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CN104488366A - 用于电路载体的装备方法和电路载体 - Google Patents

用于电路载体的装备方法和电路载体 Download PDF

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Publication number
CN104488366A
CN104488366A CN201480001918.6A CN201480001918A CN104488366A CN 104488366 A CN104488366 A CN 104488366A CN 201480001918 A CN201480001918 A CN 201480001918A CN 104488366 A CN104488366 A CN 104488366A
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CN
China
Prior art keywords
smd
led
circuit carrier
light
emitting zone
Prior art date
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Pending
Application number
CN201480001918.6A
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English (en)
Inventor
A·卡希
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ceratizit Austria GmbH
AB Mikroelektronik GmbH
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Ceratizit Austria GmbH
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=50239345&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CN104488366(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Ceratizit Austria GmbH filed Critical Ceratizit Austria GmbH
Priority to CN201811040188.7A priority Critical patent/CN108882514A/zh
Publication of CN104488366A publication Critical patent/CN104488366A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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    • H05K1/00—Printed circuits
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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
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    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
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    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
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Abstract

本发明涉及一种用于制造装备有至少一个表面贴装LED(SMD-LED)的电路载体(1)的方法，其中，所述至少一个SMD-LED(2)根据电路载体(1)的一个或多个参考点(3)定向地定位于电路载体(1)上，其中，光学探测所述至少一个SMD-LED(2)的发光区域(4)在该SMD-LED(2)中的位置并且根据所述至少一个SMD-LED(2)的发光区域(4)的探测到的位置将所述至少一个SMD-LED(2)装配在电路载体(1)上，以及一种这样的电路载体(1)。

Description

用于电路载体的装备方法和电路载体
技术领域
本发明涉及一种具有权利要求1前序部分特征的用于制造装备有至少一个表面贴装LED(SMD-LED)的电路载体和一种具有权利要求10前序部分特征的电路载体。
背景技术
为了实现基于表面贴装LED器件(SMD-LED)的光的光学应用，要求将SMD-LED器件高精度地装配在电路载体上。例如机动车的前照灯、日间行车灯、闪光器、转向信号灯，它们的光源是LED。
在此，可以相对电路载体的一个或多个限定的参考点将SMD-LED装配在位置中，然后基于这些参考点来定向光学系统(如前置透镜)。
到目前为止，以所谓的“取放(Pick&Place)”法将SMD-LED器件安放在电路载体上并且接着以“回流(Reflow)”法进行钎焊。
在此LED发光区域的最终位置由下列因素确定：
－LED器件中的公差(如发光区域相对LED外轮廓或者相对LED接线垫位置的位置)，
－电路载体中的公差，这些公差确定焊盘的位置(如印制导线相对电路载体轮廓和/或钻孔轮廓的位置，阻焊膜相对印制导线层的位置)，
－SMD-LED在回流焊工艺中的运动，该运动通过焊膏在预热区中的“塌落”以及焊膏在峰值区中熔化时的润湿力引起(浮动)。
借助该方法可实现的SMD-LED器件发光区域的最终定位精度仅在考虑SMD-LED公差和电路载体公差的情况下(尚未考虑回流焊工艺的影响)就已经大于+/-110μm。
回流焊工艺的影响引起附加的位置不精确性，尤其是在SMD-LED器件的角度位置准确度和倾翻位置准确度的领域内。
不考虑用常见的银烧结法来安装SMD-LED，这是因为该方法具有无法接受的大于10秒的漫长工艺时间。
发明内容
本发明的目的在于提供一种同类型的方法，借助该方法能够补偿SMD-LED和电路载体中不可避免存在的公差，尤其是能够在将SMD-LED定位和装配在电路载体上时达到更高的精度，以及提供相应装备的电路载体。
该目的通过具有权利要求1特征的方法和具有权利要求10特征的电路载体得以实现。
通过与发光区域在SMD-LED中的位置相关地将至少一个SMD-LED装配在电路载体上能够消除源于LED器件和电路载体中的公差的不精确性。由此可以使SMD-LED在电路载体上的定位公差达到小于+/-100μm。本申请人的测试表明，公差甚至可达到小于等于+/-50μm。
换言之，通过根据本发明的方法能够在很大程度上或甚至完全消除SMD-LED和电路载体的构件固有公差，也就是说，在根据本发明的方法中，可达到的公差基本上仅由所采用的用于SMD-LED发光区域的探测方法的精度限制。根据项目要求因此可以独立于SMD-LED和电路载体的构造来选择足够精确的探测方法并且由此实现项目中规定的公差。换言之，更便宜或更简单的构件的更大公差可以通过应用更精确的探测方法得到补偿。更精确的探测方法可以如此实现，即，采用更精确的光学相机和/或采用更精确的“取放”装置。
例如可以通过采用光学相机来探测至少一个SMD-LED的发光区域，该光学相机识别发光区域的特征轮廓。
本发明的有利的实施方式在从属权利要求中限定。
本发明例如可以用于这样的电路载体，这些电路载体用于机动车的前照灯、日间行车灯、闪光器、转向信号灯，它们的光源是LED。
参考点例如可以构造为孔的形式(圆孔或长形孔)。附加或备选地，可以使用蚀刻的或印刷的结构。
例如可以设定：根据SMD-LED的发光区域的中点的位置将SMD-LED装配在电路载体上。这是特别有利的，因为通常设置在SMD-LED光路中的光学系统关于SMD-LED的发光区域的中点定向。
特别优选设定：至少一个参考点用于定位、优选用于固定用于SMD-LED的光学系统。在现有技术中，装备有SMD-LED的电路载体在装配时必须在一个单独的方法步骤中相对光学系统定向。这在所描述的特别优选的实施方式中可省却，这是因为通过使用至少一个参考点来定位光学系统使得该光学系统已经被正确定向。如果所述至少一个参考点不仅用于定位光学系统，而且也用于将光学系统固定在电路载体上(在这种情况下，所述至少一个参考点例如构造为用于光学系统的装配孔)，那么获得最高精度。在一些应用中可接受的是：为光学系统设置分开的固定点，所述固定点相对所述至少一个参考点定向。
为了能够在晚些时候使所述至少一个SMD-LED根据电路载体的参考点定向，必须检测电路载体的参考点的位置。这例如可以如此进行，即，使光学相机经过存在的参考点并且分别确定由构件固有公差产生的相对规定位置的偏差。优选采用在晚些时候也用于定位用于SMD-LED光学系统的那些参考点的位置。
通常，在输送带中提供SMD-LED，借助根据现有技术的“取放”系统、如借助吸入装置(真空吸管)从设置在输送带中的槽中将SMD-LED从输送带中取出。在现有技术中，在从输送带取出SMD-LED后从下侧探测该SMD-LED的轮廓或接线垫的位置。这在本发明中是不可能的，因为在此位于SMD-LED上侧的发光区域的位置是决定性的。因此在使用真空吸管系统时必须在通过吸入装置接触之前对发光区域进行探测。在SMD-LED以其它方式被提供时不必绝对存在所述要求。
在应用真空吸管系统时，本发明可以如下实施：
使用这样的照相机来探测待取出的SMD-LED发光区域的位置，所述照相机这样定位或可移动到这样的位置中，使得该照相机能够看到输送带的各个槽内。优选将探测到的位置与SMD-LED在槽中的规定位置进行比较，在该规定位置中，SMD-LED应根据输送带的运行方向(Y方向，X方向＝在输送带的平面中垂直于Y方向的方向)设置在槽中央。计算探测到的发光区域位置相对发光区域中点在X和Y方向上的规定位置的偏差以及相对发光区域角度位置的规定位置的偏差。换言之，确定SMD-LED在输送带的槽中的随机位置并且与规定位置进行比较。
通过用具有匹配LED光谱的波长的光源照射SMD-LED能够使发光区域位置的探测更加可靠。由此能够提高发光区域与SMD-LED的其余区域之间的对比度。匹配波长例如可以在400至500nm的范围中、优选在420至490nm的范围中。
随机位置在SMD-LED被真空吸管取出槽时不应再改变。为确保这点，会是有利的是：也确定发光区域的或SMD-LED的Z位置(Z方向＝垂直于X和Y方向)，然后可以轻柔地进行通过真空吸管的接触，使得在接触时不出现SMD-LED在槽中的位置变化。
因为通过确定参考点的位置已知了电路载体的位置，所以可以借助确定的SMD-LED发光区域的偏差来这样控制真空吸管，使得真空吸管在X和Y方向上以及也通过围绕垂直于SMD-LED的轴线的旋转来修正存在偏差并且因此使得SMD-LED关于发光区域位置正确地定向。无需考虑SMD-LED的倾翻，这是因为SMD-LED通过固定在真空吸管上而相对真空吸管的轴线不具有夹角。
下面说明两种备选的方法，借助所述方法能够将位置正确地定向的SMD-LED位置正确地装配在电路载体上：
在第一种用于将至少一个SMD-LED装配在电路载体上的方法中，在完成定向之后，在所述至少一个SMD-LED上设置银烧结材料并且银烧结所述至少一个SMD-LED。
优选将待装备的电路载体和/或SMD-LED热处理到一个温度，在该温度下在压紧设有烧结材料的SMD-LED时并且通过压紧该设有烧结材料的SMD-LED来烧结烧结材料。
为了能够实现足够短的工艺时间，银烧结材料的粒度应小于约100nm、优选小于约60nm。由此在压紧开始后在小于1至5秒的接触时间中完成烧结。例如可以采用粒度在约20nm至约40nm范围中的烧结材料。具有希望粒度的银烧结材料可以从不同供应商处购买。
银烧结材料在SMD-LED上的设置例如可以通过将包括银烧结材料和适合的有机分离剂的膏状物涂敷到SMD-LED上来进行。
所述膏状物例如可以在SMD-LED相对真空吸管的位置不改变的情况下通过将接线垫浸入到准备好的膏坑中来完成。
备选地，银烧结材料通过“转印膜”(DTF)涂敷到SMD-LED上。在这种情况下，银烧结材料是膜形式，这种膜可以从市场上购买。
通过烧结不会造成SMD-LED的位置正确的定向在事后改变，这是因为SMD-LED能被真空吸管一直固定直到烧结过程完成。SMD-LED不会倾翻，这是因为其被真空吸管压紧到电路载体表面上。
第二种用于将至少一个SMD-LED装配在电路载体上的方法基于回流焊接法。
在此焊膏被涂敷、优选印刷到电路载体上。接着，优选根据探测到的所述至少一个SMD-LED的发光区域的位置将粘合剂涂敷到电路载体上。将SMD-LED安放在电路载体上。接着将粘合剂至少部分硬化。然后可以进行焊膏的回流焊接。
通过使用粘合剂能够避免在回流焊接时SMD-LED浮动。
作为粘合剂特别优选使用可UV固化的粘合剂。在这种情况下，粘合剂的至少部分硬化可以通过用UV光的照射来进行。特别优选使用混合型粘合剂，其可UV硬化且可与温度相关地硬化。该粘合剂在焊接时可在烤箱中二次硬化。
可以分开照射各个单体的SMD-LED，但优选同时照射所有SMD-LED，以便缩短周期时间。
附图说明
下面参考附图以及所属的附图说明给出本发明的其它优点和细节。在附图中为相同构件使用相同的附图标记。
具体实施方式
图1至3示出测试线路图，其用于检验每个单个的SMD-LED2的位置精度。电路载体1具有导电面5，这些导电面通过绝缘区域6而彼此绝缘。导电面5可以经由接线7被供应电能。
图1示出装备有六个SMD-LED2的电路载体1。可以看到两个参考点3，所述参考点一方面用于测定用于SMD-LED2在电路载体1上的规定位置的偏差并且另一方面也用于固定用于SMD-LED2的未示出的光学系统。光学系统的定向经由分开的参考点进行，所述参考点在该图中未示出。
在图1中采用根据现有技术的“取放”和回流焊接法来进行装配。SMD-LED2以其外轮廓相对参考点3定向。通过回流焊接法，SMD-LED2产生浮动，以致SMD-LED2的外轮廓不再有序定向。关于SMD-LED2的发光区域4的定向完全没有进行。
图2示出装备有六个SMD-LED2的电路载体1，其与图1的区别在于，SMD-LED2关于其外轮廓位置正确地装配在电路载体1上，但装配不是根据SMD-LED2的发光区域4进行。该电路载体1也不满足关于发光区域4的位置精度的要求。
图3相反示出本发明的一种实施例，在其中，SMD-LED2关于其发光区域4位置正确地相对电路载体1的参考点3装配在电路载体1上。电路载体1满足关于发光区域4的位置精度的要求。
图4示出根据本发明的方法，包括下述步骤：
－为所有参考点3i确定相对参考点3i在X方向和Y方向上的规定位置的偏差(图4a)；
－确定相对待取出的SMD-LED2的发光区域4在X、Y方向上的规定位置的偏差以及相对其角度位置的规定位置的偏差以及与待取出的SMD-LED2在Z方向上的规定位置的偏差(图4b)；
－将SMD-LED2位置正确地相对电路载体1的参考点3i装配在电路载体板1上(图4c)。

Claims (10)

1.用于制造装备有至少一个表面贴装LED(SMD-LED)的电路载体(1)的方法，其中，所述至少一个SMD-LED(2)根据电路载体(1)的一个或多个参考点(3)定向地定位于电路载体(1)上，其特征在于，光学探测所述至少一个SMD-LED(2)的发光区域(4)在该SMD-LED(2)中的位置并且根据所述至少一个SMD-LED(2)的发光区域(4)的探测到的位置将所述至少一个SMD-LED(2)装配在电路载体(1)上。
2.根据权利要求1所述的方法，在所有三个维度(X、Y、Z)中确定发光区域(4)的位置和相对于与SMD-LED(2)平面垂直的旋转轴线的角度位置。
3.根据权利要求1或2所述的方法，其特征在于，根据所述至少一个SMD-LED(2)的发光区域(4)的中点的位置将所述至少一个SMD-LED(2)装配在电路载体(1)上。
4.根据权利要求1至3中至少一项所述的方法，其特征在于，至少一个参考点(3)用于定位、优选用于固定用于所述至少一个SMD-LED(2)的光学系统。
5.根据权利要求1至4中至少一项所述的方法，其特征在于，用具有匹配LED光谱的波长的光源照射SMD-LED(2)。
6.根据权利要求1至5中至少一项所述的方法，其特征在于，为了将所述至少一个SMD-LED(2)装配在电路载体(1)上，在定向完成之后在所述至少一个SMD-LED(2)上设置银烧结材料，并且优选在将所述至少一个SMD-LED(2)压紧到电路载体(1)上时和/或通过将所述至少一个SMD-LED压紧到电路载体上来烧结所述至少一个SMD-LED(2)。
7.根据权利要求6所述的方法，其特征在于，使用粒度小于约100nm、优选小于约60nm的银烧结材料。
8.根据权利要求7所述的方法，其特征在于，选择粒度在约20nm至约40nm范围中的银烧结材料。
9.根据权利要求1至5中至少一项所述的方法，其特征在于，为了将所述至少一个SMD-LED(2)装配在电路载体(1)上，
－将焊膏涂敷、优选印刷到电路载体(1)上，
－优选根据探测到的所述至少一个SMD-LED(2)的发光区域(4)的位置将粘合剂涂敷到电路载体(1)上，
－在将所述至少一个SMD-LED(2)定位在电路载体(1)上后，粘合剂至少部分硬化，
－进行焊膏的回流焊。
10.电路板(1)，其包括一个或多个参考点(3)和至少一个SMD-LED(2)，其特征在于，所述至少一个SMD-LED(2)的发光区域(4)借助所述一个或多个参考点(3)定向。
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