CN104391011A - Condensation sensor - Google Patents

Abstract

The present invention relates to a condensation sensor, which includes a circuit module substrate and a condensation sensing probe. A condensation sensing probe interface is provided at one end of the circuit module substrate. Chip modules, knob mounting blocks, signal indicators, and input and output interfaces are arranged horizontally. The condensation sensing probe includes a ceramic substrate and interdigitated electrodes arranged on the ceramic substrate. The comb electrodes are arranged on the surface There is a sensing wet film, and a lead wire is connected to the end of the comb-shaped electrode, and the lead wire is connected to the interface of the condensation sensing probe. Adopting the technical scheme of the invention, the circuit module substrate can be placed in the box to form a sealed type, which is small in size, easy to operate, high in sensitivity, and can form a positive dew point sensor and a negative dew point sensor according to the material composition of the moisture sensitive film.

Description

a condensation sensor

technical field

The sensor field of the present invention specifically relates to a condensation sensor. the

Background technique

With the development of the times, industrial sectors such as scientific research, agriculture, HVAC, textiles, machine rooms, aerospace, electric power, etc., increasingly need to use condensation sensors, and the requirements for product quality are getting higher and higher. Control and monitoring and analysis of the moisture value of industrial materials have become one of the more common technical conditions; condensation sensor products and humidity measurement are industries that emerged in the 1990s. How to make a good condensation sensor and how to judge the humidity sensor? Performance, this is still a relatively complicated issue for the current technical level; in the high humidity area where condensation will occur, the resistance value of the thick film ceramic semiconductor will change sharply, and the condensation sensor uses this principle made. The resistance of the condensation sensor changes linearly with the relative humidity. The sensor converts the change of humidity into the change of resistance value, and uses this characteristic to measure the humidity. The circuit module substrate used in this condensation sensor makes the sensor smaller and more compact. The sensitivity is high, and a dew point sensor with positive characteristics and a dew point sensor with negative characteristics can be formed according to the material of the moisture sensitive film. the

Contents of the invention

The purpose of the present invention is to overcome the problems existing in the prior art and provide a condensation sensor. the

In order to achieve the above-mentioned technical purpose and achieve the above-mentioned technical effect, the present invention is realized through the following technical solutions:

A condensation sensor, comprising a circuit module substrate and a condensation sensing probe. A condensation sensing probe interface is provided at one end of the circuit module substrate. A chip module, a knob mounting block, a signal indicator light, and an input/output interface. The condensation sensing probe includes a ceramic substrate and interdigitated electrodes arranged on the ceramic substrate. The surface of the comb electrode is provided with a moisture sensor The end of the comb-shaped electrode is connected with a lead wire, and the lead wire is connected to the interface of the condensation sensing probe.

Further, the chip in the chip module is an LM393 chip. the

Further, the knob mounting block is provided with a sensitivity adjustment knob. the

Further, the input and output interfaces include a power supply negative interface, a power supply positive interface, an analog signal output interface, and a level signal output interface. the

Preferably, the moisture-sensitive film is made of one of polymer and conductive particle material, or water ionization material. the

The beneficial effects of the present invention are:

By adopting the technical solution of the invention, the circuit module substrate can be placed in the box to form a sealed type, which is small in size, easy to operate, high in sensitivity, and can form a positive characteristic dew point sensor and a negative characteristic dew point sensor according to the material composition of the moisture sensitive film.

Description of drawings

Fig. 1 is a schematic structural diagram of a circuit module substrate of the present invention;

Figure 2 is the front view of the condensation sensing probe;

Fig. 3 is a schematic cross-sectional view of the condensation sensing probe.

Explanation of symbols in the figure: 1. Circuit module substrate, 2. Condensation sensing probe, 21. Ceramic substrate, 22. Comb electrode, 23. Moisture sensing film, 24. Lead wire, 3. Condensation sensing probe interface, 4. Chip module, 5. Knob installation block, 6. Signal indicator light, 7. Input and output interface, 71. Power supply negative interface, 72. Power supply positive interface, 73. Analog signal output interface, 74. Level signal output interface, 8 , Sensitivity adjustment knob. the

Detailed ways

The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments. the

As shown in Figure 1, a condensation sensor includes a circuit module substrate 1 and a condensation sensing probe 2, and a condensation sensing probe interface 3 is provided at one end of the circuit module substrate 1, and the condensation sensing probe interface 3 The side is sequentially provided with a chip module 4, a knob mounting block 5, a signal indicator light 6, and an input and output interface 7 arranged laterally along the circuit module substrate 1, as shown in Figures 2 and 3, the condensation sensing probe 2 includes a ceramic The substrate 21, and the interdigitated comb electrode 22 arranged on the ceramic substrate 21, the surface of the comb electrode 22 is provided with a moisture-sensitive film 23, the tail end of the comb electrode 22 is connected to a lead wire 24, and the lead wire 24 is connected to Condensation sensing probe interface 3. the

The chips in the chip module 4 are LM393 chips. the

The knob mounting block 5 is provided with a sensitivity adjusting knob 8 . the

The input and output interface 7 includes a power negative interface 71 , a power positive interface 72 , an analog signal output interface 73 and a level signal output interface 74 . the

The moisture-sensitive film 23 is made of polymer and conductive particle material, or one of water ionization materials; wherein, the moisture-sensitive film 23 composed of polymer and conductive particle material realizes electron conduction and forms a dew point sensor with positive characteristics; The moisture-sensitive membrane 23 made of water ionization material realizes ion conduction and forms a dew point sensor with negative characteristics. the

In the present embodiment, the manufacturing process of the condensation sensing probe 2 is as follows:

a) first fabricate comb electrodes 22 on the ceramic substrate 21;

b) Then apply a moisture-sensitive film 23 on the comb electrode 22;

c) Solder the lead wire 24 on the end of the comb electrode 22 .

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention. the

Claims (5)

1. a condensation sensor, comprise circuit module substrate (1) and condensation inductive probe (2), it is characterized in that, described circuit module substrate (1) one end is provided with condensation inductive probe interface (3), the side of described condensation inductive probe interface (3) is disposed with the chip module (4) along circuit module substrate (1) lateral arrangement, knob mounting blocks (5), signal lamp (6), IO interface (7), described condensation inductive probe (2) comprises ceramic substrate (21), and the interdigitated electrodes (22) be arranged on ceramic substrate (21), described comb electrode (22) is provided with humidity-sensitive film (23) on the surface, comb electrode (22) tail end is connected with lead-in wire (24), described lead-in wire (24) connects condensation inductive probe interface (3).

2. condensation sensor according to claim 1, is characterized in that, the chip in described chip module (4) is LM393 chip.

3. condensation sensor according to claim 1, is characterized in that, described knob mounting blocks (5) is provided with adjustment of sensitivity knob (8).

4. condensation sensor according to claim 1, is characterized in that, described IO interface (7) comprises power cathode interface (71), positive source interface (72), analog signal output interface (73) and level signal output interface (74).

5. condensation sensor according to claim 1, is characterized in that, described humidity-sensitive film (23) is macromolecule and particulate materials, or water power is made from one in material.