CN104600009A - Chip measuring sorting system and method - Google Patents
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- CN104600009A CN104600009A CN201510023987.3A CN201510023987A CN104600009A CN 104600009 A CN104600009 A CN 104600009A CN 201510023987 A CN201510023987 A CN 201510023987A CN 104600009 A CN104600009 A CN 104600009A
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
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Abstract
The invention provides chip measuring sorting system and method. The system comprises a sorting device, a measuring device and a carrying device, wherein the sorting device and the measuring device are adjacent to each other; a first storing seat is arranged in the measuring device, and while a second sorting seat is arranged in the sorting device; the carrying device is adjacent to a positioning access device; a first carrying platform is arranged on the carrying device, and while a second carrying platform is arranged on the positioning access device to carry and position a standard device; the carrying device is adjacent to the storing device; a picking rotating arm is arranged between the carrying device and the sorting device; the positioning access device is arranged adjacent to a tool frame assembly, and a second mechanical arm is arranged between the positioning access device and the device frame assembly; a standard device and a central control system which is connected with all the devices above are stored in the device frame assembly. With the adoption of the system, the problems of low production efficiency and relatively high production cost due to repeated setting of a cabinet and wafer scanning during measuring and sorting chips in the prior art can be solved.
Description
Technical field
The present invention relates to semiconductor fabrication, particularly relate to a kind of measurement separation system and method for chip.
Background technology
Semiconductor crystal wafer is after thinning back side and cutting; form thousands of chips independent of each other; usual needs carry out sorting according to the characteristic of chip each in wafer to it; such as; to LED chip sorting usually based on the photoelectric characteristic of this LED chip; namely need the classification thousands of chips upper in wafer being carried out to different brackets according to different photoelectric characteristics, and by damage or the chip of photoelectric parameter exception cast out, this process is called sorting.
Before at present sorting being carried out to LED chip, first the photoelectric characteristic obtaining each chip is measured one by one to LED chips all in wafer; Particularly, wafer to be measured and sorting generally includes following steps: first measure the photoelectric characteristic of upper each chip in wafer and scanning generates the coordinate information of this wafer; The corresponding wafer archives of this wafer are produced according to measured photoelectric characteristic and coordinate information; Wafer archives are sent to sorting unit, and after reading at sorting unit the wafer archives obtained, perform the operation picking and rearrange according to default sort regular, the LED chip rearranged obtained has consistent photoelectric characteristic, thus completes sorting.In actual production process, please refer to Fig. 1, for the schematic diagram of the measurement method for separating of chip of the prior art, wafer all needs to carry out board setting and wafer-scanning when carrying out measuring and divide selection operation, and most operation all needs by the manual operation of operating personnel.
But, to the measurement of chip and sorting in prior art, owing to needing to repeat the operation of board setting and wafer-scanning, and cause production efficiency lowly and production cost higher.
Summary of the invention
The invention provides a kind of measurement separation system and method for chip, to solve to the measurement of chip and sorting in prior art, owing to needing the operation repeating board setting and wafer-scanning, and cause the problem that production efficiency is low and production cost is higher.
The invention provides a kind of measurement separation system of chip, measurement mechanism, sorting unit, bogey, location access device, fixture frame component, the first mechanical arm, the second mechanical arm, feeding spiral arm and central control system;
The first thing-putting holder is provided with in described measurement mechanism, the second thing-putting holder is provided with in sorting unit, described first thing-putting holder offers the identical centering ring of diameter with in described second thing-putting holder, for wafer fixation kit identical for specification is fixed in described centering ring, described measurement mechanism for scanning and obtaining in described wafer fixation kit the coordinate information of fixing wafer, and to be measured and record is arranged at the photoelectric characteristic of each chip in described wafer; Described sorting unit is disposed adjacent with described measurement mechanism, sorts out according to preset rules classification for the chip measured by described measurement mechanism;
Described bogey is disposed adjacent with described location access device, wherein, described bogey is provided with the first carrying platform, described location access device is provided with the second carrying platform, described first carrying platform and described second carrying platform are used for carrying and localization criteria fixture, and described second carrying platform is also for depositing described wafer fixation kit temporarily;
Described bogey is also disposed adjacent with described sorting unit, described feeding spiral arm is provided with between described bogey and described sorting unit, for when described sorting unit carries out sorting to the chip in described wafer, the chip sorted out by described sorting unit by described feeding spiral arm is according to preset regularly arranged in the standard fixture on described first carrying platform;
Described first mechanical arm is arranged at the center of described measurement mechanism, described sorting unit, described bogey and described location access device, for capturing and moving the wafer fixation kit on described first thing-putting holder, described second thing-putting holder or the second carrying platform, and capture and move the standard fixture on described first carrying platform or described second carrying platform;
Described location access device is also disposed adjacent with described fixture frame component, described standard fixture is stored in described fixture frame component, described second mechanical arm is arranged between described location access device and described fixture frame component, for capturing standard fixture and be placed into the second carrying platform of described location access device from described fixture frame component;
Described central control system is connected with described measurement mechanism, described sorting unit, described bogey, described location access device, described first mechanical arm, described second mechanical arm and described feeding spiral arm respectively, correspondingly operate for controlling to perform to connected described each device and assembly, also for the data analysis measured by described measurement mechanism, process and access.
The present invention also provides a kind of measurement method for separating of chip, and adopt the measurement separation system of said chip to carry out measuring and analyzing, described method comprises:
The coordinate information that position scanning generates described first wafer is carried out to described first wafer, and by described measurement module, described first wafer is carried out to the measurement of photoelectric properties, generate the first metrical information, wherein, described coordinate information comprises the coordinate information of each chip in described first wafer;
By described first mechanical arm described first wafer moved and be fixed on described second thing-putting holder, by described sorting unit and described feeding spiral arm, a point selection operation is carried out to described first wafer, according to preset sort regular by standard fixtures extremely different for the die grading in described first wafer.
As shown from the above technical solution, the measurement separation system of chip provided by the present invention and method, by to measurement mechanism, sorting unit, bogey, the rational deployment of location access device and fixture frame component, and can first thing-putting holder of wafer fixation kit of compatible same size and the second thing-putting holder by being provided with in measurement mechanism and sorting unit, coordinate the program control of central control system, achieve and a board setting and scan operation are only performed to the sorting of chip in wafer, the measurement separation system of the chip provided by the present embodiment carries out die grading, solve in prior art the measurement of chip and sorting, owing to needing the operation repeating board setting and wafer-scanning, and cause the problem that production efficiency is low and production cost is higher, correspondingly reduce processing step, improve operating efficiency to a great extent, and the hardware cost reduced in processing procedure and human cost.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the measurement method for separating of chip of the prior art;
The structural representation of the measurement separation system of a kind of chip that Fig. 2 provides for the embodiment of the present invention;
The vertical view of the first fixed eyelid retractor in the measurement separation system that Fig. 3 is provided chip embodiment illustrated in fig. 1;
The part-structure schematic diagram of measurement mechanism in the measurement separation system that Fig. 4 is provided chip embodiment illustrated in fig. 1;
The vertical view of the second fixed eyelid retractor 230 in the measurement separation system that Fig. 5 is provided chip embodiment illustrated in fig. 1;
Fig. 6 is the layout of a kind of crystal circle structure in the embodiment of the present invention;
The front view of fixture frame component in the measurement separation system that Fig. 7 is provided chip embodiment illustrated in fig. 1;
Fig. 8 is the vertical view of middle fixture frame component embodiment illustrated in fig. 7;
The flow chart of the measurement method for separating of a kind of chip that Fig. 9 provides for the embodiment of the present invention;
The flow chart of the measurement method for separating of the another kind of chip that Figure 10 provides for the embodiment of the present invention;
The schematic diagram of the measurement method for separating of a kind of chip that Figure 11 provides for the embodiment of the present invention.
Embodiment
For making the object of the embodiment of the present invention, technical scheme and advantage clearly, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
In specific embodiment once of the present invention, joining relation under the concrete structure of the measurement separation system of chip proposed by the invention and each device busy state of this system and working method are described by comparatively detailed implementation, accompanying drawing in embodiment is also only schematic diagram, for expressing invention of the present invention intention, implementation of the present invention is not limited only to the concrete structure in the following drawings, and the embodiment of the present invention is specifically explained for the measurement method for separating of LED chip, the object that the measurement separation system of the chip adopting the present invention following embodiment to provide carries out sorting also can be other semiconductor chip.By the structure of measurement separation system of chip that provides the embodiment of the present invention and the specific descriptions of working method, to those skilled in the art, difference and the advantage place of the present invention and prior art can be understood easily.
The structural representation of the measurement separation system of a kind of chip that Fig. 2 provides for the embodiment of the present invention.As shown in Figure 2, the measurement separation system of the chip that the present embodiment provides, for measuring and sorting semiconductor crystal wafer, various embodiments of the present invention are specifically elected example as be explained to be measured LED chip and to divide, the measurement separation system of this chip comprises: measurement mechanism 100, sorting unit 200, bogey 300, location access device 400, fixture frame component 500, first mechanical arm 600, second mechanical arm 700, feeding spiral arm 800 and central control system (not shown), below the structure of device each in this system and assembly is described in detail.
In the present embodiment, the first thing-putting holder 110 is provided with in measurement mechanism 100, the second thing-putting holder 210 is provided with in sorting unit 200, first thing-putting holder 110 offers the identical centering ring of diameter with in the second thing-putting holder 210, for wafer fixation kit identical for specification is fixed in centering ring, this wafer fixation kit is specifically arranged on a wafer tensioner ring 001, the photoelectric characteristic of each chip in this wafer is measured and recorded to this measurement mechanism 100 for scanning and obtaining in wafer fixation kit the coordinate information of each chip in fixing wafer, and; Sorting unit 200 is disposed adjacent with measurement mechanism 100, sorts out according to preset rules classification for the chip measured by measurement mechanism 100; Bogey 300 is disposed adjacent with location access device 400, wherein, bogey 300 is provided with the first carrying platform 310, location access device 400 is provided with the second carrying platform 410, first carrying platform 310 and the second carrying platform 410 are for carrying and localization criteria fixture, and the second carrying platform 410 is also for interim storing wafer fixation kit.It should be noted that, one, in the system that the present embodiment provides, the set-up mode of the first thing-putting holder 110 and the second thing-putting holder 210, can the wafer fixation kit that uses of compatible measurement device 100 and sorting unit 200, therefore, when obtaining the coordinate information of wafer, coordinating the programming of central control system, only needing to carry out a board setting and wafer-scanning, without the need to repeating this operation, namely, perform when dividing selection operation and utilize the scanning result before measuring, reduce the processing step of sorting, improve operating efficiency to a great extent; Its two, when carrying out batch sorting to multiple wafer, while point selection operation is carried out to wafer A, can measure wafer B, time secondary, can by one of them wafer deposit in temporarily location access device 400 the second carrying platform 410 on, to exchange the job position of wafer.
Bogey 300 is also disposed adjacent with sorting unit 200, feeding spiral arm 800 is provided with between bogey 300 and sorting unit 200, when carrying out sorting for the chip in sorting unit 200 pairs of wafers, the chip sorted out by sorting unit 200 by feeding spiral arm 800 is according to preset regularly arranged in the standard fixture on the first carrying platform 310.First standard fixture on this first carrying platform 310 is selected from fixture frame component 500 by location access device 400, and the photoelectric characteristic of the chip arranged in each standard fixture is identical, finally through the arrangements of chips of different qualities in different standard fixtures.
In specific implementation, first mechanical arm 600 can be arranged at the center of measurement mechanism 100, sorting unit 200, bogey 300 and location access device 400, for capturing and moving the wafer fixation kit on the first thing-putting holder 110, second thing-putting holder 210 or the second carrying platform 410, and capture and move the standard fixture on the first carrying platform 310 or the second carrying platform 410.As shown in Figure 1, above-mentioned each device is positioned at the first area of system, divided with quadrant this first area, bogey 300, location access device 400, measurement mechanism 100 and sorting unit 200 lay respectively at first, second, third and fourth quadrant, to meet the position relationship of above-mentioned each device; It should be noted that, various embodiments of the present invention are not restricted to the particular location of each device in Fig. 2, as long as the position relationship of above-mentioned each device can be met, and realizes identical processing mode, all can as the position set-up mode of each device in the measurement separation system of chip provided by the invention.
In the present embodiment, location access device 400 is also disposed adjacent with fixture frame component 500, standard fixture is stored in fixture frame component 500, second mechanical arm 700 is arranged between location access device 400 and fixture frame component 500, for capturing standard fixture and be placed into second carrying platform 410 of locating access device 400 from fixture frame component 500; And then this standard fixture is moved to the first carrying platform 310 by the first mechanical arm 600, so that follow-up execution sorting work.In addition, central control system in the present embodiment respectively with above-mentioned measurement mechanism 100, sorting unit 200, bogey 300, locate access device 400, first mechanical arm 600, second mechanical arm 700 and feeding spiral arm 800 is connected, correspondingly operate for controlling to perform to connected each device and assembly, also for the data analysis measured by measurement mechanism 100, process and access.Be understandable that, each device in the present embodiment and moveable assembly, comprise the first mechanical arm 600, second mechanical arm 700 and feeding spiral arm 800 controls to perform corresponding operation by central control system, this central control system can be arranged near above-mentioned each device, also can under the condition meeting above-mentioned annexation, being arranged in another service area, such as, is a computer for controlling, is controlled each device by the manual operation of operating personnel or the program that presets.
The measurement separation system of the chip that the present embodiment provides, by to measurement mechanism, sorting unit, bogey, the rational deployment of location access device and fixture frame component, and can first thing-putting holder of wafer fixation kit of compatible same size and the second thing-putting holder by being provided with in measurement mechanism and sorting unit, coordinate the program control of central control system, achieve and a board setting and scan operation are only performed to the sorting of chip in wafer, the measurement separation system of the chip provided by the present embodiment carries out die grading, solve in prior art the measurement of chip and sorting, owing to needing the operation repeating board setting and wafer-scanning, and cause the problem that production efficiency is low and production cost is higher, correspondingly reduce processing step, improve operating efficiency to a great extent, and the hardware cost reduced in processing procedure and human cost.Further, the present embodiment, while minimizing scan operation number of times, decreases the acquisition number of times of wafer coordinate information, data volume more at wafer is larger, reduce the relative risk of batch mixing, loss of data and read error, be conducive to improving the accuracy measuring sorting.
Below by way of the concrete structure of each device in the measurement separation system of the chip shown in some instantiation key diagrams 2, to explain that each device performs the specific implementation of corresponding operating.The vertical view of the first fixed eyelid retractor in the measurement separation system that Fig. 3 is provided chip embodiment illustrated in fig. 1, the part-structure schematic diagram of measurement mechanism in the measurement separation system that Fig. 4 is provided chip embodiment illustrated in fig. 1, please refer to Fig. 2 to Fig. 4, in measurement mechanism 100, be also provided with the first driver module 120, chip measurement module 130, light source acquisition module 140 (not shown in Fig. 2) and the first image receiver module (not shown).First driver module 120 is connected to the bottom of the first thing-putting holder 110, carries out transverse direction, longitudinal direction and rotary motion to make the first thing-putting holder 110 by the driving of the first driver module 120; The first fixed eyelid retractor 150 is installed with in measurement mechanism 100, specifically be arranged at the bottom of the first thing-putting holder 110 centering ring, wherein, the top of the first fixed eyelid retractor 150 is provided with and is multiplely around in this first fixed eyelid retractor 150 edge and symmetrical vacuum sucking holes 151.Particularly, the first driver module 120 such as can comprise the first horizontal slide rail, first longitudinal slide rail and the first driver, and this first driver can have and makes the first thing-putting holder 110 carry out the function rotated around central shaft; It should be noted that, first fixed eyelid retractor 150 is for being fixedly installed, that is, while first thing-putting holder 110 carries out moving, the position of this first fixed eyelid retractor 150 remains unchanged, that is, change by the motion of the first thing-putting holder 110 chip be positioned at above the first fixed eyelid retractor 150, successively each chip in wafer is measured.
As shown in Figure 2, chip measurement module 130 comprises at least two probe spiral arms 131 and is arranged at the probe 132 (only shown in Figure 4) of each probe spiral arm 131 front end, probe spiral arm 131 is for when the operating state of chip measurement module 130 changes, and the bottom around probe spiral arm 131 carries out moving horizontally, move up and down or rotating; Chip measurement module 130 is for moving to the top of the first fixed eyelid retractor 150 during by multiple probe 132, the chip above this first fixed eyelid retractor 150 is measured; Concrete metering system can be: when carrying out operation of feeding and discharging or holding state, probe spiral arm 131 moves to the position away from the first thing-putting holder 110, stop can not be caused to the movement of this first thing-putting holder 110, when a measurement is taken, probe spiral arm 131 moves to the top of the first fixed eyelid retractor 150, probe 132 end is made to be positioned at above this first fixed eyelid retractor 150, as shown in Figure 4, probe 132 and light source acquisition module 140 are all positioned at the top of wafer 002, now, the preparation measuring chip has been completed.Owing to usually needing to measure its electrical characteristics under the state of chip energising, therefore, be also provided with current source in chip measurement module 130, for providing electric current to chip to be measured, the size of current provided can be steady state value or variation value, to drive chip light emitting to be measured.As shown in Figure 4, light source acquisition module 140 is arranged at the top of the first fixed eyelid retractor 150, for when chip measurement module 130 is measured the chip above this first fixed eyelid retractor 150, obtains the optical information of this chip simultaneously.First image receiver module is arranged at the top of the first thing-putting holder 110, comprise microscope and imageing sensor, microscope is used for showing the image amplifying process when receiving the image of wafer, this imageing sensor can be such as charge coupled device (Charge Coupled Device, referred to as: CCD) imageing sensor or complementary metal oxide semiconductors (CMOS) (Complementary Metal-Oxide-Semiconductor, referred to as: CMOS) imageing sensor, for extracting the image information of wafer, namely specifically the positional information of wafer is measured.
With the similar of above-mentioned measurement mechanism 100, the vertical view of the second fixed eyelid retractor in the measurement separation system that Fig. 5 is provided chip embodiment illustrated in fig. 1, is also provided with the second driver module 220 and the second image receiver module (not shown) in sorting unit 200; Second driver module 220 is connected to the bottom of the second thing-putting holder 210, carries out transverse direction, longitudinal direction and rotary motion to make the second thing-putting holder 210 by the driving of the second driver module 220; The second fixed eyelid retractor 230 is installed with in sorting unit 200, specifically be arranged at the bottom of the second thing-putting holder 210 centering ring, wherein, the top of the second fixed eyelid retractor 230 is provided with and is multiplely around in the second fixed eyelid retractor 230 edge and symmetrical vacuum sucking holes 231, the center of the second fixed eyelid retractor 230 also arranges thimble through hole 232, for under the driving of the second driver module 220, the thimble of its inside is ejected predeterminable range.Particularly, the second driver module 220 such as can comprise the second horizontal slide rail, second longitudinal slide rail and the second driver, and this second driver can have and makes the second thing-putting holder 210 carry out the function rotated around central shaft.
It should be noted that, in the present embodiment second horizontal slide rail can be set to overall structure with the horizontal slide rail of first in above-described embodiment, second fixed eyelid retractor 230 is similarly and is fixedly installed, that is, while second thing-putting holder 210 carries out moving, the position of this second fixed eyelid retractor 230 remains unchanged, namely, the chip be positioned at above the second fixed eyelid retractor 230 is changed by the motion of the second thing-putting holder 210, successively sorting is carried out to each chip in wafer, when the thimble of the second fixed eyelid retractor 230 inside ejects, chip above it is sorted out.
In the present embodiment, the top that second image receiver module is arranged at the second thing-putting holder 210 comprises microscope and imageing sensor, microscope is used for showing the image amplifying process when receiving the image of wafer, this imageing sensor can be such as ccd image sensor or cmos image sensor, for extracting the image information of wafer.The function class of this second image receiver module like with above-mentioned first image receiver module, specifically the positional information of wafer is measured, alternatively, sorting unit 200 in the present embodiment is also for scanning and obtaining in wafer fixation kit the coordinate information of fixing wafer, and central control system is also for the data analysis measured by sorting unit 200, process and access.In specific implementation, usually need to perform a point selection operation to the chip in batch-wafer, sorting unit 200 is arranged equally to the function of surving coordinate position, be conducive to improving the production capacity performing sorting, increase work efficiency further.
It should be noted that, wafer is scanned and obtains the positional information of wafer, first the gauge point scanning this wafer is needed, as shown in Figure 6, for a kind of in embodiment of the present invention layout of crystal circle structure, Fig. 6 only illustrates a part for wafer 002, the unit repeated in figure is the chip 002a in wafer 002, be gauge point 003 with the visibly different special marking of chip form, such as "+" phenotypic marker or “ ╔ " phenotypic marker, this gauge point 003 is set to human eye usually, and above-mentioned first image received device and the second image received device, all obviously, the shape easily identified, in specific implementation, can choose wherein that arbitrary gauge point 003 is as initial markers point, then image and coordinate by recording this initial markers point scan the carrying out of wafer, to generate the relative co-ordinate information of each chip on wafer 002.Normally, wafer, in leading portion processing, all can be reserved with several gauge points, thereon so that the follow-up measurement carrying out being correlated with.
Further, the edge of the first thing-putting holder 110 and the second thing-putting holder 210 all can be provided with vacuum sucking holes or solid latch mechanism, for fixing wafer fixation kit, wherein, wafer fixation kit is provided with the fixing snap close for fixing wafer tensioner ring 001, wafer tensioner ring 001 is stained with the adhesive membrane for fixing wafer; The wafer be fixed on wafer fixation kit is chip separated from one another after cutting splitting, is not easy to come off by these adhesive die attachments, and has certain distance each other on adhesive membrane, and adhesive membrane is convenient to processing by tight on wafer tensioner ring 001.Similarly, the edge of the first carrying platform 310 is provided with vacuum sucking holes or solid latch mechanism, for fixed standard fixture, wherein, standard fixture is stained with the adhesive membrane for depositing chip, final needs will have the die grading of different photoelectric characteristic in different standard fixtures, by adhesive die attachment on the adhesive membrane of standard fixture, can be convenient to the chip preserving sorting equally when sorting is sorted out; The edge of the second carrying platform 410 is provided with location claw, for fixing also storing wafer fixation kit or standard fixture.
Particularly, the front end of feeding spiral arm 800 is provided with vacuum slot, for when feeding spiral arm 800 moves to sorting unit 200, thimble in the thimble through hole at the second fixed eyelid retractor 230 center is coordinated to eject, the adhesive membrane pierced through on wafer fixation kit ejects treats sorting chip, vacuum slot is contacted and adsorbs the chip ejected, thus chip is moved to put the first carrying platform 310 standard fixture on; Wherein, the first carrying platform 310, also for after often perform the operation of feeding at feeding spiral arm 800, move the cell of predeterminable range with transverse direction or longitudinal direction, the chip that feeding spiral arm 800 is chosen at every turn all adheres on the adhesive membrane of standard fixture.Feeding spiral arm 800 needs to be configured with driver equally, and the moving range of the feeding spiral arm 800 shown in Fig. 1 is 90 degree.
With above-mentioned measurement mechanism 100 and sorting unit 200 similarly, bogey 300 is also provided with the 3rd driver module 320 and the 3rd image receiver module; 3rd driver module 320 is connected to the bottom of the first carrying platform 310, carries out transverse direction, longitudinal direction and rotary motion to make the first carrying platform 310 by the driving of the 3rd driver module 320; Wherein, the edge of the first carrying platform 310 is provided with latching device, for fixed standard fixture.Particularly, the 3rd driver module 320 such as can comprise the 3rd horizontal slide rail, the 3rd longitudinal slide rail and the 3rd driver, and the 3rd driver can have and makes the 3rd thing-putting holder carry out the function rotated around central shaft.The 3rd image receiver module in the present embodiment is arranged at the top of the first carrying platform 310, 3rd image receiver module comprises microscope and imageing sensor, microscope is used for showing the image amplifying process when receiving the image of wafer, this imageing sensor can be ccd image sensor or cmos image sensor equally, for extracting the image information of wafer, when when feeding spiral arm 800800 chip being positioned on the standard fixture on the first carrying platform 310, 3rd image received device can the arranging situation of display chip in real time, thus avoid wrong row, the phenomenon such as to omit in printing.
As shown in Figure 1, in the measurement separation system of the chip that various embodiments of the present invention provide, shade 900 can also be provided with between measurement mechanism 100 and sorting unit 200, this shade 900 comprises shading baffle and barrier driving module, the top of shading baffle is positioned under the horizontal plane of the first thing-putting holder 110 and the second thing-putting holder 210, barrier driving module is connected with central control system, for measurement mechanism 100 and/or sorting unit 200 in running order time, raise shading baffle with isolation measurement device 100 and sorting unit 200.Particularly, this barrier driving module specifically comprises the slide rail and the driver that carry out oscilaltion for shading baffle, when shading baffle lands, its top is positioned under the thing-putting holder horizontal plane of measurement mechanism 100 and sorting unit 200, and can not impact the operation such as to pick and place of the movement of thing-putting holder in measurement mechanism 100 and sorting unit 200, wafer; When shading baffle rises, can by measurement mechanism 100 and sorting unit 200 mutually isolated, make light can not mutually through, thus when avoiding measurement mechanism 100 and sorting unit 200 to work at the same time, because light source disturbs the adverse effect brought mutually.
Further, first mechanical arm 600 is positioned at the center of above-mentioned four devices, need the first thing-putting holder 110, second thing-putting holder 210, parts on first carrying platform 310 and the second carrying platform 410 carry out capturing and placing operation, as shown in Figure 1, the first mechanical arm 600 meeting above-mentioned action can be configured with the first arm driver module, be provided for the first mechanical arm 600 carry out 360 degree of rotations and move up and down, to move to measurement mechanism 100, sorting unit 200, the top of bogey 300 or location access device 400, the front end of the first mechanical arm 600 is provided with vacuum cup, for passing through the firm grasping silicon wafer fixation kit of vacuum suction or standard, similarly, second mechanical arm 700 can be configured with the second arm driver module, be provided for the second mechanical arm 700 to carry out rotating and moving up and down, with the top of the inside and location access device 400 that move to fixture frame component 500, the front end of the second mechanical arm 700 is provided with vacuum cup, for passing through the firm crawl standard fixture of vacuum suction.It should be noted that, the fixing group of the wafer that above-mentioned mechanical arm captures is separable set-up mode, need to move between the first thing-putting holder 110, second thing-putting holder 210 and the second carrying platform 410, standard fixture moves between fixture frame component 500, second carrying platform 410 and the first carrying platform 310.
The front view of fixture frame component 500 in the measurement separation system that Fig. 7 is provided chip embodiment illustrated in fig. 1, Fig. 8 is the vertical view of middle fixture frame component 500 embodiment illustrated in fig. 7.In specific implementation, the bottom of fixture frame component 500 can be provided with four-wheel drive module, be provided for fixture frame component 500 to carry out moving left and right and moving up and down, similarly, this four-wheel drive module can comprise the slide rail that can be used for moving left and right and moving up and down equally and drive it, as shown in Figure 7, many groups of " non-" font fixture bank bits 510 are provided with in fixture frame component 500, the standard fixture 004 being stained with adhesive membrane is arranged and is placed in fixture bank bit 510, the adhesive membrane that standard fixture 004 adheres to can be blank, also can be stained with no more than restricted number, and the adhesive membrane being stained with some chips of chip coordinate information is recorded by central control system.
The flow chart of the measurement method for separating of a kind of chip that Fig. 9 provides for the embodiment of the present invention.Method shown in Fig. 9 is used in the situation of the chip in semiconductor crystal wafer being carried out to sorting, and the measurement separation system of the chip specifically provided by the above embodiment of the present invention performs, and the method that the present embodiment provides comprises the following steps:
S110, the first wafer is carried out to the coordinate information of position scanning generation first wafer, and by measurement module, the first wafer is carried out to the measurement of photoelectric properties, generate the first metrical information, wherein, coordinate information comprises the coordinate information of each chip in the first wafer.
In the present embodiment, divide with the measurement of LED chip equally and elect example as and be explained, namely the standard of carrying out sorting to LED chip is the excellent summary of its photoelectric properties, in conjunction with above-mentioned Fig. 1 to the system provided embodiment illustrated in fig. 8, wafer forms core grain separated from one another after cutting splitting, these core grains are adhered to unlikely on adhesive membrane coming off, and have certain distance each other, this adhesive membrane is convenient to processing by tight on the wafer tensioner ring 001 of a circle, and then, fixing snap close on wafer fixation kit is by fixed thereon for wafer tensioner ring 001, so that the first thing-putting holder 110 in the measurement separation system of follow-up chip, second thing-putting holder 210 all will treat that the wafer of sorting is fixed in operating table surface by this wafer fixation kit.
It should be noted that, based on the consideration promoting production capacity, carry out scanning the operation generating coordinate information to the first wafer in S110 to be performed by measurement mechanism 100 or sorting unit 200, due to these two devices all configuration image receiver module, the image information of this first wafer can be obtained.Particularly, by wafer fixation kit, this first wafer is placed on the first thing-putting holder 110 of measurement mechanism 100, or on the second thing-putting holder 210 of sorting unit 200, perform and inhale vacuum action, firmly adsorb this wafer fixation kit, thus by the first image receiver module of the first thing-putting holder 110 correspondence, or the second image receiver module of the second thing-putting holder 210 correspondence imposes level correction and scanning to this first wafer.
S120, by the first mechanical arm the first wafer moved and be fixed on the second thing-putting holder, by sorting unit and feeding spiral arm, a point selection operation is carried out to the first wafer, according to preset sort regular by standard fixtures extremely different for the die grading in the first wafer.
In the present embodiment, when the first wafer is positioned on the second thing-putting holder 210 of sorting unit 200, when preparation performs and divides selection operation, the coordinate information of the wafer that feeding spiral arm 800 obtains according to central control system, a point selection operation is performed according to the sort regular of artificial setting, when the chip meeting same sort regular in the first wafer is all picked, then by the first mechanical arm 600, the standard fixture on first carrying platform 310 is moved on the second carrying platform 410, send in fixture frame component 500 via after contraposition by the second mechanical arm 700 again, exchange another standard fixture for and continue operation, until complete the sorting of all chips on this first wafer.
The measurement separation system of the chip that the measurement method for separating of the chip that the present embodiment provides is provided by the above-mentioned any embodiment of the present invention performs, and therefore, implementation and beneficial effect are all similar to the above embodiments, do not repeat them here.
Alternatively, in a kind of possible implementation of above-described embodiment, to the concrete mode that single-wafer carries out point selection operation be only, above-mentioned S110 can replace with: be fixed on by the first wafer on the first thing-putting holder, by described measurement mechanism, position scanning is carried out to the first wafer, obtain the initial markers point of the first wafer to generate the coordinate information of the first wafer, and the measurement of photoelectric properties is carried out to the first wafer, generate the first metrical information.
In the present embodiment, only sorting is carried out to the chip in this first wafer, do not relate to the problem of production capacity, can directly the first wafer be positioned on the first thing-putting holder 110, performed the operation obtaining positional information and generate the first metrical information by measurement mechanism 100, reduce the number of times that the first mechanical arm 600 moves this first wafer as much as possible.
In actual production, usual needs carry out sorting to a large amount of wafers, its specific implementation and the above-mentioned sorting to single-wafer are distinguished to some extent, as shown in Figure 10, the flow chart of the measurement method for separating of the another kind of chip provided for the embodiment of the present invention, on the basis of method shown in above-mentioned Fig. 9, S110 comprises:
S111, first wafer is fixed on the second thing-putting holder, by sorting unit, position scanning is carried out to the first wafer, obtain the first wafer initial markers point and generate the first wafer coordinate information, wherein, this coordinate information comprises the coordinate information of each chip in the first wafer.
S112, by the first mechanical arm the first wafer moved and be fixed on the first thing-putting holder, by measurement module, the first wafer is carried out to the measurement of photoelectric properties, generate the first metrical information, and the second wafer is fixed on the second thing-putting holder, position scanning is carried out to the second wafer, obtains the initial markers point of the second wafer and generate the coordinate information of the second wafer, wherein, this coordinate information comprises the coordinate information of each chip in the second wafer.
In the present embodiment, obtained the coordinate information of the first wafer by sorting unit 200 after, first mechanical arm 600 rotates to sorting unit 200 by location access device 400, move on the first thing-putting holder 110 of measurement mechanism 100 by vacuum suction grasping silicon wafer fixation kit, this first thing-putting holder 110 starts vacuum sucking holes or consolidates latch mechanism with fixing wafer fixation kit, now, the first image receiver module be arranged on the first thing-putting holder 110 can scan and find the initial markers point of the first wafer, is shared in the coordinate information obtained in sorting unit 200.
It should be noted that, measuring the first wafer, and carrying out the second wafer in the process of position scanning, probe spiral arm 131 rotates/moves to measuring position by initial position, movable shading baffle rises simultaneously, measures the chip in the first wafer according to parameter preset.It is worth mentioning that, in the structure of traditional measurement mechanism, wafer is adhered in adhesive membrane, can't be tightened by tensioner ring, and the glove table top under this situation need be designed to plane, to adsorb whole adhesive membrane.By contrast, in the system that the above embodiment of the present invention provides, based on measuring the flow scheme design with sorting, the compatibility to production fixture of measurement mechanism 100 and sorting unit 200 will be taken into account equally, the first thing-putting holder 110 in measurement mechanism 100 is designed to the structure identical with the second thing-putting holder 210 in sorting unit 200, therefore, second thing-putting holder 210 can adopt bottom the second fixed eyelid retractor 230 supporting chip, to mate wafer tensioner ring 001 as production fixture, thus decrease in existing technique, measure this link of sorting from wafer, the waste of manpower and material is brought because of the replacing of fixture.Please refer to above-mentioned Fig. 3 and Fig. 5, first fixed eyelid retractor 150 of measurement mechanism 100 only has the vacuum sucking holes 151 around a circle, when probe spiral arm 131 measures operation to certain chips for performing, vacuum sucking holes 151 adsorb and the adhesive membrane fixing the subregion of chip position to prevent from measuring time chip be moved, make probe 132 can touch chip surface accurately.Meanwhile, obtained the optical information of each chip by light source acquisition module 140, in conjunction with the coordinate information of each chip and the electrical information of above-mentioned measurement, form the first metrical information that this first wafer is corresponding.
The method that the present embodiment provides also comprised before S120: S113, the first wafer or the second wafer to be moved and was fixed on the second carrying platform, move and be fixed on the first thing-putting holder to make the second wafer by the first mechanical arm.In the present embodiment, need to measure and sorting multiple wafer simultaneously, namely while measurement mechanism 100 is measured the first wafer, can add the second wafer place with sorting unit 200 on complete scanner uni and obtain positional information.Specific implementation is such as, after measurement mechanism 100 completes the measurement operation to the first wafer, shading baffle falls, captured by the first mechanical arm 600 and move to location access device 400 for buffer memory, capture the second wafer to measurement mechanism 100 again and perform measurement action, thus the first wafer is again crawled delivers to sorting unit 200, waits after adopting mode same as described above to scan to find out initial markers point and perform minute selection operation.
Correspondingly, the method that the present embodiment provides also comprises: S130, by measurement module, the second wafer is carried out to the measurement of photoelectric properties, generates the second metrical information.It should be noted that, the present embodiment does not limit the execution step of S120 and S130, and Figure 10 was specifically illustrated before S130 with S120, and in specific implementation, in order to improve, production capacity normally performs simultaneously.
S140, by the first mechanical arm the second wafer moved and be fixed on the second thing-putting holder, by sorting unit and feeding spiral arm, a point selection operation is carried out to the second wafer, according to preset sort regular by standard fixtures extremely different for the die grading in the second wafer.
The present embodiment, in specific implementation, also comprises after S112: the coordinate information of this first wafer and the first metrical information are sent to central control system; Correspondingly, in S140, the concrete mode of point selection operation is: central control system is according to the coordinate information of the first wafer and the first metrical information, and control sorting unit and feeding spiral arm carry out a point selection operation to this first wafer.
In the present embodiment, be no matter the sorting to the first wafer, or the sorting to the second wafer, all need choice criteria fixture in advance.In specific implementation, fixture frame component 500 internal memory is placed with multiple standard fixture being stained with adhesive membrane, each standard fixture there is absolute coding to be sorted device 200 identifications and record, thus according to treating the measurement result of sorting chip, fixture frame component 500 can before and after or move up and down, make the second mechanical arm 700 can extract required standard fixture and send into second carrying platform 410 of locating access device 400, and then by the second carrying platform 410, this standard fixture is positioned, to guarantee the accuracy of the position when feeding the first carrying platform 310, by the first mechanical arm 600, this standard fixture is moved on the first carrying platform 310 of bogey 300 again.With above steps similarly, when the first wafer terminates point selection operation, the 3rd wafer can be added and be positioned on sorting unit 200 and scan to obtain positional information, executive mode afterwards and said method similar, therefore not repeat them here.
It should be noted that, because measuring process is usually comparatively complicated, and the time required when measuring different parameters is also different, on the whole, measurement required time is performed for a same wafer and will be a bit larger tham execution sorting required time, thus, in the measurement method for separating of the chip provided in embodiment, upper by each wafer, bottom sheet action, the scanning of wafer and the cost of interface operation equal time are all placed in sorting unit to be carried out, from the activity duration, achieve mating of measurement mechanism and sorting unit, thus the production efficiency that ensure that the measurement method for separating of the chip that the embodiment of the present invention provides of amplitude peak.
The schematic diagram of the measurement method for separating of a kind of chip that Figure 11 provides for the embodiment of the present invention, operating process of the prior art shown in comparison diagram 1, apparently, use the embodiment of the present invention the measurement separation system of chip is provided after, greatly reducing manually-operated step, and decrease the consumption of the material caused in these redundancy step simultaneously.
Last it is noted that above each embodiment is only in order to illustrate technical scheme of the present invention, be not intended to limit; Although with reference to foregoing embodiments to invention has been detailed description, those of ordinary skill in the art is to be understood that: it still can be modified to the technical scheme described in foregoing embodiments, or carries out equivalent replacement to wherein some or all of technical characteristic; And these amendments or replacement, do not make the essence of appropriate technical solution depart from the scope of various embodiments of the present invention technical scheme.
Claims (14)
1. a measurement separation system for chip, is characterized in that, comprising: measurement mechanism, sorting unit, bogey, location access device, fixture frame component, the first mechanical arm, the second mechanical arm, feeding spiral arm and central control system;
The first thing-putting holder is provided with in described measurement mechanism, the second thing-putting holder is provided with in sorting unit, described first thing-putting holder offers the identical centering ring of diameter with in described second thing-putting holder, for wafer fixation kit identical for specification is fixed in described centering ring, described measurement mechanism for scanning and obtaining in described wafer fixation kit the coordinate information of fixing wafer, and to be measured and record is arranged at the photoelectric characteristic of each chip in described wafer; Described sorting unit is disposed adjacent with described measurement mechanism, sorts out according to preset rules classification for the chip measured by described measurement mechanism;
Described bogey is disposed adjacent with described location access device, wherein, described bogey is provided with the first carrying platform, described location access device is provided with the second carrying platform, described first carrying platform and described second carrying platform are used for carrying and localization criteria fixture, and described second carrying platform is also for depositing described wafer fixation kit temporarily;
Described bogey is also disposed adjacent with described sorting unit, described feeding spiral arm is provided with between described bogey and described sorting unit, for when described sorting unit carries out sorting to the chip in described wafer, the chip sorted out by described sorting unit by described feeding spiral arm is according to preset regularly arranged in the standard fixture on described first carrying platform;
Described first mechanical arm is arranged at the center of described measurement mechanism, described sorting unit, described bogey and described location access device, for capturing and moving the wafer fixation kit on described first thing-putting holder, described second thing-putting holder or the second carrying platform, and capture and move the standard fixture on described first carrying platform or described second carrying platform;
Described location access device is also disposed adjacent with described fixture frame component, described standard fixture is stored in described fixture frame component, described second mechanical arm is arranged between described location access device and described fixture frame component, for capturing standard fixture and be placed into the second carrying platform of described location access device from described fixture frame component;
Described central control system is connected with described measurement mechanism, described sorting unit, described bogey, described location access device, described first mechanical arm, described second mechanical arm and described feeding spiral arm respectively, correspondingly operate for controlling to perform to connected described each device and assembly, also for the data analysis measured by described measurement mechanism, process and access.
2. the measurement separation system of chip according to claim 1, is characterized in that, is also provided with the first driver module, chip measurement module, light source acquisition module and the first image receiver module in described measurement mechanism;
Described first driver module is connected to the bottom of described first thing-putting holder, carries out transverse direction, longitudinal direction and rotary motion to make described first thing-putting holder by the driving of described first driver module; The first fixed eyelid retractor is installed with in described measurement mechanism, specifically be arranged at the bottom of described first thing-putting holder centering ring, wherein, the top of described first fixed eyelid retractor is provided with and is multiplely around in described first fixed eyelid retractor edge and symmetrical vacuum sucking holes;
Described chip measurement module comprises at least two probe spiral arms and is arranged at the probe of each described probe spiral arm front end, wherein, described probe spiral arm is used for when the operating state change of described chip measurement module, and the bottom around described probe spiral arm carries out moving horizontally, move up and down or rotating; When described chip measurement module is used for the top multiple described probe being moved to described first fixed eyelid retractor, the chip above described first fixed eyelid retractor is measured; Current source is provided with, for providing electric current to described chip to be measured in described chip measurement module;
Described light source acquisition module is arranged at the top of described first fixed eyelid retractor, for when described chip measurement module is measured the chip above described first fixed eyelid retractor, obtains the optical information of described chip;
Described first image receiver module is arranged at the top of described first thing-putting holder, comprise microscope and imageing sensor, described microscope is used for showing the image amplifying process when receiving the image of described wafer, and described imageing sensor is for extracting the image information of described wafer.
3. the measurement separation system of chip according to claim 1, is characterized in that, is also provided with the second driver module and the second image receiver module in described sorting unit;
Described second driver module is connected to the bottom of described second thing-putting holder, carries out transverse direction, longitudinal direction and rotary motion to make described second thing-putting holder by the driving of described second driver module; The second fixed eyelid retractor is installed with in described sorting unit, specifically be arranged at the bottom of described second thing-putting holder centering ring, wherein, the top of described second fixed eyelid retractor is provided with and is multiplely around in described second fixed eyelid retractor edge and symmetrical vacuum sucking holes, the center of described second fixed eyelid retractor also arranges thimble through hole, for under the driving of described second driver module, the thimble of its inside is ejected predeterminable range;
The top that described second image receiver module is arranged at described second thing-putting holder comprises microscope and imageing sensor, described microscope is used for showing the image amplifying process when receiving the image of described wafer, and described imageing sensor is for extracting the image information of described wafer.
4. the measurement separation system of chip according to claim 3, it is characterized in that, the edge of described first thing-putting holder and described second thing-putting holder is provided with vacuum sucking holes or solid latch mechanism, for fixing described wafer fixation kit, wherein, described wafer fixation kit is provided with the fixing snap close for fixing wafer tensioner ring, described wafer tensioner ring is stained with the adhesive membrane for fixing wafer;
The edge of described first carrying platform is provided with vacuum sucking holes or solid latch mechanism, for fixing described standard fixture, wherein, described standard fixture is stained with the adhesive membrane for depositing chip;
The edge of described second carrying platform is provided with location claw, for fixing and depositing described wafer fixation kit or described standard fixture.
5. the measurement separation system of chip according to claim 4, it is characterized in that, the front end of described feeding spiral arm is provided with vacuum slot, for when described feeding spiral arm moves to described sorting unit, thimble in the thimble through hole at described second fixed eyelid retractor center is coordinated to eject, the adhesive membrane pierced through on described wafer fixation kit ejects treats sorting chip, described vacuum slot is contacted and the chip ejected described in adsorbing, thus described chip is moved to put described first carrying platform standard fixture on;
Wherein, described first carrying platform, also for after often perform the operation of feeding at described feeding spiral arm, move the cell of predeterminable range with transverse direction or longitudinal direction, the chip that described feeding spiral arm is chosen at every turn all adheres on the adhesive membrane of described standard fixture.
6. the measurement separation system of the chip according to any one of Claims 1 to 5, it is characterized in that, shade is provided with between described measurement mechanism and described sorting unit, described shade comprises shading baffle and barrier driving module, the top of described shading baffle is positioned under the horizontal plane of described first thing-putting holder and described second thing-putting holder, described barrier driving module is connected with described central control system, for described measurement mechanism and/or described sorting unit in running order time, raise described shading baffle to isolate described measurement mechanism and described sorting unit.
7. the measurement separation system of the chip according to any one of Claims 1 to 5, is characterized in that, is also provided with the 3rd driver module and the 3rd image receiver module in described bogey;
Described 3rd driver module is connected to the bottom of described first carrying platform, carries out transverse direction, longitudinal direction and rotary motion to make described first carrying platform by the driving of described 3rd driver module; Wherein, the edge of described first carrying platform is provided with latching device, for fixing described standard fixture;
Described 3rd image receiver module is arranged at the top of described first carrying platform, described 3rd image receiver module comprises microscope and imageing sensor, described microscope is used for showing the image amplifying process when receiving the image of described wafer, and described imageing sensor is for extracting the image information of described wafer.
8. the measurement separation system of the chip according to any one of Claims 1 to 5, it is characterized in that, described first mechanical arm is configured with the first arm driver module, be provided for described first mechanical arm carry out 360 degree of rotations and move up and down, to move to the top of described measurement mechanism, described sorting unit, described bogey or described location access device, the front end of described first mechanical arm is provided with vacuum cup, for passing through the firm crawl described wafer fixation kit of vacuum suction or described standard; And/or,
Described second mechanical arm is configured with the second arm driver module, be provided for described second mechanical arm to carry out rotating and moving up and down, with the top of the inside and described location access device that move to described fixture frame component, the front end of described second mechanical arm is provided with vacuum cup, for passing through the firm described standard fixture of crawl of vacuum suction.
9. the measurement separation system of the chip according to any one of Claims 1 to 5, it is characterized in that, described sorting unit is also for scanning and obtaining in described wafer fixation kit the coordinate information of fixing wafer, and described central control system is also for the data analysis measured by described sorting unit, process and access.
10. the measurement separation system of the chip according to any one of Claims 1 to 5, it is characterized in that, the bottom of described fixture frame component is provided with four-wheel drive module, be provided for described fixture frame component to carry out moving left and right and moving up and down, wherein, be provided with many groups of " non-" font fixture bank bits in described fixture frame component, described standard fixture is specifically stored in described fixture bank bit.
The measurement method for separating of 11. 1 kinds of chips, is characterized in that, adopt the measurement separation system of the chip according to any one of claim 1 ~ 10 to carry out measuring and analyzing, described method comprises:
The coordinate information that position scanning generates described first wafer is carried out to described first wafer, and by described measurement module, described first wafer is carried out to the measurement of photoelectric properties, generate the first metrical information, wherein, described coordinate information comprises the coordinate information of each chip in described first wafer;
By described first mechanical arm described first wafer moved and be fixed on described second thing-putting holder, by described sorting unit and described feeding spiral arm, a point selection operation is carried out to described first wafer, according to preset sort regular by standard fixtures extremely different for the die grading in described first wafer.
12. methods according to claim 11, it is characterized in that, the described coordinate information described first wafer being carried out to each chip in described first wafer of position scanning generation, and by described measurement module, described first wafer is carried out to the measurement of photoelectric properties, generate the first metrical information, comprising:
First wafer is fixed on described first thing-putting holder, by described measurement mechanism, position scanning is carried out to described first wafer, obtain the initial markers point of described first wafer to generate the coordinate information of described first wafer, and described first wafer is carried out to the measurement of photoelectric properties, generate the first metrical information.
13. methods according to claim 11, it is characterized in that, the described coordinate information described first wafer being carried out to described first wafer of position scanning generation, and by described measurement module, described first wafer is carried out to the measurement of photoelectric properties, generate the first metrical information, comprising:
First wafer is fixed on described second thing-putting holder, by described sorting unit, position scanning is carried out to described first wafer, obtain the initial markers point of described first wafer and generate the coordinate information of described first wafer;
By described first mechanical arm described first wafer moved and be fixed on described first thing-putting holder, by described measurement module, described first wafer is carried out to the measurement of photoelectric properties, generate the first metrical information, and the second wafer is fixed on described second thing-putting holder, position scanning is carried out to described second wafer, obtain the initial markers point of described second wafer and generate the coordinate information of described second wafer, wherein, described coordinate information comprises the coordinate information of each chip in described second wafer;
Describedly by described first mechanical arm described first wafer moved and before being fixed on described second thing-putting holder, also comprise:
By described first mechanical arm described first wafer or described second wafer moved and be fixed on described second carrying platform, move to make described second wafer and be fixed on described first thing-putting holder;
Then described method also comprises:
By described measurement module, described second wafer is carried out to the measurement of photoelectric properties, generate the second metrical information;
By described first mechanical arm described second wafer moved and be fixed on described second thing-putting holder, by described sorting unit and described feeding spiral arm, a point selection operation is carried out to described second wafer, according to preset sort regular by standard fixtures extremely different for the die grading in described second wafer.
14. methods according to any one of claim 11 ~ 13, it is characterized in that, the coordinate information that position scanning generates described first wafer is carried out to described first wafer, and by described measurement module, described first wafer is carried out to the measurement of photoelectric properties, after generating the first metrical information, also comprise:
The coordinate information of described first wafer and described first metrical information are sent to central control system;
By described sorting unit and described feeding spiral arm, a point selection operation is carried out to described first wafer then, comprising:
Described central control system, according to the coordinate information of described first wafer and described first metrical information, controls described sorting unit and described feeding spiral arm carries out a point selection operation to described first wafer.
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