CN104561943A - 用于线路板的化学镀镍钯合金工艺 - Google Patents
用于线路板的化学镀镍钯合金工艺 Download PDFInfo
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- CN104561943A CN104561943A CN201410830802.5A CN201410830802A CN104561943A CN 104561943 A CN104561943 A CN 104561943A CN 201410830802 A CN201410830802 A CN 201410830802A CN 104561943 A CN104561943 A CN 104561943A
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- 238000007747 plating Methods 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 28
- 239000000126 substance Substances 0.000 title claims abstract description 26
- 229910001252 Pd alloy Inorganic materials 0.000 title claims abstract description 21
- BSIDXUHWUKTRQL-UHFFFAOYSA-N nickel palladium Chemical compound [Ni].[Pd] BSIDXUHWUKTRQL-UHFFFAOYSA-N 0.000 title abstract description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 77
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 45
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 38
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 22
- 230000004913 activation Effects 0.000 claims abstract description 21
- 239000007788 liquid Substances 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000002253 acid Substances 0.000 claims abstract description 10
- 229910052802 copper Inorganic materials 0.000 claims abstract description 10
- 239000010949 copper Substances 0.000 claims abstract description 10
- 150000002940 palladium Chemical class 0.000 claims abstract description 7
- 230000002829 reductive effect Effects 0.000 claims abstract description 5
- 238000005406 washing Methods 0.000 claims abstract description 5
- 239000003814 drug Substances 0.000 claims abstract description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 12
- 239000000956 alloy Substances 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 150000002815 nickel Chemical class 0.000 claims description 8
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- 238000006555 catalytic reaction Methods 0.000 claims description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid group Chemical group C(CC(O)(C(=O)O)CC(=O)O)(=O)O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 6
- 239000008139 complexing agent Substances 0.000 claims description 6
- 230000003628 erosive effect Effects 0.000 claims description 6
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 claims description 6
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 claims description 4
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 4
- 238000005282 brightening Methods 0.000 claims description 4
- 239000003153 chemical reaction reagent Substances 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 claims description 4
- KBJMLQFLOWQJNF-UHFFFAOYSA-N nickel(ii) nitrate Chemical compound [Ni+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O KBJMLQFLOWQJNF-UHFFFAOYSA-N 0.000 claims description 4
- GPNDARIEYHPYAY-UHFFFAOYSA-N palladium(ii) nitrate Chemical compound [Pd+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O GPNDARIEYHPYAY-UHFFFAOYSA-N 0.000 claims description 4
- UMGDCJDMYOKAJW-UHFFFAOYSA-N thiourea Chemical compound NC(N)=S UMGDCJDMYOKAJW-UHFFFAOYSA-N 0.000 claims description 4
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 claims description 3
- 230000008021 deposition Effects 0.000 claims description 3
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 claims description 3
- IVKNZCBNXPYYKL-UHFFFAOYSA-N 2-[2-[2-[2-[2-[2-[2-[2-[2-[2-[4-(2,4,4-trimethylpentan-2-yl)phenoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethoxy]ethanol Chemical compound CC(C)(C)CC(C)(C)C1=CC=C(OCCOCCOCCOCCOCCOCCOCCOCCOCCOCCO)C=C1 IVKNZCBNXPYYKL-UHFFFAOYSA-N 0.000 claims description 2
- JHUFGBSGINLPOW-UHFFFAOYSA-N 3-chloro-4-(trifluoromethoxy)benzoyl cyanide Chemical compound FC(F)(F)OC1=CC=C(C(=O)C#N)C=C1Cl JHUFGBSGINLPOW-UHFFFAOYSA-N 0.000 claims description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 2
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 2
- 239000004471 Glycine Substances 0.000 claims description 2
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 2
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 2
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 claims description 2
- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 claims description 2
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 2
- 229910000085 borane Inorganic materials 0.000 claims description 2
- 239000004310 lactic acid Substances 0.000 claims description 2
- 235000014655 lactic acid Nutrition 0.000 claims description 2
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 claims description 2
- AIYYMMQIMJOTBM-UHFFFAOYSA-L nickel(ii) acetate Chemical compound [Ni+2].CC([O-])=O.CC([O-])=O AIYYMMQIMJOTBM-UHFFFAOYSA-L 0.000 claims description 2
- 229910017604 nitric acid Inorganic materials 0.000 claims description 2
- RFLFDJSIZCCYIP-UHFFFAOYSA-L palladium(2+);sulfate Chemical compound [Pd+2].[O-]S([O-])(=O)=O RFLFDJSIZCCYIP-UHFFFAOYSA-L 0.000 claims description 2
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 claims description 2
- ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 claims description 2
- 229960004839 potassium iodide Drugs 0.000 claims description 2
- 235000007715 potassium iodide Nutrition 0.000 claims description 2
- MCJGNVYPOGVAJF-UHFFFAOYSA-N quinolin-8-ol Chemical compound C1=CN=C2C(O)=CC=CC2=C1 MCJGNVYPOGVAJF-UHFFFAOYSA-N 0.000 claims description 2
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical group C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 claims description 2
- 235000019204 saccharin Nutrition 0.000 claims description 2
- 229910052708 sodium Inorganic materials 0.000 claims description 2
- 239000011734 sodium Substances 0.000 claims description 2
- 239000001632 sodium acetate Substances 0.000 claims description 2
- 235000017281 sodium acetate Nutrition 0.000 claims description 2
- 239000012279 sodium borohydride Substances 0.000 claims description 2
- 229910000033 sodium borohydride Inorganic materials 0.000 claims description 2
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 2
- PODWXQQNRWNDGD-UHFFFAOYSA-L sodium thiosulfate pentahydrate Chemical compound O.O.O.O.O.[Na+].[Na+].[O-]S([S-])(=O)=O PODWXQQNRWNDGD-UHFFFAOYSA-L 0.000 claims description 2
- CIJQGPVMMRXSQW-UHFFFAOYSA-M sodium;2-aminoacetic acid;hydroxide Chemical compound O.[Na+].NCC([O-])=O CIJQGPVMMRXSQW-UHFFFAOYSA-M 0.000 claims description 2
- BWYYYTVSBPRQCN-UHFFFAOYSA-M sodium;ethenesulfonate Chemical compound [Na+].[O-]S(=O)(=O)C=C BWYYYTVSBPRQCN-UHFFFAOYSA-M 0.000 claims description 2
- UORVGPXVDQYIDP-UHFFFAOYSA-N trihydridoboron Substances B UORVGPXVDQYIDP-UHFFFAOYSA-N 0.000 claims description 2
- 229960004418 trolamine Drugs 0.000 claims description 2
- 235000015165 citric acid Nutrition 0.000 claims 1
- 238000004381 surface treatment Methods 0.000 abstract description 5
- 238000000151 deposition Methods 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000003213 activating effect Effects 0.000 abstract 2
- 238000001035 drying Methods 0.000 abstract 2
- 230000002378 acidificating effect Effects 0.000 abstract 1
- 238000005238 degreasing Methods 0.000 abstract 1
- 238000005237 degreasing agent Methods 0.000 abstract 1
- 239000013527 degreasing agent Substances 0.000 abstract 1
- 238000002360 preparation method Methods 0.000 abstract 1
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 101150072497 EDS1 gene Proteins 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- -1 lactic acid Natural products 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 239000003223 protective agent Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
- C23C18/50—Coating with alloys with alloys based on iron, cobalt or nickel
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- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
本发明公开了一种用于线路板的化学镀镍钯合金工艺，其特征在于，它包括如下步骤：(1)、除油：将产品放入酸性除油剂中，去除板面的油污与指纹；(2)、微蚀：将产品放入微蚀液，将铜表面轻微咬蚀；(3)、活化：将产品放入钯活化液中活化，使产品表面沉积一层活化钯；(4)、化学镍：将产品放入镀镍液中，在铜表面沉积一层镍；(5)、微蚀：将产品置于酸液中，将镍表面轻微咬蚀；(6)、活化：将产品放入钯活化液中，使产品表面沉积一层活化钯；(7)、化学镀镍钯：将产品放入镍钯合金镀液中镀覆，在镍表面沉积一层镍钯合金镀层；(8)、水洗烘干：清洗板面残留的前制程药水，烘干。本发明可有效降低生产成本，有利于线路板表面处理工艺的应用。
Description
技术领域
本发明涉及线路板表面处理工艺，是一种用于线路板的化学镀镍钯合金工艺。
背景技术
目前，适合用于线路板上的表面处理主要有：1、有机焊锡保护剂；2、置换镀银；3、置换镀锡；4、化学镍/置换镀金；5、化学镍钯金(Ni/Pd/Au)工艺。前4种表面处理都各自存在一定的缺陷，近年流行的化学镍钯金工艺，因镀层具有良好的耐磨耐蚀性及可焊行，被广泛应用，但使用高价格的贵金属Au，且工艺略显复杂。因此有必要提供一种用于线路板表面金层的替代工艺。
发明内容
本发明的目的就是为了解决现有技术之不足而提供的一种可有效降低生产成本，有利于线路板表面处理工艺的应用的用于线路板的化学镀镍钯合金工艺。
本发明是采用如下技术解决方案来实现上述目的：一种用于线路板的化学镀镍钯合金工艺，其特征在于，它包括如下步骤：
(1)、除油：将产品放入酸性除油剂中，去除板面的油污与指纹；
(2)、微蚀：将产品放入微蚀液，将铜表面轻微咬蚀，以获得新鲜的表面，提高后续镀层结合力；
(3)、活化：将产品放入钯活化液中活化，使产品表面沉积一层活化钯，以作后续化学镍的催化媒介；
(4)、化学镍：将产品放入镀镍液中，在铜表面沉积一层镍；
(5)、微蚀：将产品置于酸液中，将镍表面轻微咬蚀；
(6)、活化：将产品放入钯活化液中，使产品表面沉积一层活化钯，以作后续化学镍钯合金的催化媒介；
(7)、化学镀镍钯：将产品放入镍钯合金镀液中镀覆，在镍表面沉积一层镍钯合金镀层；
(8)、水洗烘干：清洗板面残留的前制程药水，烘干。
作为上述方案的进一步说明，所述的步骤(2)中的微蚀液含50-200g/L过硫酸钠、20-100ml/L浓硫酸。
所述的步骤(5)中的酸液是硫酸、硝酸、盐酸的一种。
所述的钯活化液含浓硫酸1-50ml/L、离子钯10-100ppm，活化液的温度为室温。
所述的镀镍液有效组分含量为0.1-3mol/L次磷酸根、15-100g/L镍盐，镀镍液温度70-90℃，PH值为4.5-6.8。
所述的镍钯合金镀液的组分包括0.1-5g/L钯盐、2-60g/L镍盐、10-65g/L还原剂、20-100g/L络合剂、1-10mg/L稳定剂、10-60g/L缓冲剂、10-300mg/L光亮剂，其中钯盐是醋酸钯、硫酸钯、氯化钯、硝酸钯的一种，镍盐是硫酸镍、氯化镍、乙酸镍、硝酸镍的一种，还原剂是硼烷、肼、次亚磷酸盐、硼氢化钠的一种，络合剂主要是柠檬酸、乳酸、氨水、三乙醇胺、甘氨酸、EDTA、乙二胺，8-羟基喹啉等离子络合剂一种或多种的组合，稳定剂选用硫脲、硫代硫酸钠、碘化钾中的一种或多种，缓冲剂有乙酸钠、氨水-氯化铵、甘氨酸-氢氧化钠、碳酸钠，光亮剂是邻磺酰苯酰亚胺钠、乙烯基磺酸钠、OP-10、烯丙基磺酸钠等的一种或多种组合；镍钯合金镀液的温度为50-85℃，PH值范围为7.1-11。
本发明采用上述技术解决方案所能达到的有益效果是：
本发明采用镍钯合金镀层作为一种代金镀层，可焊性好、耐磨耐蚀、硬度高，且孔隙率低，在保证使用性能的同时，降低了制造成本。
附图说明
图1为本发明的样品测试位置表面微观形貌SEM图；
图2为图1中EDS1能谱分析结果；
图3为图1中EDS2能谱分析结果；
图4为本发明的样品测试位置表面微观形貌SEM图；
图5为图4中EDS1能谱分析结果；
图6为图4中EDS2能谱分析结果。
具体实施方式
以下结合具体实施例对本发明的具体实施方案作进一步的详述。
本发明是一种用于线路板的化学镀镍钯合金工艺,它包括如下步骤：
步骤1：除油：将产品放入配有80-150ml/L的酸性除油剂中，以30-40℃的温度处理4-6min，以除去板面的油污和指纹等板面污染；
步骤2：微蚀：将产品放入配有50-200g/L过硫酸钠、20-100ml/L浓硫酸的混合溶液中处理1-2min，将铜表面轻微咬蚀，以获得新鲜的表面，提高后续镀层结合力；
步骤3：活化：将产品放入配有浓硫酸1-50ml/L、离子钯10-100ppm的混合溶液中活化3-5min，使产品表面沉积一层活化钯，以作后续化学镍的催化媒介；
步骤4：化学镍：将产品放入镀镍溶液中镀覆，控制PH＝4.5-6.8，在70-90℃的温度下处理15-30min，在铜表面沉积一层镍；
步骤5：微蚀：将产品放入10％的盐酸中，将镍表面轻微咬蚀；
步骤6：钯活化：将产品放入配有浓硫酸1-50ml/L、钯盐10-100ppm的混合溶液中活化3-5min，使产品表面沉积一层活化钯，以作后续化学镍钯合金的催化媒介；
步骤7：化学镍钯：将产品放入合金镀液中镀覆，控制PH＝7.1-11，在50-85℃的温度下处理15-30min，在镍表面沉积一层镍钯合金镀层；
步骤8：水洗烘干：彻底清洗板面残留的前制程药水，然后烘干。
实施例1
本实施例是以铜片为基材，按所述步骤进行试验；其中，步骤7所采用的镍钯合金镀液的组成包括：
对试样进行SEM测试，所得镀层微观形貌如图1，EDS测试所得镀层及扫描图谱如图2与图3。
实施例3
本实施例是以铜片为基材，按上述步骤进行试验；其中，步骤7所采用的镍钯合金镀液的组成包括：
对试样进行SEM测试，所得镀层微观形貌如图4，EDS测试所得镀层及扫描图谱如图5与图6。
以上所述的仅是本发明的优选实施方式，应当指出，对于本领域的普通技术人员来说，在不脱离本发明创造构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。
Claims (6)
1.一种用于线路板的化学镀镍钯合金工艺，其特征在于，它包括如下步骤：
(1)、除油：将产品放入酸性除油剂中，去除板面的油污与指纹；
(2)、微蚀：将产品放入微蚀液，将铜表面轻微咬蚀；
(3)、活化：将产品放入钯活化液中活化，使产品表面沉积一层活化钯，以作后续化学镍的催化媒介；
(4)、化学镍：将产品放入镀镍液中，在铜表面沉积一层镍；
(5)、微蚀：将产品置于酸液中，将镍表面轻微咬蚀；
(6)、活化：将产品放入钯活化液中，使产品表面沉积一层活化钯，以作后续化学镍钯合金的催化媒介；
(7)、化学镀镍钯：将产品放入镍钯合金镀液中镀覆，在镍表面沉积一层镍钯合金镀层；
(8)、水洗烘干：清洗板面残留的前制程药水，烘干。
2.根据权利要求1所述的用于线路板的化学镀镍钯合金工艺，其特征在于，所述的步骤(2)中的微蚀液含50-200g/L过硫酸钠、20-100ml/L浓硫酸。
3.根据权利要求1所述的用于线路板的化学镀镍钯合金工艺，其特征在于，所述的步骤(5)中的酸液是硫酸、硝酸、盐酸的一种。
4.根据权利要求1所述的用于线路板的化学镀镍钯合金工艺，其特征在于，所述的钯活化液含浓硫酸1-50ml/L、离子钯10-100ppm，活化液的温度为室温。
5.根据权利要求1所述的用于线路板的化学镀镍钯合金工艺，其特征在于，所述的镀镍液有效组分含量为0.1-3mol/L次磷酸根、15-100g/L镍盐，镀镍液温度70-90℃，PH值为4.5-6.8。
6.根据权利要求1所述的用于线路板的化学镀镍钯合金工艺，其特征在于，所述的镍钯合金镀液的组分包括0.1-5g/L钯盐、2-60g/L镍盐、10-65g/L还原剂、20-100g/L络合剂、1-10mg/L稳定剂、10-60g/L缓冲剂、10-300mg/L光亮剂，其中钯盐是醋酸钯、硫酸钯、氯化钯、硝酸钯的一种，镍盐是硫酸镍、氯化镍、乙酸镍、硝酸镍的一种，还原剂是硼烷、肼、次亚磷酸盐、硼氢化钠的一种，络合剂是柠檬酸、乳酸、氨水、三乙醇胺、甘氨酸、EDTA、乙二胺，8-羟基喹啉等离子络合剂一种或多种的组合，稳定剂选用硫脲、硫代硫酸钠、碘化钾中的一种或多种，缓冲剂有乙酸钠、氨水-氯化铵、甘氨酸-氢氧化钠、碳酸钠，光亮剂是邻磺酰苯酰亚胺钠、乙烯基磺酸钠、OP-10、烯丙基磺酸钠等的一种或多种组合；镍钯合金镀液的温度为50-85℃，PH值范围为7.1-11。
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