CN104465635A - Plant lighting LED device and packaging method thereof - Google Patents

Abstract

The invention discloses a plant lighting LED device, which comprises a bracket bowl, a first wafer, a second wafer, and a transparent colloid, wherein a crystal-fixing area is provided at the inner bottom of the bracket bowl, and the first wafer and the second wafer are arranged at intervals. In the crystal-bonding area whose area is at least two-thirds of the bottom area of the bowl cup of the bracket, the first wafer and the second wafer are conducted in parallel with each other during operation, and the bottom of the bracket is also provided with a cooling fin. The invention also discloses a packaging method of the plant lighting LED device. The blue chip and the red chip are fixed in the bracket, the wires are welded, and the adhesive is coated on the blue chip and the red chip, and baked and solidified to shape. The LED of the present invention can realize the adjustment of light quality and light intensity by adjusting the magnitude of the current, so as to meet the light requirements of different plants in different growth periods.

Description

A plant lighting LED device and packaging method thereof

technical field

The invention belongs to the field of LED packaging, and in particular relates to a plant lighting LED device and a packaging method thereof.

Background technique

In recent years, the global sunshine hours have been decreasing, which is very unfavorable for agricultural development. With the continuous development of production technology and the increasing demand for increasing plant yield and shortening the planting cycle, artificial light sources have begun to be used in the field of plant cultivation.

Traditional plant factories mostly use traditional light sources such as fluorescent tubes or high-pressure sodium lamps as "artificial sunlight". However, due to the unsatisfactory match between the spectrum of these traditional lighting sources and the photosynthetic absorption spectrum of plants, only the light of individual bands can be absorbed by plants, and the light of other bands is wasted, which is not energy-saving; moreover, traditional fluorescent lamps or high-pressure sodium lamps consume a lot of power. At the same time, a lot of heat radiation is generated, and plants cannot be irradiated at close range, and the light excitation efficiency for plant growth is not high, which greatly increases the cost of artificial lighting; in addition, it is not possible to adjust the light quality and light intensity according to the different characteristics of different plants.

Contents of the invention

The technical problem to be solved by the present invention is to provide a plant lighting LED device and a packaging method thereof, which solves the problem of low light excitation efficiency of different plants in the prior art.

The present invention adopts the following technical solutions for solving the problems of the technologies described above:

A plant lighting LED device, comprising a bracket cup, a first wafer, a second wafer, and a transparent colloid, wherein a crystal-bonding area is provided at the inner bottom of the bracket bowl, and the first wafer and the second wafer are arranged at intervals in the crystal-bonding area , the two electrodes of the first wafer are respectively connected to a pair of pins, the two electrodes of the second wafer are respectively connected to the other pair of pins, the outer surfaces of the first wafer and the second wafer are coated with transparent colloid, and the top of the transparent colloid The surface is horizontally aligned with the mouth of the bracket bowl, the first wafer is a blue wafer, the second wafer is a red wafer, and the area of the solid crystal region is at least two-thirds of the bottom area of the bracket bowl, Radiating fins are arranged at the bottom of the bracket bowl cup.

The excitation wavelength of the blue wafer is 440-460 nanometers; the excitation wavelength of the red wafer is 660-680 nanometers.

The transparent colloid is epoxy resin, silica gel or a mixture of epoxy resin and silica gel.

The first wafer and the second wafer are fixed in the crystal-bonding area by a crystal-bonding glue, the electrodes of the first wafer and the pins are connected by first gold wires, and the electrodes of the second wafer and the pins are connected by gold wires. Second gold wire connection.

The material of the bracket bowl is PCT material.

A packaging method for plant lighting LED devices, comprising the steps of:

Step 1. Fix the bracket cup;

Step 2. Fix the cooling fins at the bottom of the bracket bowl;

Step 3. Set a crystal-fixing area at the bottom of the bracket bowl;

Step 4, setting the first wafer and the second wafer at regular intervals in sequence in the die-bonding area;

Step 5. Correspondingly connecting the electrodes of the first wafer and the second wafer to the external pins of the bracket bowl;

Step 6, potting transparent colloid in the bracket bowl;

Step 7. Curing the bracket cup after potting the transparent colloid.

The first wafer is a blue wafer, and the second wafer is a red wafer.

The area of the crystal-fixing area is at least two-thirds of the area of the bottom of the bracket cup.

The transparent colloid in step 6 is epoxy resin, silica gel or a mixture of epoxy resin and silica gel.

Compared with the prior art, the present invention has the following beneficial effects:

1. When plants are photosynthesizing and flowering, absorbing red light near 650nm can promote growth. When stamens are formed, blue light near 440nm can promote growth. The LED of the present invention can realize the adjustment of light quality and light intensity by adjusting the magnitude of the current, so as to meet the light requirements of different plants in different growth periods.

2. The bracket bowl used in the present invention has a large crystal bonding area, and two chips can be placed to realize parallel conduction and independent control.

3. The PCT material bracket replaces the traditional PPA material bracket. Compared with the traditional PPA material bracket, the PCT material bracket has better thermal stability (not easy to yellow) and UV resistance. The life of the LED is greatly extended, and the power can be made to 0.5-1W.

Description of drawings

Fig. 1 is a structural schematic diagram of the present invention.

Among them, the marks in the figure are: 1-blue chip; 2-red chip; 3-stand cup; 4-transparent colloid; 5-first gold wire; 6-second gold wire.

Detailed ways

Below in conjunction with accompanying drawing, structure and working process of the present invention will be further described.

As shown in Figure 1, a plant lighting LED device includes a bracket bowl 3, a first wafer, a second wafer, and a transparent colloid 4, wherein two pairs of pins are arranged outside the bracket bowl cup, and the inner bottom of the bracket bowl cup is provided with In the crystal bonding area, the first wafer and the second wafer are arranged at intervals in the crystal bonding area, the two electrodes of the first wafer are respectively connected to a pair of pins, and the two electrodes of the second wafer are respectively connected to another pair of pins, The outer cladding transparent colloid 4 of first wafer and second wafer, the upper surface of transparent colloid 4 is horizontally aligned with the bowl mouth of described support bowl cup 3, and described first wafer is blue wafer 1, and the second wafer is red For the wafer 2, the area of the crystal-fixing area is at least two-thirds of the area of the bottom of the bracket bowl, and a cooling fin is arranged on the bottom of the bracket bowl.

The excitation wavelength of the blue wafer 1 is 440-460 nanometers; the excitation wavelength of the red wafer 2 is 660-680 nanometers.

The transparent colloid 4 is epoxy resin, silica gel or a mixture of epoxy resin and silica gel.

The first wafer and the second wafer are fixed in the crystal-bonding area by a crystal-bonding glue, and the electrodes of the first wafer and the pins are connected by the first gold wire 5, and the electrodes and the pins of the second wafer are connected with each other. It is connected by a second gold wire 6 . The two ends of the first gold wire 5 are welded to the bottom of the blue chip 1 and the bracket bowl 3 respectively, and the two ends of the second gold wire 6 are welded to the bottom of the red chip 2 and the bracket bowl 3 respectively.

A large crystal-bonding area is arranged in the cup at the bottom of the bracket, and the first and second wafers are respectively fixed in the crystal-bonding area through the crystal-bonding glue. The first and second chips are connected in parallel with each other, and the bottom of the bracket is A heat sink is provided.

The material of the bracket cup 3 is PCT material.

The packaging method of the plant lighting LED device of the present invention comprises the following steps:

Step 1. Fix the bracket cup;

Step 2. Fix the cooling fins at the bottom of the bracket bowl;

Step 3. Set a crystal-fixing area at the bottom of the bracket bowl;

Step 4, setting the first wafer and the second wafer at regular intervals in sequence in the die-bonding area;

Step 5. Correspondingly connecting the electrodes of the first wafer and the second wafer to the external pins of the bracket bowl;

Step 6, potting transparent colloid in the bracket bowl;

Step 7. Curing the bracket cup after potting the transparent colloid.

The first wafer is a blue wafer, and the second wafer is a red wafer.

The area of the crystal-fixing area is at least two-thirds of the area of the bottom of the bracket cup.

The transparent colloid in step 6 is epoxy resin, silica gel or a mixture of epoxy resin and silica gel.

The manufacturing method of the present invention is as follows: fixing the first blue chip and the second red chip in the bracket, welding the wires, and then coating the adhesive on the first blue chip and the second red chip, baking and solidifying them into shape.

In addition to the above-mentioned embodiments, the present invention can also have other implementations, and all technical solutions formed by equivalent replacement or equivalent transformation fall within the scope of protection required by the present invention.

Claims (9)

1. a plant illumination LED component, comprise support bowl cup, first wafer, second wafer, transparent colloid, wherein, support bowl cup inner bottom part is provided with die bond region, first wafer, second wafer is arranged at intervals in die bond region, two electrodes of the first wafer are connected with pair of pins respectively, two electrodes of the second wafer are connected with another pair of pins respectively, the coated transparent colloid in outside of the first wafer and the second wafer, the upper surface of transparent colloid and the rim of a bowl horizontal alignment of described support bowl cup, it is characterized in that: described first wafer is blue dies, second wafer is red wafer, the area in described die bond region is at least 2/3rds of support bowl cup bottom area, the bottom of support bowl cup arranges fin.

2. plant illumination LED component according to claim 1, is characterized in that: the excitation wavelength of described blue dies is 440 ~ 460 nanometers; The excitation wavelength of red wafer is 660 ~ 680 nanometers.

3. plant illumination LED component according to claim 1, is characterized in that: described transparent colloid is the mixture of epoxy resin, silica gel or epoxy resin and silica gel.

4. plant illumination LED component according to claim 1, it is characterized in that: described first wafer, the second wafer are fixed in die bond region by die bond adhesive glue, the electrode of the first wafer is connected by the first gold thread with between pin, and the electrode of the second wafer is connected by the second gold thread with between pin.

5. plant illumination LED component according to claim 1, is characterized in that: the material of described support bowl cup is PCT material.

6., based on the method for packing of plant illumination LED component described in claim 1, it is characterized in that: comprise the steps:

Step 1, fixed support bowl cup;

Step 2, bottom support bowl cup, be fixedly installed fin;

Step 3, bottom in support bowl cup arrange die bond region;

Step 4, in die bond region, interval is fixedly installed the first wafer, the second wafer successively;

Step 5, the first wafer to be connected with the electrode of the second wafer is corresponding with support bowl cup external pin respectively;

Step 6, in support bowl cup embedding transparent colloid;

Step 7, the support bowl cup after embedding transparent colloid to be cured.

7. the method for packing of plant illumination LED component according to claim 6, is characterized in that: described first wafer is blue dies, and the second wafer is red wafer.

8. the method for packing of plant illumination LED component according to claim 6, is characterized in that: the area in described die bond region is at least 2/3rds of support bowl cup bottom area.

9. the method for packing of plant illumination LED component according to claim 6, is characterized in that: the transparent colloid in described step 6 is the mixture of epoxy resin, silica gel or epoxy resin and silica gel.