CN104701446A - Light emitting diode packaging body manufacturing method - Google Patents

Abstract

The invention discloses a light emitting diode packaging body manufacturing method. The method comprises the following steps: an insulated substrate, a first electrode and a second electrode respectively located at two opposite sides of the insulated substrate, and a light emitting diode are provided, the light emitting diode is fixed to the one-side surface of the first electrode and the second electrode, the surface of the first electrode and the second electrode and the light emitting diode are arranged at an interval, and a gap is formed, and the insulated substrate is provided with a through hole facing and communicating towards the gap; a dispenser is provided, the dispenser is filled with heat conductive adhesive, the dispenser sprays the adhesive from the through hole towards the gap until the heat conductive adhesive fills the gap; and the heat conductive adhesive is quickly cured. As the heat conductive adhesive fills every place of the gap, and effects that the heat-transfer rate at each place of the light emitting diode is consistent can be achieved.

Description

Manufacturing method of light emitting diode package

technical field

The invention relates to a semiconductor element, in particular to a method for manufacturing a light emitting diode package.

Background technique

A conventional light emitting diode package includes electrodes and a light emitting diode fixed above the electrodes by means of flip-chip or eutectic. There is a gap between the light emitting diode and the electrode. Due to the low thermal conductivity of the air, it is easy to cause the life of the light-emitting diode to be shortened due to the inability to quickly dissipate the heat everywhere.

Contents of the invention

In view of this, it is necessary to provide a manufacturing method capable of ensuring the stability of the LED package.

A method for manufacturing a light-emitting diode package, comprising the following steps:

Provide an insulating substrate, a first electrode, a second electrode, and a light-emitting diode on opposite sides of the insulating substrate with chalk, fix the light-emitting diode and one side surface of the first electrode and the second electrode, and the first electrode and the second electrode The space between the surface of the two electrodes and the light-emitting diode is arranged to form a gap, and the insulating substrate is provided with a through hole facing and communicating with the gap;

providing a glue dispenser and filling the glue dispenser with thermally conductive glue, and then causing the glue dispenser to spray glue from the through hole toward the gap until the heat conductive glue fills the gap;

Fast curing of the thermal paste.

In the present invention, since the heat-conducting adhesive fills all the gaps, the effect of making the heat transfer speed of the light-emitting diodes consistent is achieved.

Description of drawings

FIG. 1 is a top view of the main body of the LED package during the manufacturing process of the LED package according to the first embodiment of the present invention.

FIG. 2 is a cross-sectional view of the main body of the LED package along the II-II line in FIG. 1 .

FIG. 3 is a cross-sectional view of the main body of the light emitting diode package along section III-III in FIG. 1 .

4 and 5 are schematic diagrams of the process of injecting glue into the main body.

6 is a cross-sectional view of a light emitting diode package.

7 is a cross-sectional view of the main body of the LED package during the manufacturing process of the LED package according to the second embodiment of the present invention.

Description of main component symbols

insulating substrate 10 through hole 11, 11a first electrode 20 second electrode 30 led 40 pad 41 gap 43 Reflector 50 containment cavity 51 Dispenser 60 thermal paste 63 Encapsulation glue 70 first through hole 112a second through hole 114a

The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings.

Detailed ways

The manufacturing method of the light emitting diode package of the preferred embodiment of the present invention comprises the following steps:

Referring to FIG. 1 to FIG. 3 , a light emitting diode body is provided. The light-emitting diode body includes an insulating substrate 10, a first electrode 20 and a second electrode 30 respectively located on opposite sides of the insulating substrate 10, an electrode located under the insulating substrate 10 and electrically connected to the first electrode 20 and the second electrode 30. The light emitting diode 40 and a reflective cup 50 fixed on the first electrode 20 and the second electrode 30 and surrounding the light emitting diode 40 .

The longitudinal section of the insulating substrate 10 is in a "T" shape with a wide top and a narrow bottom, and is made of insulating material with good thermal conductivity. The middle part of the insulating substrate 10 is provided with a through hole 11 penetrating through the upper and lower surfaces. The cross section of the through hole 11 is oval, and the longitudinal section is rectangular.

The inner ends of the first electrode 20 and the second electrode 30 are respectively engaged with opposite sides of the insulating substrate 10, and the upper surface and the lower surface of the first electrode 20 and the second electrode 30 are respectively connected with the upper surface and the lower surface of the insulating substrate 10. The lower surfaces are coplanar.

Two welding pads 41 are disposed on the upper surface of the LED 40 . The two welding pads 41 are respectively welded on the lower surfaces of the first electrode 20 and the second electrode 30 so as to fix the LED 40 and electrically connect with the first electrode 20 and the second electrode 30 respectively. The top surface of the light emitting diode 40 is spaced apart from the bottom surfaces of the first electrode 20 and the second electrode 30 to form a gap 43 . The through hole 11 of the insulating substrate 10 is arranged in communication with the middle of the gap 43 .

The reflective cup 50 is a hollow cup, the top of which is fixed on the outer ends of the first electrode 20 and the second electrode 30 away from the LED 40 . The inner surface of the reflective cup 50 , the lower surface of the first electrode 20 , the lower surface of the second electrode 30 and the lower surface of the insulating substrate 10 jointly form a receiving cavity 51 .

4 to 6, provide a dispenser 60 and fill the dispenser 60 with thermally conductive glue 63, and then make the dispenser 60 spray glue toward the top of the through hole 11 of the insulating substrate 10 to make the heat conduction The glue 63 flows into the gap 43 from the through hole 11 until the thermal conductive glue 63 fills the gap 43 .

In this embodiment, the heat-conducting glue 63 can be heat-conducting plastic or silica gel.

Fast curing of the thermal conductive glue 63 .

Please refer to FIG. 4 , reverse the main body of the light emitting diode, and then provide a plurality of encapsulants 70 to fill the receiving cavity 51 , and then cure the encapsulants 70 . The packaging glue 70 can be a single transparent glue or a transparent glue mixed with fluorescent powder.

In the present invention, because the thermally conductive adhesive 63 is injected into the gap 43 from the vertical direction through the through hole 11 facing and connected to the gap 43, and then fills up the gaps under the impact force and gravity of the thermally conductive adhesive 63 during the injection process. Therefore, the effect of making the heat transfer rate of the light emitting diode 40 consistent everywhere can be achieved.

Please refer to FIG. 7 at the same time. The manufacturing method of the light-emitting diode package in the second embodiment of the present invention is similar to that in the first embodiment, except that in this embodiment, the through hole 11a is a structure with a wide top and a narrow bottom. T"-shaped structure, including a first through hole 112a and a second through hole 114a, the diameter of the second through hole 114a is smaller than that of the first through hole 112a, and the second through hole 114a faces and communicates with the first through hole 114a. The middle part of a through-hole part 112a. The second through hole portion 114 a is opposite to and communicates with the gap 43 . In this embodiment, since the thermally conductive adhesive 63 flows into the gap 43 through the hole 11, and the through hole 11a has a structure that is wide at the top and narrow at the bottom, in this way, when the thermally conductive adhesive 63 flows toward the gap 43, because the inner diameter of the through hole 11a is from the first The reduction from the first through hole portion 112a to the second through hole portion 114a has a tendency to accelerate the downward flow of the thermally conductive glue 63 , thereby speeding up the glue dispensing process and saving the glue dispensing time.

It can be understood that, in other embodiments, the inner diameter of the through hole 11 a may also be in other shapes that gradually decrease from top to bottom, as long as it can accelerate the flow of the thermally conductive glue 63 .

It can be understood that those skilled in the art can make various other corresponding changes and modifications according to the technical concept of the present invention, and all these changes and modifications should belong to the protection scope of the claims of the present invention.

Claims (9)

1. a manufacture method for LED encapsulation body, comprises the following steps:

Insulated substrate is provided, the first electrode, the second electrode, light-emitting diode that chalk is positioned at the relative both sides of insulated substrate, one side surface of fixing described light-emitting diode and described first electrode and the second electrode, the described surface of described first electrode and the second electrode and the interval of light-emitting diode arrange and are formed with space, and described insulated substrate offers towards and the through hole be communicated with space;

Point gum machine be provided and fill heat-conducting glue by described point gum machine, then making described point gum machine from described through hole towards described space glue spraying until heat-conducting glue fills up described space;

Heat-conducting glue described in rapid curing.

2. the manufacture method of LED encapsulation body as claimed in claim 1, is characterized in that: the aperture of described through hole is greater than described one end near described space away from the one end in described space.

3. the manufacture method of LED encapsulation body as claimed in claim 2, is characterized in that: the aperture of described through hole reduces to the one end near described space gradually from the one end away from space.

4. the manufacture method of LED encapsulation body as claimed in claim 2, is characterized in that: that to be longitudinal section be described through hole is wide at the top and narrow at the bottom "T"-shaped, comprises the first through-hole section and is positioned at second through-hole section at middle part below the first through-hole section.

5. the manufacture method of LED encapsulation body as claimed in claim 1, is characterized in that: described heat-conducting glue can be heat conduction plastic cement or silica gel.

6. the manufacture method of LED encapsulation body as claimed in claim 1, is characterized in that: the middle part in described through hole and described space is just to setting.

7. the manufacture method of LED encapsulation body as claimed in claim 1, is characterized in that: provide reflector empty in, and described reflector is fixed on the first electrode and the second electrode away from the outer end of light-emitting diode and encloses light-emitting diode.

8. the manufacture method of LED encapsulation body as claimed in claim 7, is characterized in that: provide some packaging plastics and make described packaging plastic fill up described reflector, then solidifying described packaging plastic.

9. the manufacture method of LED encapsulation body as claimed in claim 8, is characterized in that: described packaging plastic is single transparent colloid or the transparent colloid being mixed with fluorescent material.