plurality of light-emitting diode units are installed on a long-shaped substantially U-shaped metal mold,
At least two insulated metal substrates;
An upper and lower electrode type light emitting diode having a lower electrode bonded to one of the metal substrates;
A conductive connecting member for joining the upper electrode of the upper and lower electrode type light emitting diode and the other of the metal substrate;
A sealing material for sealing the periphery of the upper and lower electrode type light emitting diodes;
The light emitting diode unit composed at least from
A long light emitting device, wherein the long light emitting device is installed through an insulating layer on a metal mold having a substantially U-shaped cross section and is connected in series and / or in parallel.   The long light emitting device according to claim 1, wherein a phosphor-containing film body is provided on an upper surface of the sealing material.   The long metal section having a substantially U-shaped cross section is made of aluminum, iron, copper, or an alloy thereof, and has an open upper portion and has a U-shaped cross section or spreads upward. Item 5. The long light emitting device according to item 1 or item 2.   Bonding between one of the metal substrates and the lower electrode of the upper and lower electrode type light emitting diode, bonding between the upper electrode of the upper and lower electrode type light emitting diode and the conductive connection member, and the other of the conductive connection member and the metal substrate The elongate light-emitting device according to any one of claims 1 to 3, wherein eutectic solder is used for the bonding.   The insulating layer on the metal mold material having a substantially U-shaped cross section is a one-component condensation type silicone adhesive having a good thermal conductivity, according to any one of claims 1 to 4. The described long light emitting device.   At both ends of the long cross section substantially U-shaped metal mold material, there is provided a connector that is electrically connected to the light emitting diode unit or the power source in the other long cross section approximately U-shaped metal mold material. The long light-emitting device according to claim 1, wherein: In the manufacturing method of a long light emitting device in which a plurality of light emitting diodes are installed on the inner bottom surface of a metal mold material having a substantially U-shaped cross section,
And having at least two insulated metal substrates, and joining upper and lower electrode type light emitting diodes to one of the metal substrates with eutectic solder, and connecting the upper and lower electrode type light emitting diodes to the other of the metal substrates. Bonding with eutectic solder through each, and further manufacturing the light emitting diode unit by sealing the periphery of the upper and lower electrode type light emitting diode with a sealing material;
A step of adhering a plurality of the light emitting diode units with an insulating adhesive layer to the inner bottom surface of the metal mold material;
Each of the light emitting diode units is connected in series and / or in parallel.   The method for manufacturing a long light emitting device according to claim 7, wherein a phosphor-containing film body is formed on the sealing material.   9. The length according to claim 7, wherein the at least two insulated metal substrates are integrally held by joining a substantially cylindrical reflector so as to straddle the insulating portion. A method for manufacturing a light emitting device.   The method for manufacturing a long light emitting device according to claim 9, wherein the cylindrical reflector is made of a ceramic material or a resin material.   The at least two insulated metal substrates are integrally held by applying and curing a curable resin so as to surround the insulating portion in a circle, a straight line, or a part thereof. The manufacturing method of the elongate light-emitting device described in any one of Claims 7-9.   The method for manufacturing a long light emitting device according to claim 11, wherein the curable resin material contains a phosphor-containing film body.

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