CN104513641B - The preparation method of low burst size of methanal adhesive - Google Patents
The preparation method of low burst size of methanal adhesive Download PDFInfo
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- CN104513641B CN104513641B CN201310679683.3A CN201310679683A CN104513641B CN 104513641 B CN104513641 B CN 104513641B CN 201310679683 A CN201310679683 A CN 201310679683A CN 104513641 B CN104513641 B CN 104513641B
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- urea
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- adhesive
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- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 title claims abstract description 76
- 239000000853 adhesive Substances 0.000 title claims abstract description 35
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 35
- 235000019256 formaldehyde Nutrition 0.000 title claims abstract description 30
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims abstract description 57
- 239000004202 carbamide Substances 0.000 claims abstract description 57
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 16
- 229920000877 Melamine resin Polymers 0.000 claims abstract description 12
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000003292 glue Substances 0.000 claims abstract description 10
- 239000003513 alkali Substances 0.000 claims description 20
- 239000002253 acid Substances 0.000 claims description 15
- 239000002994 raw material Substances 0.000 claims description 13
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 5
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 5
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 5
- 239000003795 chemical substances by application Substances 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 4
- 238000005452 bending Methods 0.000 abstract description 2
- 238000007689 inspection Methods 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 2
- 229920001807 Urea-formaldehyde Polymers 0.000 description 5
- GZCGUPFRVQAUEE-SLPGGIOYSA-N aldehydo-D-glucose Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C=O GZCGUPFRVQAUEE-SLPGGIOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 239000002023 wood Substances 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000003915 air pollution Methods 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000005034 decoration Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 239000003317 industrial substance Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Abstract
The invention discloses preparation method of a kind of low burst size of methanal adhesive and preparation method thereof, relate to adhesion agent for artificial board technical field, 10800 parts of formaldehyde；8400 parts of urea；Melamine 175 parts；Auxiliary agent 75 parts；Through inspection, the adhesive burst size of methanal of the present invention is 3mg/100g 7mg/100g(condensed steam water 0.1～0.3mg/L), and bonding strength and bending strength meet national standard, therefore, human body is damaged close to zero and IAQ good by the artificial board prepared with this adhesive, and preparation technology is simple, glue stability is preferable.
Description
Technical field
The present invention relates to adhesion agent for artificial board technical field, the preparation method of a kind of low burst size of methanal adhesive.
Background technology
Adhesive and adhesive technology have shown that incomparable vigor and vitality, and its importance grows with each passing day, and practicality makes us belonging to mesh, applies increasingly extensive.At present, the adhesive of China is mainly with formaldehyde as main production raw material, i.e. urea-formaldehyde resin adhesive, phenolic resin glue and melamine-formaldehyde resin adhesive, its yield accounts for whole wood-based panel industry and sticks with glue more than the 90% of agent, wherein, urea-formaldehyde resin adhesive due to low cost of manufacture, raw material be easy to get, adhesive strength high, color and luster is close to plurality of advantages such as timber, and favored by most of artificial board enterprises, its consumption accounts for more than the 85% of above-mentioned three kinds of adhesive total amounts.
Raising along with living standards of the people, living conditions improve, substantial amounts of woodworking article is applied to interior decoration, and urea-formaldehyde resin adhesive is in glue and sheeting process, and the wood-based plate made with urea-formaldehyde resin adhesive is during Long-Time Service, can continue to discharge free formaldehyde in a large number, and this free formaldehyde could release after 15 years；Therefore, very serious to the injury of the mankind, also it is one of the important sources of room air pollution；The worsening shortages of petroleum resources, and the constantly enhancing of people's environmental consciousness, human society must be walked the road of sustainable development, therefore, find the problem that the substitute of tradition urea-formaldehyde resin adhesive has become as continuation solution.
Summary of the invention
The technical problem to be solved is to provide the preparation method of a kind of low burst size of methanal adhesive, and it can solve existing adhesive burst size of methanal height, pollute environment, the problem of infringement health.
In order to solve the problems referred to above, the technical scheme is that the preparation method of this low burst size of methanal adhesive, including the raw material of following weight portion:
10800 parts of formaldehyde；8400 parts of urea；Melamine 175 parts；Auxiliary agent 75 parts；
Comprise the steps:
A. formaldehyde is added in reactor, add alkali regulation pH value to 8.51～8.7；Adding first urea and melamine, temperature is 30 DEG C～35 DEG C, forms solution A；First urea accounts for the 45.8% of total urea amount；
B. slowly rise to solution A temperature react at 89 DEG C～90 DEG C in 40 minutes～50 minutes, be subsequently adding acid and pH value is adjusted to 6.5, be incubated 32 minutes, obtain solution B；
When C. solution B being cooled to 88 DEG C, in solution B, acid adding regulation pH value is to 5.3～5.4, and temperature is controlled to react at 89 DEG C～90 DEG C；Beginning timing from acid adding, within 110～120 minutes, reaction end viscosity 21 seconds/30 DEG C～22 seconds/30 DEG C, obtain solution C；
When D. solution C being cooled to 80 DEG C～82 DEG C, in solution C add auxiliary agent, and add alkali regulation pH value to 7.1～7.3, be subsequently adding second batch urea, at a temperature of 70 DEG C～75 DEG C react 20 minutes, obtain solution D；Second batch urea accounts for the 17.3% of total urea amount；
When E. solution D being cooled to 70 DEG C～72 DEG C, adding the 3rd batch of urea, keeping temperature is to react 20 minutes at 63 DEG C～65 DEG C, obtains solution E；3rd batch of urea accounts for the 20.2% of total urea amount；
When F. solution E being slowly cooled to 52 DEG C～55 DEG C, add alkali regulation pH value to 7.1～7.3, add the 4th batch of urea, after keeping 10 minutes, be cooled to 40 DEG C, add alkali regulate pH value to 7.5～8.0, put glue, i.e. can get this adhesive.
In technique scheme, more specifically scheme is it may also is that described accelerator includes: described auxiliary agent includes: triethanolamine 8 parts；Hexa 9 parts；Polyvinyl alcohol 6 parts；Phthalic acid 10 parts, the raw material of weight portion.
Owing to using technique scheme, there is advantages that
Through inspection, the adhesive burst size of methanal of the present invention is 3 mg/100g～7mg/100g(condensed steam water 0.1～0.3mg/L), and bonding strength and bending strength meet national standard, therefore, human body is damaged close to zero and IAQ good by the artificial board prepared with this adhesive, and preparation technology is simple, easily operate, to equipment of resin making without particular/special requirement；Raw material is common industrial chemicals, and wide material sources are easily bought, do not limited by market；The Adhensive performance prepared is stable, and free formaldehyde is low, and detection free formaldehyde content is less than 0.05% by long-term use.
Detailed description of the invention
By embodiment, the present invention is described in further detail below:
Embodiment 1
The preparation method of this low burst size of methanal adhesive, including the raw material of following weight:
10800 kilograms of formaldehyde；8400 kilograms of urea；Melamine 175 kilograms；Auxiliary agent 75 kilograms；
Comprise the steps:
A. formaldehyde is added in reactor, add alkali regulation pH value to 8.51；Adding first urea and melamine, temperature is 30 DEG C～35 DEG C, forms solution A；First urea accounts for the 45.8% of total urea amount；
B. slowly rose to solution A temperature react at 89 DEG C～90 DEG C in 40 minutes, be subsequently adding acid and pH value is adjusted to 6.5, be incubated 32 minutes, obtain solution B；
When C. solution B being cooled to 88 DEG C, in solution B, acid adding regulation pH value is to 5.3, and temperature is controlled to react at 89 DEG C～90 DEG C；Beginning timing from acid adding, within 110 minutes, reaction end viscosity 21 seconds/30 DEG C, obtain solution C；
When D. solution C being cooled to 80 DEG C～82 DEG C, in solution C add auxiliary agent, and add alkali regulation pH value to 7.1, be subsequently adding second batch urea, at a temperature of 70 DEG C～75 DEG C react 20 minutes, obtain solution D；Second batch urea accounts for the 17.3% of total urea amount；Auxiliary agent includes: triethanolamine 8 kilograms；Hexa 9 kilograms；Polyvinyl alcohol 6 kilograms；Phthalic acid 10 kilograms, the raw material of weight；
When E. solution D being cooled to 70 DEG C～72 DEG C, adding the 3rd batch of urea, keeping temperature is to react 20 minutes at 63 DEG C～65 DEG C, obtains solution E；3rd batch of urea accounts for the 20.2% of total urea amount；
When F. solution E being slowly cooled to 52 DEG C～55 DEG C, add alkali regulation pH value to 7.1, add the 4th batch of urea, after keeping 10 minutes, be cooled to 40 DEG C, add alkali regulate pH value to 7.5, put glue, i.e. can get this adhesive.
Embodiment 2:
The preparation method of this low burst size of methanal adhesive, including the raw material of following weight:
10800 kilograms of formaldehyde；8400 kilograms of urea；Melamine 175 kilograms；Auxiliary agent 75 kilograms；
Comprise the steps:
A. formaldehyde is added in reactor, add alkali regulation pH value to 8.67；Adding first urea and melamine, temperature is 30 DEG C～35 DEG C, forms solution A；First urea accounts for the 45.8% of total urea amount；
B. slowly rose to solution A temperature react at 89 DEG C～90 DEG C in 50 minutes, be subsequently adding acid and pH value is adjusted to 6.5, be incubated 32 minutes, obtain solution B；
When C. solution B being cooled to 88 DEG C, in solution B, acid adding regulation pH value is to 5.4, and temperature is controlled to react at 89 DEG C～90 DEG C；Beginning timing from acid adding, within 120 minutes, reaction end viscosity 22 seconds/30 DEG C, obtain solution C；
When D. solution C being cooled to 80 DEG C～82 DEG C, in solution C add auxiliary agent, and add alkali regulation pH value to 7.3, be subsequently adding second batch urea, at a temperature of 70 DEG C～75 DEG C react 20 minutes, obtain solution D；Second batch urea accounts for the 17.3% of total urea amount；Auxiliary agent includes: triethanolamine 8 kilograms；Hexa 9 kilograms；Polyvinyl alcohol 6 kilograms；Phthalic acid 10 kilograms, the raw material of weight；
When E. solution D being cooled to 70 DEG C～72 DEG C, adding the 3rd batch of urea, keeping temperature is to react 20 minutes at 63 DEG C～65 DEG C, obtains solution E；3rd batch of urea accounts for the 20.2% of total urea amount；
When F. solution E being slowly cooled to 52 DEG C～55 DEG C, add alkali regulation pH value to 7.3, add the 4th batch of urea, after keeping 10 minutes, be cooled to 40 DEG C, add alkali regulate pH value to 8.0, put glue, i.e. can get this adhesive.
Embodiment 3:
The preparation method of this low burst size of methanal adhesive, including the raw material of following weight:
10800 kilograms of formaldehyde；8400 kilograms of urea；Melamine 175 kilograms；Auxiliary agent 75 kilograms；
Comprise the steps:
A. formaldehyde is added in reactor, add alkali regulation pH value to 8.7；Adding first urea and melamine, temperature is 30 DEG C～35 DEG C, forms solution A；First urea accounts for the 45.8% of total urea amount；
B. slowly rose to solution A temperature react at 89 DEG C～90 DEG C in 46 minutes, be subsequently adding acid and pH value is adjusted to 6.5, be incubated 32 minutes, obtain solution B；
When C. solution B being cooled to 88 DEG C, in solution B, acid adding regulation pH value is to 5.36, and temperature is controlled to react at 89 DEG C～90 DEG C；Beginning timing from acid adding, within 114 minutes, reaction end viscosity 21 seconds/30 DEG C, obtain solution C；
When D. solution C being cooled to 80 DEG C～82 DEG C, in solution C add auxiliary agent, and add alkali regulation pH value to 7.2, be subsequently adding second batch urea, at a temperature of 70 DEG C～75 DEG C react 20 minutes, obtain solution D；Second batch urea accounts for the 17.3% of total urea amount；Auxiliary agent includes: triethanolamine 8 kilograms；Hexa 9 kilograms；Polyvinyl alcohol 6 kilograms；Phthalic acid 10 kilograms, the raw material of weight；
When E. solution D being cooled to 70 DEG C～72 DEG C, adding the 3rd batch of urea, keeping temperature is to react 20 minutes at 63 DEG C～65 DEG C, obtains solution E；3rd batch of urea accounts for the 20.2% of total urea amount；
When F. solution E being slowly cooled to 52 DEG C～55 DEG C, add alkali regulation pH value to 7.2, add the 4th batch of urea, after keeping 10 minutes, be cooled to 40 DEG C, add alkali regulate pH value to 7.7, put glue, i.e. can get this adhesive.
For verifying the effect of invention adhesive, this adhesive is made wood-based plate and detects:
Woodchip, washing, boiling softening, defibrator process are become fiber, then apply the adhesive of the present invention, urea and ammonium chloride mixed curing agent, be then dried, selection by winnowing, mat formation shaping, hot pressing, jack saw, cooling, last sanding cutting edge gets product artificial board.
Described artificial board gluing amount is over dry glue/bone dry fiber=17%, finished product sheet material thickness specification is 2440 × 1220 × 15mm, density: 700kg/m3;According to national standard, sampling Detection is as follows:
Claims (2)
1. the preparation method of a low burst size of methanal adhesive, it is characterised in that: include the raw material of following weight portion:
10800 parts of formaldehyde；8400 parts of urea；Melamine 175 parts；Auxiliary agent 75 parts；
Comprise the steps:
A. formaldehyde is added in reactor, add alkali regulation pH value to 8.51～8.7；Adding first urea and melamine, temperature is 30 DEG C～35 DEG C, forms solution A；First urea accounts for the 45.8% of total urea amount；
B. slowly rise to solution A temperature react at 89 DEG C～90 DEG C in 40 minutes～50 minutes, be subsequently adding acid and pH value is adjusted to 6.5, be incubated 32 minutes, obtain solution B；
When C. solution B being cooled to 88 DEG C, solution B adds acid for adjusting pH value to 5.3～5.4, and temperature is controlled to react at 89 DEG C～90 DEG C；Beginning timing from acid adding, within 110～120 minutes, reaction end viscosity 21 seconds/30 DEG C～22 seconds/30 DEG C, obtain solution C；
When D. solution C being cooled to 80 DEG C～82 DEG C, in solution C add auxiliary agent, and add alkali regulation pH value to 7.1～7.3, be subsequently adding second batch urea, at a temperature of 70 DEG C～75 DEG C react 20 minutes, obtain solution D；Second batch urea accounts for the 17.3% of total urea amount；
When E. solution D being cooled to 70 DEG C～72 DEG C, adding the 3rd batch of urea, keeping temperature is to react 20 minutes at 63 DEG C～65 DEG C, obtains solution E；3rd batch of urea accounts for the 20.2% of total urea amount；
When F. solution E being slowly cooled to 52 DEG C～55 DEG C, add alkali regulation pH value to 7.1～7.3, add the 4th batch of urea, after keeping 10 minutes, be cooled to 40 DEG C, add alkali regulate pH value to 7.5～8.0, put glue, i.e. can get this adhesive.
The preparation method of low burst size of methanal adhesive the most according to claim 1, it is characterised in that: described auxiliary agent includes: triethanolamine 8 parts；Hexa 9 parts；Polyvinyl alcohol 6 parts；Phthalic acid 10 parts, the raw material of weight portion.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310679683.3A CN104513641B (en) | 2013-12-15 | 2013-12-15 | The preparation method of low burst size of methanal adhesive |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310679683.3A CN104513641B (en) | 2013-12-15 | 2013-12-15 | The preparation method of low burst size of methanal adhesive |
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| Publication Number | Publication Date |
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| CN104513641A CN104513641A (en) | 2015-04-15 |
| CN104513641B true CN104513641B (en) | 2016-09-07 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105524241B (en) * | 2016-01-28 | 2018-06-12 | 四川建丰林业有限公司 | EO grades of wood-based plates preparation method of low aldehyde environment-friendly type urea-formaldehyde glue and sticks agent and preparation method thereof |
| CN107151298A (en) * | 2017-05-09 | 2017-09-12 | 陕西中兴林产科技股份有限公司 | Modified urea-formaldehyde glue of E0 grades of medium density fibre board (MDF)s of applewood and preparation method thereof |
| CN107841269A (en) * | 2017-11-29 | 2018-03-27 | 柳州市鸿联木业有限公司 | The preparation method of low burst size of methanal adhesive |
| CN113146786A (en) * | 2021-03-25 | 2021-07-23 | 广西贺州恒达板业股份有限公司 | Preparation method of anti-corrosion finger-jointed board wood |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0913411A2 (en) * | 1997-10-31 | 1999-05-06 | Elf Atochem S.A. | Process for preparing aqueous urea-formaldehyde-melamine aminoplast resins, their use in adhesives for wood products and the obtained wood products |
| CN1834186A (en) * | 2006-03-15 | 2006-09-20 | 北京林业大学 | Cyanurotriamide modified urea resin and prepn. process |
| CN1966541A (en) * | 2006-11-10 | 2007-05-23 | 北京联合大学生物化学工程学院 | Low formaldehyde release volume urea formaldehyde resin preparation method |
| WO2013144226A1 (en) * | 2012-03-29 | 2013-10-03 | Basf Se | Melamine-reinforced uf glues containing up to 0.9% of melamine for the production of medium-density fiberboards |
-
2013
- 2013-12-15 CN CN201310679683.3A patent/CN104513641B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0913411A2 (en) * | 1997-10-31 | 1999-05-06 | Elf Atochem S.A. | Process for preparing aqueous urea-formaldehyde-melamine aminoplast resins, their use in adhesives for wood products and the obtained wood products |
| CN1834186A (en) * | 2006-03-15 | 2006-09-20 | 北京林业大学 | Cyanurotriamide modified urea resin and prepn. process |
| CN1966541A (en) * | 2006-11-10 | 2007-05-23 | 北京联合大学生物化学工程学院 | Low formaldehyde release volume urea formaldehyde resin preparation method |
| WO2013144226A1 (en) * | 2012-03-29 | 2013-10-03 | Basf Se | Melamine-reinforced uf glues containing up to 0.9% of melamine for the production of medium-density fiberboards |
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