CN104425683A - LED packaging support with all-metal structure - Google Patents

Abstract

An all-metal structure LED packaging bracket is characterized in that the bracket body with a concave reflective cup is made of a metal plate; two relatively independent and separated metal sheets are fixed on the bracket with a heat-resistant insulating adhesive layer The upper surface of the body forms an integrated all-metal LED package bracket with input and output electrodes under the condition of insulation protection; the LED chip is fixed on the upper surface of the concave reflective cup, and the two metal sheets are close to the LED chip An electrical connection is formed between one end and the LED chip; or a coating that can be electrically connected to the LED chip is directly deposited on the upper surface of the concave reflective cup by physical or chemical methods.

Description

An all-metal structure LED packaging bracket

technical field

The invention relates to an LED packaging bracket, in particular to an all-metal LED packaging bracket. the

Background technique

The current traditional LED packaging bracket is mainly that LED particles are sealed in a bracket composed of plastic or ceramic + metal electrodes with an inverted trapezoidal reflective cup-shaped cross section. There are two electrode pins extending out of the bracket on the left and right of the LED particles. This traditional solution is complex in process and because of the use of plastic as the reflective material, on the one hand, the reflective efficiency is low; on the other hand, because the shell material is plastic, its thermal conductivity is poor, and the heat dissipation is only relying on the left and right two electrode pins, which leads to overall heat dissipation The effect is poor. Therefore, it is very important to design a packaging method with high reflective efficiency and good thermal conductivity. the

Contents of the invention

In view of this, in order to solve the above-mentioned problems, the present invention provides a new type of LED packaging bracket that improves on the above-mentioned shortcomings, has simple process, low cost and good reflective and heat-dissipating effects. the

To achieve the above object, the present invention adopts the following technical solutions:

An all-metal structure LED packaging bracket is characterized in that the bracket body with a concave reflective cup is made of a metal plate;

Using a heat-resistant insulating adhesive layer, two relatively independent and separated metal sheets are fixed on the upper surface of the bracket body to form an integrated all-metal LED packaging bracket with input and output electrodes under insulation protection conditions;

Fix the LED chip on the upper surface of the concave reflective cup, and form an electrical connection between one end of the two metal sheets close to the LED chip and the LED chip; or use physical or chemical methods on the concave reflective cup A coating that can be electrically connected to the LED chip is directly deposited on the surface;

Further, the LED encapsulation bracket of the all-metal structure is encapsulated and protected with phosphor powder mixed with silica gel or remote phosphor film.

Further, the cross-sectional shape of the concave reflective cup may be trapezoidal. the

Further, the method for fixing the LED chips may be fixing with silver glue or silver paste. the

Further, the electrical connection formed between the end close to the LED chip and the LED chip can be made of gold wire or silver wire. the

Further, the upper surface of the trapezoidal reflective cup is plated with silver or aluminum or coated with nano-reflective material. the

Further, the heat-resistant insulating adhesive layer can be epoxy resin, parylene, PET or polyimide, acrylic film layer or structural adhesive layer, or a combination of the above materials, or use Modified colloid mixed with high thermal conductivity material. the

Further, the surface treatment of the packaged product of the all-metal structure LED packaging bracket adopts parylene technology. the

Further, the lower surface of the bracket body is usually welded to the metal heat dissipation substrate of the lamp, and the surface of the metal heat dissipation substrate can be electroplated or chemically plated with medium and low temperature soldered silver, nickel, tin and other materials to make its surface have Common solderability with SMT equipment. the

Beneficial effect:

After adopting this solution, the LED chip can be directly packaged on the upper surface of the bottom of the metal cup with high light reflection, high thermal conductivity and optical design function. At the same time, the metal electrode of the bracket not only has good light reflection and heat dissipation performance, but also has good insulation protection between it and the bracket body.

When the LED device packaged by this technology is applied to a lamp product, a good heat dissipation path can be formed by low-temperature soldering technology between its solderable cup bottom (that is, the reverse side of the bracket body) and the metal heat dissipation substrate of the lamp; Compared with the traditional LED packaging bracket designed with plastic and metal materials and ceramic materials, the proposed all-metal structure LED packaging bracket can significantly improve the light efficiency and heat dissipation performance of LED packaging devices. the

the

Description of drawings

Figure 1 is a side sectional view of the present invention. the

the

Detailed ways

Referring to Fig. 1, an all-metal structure LED packaging bracket, the bracket body 1 with a concave reflective cup 11 is made of a metal plate; two relatively independent metal sheets 3 are separated by a heat-resistant insulating adhesive layer 2 It is fixed on the upper surface of the bracket body 1 to form an integrated all-metal LED package bracket with input and output electrodes under the condition of insulation protection; the LED chip 4 is fixed on the upper surface of the concave reflective cup 11, the Two metal sheets 3 close to one end of the LED chip 4 form an electrical connection with the LED chip 4; or directly deposit on the upper surface of the concave reflective cup 11 by physical or chemical methods to make an electrical connection with the LED chip 4 coating; use fluorescent powder mixed with silica gel or remote fluorescent film to package and protect the LED packaging bracket with all-metal structure. The cross-sectional shape of the concave reflective cup 11 may be trapezoidal. The method for fixing the LED chip 4 may be fixing with silver glue or silver paste. The electrical connection between the end close to the LED chip 4 and the LED chip 4 can be done by putting gold wire or silver wire 5 on it. The upper surface of the trapezoidal reflective cup 11 is plated with silver or aluminum or coated with nano-reflective material. The heat-resistant insulating adhesive layer 2 can be a film layer or a structural adhesive layer of epoxy resin, parylene, PET or polyimide, acrylic, or a combination of the above materials, or with a high thermal conductivity Modified colloid for material incorporation. The surface treatment of the finished product of the LED encapsulation bracket with all-metal structure adopts Parylene technology. The lower surface of the bracket body 1 is usually welded with the metal heat dissipation substrate of the lamp, and the surface of the metal heat dissipation substrate can be electroplated or chemically plated with medium and low temperature soldered silver, nickel, tin and other materials so that its surface has the same characteristics as SMT. Equipment-compatible solderability. the

Compared with the traditional scheme, the thermoelectric separation technology adopted in the present invention differs in that the present invention uses silver-plated or aluminum-plated trapezoidal reflective cups 11 on the upper surface or is coated with nano-reflective materials to form full mirror reflection, and the light reflection efficiency is higher than that of traditional LEDs. The package standoff has been improved by more than 15%. Due to the use of an all-metal structure, which can be directly welded on the metal heat dissipation substrate, compared with the traditional application method of LED devices from the electrode to the copper foil to the insulating layer and then to the metal heat dissipation substrate, the heat dissipation area of the LED device produced by this packaging bracket is larger than that of the traditional LED device. The electrode has been enlarged by dozens of times, which reduces the adverse effect of thermal diffusion caused by traditional plastic or ceramic reflector cups dissipating heat through electrodes and copper foil, and reduces a layer of thermal resistance downward (the packaged device of the present invention can be directly welded on non- Insulated heat sink, while the traditional package needs to dissipate heat through the insulation treatment of the circuit or substrate, which will form an inevitable thermal resistance), and its comprehensive heat dissipation performance will be improved hundreds of times. Moreover, the scheme has simple process, low cost and good reliability. the

the

Claims (9)

1. A kind of LED encapsulation bracket of all-metal structure, it is characterized in that: A bracket body (1) with a concave reflector (11) is made of a metal plate; Use a heat-resistant insulating adhesive layer (2) to fix two relatively independent and separated metal sheets (3) on the upper surface of the bracket body (1) to form an integrated circuit with input and output electrodes under insulation protection conditions. All-metal LED packaging bracket; Fixing the LED chip (4) on the upper surface of the concave reflective cup (11), and forming an electrical connection between the ends of the two metal sheets (3) close to the LED chip (4) and the LED chip (4); Or directly deposit a coating that can be electrically connected to the LED chip (4) on the upper surface of the concave reflective cup (11) by physical or chemical methods. 2. An all-metal structure LED package bracket as claimed in claim 1, characterized in that: the all-metal structure LED package bracket is packaged and protected with fluorescent powder mixed with silica gel or remote fluorescent film. 3. The all-metal structure LED package holder according to claim 2, characterized in that: the cross-sectional shape of the concave reflective cup (11) can be trapezoidal. 4. The LED packaging bracket with all-metal structure according to claim 3, characterized in that: the method for fixing the LED chip (4) can be fixed by silver glue or silver paste. 5. An all-metal structure LED packaging bracket according to claim 4, characterized in that: the electrical connection between the end close to the LED chip (4) and the LED chip (4) can be made by marking Gold or silver wire (5). 6. An all-metal structure LED package holder according to claim 5, characterized in that: the upper surface of the trapezoidal reflective cup (11) is plated with silver or aluminum or coated with nano-reflective material. 7. An all-metal structure LED packaging bracket as claimed in claim 6, characterized in that: the heat-resistant insulating adhesive layer (2) can be epoxy resin, parylene, PET or polyimide Amine, acrylate film layer or structural adhesive layer, or a combination of the above materials, or modified colloid mixed with high thermal conductivity materials. 8 . The all-metal structure LED packaging support as claimed in claim 7 , wherein the surface treatment of the all-metal structure LED package support adopts Parylene technology. 9 . 9. An all-metal structure LED packaging bracket according to any one of claims 1-8, characterized in that: the lower surface of the bracket body (1) is usually welded to the metal heat dissipation substrate of the lamp, and the The surface of the metal heat dissipation substrate can be electroplated and chemically plated with medium and low temperature soldered silver, nickel, tin and other materials to make its surface have the same solderability as SMT equipment.