CN104617051A - Preset adhesive film chip and implementation method thereof - Google Patents
Preset adhesive film chip and implementation method thereof Download PDFInfo
- Publication number
- CN104617051A CN104617051A CN201410855552.0A CN201410855552A CN104617051A CN 104617051 A CN104617051 A CN 104617051A CN 201410855552 A CN201410855552 A CN 201410855552A CN 104617051 A CN104617051 A CN 104617051A
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- Prior art keywords
- chip
- glued membrane
- wafer
- circuit layer
- adhesive film
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- 239000002313 adhesive film Substances 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000012528 membrane Substances 0.000 claims description 74
- 238000005520 cutting process Methods 0.000 claims description 20
- 238000010438 heat treatment Methods 0.000 claims description 12
- 239000000084 colloidal system Substances 0.000 claims description 11
- 238000007711 solidification Methods 0.000 claims description 9
- 230000008023 solidification Effects 0.000 claims description 9
- 230000008569 process Effects 0.000 claims description 7
- 230000008859 change Effects 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 238000004026 adhesive bonding Methods 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 19
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 abstract 2
- 230000001070 adhesive effect Effects 0.000 abstract 2
- 238000000151 deposition Methods 0.000 abstract 2
- 230000007547 defect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 10
- 239000003292 glue Substances 0.000 description 7
- 238000005538 encapsulation Methods 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 229910052709 silver Inorganic materials 0.000 description 5
- 239000004332 silver Substances 0.000 description 5
- 239000002002 slurry Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000007306 turnover Effects 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Die Bonding (AREA)
Abstract
The invention discloses a preset adhesive film chip and an implementation method thereof. An adhesive film layer is preset at the back of a circuit layer of a chip and correspondingly and closely fitted to the back of the circuit layer of the chip in a matched manner. The adhesive film layer is preset in the back of the chip, and the chip is mounted on a carrier tape to heat and solidify, then is welded through a lead, packaged, tested and the like to form a packaging module with a stable performance. The module is packaged by the chip, an adhesive depositing working procedure of a device can be omitted, production efficiency is greatly improved, the defect rate caused by an adhesive depositing manufacturing procedure is avoided, product cost is effectively reduced, and an existing device can be used for mass production in the whole production process.
Description
Technical field
The present invention relates to a kind of integrated circuit (IC) chip and integrated antenna package technology, particularly a kind of smart card integrated circuit (IC) chip.
Background technology
Along with the continuous progress of integrated antenna package technology, the integrated level of integrated circuit improves day by day, and function is more and more abundanter.For the new opplication demand constantly occurred, require that integrated antenna package enterprise can design novel packing forms to coordinate new demand.
At present, in field of semiconductor package, the mode of die bond mostly adopts the mode of silver slurry point glue die bond; Particularly in smart card module encapsulation field, chip is installed on carrier band by traditional smart card module mode of silver slurry die bond that all adopts without exception, by heating by the solidification of silver slurry, then carries out the operations such as follow-up wire bonds, encapsulation, test.Adopt the technique of silver slurry point glue, there is complex production process, material cost is high, spillage of material is large, the shortcomings such as production efficiency is low.
For this reason, develop new production technology and new technology, that this area needs the problem that will solve badly, also occurred in industry adopting the technique of encapsulation to carry out the production that alternative traditional wire bonds technique realizes smart card module, but this mode has its limitation, the versatility of such as carrier band is not strong, the belt for smart card that often kind of necessary Aided design of chip is special, pad on carrier band and the necessary one_to_one corresponding of chip, change chip must change carrier band simultaneously, this mode is for small batch, and the production of polytypic is very unfavorable.
Summary of the invention
The problem such as high and production efficiency is low for existing smart card module complex production process, production cost, an object of the present invention is the chip providing a kind of preset glued membrane.
Two of object of the present invention is the implementation of the chip providing a kind of above-mentioned preset glued membrane.
The intelligent card chip that the present invention utilizes said method to realize, can be advantageously used in smart card and field of semiconductor package, effectively can simplify production procedure, enhance productivity, more reduce the production cost of product.
In order to achieve the above object, the present invention adopts following technical scheme:
Object 1: a kind of chip of preset glued membrane, comprises chip circuit layer, it is characterized in that, described chip also comprises adhesive film, and described adhesive film is preset in the reverse side of the circuit layer of chip, the circuit layer reverse side corresponding matching of this adhesive film and chip and fitting tightly.
Further, described adhesive film has the characteristic varying with temperature and produce state and viscosity change, and under normal temperature, glued membrane is solid-state, and after heating, glued membrane melts, and produces stronger cohesive force, and the low temperature melt temperature of glued membrane is between 50-100 DEG C.
Further, described adhesive film solidifies at normal temperatures after a low-temperature heat is melted, and can not again melt when secondary low-temperature heat.
Further, described adhesive film solidifies at normal temperatures after a low-temperature heat is melted, and can again melt when secondary low-temperature heat.
Further, described adhesive film reaches final solidification after 100-200 DEG C of quick high-temp heating, and after final solidification, heating can not be melted again, has the characteristic that can not recall.
Further, described adhesive film thickness is evenly 5 ~ 30um.
Object 2: a kind of implementation method of chip of preset glued membrane, described method comprises the steps:
(1) wafer turns over film: together with film adhered with die bond for the circuit layer front of the wafer needing cutting, and overturn, expose wafer circuit layer reverse side;
(2) gluing: cover one deck glued membrane at the circuit layer reverse side of wafer;
(3) solidify: the wafer obtained by step (2) is cured, forms an adhesive film at the circuit layer reverse side of wafer;
(4) wafer turns over film again: the wafer covering glued membrane obtained step (3), the die bond film of removing circuit layer front laminating, and overturn, together with film adhered with new die bond for the adhesive film of wafer circuit layer reverse side, expose the circuit layer front of wafer;
(5) cut: wafer is obtained to step (4), is cut by chip cutting equipment, make to isolate single independently chip.
Further, adopted the colloid of semifluid shape in described step (2) by automatic double surface gluer, carry out the whole surface of colloid even spread to wafer circuit layer reverse side through coating process, and colloid thickness is even.
Further, described step (2) adopts the glued membrane of solid shape through attaching process, glued membrane entirely to be attached to the whole surface of wafer circuit layer reverse side, glued membrane bubble-free, non-wrinkled, and removes unnecessary glued membrane.
Further, it is characterized in that, described step (5) adopts wafer cutting equipment to be separated completely by the wafer body being prefixed glued membrane, and the severity control of cutting groove is being greater than the degree of depth bottom glued membrane.
The chip of preset glued membrane provided by the invention, it can save the technique of the silver slurry point glue in die bond process in actual application, the processing procedure be heating and curing more can be eliminated under partial picture, greatly save the production time, improve production efficiency, also reduce due to a glue debugging and the raw material loss of waste simultaneously, and thoroughly solve the fraction defective problem in a glue process, for the batch production of product provides technical guarantee.
Moreover scheme provided by the invention can adapt to the encapsulation requirement of semiconductor, integrated circuit fields, is more suitable for the innovation and application in smart card module field, greatly will promote the development of global smart card module Packaging Industry, there is good application prospect.
Accompanying drawing explanation
The present invention is further illustrated below in conjunction with the drawings and specific embodiments.
Fig. 1 is the schematic diagram that in the present invention, the wafer circuit back side attaches die bond film;
Fig. 2 is that in the present invention, wafer circuit face attaches die bond film and is coated with the schematic diagram of glued membrane;
Fig. 3 is through being prefixed the schematic diagram of wafer after cutting action of glued membrane in the present invention;
Fig. 4 is one single chip in the present invention after preset glued membrane and glued membrane schematic diagram.
Embodiment
The technological means realized to make the present invention, creation characteristic, reaching object and effect is easy to understand, below in conjunction with concrete diagram, setting forth the present invention further.
See Fig. 4, it is depicted as one single chip after preset glued membrane provided by the invention and glued membrane schematic diagram.
As seen from the figure, whole chip is made up of chip circuit layer 32 and the preset and adhesive film 4 covering chip circuit layer 32 reverse side.This adhesive film 4 thickness is even, and its size, shape are all corresponding with chip circuit layer 32 aspect, and fit tightly in chip circuit layer 32.
When specific implementation, the glued membrane forming adhesive film 4 has the characteristic varying with temperature and produce state and viscosity change, and under normal temperature, glued membrane is solid-state, and after heating, glued membrane melts, and produces stronger cohesive force, and the low temperature melt temperature of glued membrane is between 50-100 DEG C.
Further, the glued membrane forming adhesive film 4 solidifies at normal temperatures after a low-temperature heat is melted, and can not again melt when secondary low-temperature heat.
As an alternative, form the glued membrane of adhesive film 4, also can adopt and solidify at normal temperatures after a low-temperature heat is melted, the glued membrane that can again melt when secondary low-temperature heat.
As an alternative, form the glued membrane of adhesive film 4, also can adopt and reach final solidification after 100-200 DEG C of quick high-temp heating, after final solidification, heating can not be melted again, has the glued membrane of the characteristic that can not recall.
The thickness of the adhesive film 4 utilizing above-mentioned glued membrane to form is even, and thickness is 5 ~ 30um.
For the one single chip of above-mentioned preset glued membrane, the present invention is realized by following processing step:
(1) wafer turns over film: together with film adhered with die bond for the circuit layer front of the wafer needing cutting, or the die bond film of circuit layer reverse side of having fitted is removed, after turning over turnback, together with film adhered with die bond for circuit layer front, and expose the circuit layer reverse side of wafer;
(2) gluing: by the semifluid glue-line of automatic double surface gluer at the circuit layer reverse side coating thin layer of wafer, glue-line needs the whole wafer of complete application, and the bondline thickness of regional keeps evenly.
As an alternative, this step can adopt the glued membrane of solid shape through attaching process, glued membrane entirely to be attached to the whole surface of wafer circuit reverse side, glued membrane bubble-free, non-wrinkled, and removes unnecessary glued membrane, realizes gluing thus.
(3) solidify: the wafer obtained by step (2) is cured, the reverse side of wafer circuit layer is formed one deck adhesive film.
(4) wafer turns over film again: the wafer covering adhesive film obtained step (3), remove die bond film on its front, after turning over turnback, together with film adhered with new die bond for the glued membrane face on wafer circuit layer reverse side, and expose the circuit layer front of wafer.
(5) cut: wafer is obtained to step (4), is cut by chip cutting equipment, make the chip isolating single independently preset glued membrane.
This step is when adopting wafer cutting equipment to be separated completely by the wafer body being prefixed glued membrane, and the severity control of the cutting groove of chip chamber is being greater than the degree of depth bottom glued membrane.
The solution of the present invention is further illustrated below by way of an instantiation:
See Fig. 1, it is depicted as the wafer circuit back side in this example and attaches the schematic diagram of die bond film.
Generally, without the wafer 3 of cutting processing, its circuit face mark 31 is upwards placed, and wafer attachment is got up by the film colloid 21 on die bond film by the circuit reverse side of wafer and die bond film 2, plays the effect of fixing wafer.Metal supporting frames 1 is for being reliably fixed up smooth for die bond film.
Before carrying out coating process, need wafer 3 to turn over turnback, namely make circuit labels face (i.e. front) place downwards, make the circuit face of wafer and die bond film adhered.Turn over mold process should adopt first paste new film after carry out except the mode of old film, film should attach reliably smooth,
See Fig. 2, attach die bond film for wafer circuit face in this example and be coated with the schematic diagram of glued membrane, after turning over mold technique through wafer, die bond film 2 is effectively fixed up by metal supporting frames 1, together with the circuit face of wafer 3 is attached to the film colloid 21 of die bond film; Further, the circuit reverse side of wafer 3 exposes.
For the circuit reverse side of the wafer 3 exposed, by automatic double surface gluer, colloid is coated on the circuit reverse side surface of wafer 3, after solidification, forms adhesive film 4.
After glued membrane parches completely, again wafer is turned over mould, the film colloid 21 of the adhesive film 4 and die bond film 2 that are prefixed the wafer of glued membrane is fit together, (see Fig. 3) to be cut.
See Fig. 3, in this example through being prefixed the schematic diagram of wafer after cutting action of glued membrane.Being coated with and turning over the wafer of mould by wafer cutting equipment well cutting on request by completing glued membrane, forming many independently chip 32 uses to be packaged.Detailed process is as follows:
Complete the wafer of glued membrane coating and solidification, by metal supporting frames 1, die bond film 2 is effectively fixed up, through turning over mould, make the circuit face mark 31 of wafer 3 upwards, adhesive film 4 forms corresponding cutting groove 33, makes between chip 32 separate together with being attached to the film colloid 21 of die bond film 2 downwards between chip 32, glued membrane 4 bottom chip 32 is also independent by cutting groove 33, and the severity control of this cutting groove is being greater than the degree of depth bottom glued membrane.
See Fig. 4, be the one single chip in this example after preset glued membrane and glued membrane schematic diagram, chip is removed rear adhesive film 4 and chip 32 is attached together.
When utilizing the above-mentioned chip being prefixed glued membrane to carry out the production of smart card module, chip is arranged on carrier band and is heating and curing, then through techniques such as wire bonds, encapsulation, tests, the package module that forming property is stable.This chip is adopted to carry out the encapsulation of module, not only can save the operation of equipment point glue, substantially increase production efficiency, avoid the fraction defective because a glue processing procedure produces simultaneously, effectively reduce product cost, whole production process can adopt existing equipment and produce in enormous quantities.
More than show and describe general principle of the present invention, principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and specification just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection range is defined by appending claims and equivalent thereof.
Claims (10)
1. a chip for preset glued membrane, comprises chip circuit layer, it is characterized in that, described chip also comprises adhesive film, and described adhesive film is preset in the reverse side of the circuit layer of chip, the circuit layer reverse side corresponding matching of this adhesive film and chip and fitting tightly.
2. the chip of a kind of preset glued membrane according to claim 1, it is characterized in that, described adhesive film has the characteristic varying with temperature and produce state and viscosity change, under normal temperature, glued membrane is solid-state, after heating, glued membrane melts, and producing stronger cohesive force, the low temperature melt temperature of glued membrane is between 50-100 DEG C.
3. the chip of a kind of preset glued membrane according to claim 1, is characterized in that, described adhesive film solidifies at normal temperatures after a low-temperature heat is melted, and can not again melt when secondary low-temperature heat.
4. the chip of a kind of preset glued membrane according to claim 1, is characterized in that, described adhesive film solidifies at normal temperatures after a low-temperature heat is melted, and can again melt when secondary low-temperature heat.
5. the chip of a kind of preset glued membrane according to claim 1, is characterized in that, described adhesive film reaches final solidification after 100-200 DEG C of quick high-temp heating, and after final solidification, heating can not be melted again, has the characteristic that can not recall.
6. the chip of a kind of preset glued membrane according to any one of claim 1-5, is characterized in that, described adhesive film thickness is evenly 5 ~ 30um.
7. an implementation method for the chip of preset glued membrane, is characterized in that, described method comprises the steps:
(1) wafer turns over film: together with film adhered with die bond for the circuit layer front of the wafer needing cutting, and overturn, expose wafer circuit layer reverse side;
(2) gluing: cover one deck glued membrane at the circuit layer reverse side of wafer;
(3) solidify: the wafer obtained by step (2) is cured, forms an adhesive film at the circuit layer reverse side of wafer;
(4) wafer turns over film again: the wafer covering glued membrane obtained step (3), the die bond film of removing circuit layer front laminating, and overturn, together with film adhered with new die bond for the adhesive film of wafer circuit layer reverse side, expose the circuit layer front of wafer;
(5) cut: wafer is obtained to step (4), is cut by chip cutting equipment, make to isolate single independently chip.
8. the implementation method of the chip of a kind of preset glued membrane according to claim 7, it is characterized in that, adopted the colloid of semifluid shape by automatic double surface gluer in described step (2), carry out the whole surface of colloid even spread to wafer circuit layer reverse side through coating process, and colloid thickness is even.
9. the implementation method of the chip of a kind of preset glued membrane according to claim 7, it is characterized in that, described step (2) adopts the glued membrane of solid shape through attaching process, glued membrane entirely to be attached to the whole surface of wafer circuit layer reverse side, glued membrane bubble-free, non-wrinkled, and remove unnecessary glued membrane.
10. the implementation method of the chip of a kind of preset glued membrane according to claim 7, it is characterized in that, it is characterized in that, described step (5) adopts wafer cutting equipment to be separated completely by the wafer body being prefixed glued membrane, and the severity control of cutting groove is being greater than the degree of depth bottom glued membrane.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410855552.0A CN104617051A (en) | 2014-12-30 | 2014-12-30 | Preset adhesive film chip and implementation method thereof |
| PCT/CN2015/094436 WO2016107298A1 (en) | 2014-12-30 | 2015-11-12 | Molding packaged mini mobile phone intelligent card, and packing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410855552.0A CN104617051A (en) | 2014-12-30 | 2014-12-30 | Preset adhesive film chip and implementation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104617051A true CN104617051A (en) | 2015-05-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410855552.0A Pending CN104617051A (en) | 2014-12-30 | 2014-12-30 | Preset adhesive film chip and implementation method thereof |
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| CN (1) | CN104617051A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107359128A (en) * | 2017-06-14 | 2017-11-17 | 广东欧珀移动通信有限公司 | A chip packaging method, chip packaging structure and mobile terminal |
| CN107516651A (en) * | 2016-06-16 | 2017-12-26 | 宁波舜宇光电信息有限公司 | Photosensory assembly and camera module and its manufacture method |
| CN107545296A (en) * | 2016-06-24 | 2018-01-05 | 苏州赛尼诗电子科技有限公司 | RFID preparation method |
| CN109284716A (en) * | 2018-09-21 | 2019-01-29 | 京东方科技集团股份有限公司 | A substrate, a display panel and a display device |
| CN109979856A (en) * | 2019-04-03 | 2019-07-05 | 深圳市联得自动化装备股份有限公司 | Upside-down mounting die bond device and method thereof |
| CN111422819A (en) * | 2020-03-30 | 2020-07-17 | 歌尔微电子有限公司 | Sensor packaging structure, packaging method thereof and electronic equipment |
| CN112894165A (en) * | 2021-01-20 | 2021-06-04 | 湖北五方晶体有限公司 | Laser cutting method for glass organic layer composite material |
| CN113838782A (en) * | 2021-09-29 | 2021-12-24 | 深圳市高创自动化技术有限公司 | Full-automatic glue dispensing equipment for IGBT production |
| US12021097B2 (en) | 2016-03-12 | 2024-06-25 | Ningbo Sunny Opotech Co., Ltd. | Camera module, and photosensitive component thereof and manufacturing method therefor |
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| CN109979856A (en) * | 2019-04-03 | 2019-07-05 | 深圳市联得自动化装备股份有限公司 | Upside-down mounting die bond device and method thereof |
| CN111422819A (en) * | 2020-03-30 | 2020-07-17 | 歌尔微电子有限公司 | Sensor packaging structure, packaging method thereof and electronic equipment |
| CN112894165A (en) * | 2021-01-20 | 2021-06-04 | 湖北五方晶体有限公司 | Laser cutting method for glass organic layer composite material |
| CN113838782A (en) * | 2021-09-29 | 2021-12-24 | 深圳市高创自动化技术有限公司 | Full-automatic glue dispensing equipment for IGBT production |
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Application publication date: 20150513 |
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