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CN102723325A - LED (Light-Emitting Diode) light-emitting element - Google Patents

LED (Light-Emitting Diode) light-emitting element Download PDF

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Publication number
CN102723325A
CN102723325A CN2012101888228A CN201210188822A CN102723325A CN 102723325 A CN102723325 A CN 102723325A CN 2012101888228 A CN2012101888228 A CN 2012101888228A CN 201210188822 A CN201210188822 A CN 201210188822A CN 102723325 A CN102723325 A CN 102723325A
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China
Prior art keywords
led light
led
chip
emitting
light
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CN2012101888228A
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Chinese (zh)
Inventor
徐毅
苏庄严
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SHENZHEN JUDE TECHNOLOGY Ltd
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SHENZHEN JUDE TECHNOLOGY Ltd
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Priority to CN2012101888228A priority Critical patent/CN102723325A/en
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    • H10W72/5449
    • H10W72/932
    • H10W90/753

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Abstract

一种LED发光元件,包括封装外壳及设置于封装外壳内的LED发光芯片及与LED发光芯片相连并驱动LED发光芯片工作的LED驱动芯片,LED驱动芯片设置于封装外壳内,LED发光芯片设置于LED驱动芯片上。该LED发光元件通过将LED发光芯片设置于LED驱动芯片上,以使LED发光芯片发出的光不易受到LED驱动芯片的阻挡,从而具有较好的发光效果。另外,LED发光芯片设置于LED驱动芯片上可以减小LED发光元件发光面的面积,使LED发光元件具有发光面面积小的优点。

Figure 201210188822

An LED light-emitting element, comprising a package casing, an LED light-emitting chip arranged in the package casing, and an LED driver chip connected to the LED light-emitting chip and driving the LED light-emitting chip to work, the LED driver chip is arranged in the package casing, and the LED light-emitting chip is arranged in the LED driver chip. The LED light-emitting element arranges the LED light-emitting chip on the LED driving chip, so that the light emitted by the LED light-emitting chip is not easily blocked by the LED driving chip, thereby having a better light-emitting effect. In addition, the arrangement of the LED light-emitting chip on the LED driving chip can reduce the area of the light-emitting surface of the LED light-emitting element, so that the LED light-emitting element has the advantage of a small light-emitting surface area.

Figure 201210188822

Description

The LED light-emitting component
Technical field
The present invention relates to a kind of light-emitting device, particularly relate to a kind of LED light-emitting component.
Background technology
The English of light-emitting diode is light emitting diode, i.e. LED.Brightness height, life-span are long because of having, the luminous efficiency advantages of higher obtains application more and more widely for LED.In actual use, LED often is used as the demonstration of large tracts of land indoor and outdoor.At this moment,, usually can LED luminescence chip and LED chip for driving be integrated on the plate, form lamp and drive the LED light-emitting component of unification for easy to use and reduce cost.
Please refer to Fig. 1, the LED light-emitting component 100 that lamp commonly used drives unification is that LED luminescence chip 120 and LED chip for driving 110 are packaged together.At this moment, LED luminescence chip 120 and LED chip for driving 110 all are positioned over the bottom of package casing 130, and LED luminescence chip 120 is arranged at a side of LED chip for driving 110.Yet the part that the optics that LED luminescence chip 120 sends in this kind design can receive LED chip for driving 110 stops, influences illumination effect.In addition, the area that this designing institute takies is bigger, is unfavorable for being provided with in the unit are more LED light-emitting component 100, and promptly the light-emitting area area of this LED light-emitting component 100 is too big.
Summary of the invention
Based on this, be necessary to provide a kind of illumination effect not to be subject to influence of LED chip for driving and the less LED light-emitting component of light-emitting area area.
A kind of LED light-emitting component; Comprise package casing and be arranged at the LED luminescence chip in the said package casing and the also LED chip for driving of driving LED luminescence chip work that links to each other with said LED luminescence chip; Said LED chip for driving is arranged in the said package casing, and said LED luminescence chip is arranged on the said LED chip for driving.
Therein among embodiment; Said LED light-emitting component also comprises the support that is fixed on the package casing; Said support is a sheet; Offer through hole on the support of said sheet, said LED chip for driving and said LED luminescence chip are individually fixed in the back side of said support with positive, and said LED chip for driving is connected through the through hole that lead-in wire passes on the support with said LED luminescence chip.
Among embodiment, said LED light-emitting component comprises that also the support that is fixed on the package casing prolongs fin therein.
Among embodiment, said support is stitched together by a plurality of supports and forms, and has the slit between said a plurality of supports therein, and said LED chip for driving is connected through the slit that lead-in wire passes between a plurality of supports with said LED luminescence chip.
Among embodiment, said LED light-emitting component also comprises the transparent enclosure glue that wraps up said LED luminescence chip therein.
Among embodiment, said LED light-emitting component also comprises the heat conduction packaging plastic that wraps up said LED chip for driving therein.
Among embodiment, said LED luminescence chip comprises three LED luminescence chips therein, and said three LED luminescence chips are respectively red-light LED luminescence chip, green light LED luminescence chip and blue-ray LED luminescence chip.
Among embodiment, said three LED luminescence chips are in-line and arrange therein.
Among embodiment, said three LED luminescence chips are triangular arranged therein.
Above-mentioned LED light-emitting component so that the light that the LED luminescence chip sends is not vulnerable to stopping of LED chip for driving, thereby has illumination effect preferably through the LED luminescence chip is arranged on the LED chip for driving.In addition, the LED luminescence chip is arranged at the area that can reduce LED light-emitting component light-emitting area on the LED chip for driving, makes the LED light-emitting component have the little advantage of light-emitting area area.
Description of drawings
Fig. 1 is LED light-emitting component stereogram commonly used;
Fig. 2 is the LED light-emitting component isometric front view of an embodiment;
Fig. 3 is the rear isometric view of the said LED light-emitting component of Fig. 2;
Isometric front view when Fig. 4 is the said LED light-emitting component adding of Fig. 2 transparent enclosure glue;
Rear isometric view when Fig. 5 is the said LED light-emitting component adding of Fig. 3 heat conduction packaging plastic.
Embodiment
Please refer to Fig. 2 and Fig. 3, an execution mode provides a kind of LED light-emitting component 200.This LED light-emitting component 200 comprises package casing 230 and is arranged at the LED luminescence chips 220 in the package casing 230 and links to each other with LED luminescence chip 220 and LED chip for driving 210 that driving LED luminescence chip 220 is worked; This LED chip for driving 210 is arranged in the package casing 230, and LED luminescence chip 220 is arranged on the LED chip for driving 210.
This LED light-emitting component 200 also comprises the support 232 that is fixed on the package casing 230.This support 232 is a sheet, offers through hole 233 on the support 232 of this sheet.The back side that LED chip for driving 210 and LED luminescence chip 220 are individually fixed in support 232 is with positive, and LED chip for driving 210 and LED luminescence chip 220 are connected through 236 through holes 233 that pass on the support 232 that go between.Like this, has better radiating effect owing to being provided with support 232 between LED chip for driving 210 and the LED luminescence chip 220.
In addition, being provided with of through hole 233 can make between LED chip for driving 210 and the LED luminescence chip 220 through going between and 236 reach the effect of electric connection, thereby makes the LED chip for driving 210 can 220 work of driving LED luminescence chip.The quantity of through hole 233 can be set as required here, is three among the figure.
The support 232 of this LED light-emitting component 200 also can be stitched together by a plurality of supports and form, and has the slit between a plurality of supports.At this moment, LED chip for driving 210 and LED luminescence chip 220 are connected through 236 slits passed between the support that go between.
This LED light-emitting component 200 comprises that also the support that is fixed on the package casing 230 prolongs fin 234.This support prolongs fin 234 and can directly link to each other with support 232, also can directly not link to each other with support 232, and it mainly acts on is that LED chip for driving 210 and the heat that LED luminescence chip 220 produces are better distributed.
This LED light-emitting component 200 comprises three LED luminescence chips 220, and these three LED luminescence chips 220 are respectively red-light LED luminescence chip, green light LED luminescence chip and blue-ray LED luminescence chip.These three LED luminescence chips 220 are in-line in the present embodiment and arrange.In other embodiments, these three LED luminescence chips 220 also can be triangular arranged.That is to say that these three LED luminescence chips 220 are arranged at respectively on three summits of equilateral triangle.
Please refer to Fig. 4, this LED light-emitting component 200 also comprises the transparent enclosure glue 231 of parcel LED luminescence chip 220.This transparent enclosure glue 231 can play protection and fixed L ED luminescence chip 220, does not influence the effect of LED luminescence chip 220 simultaneously.
Please refer to Fig. 5, this LED light-emitting component 200 also comprises the heat conduction packaging plastic 238 of parcel LED chip for driving 210.This heat conduction packaging plastic 238 can also play the effect of heat conduction except the effect of playing protection and fixed L ED chip for driving 210, thereby can fast LED chip for driving 210 and the heat that LED luminescence chip 220 produces be distributed.
This LED light-emitting component 200 so that the light that LED luminescence chip 220 sends is not vulnerable to stopping of LED chip for driving 210, thereby has illumination effect preferably through LED luminescence chip 220 is arranged on the LED chip for driving 210.In addition, LED luminescence chip 220 is arranged at the area that can reduce LED light-emitting component 200 light-emitting areas on the LED chip for driving 210, makes this LED light-emitting component 200 have the little advantage of light-emitting area area.Like this, when this LED light-emitting component 200 is used for outdoor display, can makes more LED light-emitting component 200 is set in the outdoor display unit are, thereby make outdoor display have better display effect.Therefore, this LED light-emitting component 200 has illumination effect and is not subject to LED chip for driving influence and the less advantage of light-emitting area area.
The above embodiment has only expressed several kinds of execution modes of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the present invention's design, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with accompanying claims.

Claims (9)

1.一种LED发光元件,包括封装外壳及设置于所述封装外壳内的LED发光芯片及与所述LED发光芯片相连并驱动LED发光芯片工作的LED驱动芯片,其特征在于,所述LED驱动芯片设置于所述封装外壳内,所述LED发光芯片设置于所述LED驱动芯片上。1. A LED light-emitting element, comprising a package shell and an LED light-emitting chip arranged in the package shell and an LED driver chip that is connected to the LED light-emitting chip and drives the work of the LED light-emitting chip, wherein the LED driver The chip is arranged in the packaging shell, and the LED light-emitting chip is arranged on the LED driving chip. 2.根据权利要求1所述的LED发光元件,其特征在于,所述LED发光元件还包括固定于封装外壳上的支架,所述支架为片状,所述片状的支架上开设有通孔,所述LED驱动芯片与所述LED发光芯片分别固定于所述支架的背面与正面,所述LED驱动芯片与所述LED发光芯片通过引线穿过支架上的通孔相连接。2. The LED light-emitting element according to claim 1, characterized in that, the LED light-emitting element further comprises a bracket fixed on the packaging shell, the bracket is sheet-shaped, and a through hole is opened on the sheet-shaped bracket The LED driver chip and the LED light-emitting chip are respectively fixed on the back and the front of the bracket, and the LED driver chip and the LED light-emitting chip are connected through the through holes on the bracket through wires. 3.根据权利要求2所述的LED发光元件,其特征在于,所述LED发光元件还包括固定于封装外壳上的支架延长散热片。3. The LED light-emitting element according to claim 2, characterized in that, the LED light-emitting element further comprises a bracket extending heat sink fixed on the packaging shell. 4.根据权利要求1所述的LED发光元件,其特征在于,所述支架由多个支架拼接在一起组成,所述多个支架之间具有缝隙,所述LED驱动芯片与所述LED发光芯片通过引线穿过多个支架之间的缝隙相连接。4. The LED light-emitting element according to claim 1, wherein the bracket is composed of a plurality of brackets spliced together, there are gaps between the plurality of brackets, and the LED driver chip and the LED light-emitting chip The lead wires are connected through the gaps between multiple brackets. 5.根据权利要求1所述的LED发光元件,其特征在于,所述LED发光元件还包括包裹所述LED发光芯片的透明封装胶。5 . The LED light-emitting element according to claim 1 , further comprising a transparent encapsulant encapsulating the LED light-emitting chip. 6.根据权利要求1所述的LED发光元件,其特征在于,所述LED发光元件还包括包裹所述LED驱动芯片的导热封装胶。6 . The LED light-emitting element according to claim 1 , further comprising a heat-conducting encapsulant encapsulating the LED driver chip. 7 . 7.根据权利要求1至6中任一项权利要求所述的LED发光元件,其特征在于,所述LED发光芯片包括三个LED发光芯片,所述三个LED发光芯片分别为红光LED发光芯片、绿光LED发光芯片与蓝光LED发光芯片。7. The LED light-emitting element according to any one of claims 1 to 6, wherein the LED light-emitting chip comprises three LED light-emitting chips, and the three LED light-emitting chips are red LED light-emitting chips respectively. chip, green LED light-emitting chip and blue LED light-emitting chip. 8.根据权利要求7所述的LED发光元件,其特征在于,所述三个LED发光芯片呈一字形排列。8. The LED light-emitting element according to claim 7, wherein the three LED light-emitting chips are arranged in a line. 9.根据权利要求7所述的LED发光元件,其特征在于,所述三个LED发光芯片呈等边三角形排列。9. The LED light-emitting element according to claim 7, wherein the three LED light-emitting chips are arranged in an equilateral triangle.
CN2012101888228A 2012-06-08 2012-06-08 LED (Light-Emitting Diode) light-emitting element Pending CN102723325A (en)

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Application Number Priority Date Filing Date Title
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104465635A (en) * 2014-12-17 2015-03-25 江苏稳润光电有限公司 Plant lighting LED device and packaging method thereof
CN106783823A (en) * 2017-01-03 2017-05-31 厦门天微电子有限公司 A kind of LED lamplight electricity composite packaging method
CN109244217A (en) * 2018-09-23 2019-01-18 厦门天微电子有限公司 A kind of composite packaging method shown for LED

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201584409U (en) * 2009-07-08 2010-09-15 连展科技(深圳)有限公司 Light-emitting diode chip carrier structure
CN101877350A (en) * 2010-04-20 2010-11-03 蒋伟东 Integrated chip unit
CN202093756U (en) * 2011-03-02 2011-12-28 惠州科锐半导体照明有限公司 LED (light-emitting diode) display
CN202662603U (en) * 2012-06-08 2013-01-09 深圳市聚智德科技有限公司 LED (light-emitting diode) light emitting element

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201584409U (en) * 2009-07-08 2010-09-15 连展科技(深圳)有限公司 Light-emitting diode chip carrier structure
CN101877350A (en) * 2010-04-20 2010-11-03 蒋伟东 Integrated chip unit
CN202093756U (en) * 2011-03-02 2011-12-28 惠州科锐半导体照明有限公司 LED (light-emitting diode) display
CN202662603U (en) * 2012-06-08 2013-01-09 深圳市聚智德科技有限公司 LED (light-emitting diode) light emitting element

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104465635A (en) * 2014-12-17 2015-03-25 江苏稳润光电有限公司 Plant lighting LED device and packaging method thereof
CN106783823A (en) * 2017-01-03 2017-05-31 厦门天微电子有限公司 A kind of LED lamplight electricity composite packaging method
CN109244217A (en) * 2018-09-23 2019-01-18 厦门天微电子有限公司 A kind of composite packaging method shown for LED

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Application publication date: 20121010