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CN104600181A - 一种led灯条及其制备方法 - Google Patents

一种led灯条及其制备方法 Download PDF

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Publication number
CN104600181A
CN104600181A CN201510046804.XA CN201510046804A CN104600181A CN 104600181 A CN104600181 A CN 104600181A CN 201510046804 A CN201510046804 A CN 201510046804A CN 104600181 A CN104600181 A CN 104600181A
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led
light bar
powder
adhesive layer
fluorescent powder
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章少华
丁磊
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Jiangxi Hejing Technology Co Ltd
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Jiangxi Hejing Technology Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

本发明提供一种LED灯条的制备方法，包括准备条状透光基板，在透光基板上形成若干个第一荧光粉胶层并固化，在各个第一荧光粉胶层上固定LED芯片，打线连接LED芯片，并与电极相连，在LED芯片上形成第二荧光粉胶层。本发明通过在透光基板和LED芯片的接触面上设有一荧光粉胶层，实现LED灯条的360°全周出光，并且减少了荧光粉的使用，降低了生产成本；通过在荧光粉胶层中添加散热材料，提高了灯条的散热效果和可靠性。

Description

一种LED灯条及其制备方法
技术领域
本发明涉及LED照明技术领域，尤其涉及一种LED灯条及其制备方法。
背景技术
传统照明灯具的灯丝一般由钨丝等可直接发光的金属丝构成，这类灯丝普遍存在着寿命短、功耗大、散热差等缺陷，且一般仅能发出黄色光，显色性较差。
LED 是发光二极管（LED，Lighting emitted diode），是利用在电场作用下PN 结发光的固态发光器件，具有高寿命、环保、节能的特点，是绿色环保的新光源。随着科技的发展，LED灯逐渐取代传统的照明灯具。LED 技术日趋发展成熟，目前LED 白光是通过蓝色芯片激发黄、红、绿色荧光粉，进行波长调和而产生出的白光，目前LED 的发光效率已经超过大部分传统光源。
目前现有的一种LED灯条是先将LED固定在金属丝上，从而封装成LED灯条的方法。该种灯条不能实现360°发光，只能通过多条LED灯条组合才能实现全周光。另外还有一种LED灯条，是通过在透明基板上固定LED芯片，然后通过在芯片的表面包封荧光胶，在透明基板的另一表面也涂覆一层荧光胶。该种LED灯条由于LED包封在荧光胶体内，在使用的过程中，其散热效果不好，最终导致LED灯条产生比较严重的光衰。同时，这种LED灯条需要使用比较多的荧光粉胶，因此也增加了成本。
发明内容
本发明所要解决的第一个技术问题是提供一种LED灯条的制备方法。通过该方法制得的LED灯条不仅能发出360°全周光，而且具有发光亮度均匀性高、散热效果好、成本低的特点。
本发明所要解决的第二个技术问题是提供一种LED灯条。该LED灯条不仅能发出360°全周光，而且具有发光亮度均匀性高、散热效果好、成本低的特点。
为了解决本发明所提出的第一个技术问题，本发明提供一种LED灯条的制备方法，包括准备条状透光基板，在透光基板上形成若干个第一荧光粉胶层并固化，在各个第一荧光粉胶层上固定LED芯片，打线连接LED芯片，并与电极相连，在LED芯片上形成第二荧光粉胶层。
优选地，所述透光基板包括蓝宝石基板、玻璃基板、透明陶瓷基板、白陶瓷基板中的一种。
优选地，所述第一荧光粉胶层为含有荧光粉和散热材料的环氧树脂。
优选地，所述荧光粉和散热材料的质量与环氧树脂的质量比大于5:1。
优选地，所述散热材料是下列材料的一种或多种：氮化铝粉，氧化铝粉，金刚石粉，石墨烯粉。
优选地，所述第一荧光粉胶层的形状为正方形、长方形、圆形中的一种，且各个第一荧光粉胶层相互隔离。
为了解决本发明所提出的第二个技术问题，本发明提供一种LED灯条，包括条状透光基板、位于透光基板上的若干颗电连接的LED芯片，位于LED芯片上的第二荧光粉胶层，以及位于透光基板两端的电极，在LED芯片和透光基板之间设有第一荧光粉胶层，LED芯片固定在固化的第一荧光粉胶层上。
优选地，所述第一荧光粉胶层为含有荧光粉和散热材料的环氧树脂。
优选地，所述荧光粉和散热材料的质量与环氧树脂的质量比大于5:1。
优选地，所述散热材料是下列材料的一种或多种：氮化铝粉，氧化铝粉，金刚石粉，石墨烯粉。
优选地，所述第一荧光粉胶层的形状为正方形、长方形、圆形中的一种，且各个第一荧光粉胶层相互隔离。
本发明的有益效果：本发明通过在透光基板和LED芯片的接触面上设有一荧光粉胶层，实现LED灯条的360°全周出光，并且减少了荧光粉的使用，降低了生产成本；通过在该荧光粉胶层中添加散热材料，提高了灯条的散热效果和可靠性。
附图说明
图1是本发明第一个实施例LED灯条的侧面结构示意图；
图2是本发明第二个实施例LED灯条的俯视图；
图3是本发明第三个实施例LED多排灯条打线后的俯视图；
图4是本发明第四个实施例LED灯条的俯视图。
具体实施方式
实施例1
如图1所示，本实施例提供一种LED灯条，该LED灯条包括条状蓝宝石基板1，其长宽厚的尺寸为30×0.8×0.4mm，然后通过点胶的方法在蓝宝石基板1上形成20个长为0.8mm，宽为0.6mm的长方形第一荧光粉胶层5并固化，并将第一荧光粉胶层5的厚度研磨到0.04mm，将20颗10×20mil蓝光LED芯片2固定在第一荧光粉胶层5上，其中第一荧光粉胶层5的材料包含荧光粉、氧化铝粉和环氧树脂，20颗蓝光LED芯片2通过金属引线4顺次串联，并与电极6连接，最后在蓝光LED芯片2的表面形成第二荧光粉胶层3。
实施例2
本实施例提供一种LED灯条，该LED灯条包括条状玻璃基板8，其长宽厚的尺寸为30×0.9×0.5mm，然后通过刮涂的方法在玻璃基板8上面形成28个直径为0.8mm的圆形第一荧光粉胶层9并固化，第一荧光粉胶层9的厚度为0.04mm，其中第一荧光粉胶层9的材料包含荧光粉、金刚石粉导热材料和环氧树脂，荧光粉和金刚石导热材料的质量与环氧树脂的质量比为6:1，将28颗蓝光8×15mil LED芯片2固定在第一荧光粉胶层9上，并将28颗蓝光LED芯片2通过金属引线4顺次串联，并与电极6连接，其俯视图如图2所示，最后在蓝光LED芯片2的表面形成第二荧光粉胶层。
实施例3
本实施例提供一种LED灯条，包括多排分布的条状白陶瓷基板10，其长宽厚的尺寸为30×0.8×0.4mm，然后用丝网印刷的方法在白陶瓷基板10上形成20个直径为0.7mm的圆形第一荧光粉胶层11并固化，第一荧光粉胶层11的厚度为0.02mm，将20颗10×20mil的蓝光LED芯片2固定在第一荧光粉胶层11上，其中第一荧光粉胶层11的材料包括荧光粉、金刚石粉导热材料和环氧树脂，荧光粉和金刚石导热材料的质量与环氧树脂的质量比为6.5:1，蓝光LED芯片2通过金属引线4顺次串联，并与电极12连接，其俯视图如图3所示，最后在蓝光LED芯片2的表面形成第二荧光粉胶层并切割电极12，形成多条细条状LED灯条。
实施例四
本实施例提供一种LED灯条，该LED灯条包括条状透明陶瓷基板13，其长宽厚的尺寸为30×2×0.4mm，然后通过丝网印刷的方法在透明陶瓷基板13上面形成两排长为0.8mm、宽为0.6mm的长方形第一荧光粉胶层14并固化，每一排20个，第一荧光粉胶层14的厚度为0.04mm，其中第一荧光粉胶层14的材料包含荧光粉、氮化铝粉导热材料和环氧树脂，荧光粉和氮化铝粉导热材料的质量与环氧树脂的质量比为5.5:1，将8×15mil蓝光LED芯片2固定在第一荧光粉胶层14上，并将所有的蓝光LED芯片2通过金属引线4顺次串联，并与电极6连接，其俯视图如图4所示，最后在蓝光LED芯片2的表面形成第二荧光粉胶层。
以上所述，仅为本发明中的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉该技术的人在本发明所揭露的技术范围内，可轻易想到的变换或替换都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应该以权利要求书的保护范围为准。

Claims (11)

1.一种LED灯条的制备方法，包括准备条状透光基板，在透光基板上形成若干个第一荧光粉胶层并固化，在各个第一荧光粉胶层上固定LED芯片，打线连接LED芯片，并与电极相连，在LED芯片上形成第二荧光粉胶层。
2.根据权利要求1所述的一种LED灯条的制备方法，其特征在于，所述透光基板包括蓝宝石基板、玻璃基板、透明陶瓷基板、白陶瓷基板中的一种。
3.根据权利要求1所述的一种LED灯条的制备方法，其特征在于，所述第一荧光粉胶层为含有荧光粉和散热材料的环氧树脂。
4.根据权利要求3所述的一种LED灯条的制备方法，其特征在于，所述荧光粉和散热材料的质量与环氧树脂的质量比大于5:1。
5.根据权利要求3或4所述的一种LED灯条的制备方法，其特征在于，所述散热材料是下列材料的一种或多种：氮化铝粉，氧化铝粉，金刚石粉，石墨烯粉。
6.根据权利要求1或3所述的一种LED灯条的制备方法，其特征在于，所述第一荧光粉胶层的形状为正方形、长方形、圆形中的一种，且各个第一荧光粉胶层相互隔离。
7.一种LED灯条，包括条状透光基板，位于透光基板上的若干颗电连接的LED芯片，位于LED芯片上的第二荧光粉胶层，以及位于透光基板两端的电极，其特征在于，在LED芯片和透光基板之间设有若干个第一荧光粉胶层，LED芯片固定在固化的第一荧光粉胶层上。
8.根据权利要求7所述的一种LED灯条，其特征在于，所述第一荧光粉胶层为含有荧光粉和散热材料的环氧树脂。
9.根据权利要求8所述的一种LED灯条，其特征在于，所述荧光粉和散热材料的质量与环氧树脂的质量比大于5:1。
10.根据权利要求8或9所述的一种LED灯条，其特征在于，所述散热材料是下列材料的一种或多种：氮化铝粉，氧化铝粉，金刚石粉，石墨烯粉。
11.根据权利要求7或8所述的一种LED灯条，其特征在于，所述第一荧光粉胶层的形状为正方形、长方形、圆形中的一种，且各个第一荧光粉胶层相互隔离 。
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