CN104470672B - 以高横向精度焊接电子组件的方法 - Google Patents
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- B23K35/24—Selection of soldering or welding materials proper
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- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
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- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
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- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
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- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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Abstract
本发明涉及一种使用瞬间液相焊接以高精度将电子组件（3）焊接到衬底（1）的方法。利用操纵工具将组件（3）准确地定位在衬底（1）上方，放置在熔化的焊料（2）中并且抵靠衬底（1）按压。然后释放组件（3）并且允许焊料（2）凝固。由于所使用的焊料（2）具有仅在较低熔点的熔化的第一金属或金属合金中部分地溶解的足够高量的较高熔点的第二金属或金属合金，因此在液相焊接期间形成固体框架，其阻止所放置的组件（3）在焊接期间的横向移动。由于使用衬底（1）上的准确参考特征做出组件（3）的定位，因此整个焊接工艺导致所焊接的组件的高度精确的横向定位。
Description
技术领域和背景技术
本发明涉及通过瞬间液相焊接将电子组件焊接到衬底的方法，其中将焊料膏沉积和熔化在衬底上，通过操纵工具将电子组件置于熔化的焊料中，并且允许熔化的焊料凝固。
在将电子组件焊接到衬底时，在其中需要将组件非常精确地放置在衬底上的光电子或其它应用的领域中会出现问题。例如LED的发光表面的光学中心必须关于衬底或板的参考特征非常精确地定位以使得能够实现划算且精确的头灯组装，即初级和次级光学器件的组装。在许多应用中，PCB板（PCB：印刷电路板）被用作必须将电子组件焊接到的衬底。相比于在10μm的范围中的光电子要求而言，PCB产业上的容差是大的，其典型地在100μm的量级。例如参考特征到垫、回流焊接、载体的顶部到底部特征容差的容差链加起来超过100μm。
基于标准SAC膏（SAC：SnAgCu）的瞬间液相（TLP）焊料膏目前处于发展之中以形成用于高温应用的高可靠键合。TLP焊接一般具有以下优点：焊接接合在低温下形成但是在明显更高的温度下再熔，即焊料在焊接工艺期间凝固。对于许多光电子应用（例如机动车的低和高波束模块）而言，要求非常高的焊接后精度，即在10μm的范围中。标准回流工艺不能达到这样高的精度，因为回流工艺本身具有容差（标准偏差5到10μm）并且此外焊接垫与板上的参考结构之间的容差也在50μm的量级。因此，电子组件在液体焊料表面上的自对准的已知工艺不允许电子组件的准确定位。
发明内容
本发明的目的是提供一种将电子组件焊接到衬底的方法，所述方法允许满足光电子应用的要求的高定位精度。
该目的利用根据权利要求1的方法实现。该方法的有利实施例是从属权利要求的主题或者在描述和实施例的以下部分中描述。
在所提出的方法中，通过瞬间液相焊接将电子组件焊接到衬底。至少在电子组件上的对应接触垫必须被焊接到的接触垫处将使得能够实现瞬间液相焊接的焊料膏沉积在衬底上。焊料膏可以通过已知工艺沉积，例如通过在衬底上印刷或分配焊料膏。衬底可以是用于电子组件的任何适当载体，特别是具有电气布线的载体板，例如PCB、IMS（IMS：绝缘金属衬底）、模塑互连设备（MID）。衬底上的焊料膏被熔化以用于瞬间液相焊接，并且电子组件通过适当操纵工具（例如键合器设备）定位在衬底上方。用于将小组件键合或焊接到衬底的这种键合器设备在本领域中是已知的并且在商业上可得到。通过使用与衬底上的接触垫独立的衬底上的参考特征或结构来实现电子组件在衬底之上的准确横向定位。这样的参考特征可以是比如边缘或钻孔的机械特征，其用于在对应应用中安装衬底。参考特征还可以是金属化或其它标记，其满足针对对应应用的精度要求。利用通常已经为操纵工具（例如键合器设备）的一部分的光学构件来检测参考特征。在该准确定位之后，通过操纵工具将组件在该位置处放置到熔化的焊料膏中并且利用轻微的力抵靠衬底按压它。当通过操纵工具放置和释放组件时，焊料膏已经立即部分地凝固。与所提出的方法一起使用的焊料膏包含不同金属和/或一个或若干金属合金的颗粒的混合物，至少一个第一金属或金属合金在瞬间液相焊接工艺的期望的低温下熔化并且至少另一个第二金属或金属合金在较高温度下熔化。在所提出的方法中，使用几乎共熔成分的焊料膏，其中在较高温度下熔化的第二金属或金属合金的颗粒以这样高的量被包括使得在瞬间液相焊接期间这些金属颗粒的仅一部分溶解在液体焊料中。在其余固体颗粒之间形成金属间相。这导致在仍为液体的焊料内形成固体框架，其阻止被放置在该焊料膏中的组件的横向移动。阻止组件的横向移动允许在组件的放置之后同样维持利用操纵工具所实现的高横向定位精度直到焊料膏凝固为止。
因此利用所提出的方法，电子组件以适合于光电子应用的高定位精度焊接在衬底上。由于已知键合器设备的定位精度在5到10μm的范围中或者甚至更高（高达1μm），因此电子组件可以以类似的精度焊接到衬底。一方面，这归因于焊料膏的成分，其中电子组件由于固体框架的形成而在放置之后不能在轻微的压力下横向移动并且因此被焊接在操纵工具已经将组件放置于的位置处。另一方面，由于相对于以高于接触垫的精度布置的衬底的参考特征进行定位，因此整个工艺实现期望的精确定位。利用所提出的方法，例如，用于灯的LED封装可以以光电子应用所要求的高精度被焊接到载体衬底。由于LED封装在放置之后不再移动，因此参考用于灯的初级和次级光学器件的组装的精准参考特征或结构来准确地定位LED。
在优选实施例中，第二金属颗粒的一部分是所谓的类型5颗粒，即具有40与60μm之间的尺寸（直径）的金属球。这些球还可以充当托脚(standoffs)并且使得能够实现足够的键合线厚度以形成可靠的焊接接合。
第二金属颗粒优选地以关于焊料膏中所存在的所有金属颗粒的20与40 wt%（重量百分比）之间的比例包括在焊料膏中。利用第二金属颗粒的这样的比例，用于形成期望的固体框架的要求得以最佳地满足。
在另外的优选实施例中，焊料膏是包括作为金属颗粒的SnAgCu合金的SAC焊料膏。除SnAgCu合金中的低量（0.5 wt%）的Cu之外，通过添加纯铜球将Cu部分提升到明显更高的量以使得大部分Cu在熔化的Sn中不溶解并且形成期望的固体框架。由于CuSn金属间化合物的形成，从组件的接触垫到衬底的接触垫形成固体键合。由于铜球在放置组件之后与两种垫接触，因此组件在放置之后不再移动并且被焊接在期望的位置处，这是因为从衬底垫到组件垫建立起固体框架的缘故。
附图说明
以下通过示例的方式结合附图描述所提出的方法，而不限制如权利要求所限定的保护范围。各图示出：
图1示意性地示出所提出的方法的第一工艺步骤；
图2示意性地示出所提出的方法的第二工艺步骤；以及
图3示意性地示出所提出的方法的第三工艺步骤。
具体实施方式
在下文中使用SnAgCu焊料膏来描述所提出的方法。该膏基于商业上可得到的SAC膏来制备，其典型地包含96 wt%的Sn、3.5 wt%的Ag和0.5 wt%的Cu。向这样的膏添加具有40到60μm的直径的固体铜球以及可选的还有具有10和25μm之间的直径的小球。调节铜球的比率使得在回流期间铜球仍被液体Sn基质围绕（10至15%的铜球体积，35至40%的SnAg体积和50%焊剂体积）。
所制备的焊料膏2被印刷在组件3要焊接到的板1上。焊料2在230℃和260℃之间的温度下在组装机中熔化。组件3然后如图1中指示的那样定位在板1上方。组件1与参考特征（在图中未示出）而不是焊接垫对准，以便实现期望的准确定位。图1还示意性地示出键合器设备（组装机）的抓取或键合工具4，其抓取和定位组件3。参考特征取决于组件的应用。将特征选择成确保组件关于应用的其它特征（比如板稍后将安装于其中的初级光学器件）的期望定位精度。
在定位之后，以10g-200g（0.1N-20N）的小力将组件按压到膏状焊料中，即焊料2包括具有固体颗粒的液相。为此，以如图2中利用箭头所示的受控力使键合工具4向下移动。焊料2中的铜颗粒被挤压在一起并且建立起包括Cu和CuSn相的固体基质。固体基质被液体焊料围绕。为了实现接触垫的正确定位，这些接触垫是尺寸过大的，即被设计有足够大的垫面积，这是因为通常以低定位精度做出垫在板上的沉积。
当组件被放置在液体焊料中时，球仍可以移动。在放置期间焊料被挤压在一起。当抵靠板轻微按压组件时，在组件垫与板垫之间形成固体基质。此时，所放置的组件在放置之后不再能移动，这是由于固体框架由其余Cu颗粒和金属间相形成的缘故。键合工具4然后可以释放组件并且焊料凝固而没有组件的任何进一步移动（图3）。利用该工艺形成高度精确和高度可靠的界面。
该工艺可以应用在高功率LED架构中，例如用于机动车前向照明，而且同样用于其中必须以高横向精度执行电子组件的焊接的任何其它应用。
虽然已经在附图和前述描述中详细图示和描述了本发明，但是这样的图示和描述要被视为是说明性或示例性而非限制性的。本发明不限于所公开的实施例。本领域技术人员在实践所要求保护的本发明时，通过附图、公开内容和随附权利要求的研究，可以理解和实现所公开的实施例的其它变型。在权利要求中，词语“包括”不排除其它元件或步骤，并且不定冠词“一”或“一个”不排除多个。在相互不同的从属权利要求中陈述某些措施的仅有事实不指示这些措施的组合不能被用来获益。权利要求中的任何参考标记不应当解释为限制权利要求的范围。
参考标记列表
1 板
2 焊料膏
3 电子组件
4 键合工具
Claims (4)
1.一种通过瞬间液相焊接将用于光电子应用的电子组件（3）焊接到衬底（1）的方法，所述方法包括
-沉积允许所述衬底（1）的接触垫上的瞬间液相焊接的焊料膏（2），
-在瞬间液相焊接的温度下熔化所述焊料膏（2），
-利用操纵工具（4）使用所述衬底（1）上的对准特征来将所述组件（3）定位在所述衬底上方，
-利用所述操纵工具（4）将所述组件（3）按压在熔化的焊料膏（2）中，
-释放所述组件（3），以及
-允许熔化的焊料膏（2）凝固，
其中使用包含不同金属和/或一个或多个金属合金的颗粒的混合物的焊料膏（2），所述混合物的至少第一金属或金属合金在瞬间液相焊接的温度下熔化并且所述混合物的至少第二金属或金属合金在较高温度下熔化，所述第二金属或金属合金的金属颗粒在所述焊料膏（2）中的量使得在瞬间液相焊接期间所述第二金属或金属合金的这些金属颗粒的仅一部分溶解在熔化的焊料膏（2）中并且在其余颗粒之间的颗粒表面处与熔化的第一金属或金属合金形成金属间相，从而导致熔化的焊料膏（2）内的固体框架的形成，并且
其中所述第二金属或金属合金的金属颗粒的一部分被选择成包括具有在40与60μm之间的直径的金属球，所述部分大于所述第二金属或金属合金的金属颗粒的50 wt%。
2.根据权利要求1所述的通过瞬间液相焊接将用于光电子应用的电子组件（3）焊接到衬底（1）的方法，
其中所述焊料膏（2）包括作为第一金属合金的SnAgCu合金和作为第二金属的Cu。
3.根据权利要求1或2所述的通过瞬间液相焊接将用于光电子应用的电子组件（3）焊接到衬底（1）的方法，
其中所述第二金属或金属合金的金属颗粒的比例被选择成在关于所述焊料膏（2）中的所有金属颗粒的20与40 wt%之间。
4.根据权利要求1所述的通过瞬间液相焊接将用于光电子应用的电子组件（3）焊接到衬底（1）的方法，
其中所述组件（3）是发光二极管封装体。
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