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CN113588727B - Humidity sensor chip without storage module - Google Patents

Humidity sensor chip without storage module Download PDF

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CN113588727B
CN113588727B CN202110531383.5A CN202110531383A CN113588727B CN 113588727 B CN113588727 B CN 113588727B CN 202110531383 A CN202110531383 A CN 202110531383A CN 113588727 B CN113588727 B CN 113588727B
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CN113588727A (en
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尹海宏
施天宇
王志亮
宋长青
印川
赵晨媛
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Shenzhen Hongyue Information Technology Co ltd
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Abstract

The invention discloses a humidity sensor chip without a storage module, which comprises a humidity sensitive module, a measuring circuit module and a microprocessing unit (MCU); the humidity sensitive module comprises a humidity sensitive material, a substrate, a first electrode, a second electrode and a third electrode; the humidity sensitive material, the substrate, the first electrode, the second electrode and the third electrode form a humidity sensitive capacitor-resistor composite structure with a three-electrode structure; the first electrode, the humidity sensitive material and the second electrode form a humidity sensitive resistor (humidity sensitive resistor) structure, and the humidity sensitive material is used as the humidity sensitive material of the humidity sensitive resistor (humidity sensitive resistor); the substrate is a crystalline material with piezoelectric effect.

Description

无存储模块的湿度传感器芯片Humidity sensor chip without memory module

本申请是一种三电极结构的湿度传感器芯片的分案申请,该申请的申请日为:2020.01.07,申请号为202010011995.7,发明创造名称为:一种三电极结构的湿度传感器芯片。This application is a divisional application for a humidity sensor chip with a three-electrode structure. The application date of this application is: 2020.01.07, the application number is 202010011995.7, and the name of the invention is: A humidity sensor chip with a three-electrode structure.

技术领域technical field

本发明涉及一种无存储模块的湿度传感器芯片。The invention relates to a humidity sensor chip without a storage module.

背景技术Background technique

本发明专利申请是CN202010011995.7的分案申请,为克服母案的单一性缺陷而提出。The patent application of the present invention is a divisional application of CN202010011995.7, which is proposed to overcome the singularity defect of the parent case.

湿度传感器的相关背景技术文件,可参阅:For the relevant background technical documents of the humidity sensor, please refer to:

[1]Hosseinbabaei,F.and P.Shabani(2014).″A gold/organic semiconductordiode for ppm-level humidity sensing.″Sensors and Actuators B-chemical 205:143-150.[1] Hosseinbabaei, F. and P. Shabani (2014). “A gold/organic semiconductordiode for ppm-level humidity sensing.” Sensors and Actuators B-chemical 205: 143-150.

[2]Hosseini,M.S.and S.Zeinali(2019).″Capacitive humidity sensingusing a metal-organic framework nanoporous thin film fabricated throughelectrochemical in situ growth,″Journal of Materials Science:Materials inElectronics 30(4):3701-3710.[2] Hosseini, M.S. and S. Zeinali (2019). “Capacitive humidity sensing using a metal-organic framework nanoporous thin film fabricated through electrochemical in situ growth,” Journal of Materials Science: Materials in Electronics 30(4): 3701-3710.

[3]Jeong,W.,J.Song,et al.(2019).″Breathable Nanomesh Humidity Sensorfor Real-time Skin Humidity Monitoring.″ACS Applied Materials&Interfaces 11[3] Jeong, W., J. Song, et al. (2019). "Breathable Nanomesh Humidity Sensor for Real-time Skin Humidity Monitoring." ACS Applied Materials & Interfaces 11

(47):44758-44763.(47): 44758-44763.

[4]Kuang,Q.,C.Lao,et al.(2007).″High-sensitivity humidity sensorbased on a single SnO2 nanowire.″Journal of the American Chemical Society 129[4] Kuang, Q., C. Lao, et al. (2007). "High-sensitivity humidity sensor based on a single SnO2 nanowire." Journal of the American Chemical Society 129

(19):6070-6071.(19): 6070-6071.

[5]Li,L.,F.Vilela,et al.(2009).″Miniature humidity micro-sensor basedon organic conductive polymer-poly(3,4-ethylenedioxythiophene).″Micro&NanoLetters 4(2):84-87.[5] Li, L., F. Vilela, et al. (2009). "Miniature humidity micro-sensor based on organic conductive polymer-poly(3,4-ethylenedioxythiophene)." Micro & NanoLetters 4(2): 84-87.

[6]Popov,V.I.,D.V.Nikolaev,et al.(2017).″Graphene-based humiditysensors:the origin of alternating resistance change.″Nanotechnology28(35):355501.[6] Popov, V.I., D.V. Nikolaev, et al. (2017). “Graphene-based humidity sensors: the origin of alternating resistance change.” Nanotechnology 28(35): 355501.

[7]Su,P.and C.Uen(2005).″A resistive-type humidity sensor usingcomposite films prepared from poly(2-acrylamido-2-methylpropane sulfonate)anddispersed organic silicon sol.″Talanta 66(5):1247-1253.[7] Su, P. and C. Uen (2005). "A resistive-type humidity sensor using composite films prepared from poly(2-acrylamido-2-methylpropane sulfonate) and dispersed organic silicon sol." Talanta 66(5): 1247 -1253.

[8]Zhang,C.,W.Zhang,et al.(2010).″Optical fibre temperature andhumidity sensor.″Electronics Letters 46(9):643-644.[8] Zhang, C., W. Zhang, et al. (2010). "Optical fibre temperature and humidity sensor." Electronics Letters 46(9): 643-644.

发明内容SUMMARY OF THE INVENTION

本发明的目的在于提供一种无存储模块的湿度传感器芯片,还能实现湿度传感器芯片的自我诊断、更换提醒。实现本发明目的具体技术方案是:The purpose of the present invention is to provide a humidity sensor chip without a storage module, which can also realize self-diagnosis and replacement reminder of the humidity sensor chip. The concrete technical scheme that realizes the object of the present invention is:

一种湿度传感器芯片,传感器芯片包括湿度敏感模块,所述湿度敏感模块包括湿度敏感材料、衬底、上电极和下电极;下电极位于衬底材料的背面,湿度敏感材料制备在衬底的正面,上电极位于湿度敏感材料的上面;所述湿度敏感材料特征在于:具有吸水特性,吸收环境空气中的水分导致电阻率随着含水率而变化。所述湿度敏感材料为有机材料,或无机材料,或有机/无机复合材料。A humidity sensor chip, the sensor chip includes a humidity sensitive module, the humidity sensitive module includes a humidity sensitive material, a substrate, an upper electrode and a lower electrode; the lower electrode is located on the back of the substrate material, and the humidity sensitive material is prepared on the front of the substrate , the upper electrode is located above the humidity-sensitive material; the humidity-sensitive material is characterized in that: it has the characteristic of water absorption, and absorbing the water in the ambient air causes the resistivity to change with the water content. The humidity-sensitive material is an organic material, or an inorganic material, or an organic/inorganic composite material.

在有些实施方式中,传感器芯片包括湿度敏感模块、测量电路模块、微处理单元MCU;在有些实施方式中,传感器芯片包括湿度敏感模块、测量电路模块、存储模块、微处理单元MCU。In some embodiments, the sensor chip includes a humidity sensitive module, a measurement circuit module, and a microprocessing unit MCU; in some embodiments, the sensor chip includes a humidity sensitive module, a measurement circuit module, a storage module, and a microprocessing unit MCU.

在有些实施方式中,所述湿度敏感模块包括湿度敏感材料、衬底、上电极和下电极;所述湿度敏感材料为:在苯甲酸苯酯中加入重量份为5-8%的氧化亚铜、重量份为4-7%的氧化锌、重量份为4-8%的4-环氧丙烷氧基咔唑,在90-110℃下进行强力搅拌后形成的混合液,即:In some embodiments, the humidity-sensitive module includes a humidity-sensitive material, a substrate, an upper electrode and a lower electrode; the humidity-sensitive material is: adding 5-8% by weight of cuprous oxide to phenyl benzoate , 4-7% by weight of zinc oxide, 4-8% by weight of 4-epoxypropanoloxycarbazole, the mixed solution formed after vigorous stirring at 90-110 ° C, namely:

所述湿度敏感材料的前驱体溶液为:由氧化亚铜、氧化锌、4-环氧丙烷氧基咔唑(CAS号:53-95-2)、苯甲酸苯酯组成的疏水性油状混合液;The precursor solution of the humidity-sensitive material is: a hydrophobic oily mixed solution composed of cuprous oxide, zinc oxide, 4-epoxypropanoloxycarbazole (CAS number: 53-95-2), and phenyl benzoate ;

优选地,氧化亚铜为1-10μm的颗粒状氧化亚铜,氧化锌为0.5-5μm的棒状氧化锌;Preferably, the cuprous oxide is granular cuprous oxide of 1-10 μm, and the zinc oxide is rod-shaped zinc oxide of 0.5-5 μm;

优选地,氧化亚铜的重量份为5-8%,氧化锌的重量份为4-7%,4-环氧丙烷氧基咔唑的重量份为3-6%,余量为苯甲酸苯酯。Preferably, the weight part of cuprous oxide is 5-8%, the weight part of zinc oxide is 4-7%, the weight part of 4-epoxypropoxycarbazole is 3-6%, and the balance is benzene benzoate ester.

所述湿度敏感模块制备方法如下:The preparation method of the humidity sensitive module is as follows:

(a)制备湿度敏感材料的前驱体溶液:在苯甲酸苯酯中加入重量份为5-8%的氧化亚铜、重量份为4-7%的氧化锌、重量份为4-8%的4-环氧丙烷氧基咔唑;将混合物加热至90-110℃,采用磁力搅拌器进行强力搅拌30-60分钟,形成疏水性油状混合液;(a) Preparation of the precursor solution of the humidity-sensitive material: adding 5-8% by weight of cuprous oxide, 4-7% by weight of zinc oxide, and 4-8% by weight of phenyl benzoate 4-propylene oxide alkoxycarbazole; the mixture is heated to 90-110°C, and vigorously stirred with a magnetic stirrer for 30-60 minutes to form a hydrophobic oily liquid mixture;

(b)湿度敏感材料制备在衬底的正面:将步骤(a)得到的疏水性油状混合液在90-110℃条件下旋涂在衬底的正面,然后自然冷却至室温;(b) Preparation of humidity-sensitive material on the front side of the substrate: spin-coating the hydrophobic oily mixed solution obtained in step (a) on the front side of the substrate at 90-110° C., and then naturally cool to room temperature;

(c)采用蒸镀工艺或溅射工艺或射频磁控溅射工艺在衬底的背面制备得到第三电极;(c) adopting evaporation process or sputtering process or radio frequency magnetron sputtering process to prepare the third electrode on the backside of the substrate;

(d)采用掩膜版,通过蒸镀工艺或溅射工艺或射频磁控溅射工艺在衬底的正面的湿度敏感材料上制备得到第一电极和第二电极;(d) using a mask to prepare a first electrode and a second electrode on the humidity-sensitive material on the front side of the substrate by an evaporation process or a sputtering process or a radio frequency magnetron sputtering process;

可选地,步骤(c)调整到步骤(a)之前。Optionally, step (c) is adjusted before step (a).

在本发明的所有实施方式中,所述湿度敏感模块包括湿度敏感材料、衬底、第一电极、第二电极和第三电极;湿度敏感材料、衬底、第一电极、第二电极和第三电极构成三电极结构的湿度敏感型电容--电阻复合结构,即:In all embodiments of the present invention, the humidity-sensitive module includes a humidity-sensitive material, a substrate, a first electrode, a second electrode, and a third electrode; a humidity-sensitive material, a substrate, a first electrode, a second electrode, and a third electrode Three electrodes form a humidity-sensitive capacitor-resistor composite structure with a three-electrode structure, namely:

第一电极、第二电极之间构成湿度敏感电阻(湿敏电阻),第一电极、第三电极之间构成湿度敏感电容(湿敏电容),第二电极、第三电极之间也构成湿度敏感电容(湿敏电容),且第一电极、第二电极和第三电极互相之间为同一湿度敏感材料;A humidity-sensitive resistor (humidity-sensitive resistor) is formed between the first electrode and the second electrode, a humidity-sensitive capacitor (humidity-sensitive capacitor) is formed between the first electrode and the third electrode, and a humidity is also formed between the second electrode and the third electrode. A sensitive capacitor (humidity sensitive capacitor), and the first electrode, the second electrode and the third electrode are the same humidity sensitive material;

所述衬底是具备压电效应的晶体材料。The substrate is a crystalline material with piezoelectric effect.

在本发明中,湿度传感器测量环境空气湿度,实现方式如下:In the present invention, the humidity sensor measures ambient air humidity, and the implementation is as follows:

测量电路模块用于在测量时执行如下两个测量操作,且两个测量操作的先后次序不作限制:The measurement circuit module is used to perform the following two measurement operations during measurement, and the sequence of the two measurement operations is not limited:

(1)测量电路模块向湿度敏感模块的第一电极和第三电极施加预设频率范围的、频率变化的交流激励信号,或,交流激励信号施加在湿度敏感模块的第二电极和第三电极上,测量湿度敏感模块的谐振频率;(1) The measurement circuit module applies an AC excitation signal with a preset frequency range to the first electrode and the third electrode of the humidity sensitive module, or the AC excitation signal is applied to the second electrode and the third electrode of the humidity sensitive module. , measure the resonant frequency of the humidity sensitive module;

(2)测量电路模块向湿度敏感模块的第一电极和第二电极施加直流电信号,测量湿度敏感模块的湿度敏感电阻(湿敏电阻)值;(2) The measurement circuit module applies a direct current signal to the first electrode and the second electrode of the humidity sensitive module, and measures the humidity sensitive resistance (humidity sensitive resistance) value of the humidity sensitive module;

所述谐振频率和所述湿度敏感电阻(湿敏电阻)值随着湿度敏感材料含水率变化而变化;the resonant frequency and the humidity-sensitive resistance (humidity-sensitive resistance) value vary with the moisture content of the humidity-sensitive material;

所述测量电路模块将测量得到的测量湿度敏感模块的谐振频率和湿度敏感电阻(湿敏电阻)值传输至微处理单元MCU;The measurement circuit module transmits the measured resonant frequency and humidity sensitive resistance (humidity sensitive resistance) value of the measured humidity sensitive module to the microprocessor unit MCU;

微处理单元MCU根据谐振频率和湿度敏感电阻(湿敏电阻)值分别计算得到两个环境空气湿度参考值,即环境空气湿度参考值a和环境空气湿度参考值b;The micro-processing unit MCU calculates and obtains two ambient air humidity reference values, namely, ambient air humidity reference value a and ambient air humidity reference value b, respectively, according to the resonant frequency and the humidity sensitive resistor (humidity sensitive resistor) value;

优选地,环境空气湿度参考值a和环境空气湿度参考值b的均方值或平均值作为结果输出。Preferably, the mean square value or average value of the ambient air humidity reference value a and the ambient air humidity reference value b is output as the result.

湿度传感器芯片实现自我诊断、更换提醒,具体地:微处理单元MCU包括判别功能模块,判别功能模块执行如下判别功能:微处理单元MCU中的判别功能模块根据计算得到环境空气湿度参考值a和环境空气湿度参考值b进行自我诊断、判别湿度传感器芯片是否存在故障、或性能老化。The humidity sensor chip realizes self-diagnosis and replacement reminder. Specifically: the micro-processing unit MCU includes a discriminating function module, and the discriminating function module performs the following discriminating functions: the discriminating function module in the micro-processing unit MCU obtains the ambient air humidity reference value a and the environment according to the calculation. The air humidity reference value b performs self-diagnosis to determine whether the humidity sensor chip is faulty or its performance is aging.

在本发明的研究过程中,发明人发现,有些湿度敏感模块存在两种不同的物理性质随着湿度敏感材料含水率变化而变化,这两种物理性质均与湿度敏感材料的含水率密切相关,均可以用于检测环境空气中的湿度。发明人还发现,由于是两种不同的物理性质,其随着含水率变化的物理机制的不同的,构建出的湿度敏感模块后,这两种不同的、与湿度敏感材料的含水率密切相关物理性质,随着湿度传感器的使用时间的延长,性能衰退的曲线也是不一致的,即,与湿度敏感相关的不同的物理性质,随着传感器使用时间的延长,测量准确度方面的偏差会越来越大,并且偏差的程度是不一致的。During the research process of the present invention, the inventor found that some humidity-sensitive modules have two different physical properties that change with the moisture content of the humidity-sensitive material. Both physical properties are closely related to the moisture content of the humidity-sensitive material. Both can be used to detect humidity in ambient air. The inventor also found that, due to two different physical properties, the physical mechanism of the change with the moisture content is different. After the moisture sensitive module is constructed, these two different physical properties are closely related to the moisture content of the moisture sensitive material. Physical properties, the performance degradation curve is also inconsistent as the humidity sensor is used for an extended period of time, i.e., different physical properties related to humidity sensitivity, the deviation in measurement accuracy will become more and more as the sensor is used for an extended period of time. is larger, and the degree of deviation is inconsistent.

在本发明中,利用了某些湿度敏感材料的电阻率的湿度敏感性来检测环境空气湿度。同时,发明人创造性地提出了:湿度敏感模块包括湿度敏感材料、衬底、第一电极、第二电极和第三电极;湿度敏感材料、衬底、第一电极、第二电极和第三电极构成三电极结构的湿度敏感型电容--电阻复合结构;第一电极、湿度敏感材料、衬底、第三电极构成电容器结构,湿度敏感材料、衬底为电容器的复合介电层;第二电极、湿度敏感材料、衬底、第三电极 也构成电容器结构,湿度敏感材料、衬底为电容器的介电层In the present invention, the humidity sensitivity of the resistivity of certain humidity sensitive materials is utilized to detect ambient air humidity. At the same time , the inventor creatively proposes that the humidity-sensitive module includes a humidity-sensitive material, a substrate, a first electrode, a second electrode and a third electrode; the humidity-sensitive material, the substrate, the first electrode, the second electrode and the third electrode A humidity-sensitive capacitor-resistor composite structure that constitutes a three-electrode structure; the first electrode, the humidity-sensitive material, the substrate, and the third electrode constitute a capacitor structure , and the humidity-sensitive material and the substrate are the composite dielectric layer of the capacitor; the second electrode , The humidity-sensitive material, the substrate, and the third electrode also constitute the capacitor structure, and the humidity-sensitive material and the substrate are the dielectric layers of the capacitor ;

该电容器被施加一定频率的交流电激励信号时,会发生机械振荡,且机械振荡的谐振频率敏感依赖于环境空气的湿度。这是由于石英薄片具备压电特性,被施加一定频率的交流电激励信号时,会发生机械振荡,且机械振荡的谐振频率敏感依赖于石英薄片的切割方向、尺寸、质量,而水分子被湿度敏感材料吸附后,改变了附着于石英薄片的湿度敏感材料的质量,进而使得在该电容器被施加一定频率的交流电激励信号时,谐振频率敏感依When an alternating current excitation signal of a certain frequency is applied to the capacitor, mechanical oscillation will occur, and the resonance frequency of the mechanical oscillation is sensitively dependent on the humidity of the ambient air. This is because the quartz flakes have piezoelectric properties. When an alternating current excitation signal of a certain frequency is applied, mechanical oscillation will occur, and the resonance frequency of the mechanical oscillation is sensitive to the cutting direction, size, and quality of the quartz flakes, while water molecules are sensitive to humidity. After the material is adsorbed, the quality of the humidity-sensitive material attached to the quartz sheet is changed, so that when the capacitor is applied with an AC excitation signal of a certain frequency, the resonant frequency is sensitive to a certain frequency.

赖于环境空气的湿度。Depends on the humidity of the ambient air.

由此,在本发明的三电极结构的湿度传感器芯片中,在测量环境空气湿度时,同时利用了本发明独创的湿度敏感模块的两种物理特性:Therefore, in the humidity sensor chip of the three-electrode structure of the present invention, when measuring the ambient air humidity, two physical characteristics of the humidity sensitive module created by the present invention are simultaneously utilized:

(I)湿度敏感模块的谐振频率随着湿度敏感材料含水率变化而变化;(II)湿度敏感模块的湿度敏感电阻(湿敏电阻)值随着湿度敏感材料含水率变化而变化。(I) The resonant frequency of the humidity-sensitive module changes with the moisture content of the humidity-sensitive material; (II) The humidity-sensitive resistor (humidity-sensitive resistor) value of the humidity-sensitive module changes with the change of the moisture content of the humidity-sensitive material.

并且,这两种物理机制是不同的,随着湿度传感器的使用时间的延长,性能衰退的曲线也是不一致的,可用于实现湿度传感器的自我诊断、更换提醒功能。In addition, these two physical mechanisms are different. With the extension of the humidity sensor's use time, the performance degradation curve is also inconsistent, which can be used to realize the self-diagnosis and replacement reminder functions of the humidity sensor.

更详细的技术原理,可参见本发明人提出的两件在先专利申请的说明书:For more detailed technical principles, please refer to the descriptions of the two prior patent applications filed by the inventor:

CN2019111875813、CN2019113061843。CN2019111875813, CN2019113061843.

与上述两件在先申请不同的是:The differences from the two earlier applications above are:

在本发明中,利用了湿度敏感模块的湿度敏感电阻(湿敏电阻)值随着湿度敏感材料含水率变化而变化的物理特性,替换了在先申请的两件专利申请(CN2019111875813、CN2019113061843)中利用的湿度敏感模块的电容值(介电常数)随着湿度敏感材料含水率变化而变化的物理特性;In the present invention, the physical properties of the humidity-sensitive resistance (humidity-sensitive resistance) value of the humidity-sensitive module changing with the moisture content of the humidity-sensitive material are used, which replaces the two previously applied patent applications (CN2019111875813, CN2019113061843). The physical properties of the capacitance value (dielectric constant) of the utilized humidity-sensitive module as a function of the moisture content of the humidity-sensitive material;

在本发明的某些实施方式中,取消了在先申请的两件专利申请(CN2019111875813、CN 2019113061843)中存在的独立的存储模块,不再记录有湿度敏感模块的两种不同的物理性质随着湿度敏感材料含水率变化而变化的标准曲线,环境空气湿度的值由微处理单元MCU根据公式计算得到,这样就可降低湿度传感器芯片的成本;In some embodiments of the present invention, the independent storage modules existing in the two previously filed patent applications (CN2019111875813, CN 2019113061843) are cancelled, and the two different physical properties of the humidity sensitive module are no longer recorded as The standard curve of the moisture content of the humidity sensitive material changes, the value of the ambient air humidity is calculated by the microprocessor unit MCU according to the formula, so that the cost of the humidity sensor chip can be reduced;

在本发明的所有实施方式中,湿度敏感模块中的湿度敏感材料、衬底、第一电极、第二电极和第三电极构成三电极结构的湿度敏感型电容--电阻复合结构,第一电极、第二电极之间构成湿度敏感电阻(湿敏电阻),第一电极、第三电极之间构成湿度敏感电容(湿敏电容),第二电极、第三电极之间也构成湿度敏感电容(湿敏电容),且第一电极、第二电极和第三电极互相之间为同一湿度敏感材料;而在先申请的两件专利申请中,则为简单的上下两个电极,湿度敏感模块中的湿度敏感材料、衬底、上电极、下电极构成简单的湿度敏感型电容结构。In all embodiments of the present invention, the humidity-sensitive material, the substrate, the first electrode, the second electrode and the third electrode in the humidity-sensitive module constitute a humidity-sensitive capacitor-resistance composite structure with a three-electrode structure, and the first electrode , A humidity-sensitive resistor (humidity-sensitive resistor) is formed between the second electrodes, a humidity-sensitive capacitor (humidity-sensitive capacitor) is formed between the first electrode and the third electrode, and a humidity-sensitive capacitor (humidity-sensitive capacitor) is formed between the second electrode and the third electrode. Humidity sensitive capacitor), and the first electrode, the second electrode and the third electrode are the same humidity sensitive material; while in the two patent applications filed earlier, it is a simple upper and lower electrodes, and the humidity sensitive module The humidity-sensitive material, substrate, upper electrode, and lower electrode constitute a simple humidity-sensitive capacitor structure.

在本发明中,进一步提出了两件在先申请中未公开的有机/无机复合湿度敏感材料,即湿度敏感材料为:在苯甲酸苯酯中加入重量份为5-8%的氧化亚铜、重量份为4-7%的氧化锌、重量份为4-8%的4-环氧丙烷氧基咔唑,进行强力搅拌后形成的混合物;In the present invention, two organic/inorganic composite humidity-sensitive materials that are not disclosed in the previous application are further proposed, that is, the humidity-sensitive materials are: adding 5-8% by weight of cuprous oxide to phenyl benzoate, A mixture formed after vigorous stirring of 4-7% by weight of zinc oxide and 4-8% by weight of 4-epoxypropanoloxycarbazole;

在本发明中,所提出的有机/无机复合湿度敏感材料为疏水性湿度敏感材料,以避免湿敏传感层在较高的湿度条件下由于溶解在较高湿度下的水中而剥离,而在两件在先申请中未考虑这一技术问题;In the present invention, the proposed organic/inorganic composite humidity-sensitive material is a hydrophobic humidity-sensitive material, so as to avoid peeling of the humidity-sensitive sensing layer due to dissolving in water at higher humidity under higher humidity conditions, and This technical issue was not considered in the two earlier applications;

在本发明中,作为优选的技术方案,第一电极、第二电极之间设置一个由微处理单元MCU控制的电子开关,所述电子开关为一对PMOS/NMOS构成的传输门;传输门的控制端连接至微处理单元MCU;在测量所述湿度敏感模块的谐振频率时,所述电子开关由微处理单元MCU控制处于导通状态,使得第一电极、第二电极短路连接,其余时间所述电子开关则保持断开状态,而在两件在先申请中不涉及这一技术问题;In the present invention, as a preferred technical solution, an electronic switch controlled by the micro-processing unit MCU is arranged between the first electrode and the second electrode, and the electronic switch is a transmission gate composed of a pair of PMOS/NMOS; The control terminal is connected to the micro-processing unit MCU; when measuring the resonant frequency of the humidity sensitive module, the electronic switch is controlled by the micro-processing unit MCU to be in an on state, so that the first electrode and the second electrode are short-circuited, and the rest of the time is The aforementioned electronic switch remains in an off state, and this technical problem is not involved in the two earlier applications;

在本发明中,作为优选的技术方案,湿度敏感模块中还集成有温度传感器,温度传感器连接至测量电路模块,测量电路模块将测量得到的湿度敏感材料的温度值传输至微处理单元MCU,微处理单元MCU根据所述温度值对测量得到的环境空气湿度值进行修正。发明5/9页人发现,温度影响着指定环境空间的相对湿度,而在两件在先申请中未考虑这一技术问题。本发明的湿度传感器芯片,在自我诊断过程中,无需凭借湿度传感器芯片自身以外的任何外在的参照标准,仅仅利用自身特性而实现自我诊断。In the present invention, as a preferred technical solution, a temperature sensor is also integrated in the humidity sensitive module, the temperature sensor is connected to the measurement circuit module, and the measurement circuit module transmits the measured temperature value of the humidity sensitive material to the microprocessing unit MCU, and the microcomputer The processing unit MCU corrects the measured ambient air humidity value according to the temperature value. The inventors on page 5/9 of the invention found that temperature affects the relative humidity of a given ambient space, and this technical problem was not considered in the two prior applications. During the self-diagnosis process, the humidity sensor chip of the present invention does not need to rely on any external reference standard other than the humidity sensor chip itself, but only uses its own characteristics to realize self-diagnosis.

至此,发明人已经阐述了本发明的工作原理及技术方案、技术效果。未尽之处,请参阅本发明人的两件在先专利申请(CN2019111875813、CN 2019113061843)。理所当然地,除了前述特点之外,本发明也具备上述两件在先专利申请的有益效果。So far, the inventor has described the working principle, technical solutions, and technical effects of the present invention. For details, please refer to the two prior patent applications of the present inventor (CN2019111875813, CN 2019113061843). Of course, in addition to the aforementioned features, the present invention also has the beneficial effects of the above two prior patent applications.

附图说明Description of drawings

图1:湿度传感器芯片的正面图,1为第一电极,2为第二电极,3为湿度敏感材料,石英衬底和背面的第三电极未标出。Figure 1: The front view of the humidity sensor chip, 1 is the first electrode, 2 is the second electrode, 3 is the humidity sensitive material, the quartz substrate and the third electrode on the back are not marked.

图2:一种湿度传感器芯片的立体示意图,图2中,1为第一电极,2为第二电极,3为第三电极,4为湿度敏感材料,5为石英薄片。Fig. 2 is a three-dimensional schematic diagram of a humidity sensor chip. In Fig. 2, 1 is a first electrode, 2 is a second electrode, 3 is a third electrode, 4 is a humidity sensitive material, and 5 is a quartz flake.

图3:另一种湿度传感器芯片的图,图3中,1为第一电极,2为第二电极,3为第三电极,4为湿度敏感材料,图中石英薄片在湿度敏感材料的下方,未标出。Figure 3: A diagram of another humidity sensor chip. In Figure 3, 1 is the first electrode, 2 is the second electrode, 3 is the third electrode, and 4 is the humidity-sensitive material. In the figure, the quartz flake is below the humidity-sensitive material. , not marked.

图4:图3或图4中湿度传感器芯片的湿度敏感模块的电容--电阻复合结构的等效电路。Fig. 4: Equivalent circuit of the capacitance-resistance composite structure of the humidity sensitive module of the humidity sensor chip in Fig. 3 or Fig. 4.

具体实施方式Detailed ways

下面结合实例具体介绍本发明的技术方案。The technical solutions of the present invention are specifically described below with reference to examples.

湿度传感器芯片,传感器芯片包括湿度敏感模块、测量电路模块、微处理单元MCU。在有些实施方式中,湿度敏感材料为有机材料;在有些实施方式中,湿度敏感材料为无机材料;在有些实施方式中,湿度敏感材料为有机/无机复合材料。Humidity sensor chip, the sensor chip includes a humidity sensitive module, a measurement circuit module, and a microprocessor unit MCU. In some embodiments, the humidity-sensitive material is an organic material; in some embodiments, the humidity-sensitive material is an inorganic material; in some embodiments, the humidity-sensitive material is an organic/inorganic composite material.

在有些实施方式中,相对于申请号为CN2019111875813的在先发明专利申请,不含有独立的存储模块;在这样的实施方式中,湿度敏感模块包括湿度敏感材料、衬底、第一电极、第二电极和第三电极;湿度敏感材料、衬底、第一电极、第二电极和第三电极构成三电极结构的湿度敏感型电容--电阻复合结构;如图2所示。In some embodiments, relative to the prior invention patent application with application number CN2019111875813, there is no independent storage module; in such embodiments, the humidity-sensitive module includes a humidity-sensitive material, a substrate, a first electrode, a second The electrode and the third electrode; the humidity-sensitive material, the substrate, the first electrode, the second electrode and the third electrode constitute a humidity-sensitive capacitor-resistance composite structure with a three-electrode structure; as shown in FIG. 2 .

湿度敏感模块、微处理单元MCU、存储模块通过层叠封装技术集成在一片衬底材料上得到湿度传感器芯片;第一电极、第二电极之间构成湿度敏感电阻(湿敏电阻),第一电极、第三电极之间构成湿度敏感电容(湿敏电容),第二电极、第三电极之间也构成湿度敏感电容(湿敏电容),且第一电极、第二电极和第三电极互相之间为同一湿度敏感材料;湿度敏感材料制备在衬底的正面,第一电极、第二电极均位于湿度敏感材料的上面,第三电极位于衬底材料的背面;第一电极、第二电极为一对互相围绕而不接触的、其间具有湿度敏感材料的双电极;The humidity sensitive module, the micro-processing unit MCU, and the storage module are integrated on a piece of substrate material through stack packaging technology to obtain a humidity sensor chip; a humidity sensitive resistor (humidity sensitive resistor) is formed between the first electrode and the second electrode, and the first electrode, A humidity-sensitive capacitor (humidity-sensitive capacitor) is formed between the third electrodes, a humidity-sensitive capacitor (humidity-sensitive capacitor) is also formed between the second electrode and the third electrode, and the first electrode, the second electrode and the third electrode are mutually It is the same humidity sensitive material; the humidity sensitive material is prepared on the front side of the substrate, the first electrode and the second electrode are located on the top of the humidity sensitive material, and the third electrode is located on the back side of the substrate material; the first electrode and the second electrode are one pairs of electrodes surrounding each other without touching each other, with moisture-sensitive material therebetween;

第一电极、湿度敏感材料、衬底、第三电极构成电容器结构,湿度敏感材料、衬底为电容器的复合介电层;第二电极、湿度敏感材料、衬底、第三电极也构成电容器结构,湿度敏感材料、衬底为电容器的介电层;第一电极、湿度敏感材料、第二电极构成湿度敏感电阻结构,湿度敏感材料作为湿度敏感电阻的湿度敏感材料;The first electrode, the humidity sensitive material, the substrate and the third electrode constitute a capacitor structure, and the humidity sensitive material and the substrate are the composite dielectric layer of the capacitor; the second electrode, the humidity sensitive material, the substrate and the third electrode also constitute the capacitor structure , the humidity-sensitive material and the substrate are the dielectric layers of the capacitor; the first electrode, the humidity-sensitive material, and the second electrode constitute a humidity-sensitive resistor structure, and the humidity-sensitive material is used as the humidity-sensitive material of the humidity-sensitive resistor;

在这样的实施方式中,微处理单元MCU根据预设公式,由谐振频率和湿度敏感电阻值分别计算得到两个环境空气湿度参考值,即环境空气湿度参考值a和环境空气湿度参考值b。In such an embodiment, the micro-processing unit MCU calculates two ambient air humidity reference values, ie, ambient air humidity reference value a and ambient air humidity reference value b, respectively, according to the preset formula, from the resonance frequency and the humidity sensitive resistance value.

在有些实施方式中,传感器芯片则包括湿度敏感模块、测量电路模块、微处理单元MCU、存储模块;即,相比于前述的实施方式,多了独立的存储模块,存储模块用于存储标准参数库;在这样的实施方式中:湿度敏感模块包括湿度敏感材料、衬底、第一电极、第二电极和第三电极;湿度敏感材料、衬底、第一电极、第二电极和第三电极构成三电极结构的湿度敏感型电容--电阻复合结构;湿度敏感模块、微处理单元MCU、测量电路模块、存储模块通过层叠封装技术集成在一片衬底材料上得到湿度传感器芯片;第一电极、第二电极之间构成湿度敏感电阻,第一电极、第三电极之间构成湿度敏感电容,第二电极、第三电极之间也构成湿度敏感电容,且第一电极、第二电极和第三电极互相之间为同一湿度敏感材料;如图2所示。In some embodiments, the sensor chip includes a humidity sensitive module, a measurement circuit module, a micro-processing unit MCU, and a storage module; that is, compared with the foregoing embodiments, an independent storage module is added, and the storage module is used to store standard parameters library; in such an embodiment: the humidity sensitive module includes a humidity sensitive material, a substrate, a first electrode, a second electrode and a third electrode; the humidity sensitive material, the substrate, the first electrode, the second electrode and the third electrode A humidity-sensitive capacitor-resistor composite structure that constitutes a three-electrode structure; a humidity-sensitive module, a micro-processing unit MCU, a measurement circuit module, and a storage module are integrated on a piece of substrate material by stacking packaging technology to obtain a humidity sensor chip; the first electrode, A humidity-sensitive resistor is formed between the second electrodes, a humidity-sensitive capacitor is formed between the first electrode and the third electrode, a humidity-sensitive capacitor is also formed between the second electrode and the third electrode, and the first electrode, the second electrode and the third electrode The electrodes are of the same humidity sensitive material as each other; as shown in Figure 2.

湿度敏感材料制备在衬底的正面,第一电极、第二电极均位于湿度敏感材料的上面,第三电极位于衬底材料的背面;第一电极、第二电极为一对互相围绕而不接触的、其间具有湿度敏感材料的双电极;第一电极、湿度敏感材料、衬底、第三电极构成电容器结构,湿度敏感材料、衬底为电容器的复合介电层;第二电极、湿度敏感材料、衬底、第三电极也构成电容器结构,湿度敏感材料、衬底为电容器的介电层;第一电极、湿度敏感材料、第二电极构成湿度敏感电阻(湿敏电阻)结构,湿度敏感材料作为湿度敏感电阻的湿度敏感材料;The humidity-sensitive material is prepared on the front side of the substrate, the first electrode and the second electrode are located on the top of the humidity-sensitive material, and the third electrode is located on the backside of the substrate material; the first electrode and the second electrode are a pair of surrounding each other without contact The first electrode, the humidity-sensitive material, the substrate, and the third electrode constitute a capacitor structure, and the humidity-sensitive material and the substrate are the composite dielectric layer of the capacitor; the second electrode, the humidity-sensitive material , The substrate and the third electrode also constitute the capacitor structure, the humidity sensitive material and the substrate are the dielectric layers of the capacitor; the first electrode, the humidity sensitive material and the second electrode constitute a humidity sensitive resistor (humidity sensitive resistor) structure, and the humidity sensitive material Humidity sensitive material as humidity sensitive resistor;

在这样的实施方式中,所述存储模块中存储有标准参数库,所述标准参数库中同时记录有所述湿度敏感模块的谐振频率和湿度敏感电阻值分别随着湿度敏感材料含水率变化而变化的标准曲线;In such an embodiment, a standard parameter library is stored in the storage module, and the resonant frequency of the humidity sensitive module and the humidity sensitive resistance value of the humidity sensitive module are recorded in the standard parameter library as the moisture content of the humidity sensitive material changes, respectively. changing standard curve;

微处理单元MCU根据测量得到的所述湿度敏感模块的谐振频率和湿度敏感电阻值,对标准参数库中记录的所述湿度敏感模块的谐振频率和湿度敏感电阻值分别随着湿度敏感材料含水率变化而变化的标准曲线,分别进行索引、比较、运算,分别得到环境空气湿度参考值a和环境空气湿度参考值b。According to the measured resonant frequency and humidity sensitive resistance value of the humidity sensitive module, the microprocessor unit MCU changes the resonant frequency and humidity sensitive resistance value of the humidity sensitive module recorded in the standard parameter library with the moisture content of the humidity sensitive material, respectively. The standard curve that changes with the change is indexed, compared and calculated respectively, and the reference value a of the ambient air humidity and the reference value b of the ambient air humidity are obtained respectively.

在所有的实施方式中,优选地,所述衬底是具备压电效应的晶体材料。In all embodiments, preferably, the substrate is a crystalline material with piezoelectric effect.

在所有的实施方式中,优选地,第一电极、第二电极为一对叉指电极,如图1和2所示,或一对螺旋形电极,如图3所示,或一对回形电极;In all embodiments, preferably, the first electrode and the second electrode are a pair of interdigitated electrodes, as shown in Figures 1 and 2, or a pair of spiral electrodes, as shown in Figure 3, or a pair of looped electrodes electrode;

在所有的实施方式中,优选地,第一电极、第二电极、第三电极为金电极或银电极;In all embodiments, preferably, the first electrode, the second electrode and the third electrode are gold electrodes or silver electrodes;

在有些实施方式中,第一电极、第二电极、第三电极均采用蒸镀工艺制备得到;In some embodiments, the first electrode, the second electrode, and the third electrode are all prepared by an evaporation process;

在有些实施方式中,第一电极、第二电极、第三电极均采用溅射工艺制备得到;In some embodiments, the first electrode, the second electrode, and the third electrode are all prepared by a sputtering process;

在有些实施方式中,第一电极、第二电极、第三电极均采用射频磁控溅射工艺制备得到;In some embodiments, the first electrode, the second electrode, and the third electrode are all prepared by a radio frequency magnetron sputtering process;

在所有的实施方式中,优选地,湿度敏感材料为疏水性材料,以避免湿敏传感层在较高的湿度条件下由于溶解在较高湿度下的水中而剥离;In all embodiments, preferably, the humidity-sensitive material is a hydrophobic material to avoid peeling of the humidity-sensitive sensing layer due to dissolving in water at higher humidity under higher humidity conditions;

作为一种示例,所述湿度敏感材料的前驱体溶液为:由氧化亚铜、氧化锌、4-环氧丙烷氧基咔唑(CAS号:53-95-2)、苯甲酸苯酯组成的疏水性油状混合物;As an example, the precursor solution of the humidity-sensitive material is: a solution consisting of cuprous oxide, zinc oxide, 4-epoxypropoxycarbazole (CAS number: 53-95-2), phenyl benzoate Hydrophobic oily mixture;

优选地,氧化亚铜为1-10μm的颗粒状氧化亚铜,氧化锌为0.5-5μm的棒状氧化锌;Preferably, the cuprous oxide is granular cuprous oxide of 1-10 μm, and the zinc oxide is rod-shaped zinc oxide of 0.5-5 μm;

优选地,氧化亚铜的重量份为5-8%,氧化锌的重量份为4-7%,4-环氧丙烷氧基咔唑的重量份为3-6%,余量为苯甲酸苯酯。Preferably, the weight part of cuprous oxide is 5-8%, the weight part of zinc oxide is 4-7%, the weight part of 4-epoxypropoxycarbazole is 3-6%, and the balance is benzene benzoate ester.

在这里,利用了苯甲酸苯酯、4-环氧丙烷氧基咔唑的疏水性。氧化亚铜,氧化锌则作为湿度敏感材料。Here, the hydrophobicity of phenyl benzoate and 4-epoxypropanoloxycarbazole is utilized. Cuprous oxide and zinc oxide are used as moisture sensitive materials.

所述湿度敏感模块制备方法如下:The preparation method of the humidity sensitive module is as follows:

(a)制备湿度敏感材料的前驱体溶液:在苯甲酸苯酯中加入重量份为5-8%的氧化亚铜、重量份为4-7%的氧化锌、重量份为4-8%的4-环氧丙烷氧基咔唑;将混合物加热至90-110℃,采用磁力搅拌器进行强力搅拌30-60分钟,形成疏水性油状混合液;(a) Preparation of the precursor solution of the humidity-sensitive material: adding 5-8% by weight of cuprous oxide, 4-7% by weight of zinc oxide, and 4-8% by weight of phenyl benzoate 4-propylene oxide alkoxycarbazole; the mixture is heated to 90-110°C, and vigorously stirred with a magnetic stirrer for 30-60 minutes to form a hydrophobic oily liquid mixture;

(b)湿度敏感材料制备在衬底的正面:将步骤(a)得到的疏水性油状混合液在90-110℃条件下旋涂在衬底的正面,然后自然冷却至室温;(b) Preparation of humidity-sensitive material on the front side of the substrate: spin-coating the hydrophobic oily mixed solution obtained in step (a) on the front side of the substrate at 90-110° C., and then naturally cool to room temperature;

(c)采用蒸镀工艺或溅射工艺或射频磁控溅射工艺在衬底的背面制备得到第三电极;(c) adopting evaporation process or sputtering process or radio frequency magnetron sputtering process to prepare the third electrode on the backside of the substrate;

(d)采用掩膜版,通过蒸镀工艺或溅射工艺或射频磁控溅射工艺在衬底的正面的湿度敏感材料上制备得到第一电极和第二电极;(d) using a mask to prepare a first electrode and a second electrode on the humidity-sensitive material on the front side of the substrate by an evaporation process or a sputtering process or a radio frequency magnetron sputtering process;

可选地,步骤(c)调整到步骤(a)之前。Optionally, step (c) is adjusted before step (a).

所述湿度敏感模块包括湿度敏感材料、衬底、上电极和下电极;所述湿度敏感材料为:在苯甲酸苯酯中加入重量份为5-8%的氧化亚铜、重量份为4-7%的氧化锌、重量份为4-8%的4-环氧丙烷氧基咔唑,在90-110℃下进行强力搅拌后形成的混合物。The humidity-sensitive module includes a humidity-sensitive material, a substrate, an upper electrode and a lower electrode; the humidity-sensitive material is: adding 5-8% by weight of cuprous oxide to phenyl benzoate, and 4-8% by weight of cuprous oxide. 7% of zinc oxide, 4-8% by weight of 4-epoxypropanoloxycarbazole, and a mixture formed after vigorous stirring at 90-110°C.

在所有的实施方式中,优选地,第一电极、第二电极之间设置一个由微处理单元MCU控制的电子开关,在测量所述湿度敏感模块的谐振频率时,所述电子开关由微处理单元MCU控制处于导通状态,使得第一电极、第二电极短路连接,其余时间所述电子开关则保持断开状态;优选地,所述电子开关为一对PMOS/NMOS构成的传输门;传输门的控制端连接至微处理单元MCU。In all embodiments, preferably, an electronic switch controlled by a microprocessor unit MCU is arranged between the first electrode and the second electrode. When measuring the resonant frequency of the humidity sensitive module, the electronic switch is controlled by the microprocessor. The unit MCU is controlled to be in an on state, so that the first electrode and the second electrode are short-circuited and connected, and the electronic switch is kept in an off state during the rest of the time; preferably, the electronic switch is a transmission gate composed of a pair of PMOS/NMOS; The control terminal of the door is connected to the microprocessor unit MCU.

如图4所示,K为电子开关,电子开关受MCU控制;第一电极1、湿度敏感材料4、石英薄片5、第三电极3构成电容器结构C1;第二电极2、湿度敏感材料4、石英薄片5、第三电极3构成电容器结构C2;第一电极1、湿度敏感材料4、第二电极2构成湿度敏感电阻R。As shown in Figure 4, K is an electronic switch, which is controlled by the MCU; the first electrode 1, the humidity-sensitive material 4, the quartz sheet 5, and the third electrode 3 form a capacitor structure C1; the second electrode 2, the humidity-sensitive material 4, The quartz sheet 5 and the third electrode 3 constitute the capacitor structure C2; the first electrode 1, the humidity sensitive material 4, and the second electrode 2 constitute the humidity sensitive resistor R.

在所有的实施方式中,优选地,湿度敏感模块中还集成有温度传感器,温度传感器连接至测量电路模块,测量电路模块将测量得到的湿度敏感材料的温度值传输至微处理单元MCU,微处理单元MCU根据所述温度值对测量得到的环境空气湿度值进行修正。对于利用温度对湿度测量值进行修正,可通过经验公式进行,本领域技术人员有能力根据本发明的描述去实现,在此不再赘述。In all embodiments, preferably, a temperature sensor is further integrated in the humidity sensitive module, the temperature sensor is connected to the measurement circuit module, and the measurement circuit module transmits the measured temperature value of the humidity sensitive material to the microprocessor unit MCU, and the microprocessor processes The unit MCU corrects the measured ambient air humidity value according to the temperature value. The correction of the humidity measurement value by using temperature can be performed through an empirical formula, and those skilled in the art are capable of realizing it according to the description of the present invention, which will not be repeated here.

在所有的实施方式中,测量电路模块用于在测量时执行如下两个测量操作,且两个测量操作的先后次序不作限制:In all embodiments, the measurement circuit module is configured to perform the following two measurement operations during measurement, and the sequence of the two measurement operations is not limited:

(1)测量电路模块向湿度敏感模块的第一电极和第三电极施加预设频率范围的、频率变化的交流激励信号,测量湿度敏感模块的谐振频率;如图4所示,即交流激励信号加在A和G两点之间,电子开关K处于断开状态;或,(1) The measurement circuit module applies an AC excitation signal with a preset frequency range and a frequency change to the first electrode and the third electrode of the humidity sensitive module to measure the resonant frequency of the humidity sensitive module; as shown in Figure 4, the AC excitation signal Added between points A and G, the electronic switch K is in an open state; or,

测量电路模块向湿度敏感模块的第二电极和第三电极施加预设频率范围的、频率变化的交流激励信号,测量湿度敏感模块的谐振频率;如图4所示,即交流激励信号加在B和G两点之间,电子开关K处于断开状态;The measurement circuit module applies an AC excitation signal with a preset frequency range and a frequency change to the second electrode and the third electrode of the humidity sensitive module to measure the resonant frequency of the humidity sensitive module; as shown in Figure 4, that is, the AC excitation signal is added to B Between the two points of G and G, the electronic switch K is in an off state;

或,优选地,所述电子开关由微处理单元MCU控制处于导通状态,使得第一电极、第8/9页二电极短路连接,测量电路模块向湿度敏感模块的第一电极、第二电极和第三电极施加预设频率范围的、频率变化的交流激励信号,测量湿度敏感模块的谐振频率;如图4所示,此时左边的湿度敏感模块的等效电路就变为右边的简单电容C形式,即电子开关K处于导通状态,交流激励信号相当于加在A和G两点之间,C相当于C1和C2并联的等效电容。Or, preferably, the electronic switch is controlled by the micro-processing unit MCU to be in an on state, so that the first electrode and the two electrodes on page 8/9 are short-circuited, and the measurement circuit module is connected to the first electrode and the second electrode of the humidity sensitive module. Apply an AC excitation signal with a preset frequency range and a frequency change to the third electrode to measure the resonant frequency of the humidity sensitive module; as shown in Figure 4, the equivalent circuit of the humidity sensitive module on the left becomes the simple capacitor on the right Form C, that is, the electronic switch K is in a conducting state, the AC excitation signal is equivalent to being added between points A and G, and C is equivalent to the equivalent capacitance of C1 and C2 in parallel.

(2)所述电子开关由微处理单元MCU控制处于断开状态,使得第一电极、第二电极断开连接,测量电路模块向湿度敏感模块的第一电极和第二电极施加直流电信号,测量湿度敏感模块的湿度敏感电阻(湿敏电阻)值;此时,C1和C2相当于电路断路,对湿度敏感电阻(湿敏电阻)值的测量不构成任何影响。(2) The electronic switch is controlled by the micro-processing unit MCU to be in an off state, so that the first electrode and the second electrode are disconnected, and the measurement circuit module applies a direct current signal to the first electrode and the second electrode of the humidity sensitive module to measure Humidity sensitive resistance (humidity sensitive resistance) value of the humidity sensitive module; at this time, C1 and C2 are equivalent to circuit breakage, and do not have any influence on the measurement of the humidity sensitive resistance (humidity sensitive resistance) value.

所述谐振频率和所述湿度敏感电阻值随着湿度敏感材料含水率变化而变化;The resonant frequency and the humidity-sensitive resistance value vary with the moisture content of the humidity-sensitive material;

所述测量电路模块将测量得到的测量湿度敏感模块的谐振频率和湿度敏感电阻(湿敏电阻)值传输至微处理单元MCU;The measurement circuit module transmits the measured resonant frequency and humidity sensitive resistance (humidity sensitive resistance) value of the measured humidity sensitive module to the microprocessor unit MCU;

微处理单元MCU根据谐振频率和湿度敏感电阻值分别计算得到两个环境空气湿度参考值,即环境空气湿度参考值a和环境空气湿度参考值b;The microprocessor unit MCU calculates and obtains two ambient air humidity reference values respectively according to the resonance frequency and the humidity sensitive resistance value, namely the ambient air humidity reference value a and the ambient air humidity reference value b;

优选地,环境空气湿度参考值a和环境空气湿度参考值b的均方值或平均值作为结果输出。具体计算细节请参阅本发明人的两件在先专利申请(CN2019111875813、CN2019113061843)。Preferably, the mean square value or average value of the ambient air humidity reference value a and the ambient air humidity reference value b is output as the result. For specific calculation details, please refer to two prior patent applications (CN2019111875813, CN2019113061843) of the inventor.

在一些实施方式中,湿度传感器芯片还能够自我诊断、更换提醒,具体地:In some embodiments, the humidity sensor chip is also capable of self-diagnosis and replacement reminders, specifically:

微处理单元MCU包括判别功能模块,判别功能模块执行如下判别功能:The micro-processing unit MCU includes a discrimination function module, and the discrimination function module performs the following discrimination functions:

微处理单元MCU中的判别功能模块根据计算得到环境空气湿度参考值a和环境空气湿度参考值b进行自我诊断、判别湿度传感器芯片是否存在故障、或性能老化,具体实现为:The discrimination function module in the micro-processing unit MCU performs self-diagnosis according to the ambient air humidity reference value a and ambient air humidity reference value b obtained by calculation, and determines whether the humidity sensor chip is faulty or has performance aging. The specific implementation is as follows:

预设第一判别阈值,计算前述环境空气湿度参考值a和环境空气湿度参考值b的差的绝对值;判别环境空气湿度参考值a和环境空气湿度参考值b的差的绝对值是否大于预设的第一判别阈值;若所述差的绝对值小于预设的第一判别阈值,则:环境空气湿度参考值a和环境空气湿度参考值b的均方根值或平均值作为结果输出,且表示湿度传感器芯片工作正常;Preset the first discrimination threshold, calculate the absolute value of the difference between the aforementioned ambient air humidity reference value a and the ambient air humidity reference value b; determine whether the absolute value of the difference between the ambient air humidity reference value a and the ambient air humidity reference value b is greater than the predetermined value. The set first judgment threshold; if the absolute value of the difference is less than the preset first judgment threshold, then: the root mean square value or average value of the ambient air humidity reference value a and the ambient air humidity reference value b is output as the result, And it means that the humidity sensor chip is working normally;

若所述差的绝对值等于或大于预设的第一判别阈值,则:微处理单元MCU进一步输出警告信息,警告信息表示为湿度传感器芯片存在故障,或性能已老化,提示需要检修或更换;If the absolute value of the difference is equal to or greater than the preset first discrimination threshold, then: the micro-processing unit MCU further outputs a warning message, the warning message indicates that the humidity sensor chip is faulty, or the performance is aging, indicating that maintenance or replacement is required;

优选地,微处理单元MCU中的判别功能模块还预设有第二判别阈值,所述第二判别阈值大于所述第一判别阈值;若所述差的绝对值小于预设的第一判别阈值,则:环境空气湿度参考值a和环境空气湿度参考值b的均方根值或平均值作为结果输出,且表示湿度传感器芯片工作正常;若所述差的绝对值等于或大于预设的第一判别阈值且小于第二判别阈值,则:微处理单元MCU输出警告信息,警告信息表示为湿度传感器芯片可能存在故障,或性能已轻微老化,推荐检修或更换;Preferably, the discrimination function module in the micro-processing unit MCU is further preset with a second discrimination threshold, and the second discrimination threshold is greater than the first discrimination threshold; if the absolute value of the difference is smaller than the preset first discrimination threshold , then: the root mean square value or average value of the ambient air humidity reference value a and the ambient air humidity reference value b is output as the result, and it indicates that the humidity sensor chip is working normally; if the absolute value of the difference is equal to or greater than the preset first The first judgment threshold is smaller than the second judgment threshold, then: the microprocessor unit MCU outputs a warning message, and the warning message indicates that the humidity sensor chip may be faulty, or the performance has been slightly aged, and it is recommended to repair or replace it;

若所述差的绝对值等于或大于预设的第二判别阈值,则:微处理单元MCU输出错误信息,错误信息表示为湿度传感器芯片存在故障,或性能已严重老化,必须检修或更换。If the absolute value of the difference is equal to or greater than the preset second discrimination threshold, the micro-processing unit MCU outputs an error message indicating that the humidity sensor chip is faulty, or the performance has deteriorated seriously and must be repaired or replaced.

作为一个示例,预设第一判别阈值为1%RH,第二判别阈值为2%RH;在某次测量9/9页中,微处理单元MCU依据湿度敏感模块的物理性质A随着含水率变化而变化的标准曲线而计算得到的环境空气湿度参考值a为23.27%RH,依据湿度敏感模块的物理性质B随着含水率变化而变化的标准曲线而计算得到的环境空气湿度参考值b为24.11%RH,则,环境空气湿度参考值a与环境空气湿度参考值b的差的绝对值为24.11%RH-23.27%RH=0.84%RH,As an example, the preset first judgment threshold is 1%RH, and the second judgment threshold is 2%RH; in a certain measurement page 9/9, the microprocessor unit MCU changes the moisture content according to the physical property A of the humidity sensitive module The ambient air humidity reference value a calculated by the standard curve that changes with the change is 23.27%RH, and the ambient air humidity reference value b calculated according to the standard curve of the physical property B of the humidity sensitive module that changes with the change of the moisture content is 24.11%RH, then, the absolute value of the difference between the ambient air humidity reference value a and the ambient air humidity reference value b is 24.11%RH-23.27%RH=0.84%RH,

微处理单元MCU中的判别功能模块经过比较,得出:差的绝对值0.84%RH小于预设的第一判别阈值1%RH,因此,表示湿度传感器芯片工作正常,且输出a与b的均方根值23.69%RH作为最终结果输出环境空气湿度值。The discrimination function module in the micro-processing unit MCU is compared, and it is concluded that the absolute value of the difference 0.84%RH is less than the preset first discrimination threshold 1%RH. Therefore, it means that the humidity sensor chip is working normally, and the average output of a and b is The root value of 23.69%RH is used as the final result to output the ambient air humidity value.

作为一个示例,预设第一判别阈值为1%RH,第二判别阈值为2%RH;在某次测量中,微处理单元MCU依据湿度敏感模块的物理性质A随着含水率变化而变化的标准曲线而计算得到的环境空气湿度为42.69%RH,依据湿度敏感模块的物理性质B随着含水率变化而变化的标准曲线而计算得到的环境空气湿度为44.57%RH,则,环境空气湿度参考值a与环境空气湿度参考值b的差的绝对值为44.57%RH-42.69%RH=1.88%RH,微处理单元MCU中的判别功能模块经过比较,得出:差的绝对值1.88%RH大于预设的第一判别阈值1%RH,但小于第二判别阈值2%RH,因此,微处理单元MCU输出警告信息,警告信息表示为湿度传感器芯片可能存在故障,或性能已轻微老化,推荐检修或更换。As an example, the preset first discrimination threshold is 1%RH, and the second discrimination threshold is 2%RH; in a certain measurement, the micro-processing unit MCU changes according to the physical property A of the humidity sensitive module as the moisture content changes. The ambient air humidity calculated from the standard curve is 42.69%RH, and the ambient air humidity calculated according to the standard curve that the physical property B of the humidity sensitive module changes with the moisture content is 44.57%RH, then, the ambient air humidity reference The absolute value of the difference between the value a and the reference value b of the ambient air humidity is 44.57%RH-42.69%RH=1.88%RH. After comparing the discriminant function module in the micro-processing unit MCU, it is concluded that the absolute value of the difference 1.88%RH is greater than The preset first judgment threshold is 1%RH, but it is less than the second judgment threshold 2%RH. Therefore, the micro-processing unit MCU outputs a warning message. The warning message indicates that the humidity sensor chip may be faulty, or the performance has been slightly aged, and maintenance is recommended. or replace.

作为再一个示例,预设第一判别阈值为0.5%RH,第二判别阈值为1%RH;在某次测量中,微处理单元MCU依据湿度敏感模块的物理性质A随着含水率变化而变化的标准曲线而计算得到的环境空气湿度为42.69%RH,依据湿度敏感模块的物理性质B随着含水率变化而变化的标准曲线而计算得到的环境空气湿度为44.57%RH,则,环境空气湿度参考值a与环境空气湿度参考值b的差的绝对值为44.57%RH-42.69%RH=1.88%RH,微处理单元MCU中的判别功能模块经过比较,得出:差的绝对值1.88%RH大于预设的第二判别阈值1%RH,因此,微处理单元MCU输出错误信息,错误信息表示为湿度传感器芯片存在故障,或性能已严重老化,必须检修或更换。As another example, the preset first discrimination threshold is 0.5% RH, and the second discrimination threshold is 1% RH; in a certain measurement, the micro-processing unit MCU changes with the moisture content according to the physical property A of the humidity sensitive module The ambient air humidity calculated according to the standard curve is 42.69%RH, and the ambient air humidity calculated according to the standard curve of the physical property B of the humidity sensitive module changing with the moisture content is 44.57%RH, then, the ambient air humidity The absolute value of the difference between the reference value a and the ambient air humidity reference value b is 44.57%RH-42.69%RH=1.88%RH. After comparing the discriminant function module in the micro-processing unit MCU, it is obtained: the absolute value of the difference is 1.88%RH It is greater than the preset second discrimination threshold 1%RH. Therefore, the micro-processing unit MCU outputs an error message, which indicates that the humidity sensor chip is faulty, or the performance has deteriorated seriously and must be repaired or replaced.

由上面的三个示例可知,微处理单元MCU是否输出警告信息或错误信息,还是提示正常工作并输出最终计算结果,取决于预设第一判别阈值和第二判别阈值的大小。It can be seen from the above three examples that whether the micro-processing unit MCU outputs warning information or error information, or prompts normal operation and outputs the final calculation result, depends on the preset first and second judgment thresholds.

而第一判别阈值和第二判别阈值的大小的设置,取决于终端用户对湿度传感器芯片性能劣化的容忍度。若终端用户对湿度传感器芯片性能劣化的容忍度较低,存在精确测量的需求,则可预设较小的第一判别阈值和第二判别阈值;反之,若终端用户对湿度传感器芯片性能劣化的容忍度较高,不需要特别精确的测量需求,则可预设相对大的第一判别阈值和第二判别阈值。另一方面,预设第一判别阈值和第二判别阈值的大小,也会影响到湿度传感器芯片的在役时间。预设第一判别阈值和第二判别阈值较小,则湿度传感器芯片的在役时间就较短;预设第一判别阈值和第二判别阈值较大,则湿度传感器芯片的在役时间就可以长一些。这完全取决于终端客户对于测量准确度、使用成本的需求。The setting of the first judgment threshold and the second judgment threshold depends on the tolerance of the end user to the performance degradation of the humidity sensor chip. If the end user has a low tolerance for the performance degradation of the humidity sensor chip and there is a need for accurate measurement, a smaller first and second judgment thresholds can be preset; If the tolerance is high, and no particularly precise measurement requirements are required, relatively large first discrimination thresholds and second discrimination thresholds may be preset. On the other hand, the preset size of the first discrimination threshold and the second discrimination threshold will also affect the in-service time of the humidity sensor chip. If the preset first judgment threshold and the second judgment threshold are smaller, the in-service time of the humidity sensor chip will be shorter; if the preset first and second judgment thresholds are larger, the in-service time of the humidity sensor chip will be sufficient. longer. It all depends on the end customer's requirements for measurement accuracy and cost of use.

在说明书中所记载的各个实施方式中,所采取的技术手段是互不冲突的,即可以自由组合,构建成不同的技术方案。这些可能的排列组合出的技术方案,均视为已经记载在本申请的原始申请文件中。除非作出了特别声明,某些技术手段在技术上是矛盾的,不能在同一个技术方案中并存。以上所述,仅为本发明较佳的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,可轻易想到的变化或替换,都应涵盖在本发明的保护范围之内。In each embodiment described in the specification, the adopted technical means are not in conflict with each other, that is, they can be freely combined to form different technical solutions. The technical solutions obtained by these possible permutations and combinations are deemed to have been recorded in the original application documents of the present application. Unless a special statement is made, some technical means are technically contradictory and cannot coexist in the same technical solution. The above description is only a preferred embodiment of the present invention, but the protection scope of the present invention is not limited to this. Substitutions should be covered within the protection scope of the present invention.

Claims (15)

1.一种无存储模块的湿度传感器芯片,其特征在于:1. a humidity sensor chip without a storage module, characterized in that: 传感器芯片包括湿度敏感模块、测量电路模块、微处理单元MCU;不含有独立的存储模块;The sensor chip includes a humidity sensitive module, a measurement circuit module, and a microprocessor unit MCU; it does not contain an independent storage module; 湿度敏感模块包括湿度敏感材料、衬底、第一电极、第二电极和第三电极;湿度敏感材料、衬底、第一电极、第二电极和第三电极构成三电极结构的湿度敏感型电容-电阻复合结构;The humidity-sensitive module includes a humidity-sensitive material, a substrate, a first electrode, a second electrode, and a third electrode; the humidity-sensitive material, the substrate, the first electrode, the second electrode, and the third electrode form a humidity-sensitive capacitor with a three-electrode structure - Resistive composite structure; 第一电极、第二电极之间构成湿度敏感电阻,第一电极、第三电极之间构成湿度敏感电容,第二电极、第三电极之间也构成湿度敏感电容,且第一电极、第二电极和第三电极互相之间为同一湿度敏感材料;A humidity-sensitive resistor is formed between the first electrode and the second electrode, a humidity-sensitive capacitor is formed between the first electrode and the third electrode, a humidity-sensitive capacitor is also formed between the second electrode and the third electrode, and the first electrode and the second electrode are also formed. The electrode and the third electrode are the same humidity sensitive material; 湿度敏感材料制备在衬底的正面,第一电极、第二电极均位于湿度敏感材料的上面,第三电极位于衬底材料的背面;The humidity sensitive material is prepared on the front side of the substrate, the first electrode and the second electrode are both located on the top of the humidity sensitive material, and the third electrode is located on the back side of the substrate material; 第一电极、湿度敏感材料、衬底、第三电极构成电容器结构,湿度敏感材料、衬底为电容器的复合介电层;第二电极、湿度敏感材料、衬底、第三电极也构成电容器结构,湿度敏感材料、衬底为电容器的介电层;第一电极、湿度敏感材料、第二电极构成湿度敏感电阻结构,湿度敏感材料作为湿度敏感电阻的湿度敏感材料;衬底是具备压电效应的晶体材料;The first electrode, the humidity sensitive material, the substrate and the third electrode constitute a capacitor structure, and the humidity sensitive material and the substrate are the composite dielectric layer of the capacitor; the second electrode, the humidity sensitive material, the substrate and the third electrode also constitute the capacitor structure , the humidity-sensitive material and the substrate are the dielectric layers of the capacitor; the first electrode, the humidity-sensitive material, and the second electrode form a humidity-sensitive resistor structure, and the humidity-sensitive material is used as the humidity-sensitive material of the humidity-sensitive resistor; the substrate is a humidity-sensitive material with piezoelectric effect crystalline material; 第一电极、第二电极之间设置一个由微处理单元MCU控制的电子开关,在测量湿度敏感模块的谐振频率时,电子开关由微处理单元MCU控制处于导通状态,使得第一电极、第二电极短路连接,其余时间电子开关则保持断开状态。An electronic switch controlled by the micro-processing unit MCU is arranged between the first electrode and the second electrode. When measuring the resonant frequency of the humidity sensitive module, the electronic switch is controlled by the micro-processing unit MCU to be in a conducting state, so that the first electrode and the second electrode are in a conducting state. The two electrodes are short-circuited, and the electronic switch remains disconnected for the rest of the time. 2.如权利要求1所述的湿度传感器芯片,其特征在于:2. The humidity sensor chip according to claim 1, wherein: 湿度敏感材料为疏水性材料。The moisture sensitive material is a hydrophobic material. 3.如权利要求1所述的湿度传感器芯片,其特征在于:3. The humidity sensor chip of claim 1, wherein: 第一电极、第二电极为一对互相围绕而不接触的、其间具有湿度敏感材料的双电极;第一电极、第二电极为一对叉指电极,或一对螺旋形电极,或一对回形电极。The first electrode and the second electrode are a pair of double electrodes that surround each other without contact, and have humidity-sensitive material in between; the first electrode and the second electrode are a pair of interdigitated electrodes, or a pair of spiral electrodes, or a pair of Circular electrode. 4.如权利要求1所述的湿度传感器芯片,其特征在于:4. The humidity sensor chip of claim 1, wherein: 第一电极、第二电极、第三电极为金电极或银电极。The first electrode, the second electrode and the third electrode are gold electrodes or silver electrodes. 5.如权利要求4所述的湿度传感器芯片,其特征在于:第一电极、第二电极、第三电极均采用蒸镀工艺或溅射工艺制备得到。5 . The humidity sensor chip according to claim 4 , wherein the first electrode, the second electrode and the third electrode are all prepared by an evaporation process or a sputtering process. 6 . 6.如权利要求1所述的湿度传感器芯片,其特征在于:湿度敏感材料为有机材料,或无机材料,或有机/无机复合材料。6. The humidity sensor chip according to claim 1, wherein the humidity sensitive material is an organic material, an inorganic material, or an organic/inorganic composite material. 7.如权利要求1所述的湿度传感器芯片,其特征在于:衬底是石英薄片。7. The humidity sensor chip of claim 1, wherein the substrate is a quartz flake. 8.如权利要求1所述的湿度传感器芯片,其特征在于:电子开关为一对PMOS/NMOS构成的传输门;传输门的控制端连接至微处理单元MCU。8 . The humidity sensor chip according to claim 1 , wherein the electronic switch is a transmission gate composed of a pair of PMOS/NMOS; the control end of the transmission gate is connected to the micro-processing unit MCU. 9 . 9.如权利要求1-4任一项所述的湿度传感器芯片,其特征在于:9. The humidity sensor chip according to any one of claims 1-4, wherein: 湿度敏感模块中还集成有温度传感器,温度传感器连接至测量电路模块,测量电路模块将测量得到的湿度敏感材料的温度值传输至微处理单元MCU,微处理单元MCU根据温度值对测量得到的环境空气湿度值进行修正。A temperature sensor is also integrated in the humidity sensitive module. The temperature sensor is connected to the measurement circuit module. The measurement circuit module transmits the measured temperature value of the humidity sensitive material to the micro-processing unit MCU. The air humidity value is corrected. 10.如权利要求1-4任一项所述的湿度传感器芯片,其特征在于:10. The humidity sensor chip according to any one of claims 1-4, wherein: 测量电路模块用于在测量时执行如下两个测量操作,且两个测量操作的先后次序不作限制:The measurement circuit module is used to perform the following two measurement operations during measurement, and the sequence of the two measurement operations is not limited: (1)测量电路模块向湿度敏感模块的第一电极和第三电极施加预设频率范围的、频率变化的交流激励信号,测量湿度敏感模块的谐振频率;或,(1) The measurement circuit module applies an AC excitation signal of a preset frequency range and a frequency change to the first electrode and the third electrode of the humidity sensitive module to measure the resonant frequency of the humidity sensitive module; or, 测量电路模块向湿度敏感模块的第二电极和第三电极施加预设频率范围的、频率变化的交流激励信号,测量湿度敏感模块的谐振频率;The measurement circuit module applies an AC excitation signal with a preset frequency range and a frequency change to the second electrode and the third electrode of the humidity sensitive module, and measures the resonance frequency of the humidity sensitive module; (2)电子开关由微处理单元MCU控制处于断开状态,使得第一电极、第二电极断开连接,测量电路模块向湿度敏感模块的第一电极和第二电极施加直流电信号,测量湿度敏感模块的湿度敏感电阻值;(2) The electronic switch is controlled by the micro-processing unit MCU to be in a disconnected state, so that the first electrode and the second electrode are disconnected, and the measurement circuit module applies a direct current signal to the first electrode and the second electrode of the humidity sensitive module to measure the humidity sensitive module. The humidity sensitive resistance value of the module; 谐振频率和湿度敏感电阻值随着湿度敏感材料含水率变化而变化;The resonance frequency and the humidity sensitive resistance value change with the moisture content of the humidity sensitive material; 测量电路模块将测量得到的测量湿度敏感模块的谐振频率和湿度敏感电阻值传输至微处理单元MCU;The measurement circuit module transmits the measured resonance frequency and humidity sensitive resistance value of the measured humidity sensitive module to the microprocessor unit MCU; 微处理单元MCU根据谐振频率和湿度敏感电阻值分别计算得到两个环境空气湿度参考值,即环境空气湿度参考值a和环境空气湿度参考值b。The microprocessor unit MCU calculates and obtains two ambient air humidity reference values, namely, ambient air humidity reference value a and ambient air humidity reference value b, respectively, according to the resonant frequency and the humidity sensitive resistance value. 11.如权利要求10所述的湿度传感器芯片,其特征在于:11. The humidity sensor chip according to claim 10, wherein: 电子开关由微处理单元MCU控制处于导通状态,使得第一电极、第二电极短路连接,测量电路模块向湿度敏感模块的第一电极、第二电极和第三电极施加预设频率范围的、频率变化的交流激 励信号,测量湿度敏感模块的谐振频率。The electronic switch is controlled by the micro-processing unit MCU to be in an on state, so that the first electrode and the second electrode are short-circuited, and the measurement circuit module applies a predetermined frequency range, Frequency-varying AC excitation signal to measure the resonant frequency of the humidity-sensitive module. 12.如权利要求11所述的湿度传感器芯片,其特征在于:环境空气湿度参考值a和环境空气湿度参考值b的均方值或平均值作为结果输出。12 . The humidity sensor chip according to claim 11 , wherein the mean square value or average value of the ambient air humidity reference value a and the ambient air humidity reference value b is output as the result. 13 . 13.如权利要求10所述的湿度传感器芯片,其特征在于:13. The humidity sensor chip of claim 10, wherein: 微处理单元MCU根据预设公式,由谐振频率和湿度敏感电阻值分别计算得到两个环境空气湿度参考值,即环境空气湿度参考值a和环境空气湿度参考值b。The micro-processing unit MCU calculates two ambient air humidity reference values, ie, ambient air humidity reference value a and ambient air humidity reference value b, respectively, by calculating the resonant frequency and the humidity-sensitive resistance value according to the preset formula. 14.如权利要求10所述的湿度传感器芯片,其特征在于:湿度传感器芯片自我诊断、更换提醒,具体地:微处理单元MCU包括判别功能模块,判别功能模块执行如下判别功能:14. The humidity sensor chip according to claim 10, characterized in that: the humidity sensor chip self-diagnoses and reminds of replacement, specifically: the micro-processing unit MCU comprises a judging function module, and the judging function module performs the following judging function: 微处理单元MCU中的判别功能模块根据计算得到环境空气湿度参考值a和环境空气湿度参考值b进行自我诊断、判别湿度传感器芯片是否存在故障、或性能老化,具体实现为:预设第一判别阈值,计算前述环境空气湿度参考值a和环境空气湿度参考值b的差的绝对值;The discrimination function module in the micro-processing unit MCU performs self-diagnosis according to the ambient air humidity reference value a and ambient air humidity reference value b obtained by calculation, and determines whether the humidity sensor chip is faulty or has performance aging, which is specifically implemented as follows: preset first discrimination Threshold, calculate the absolute value of the difference between the aforementioned ambient air humidity reference value a and ambient air humidity reference value b; 判别环境空气湿度参考值a和环境空气湿度参考值b的差的绝对值是否大于预设的第一判别阈值;若差的绝对值小于预设的第一判别阈值,则:Determine whether the absolute value of the difference between the ambient air humidity reference value a and the ambient air humidity reference value b is greater than the preset first determination threshold; if the absolute value of the difference is smaller than the preset first determination threshold, then: 环境空气湿度参考值a和环境空气湿度参考值b的均方根值或平均值作为结果输出,且表示湿度传感器芯片工作正常;The root mean square value or average value of the ambient air humidity reference value a and the ambient air humidity reference value b is output as the result, and it indicates that the humidity sensor chip works normally; 若差的绝对值等于或大于预设的第一判别阈值,则:If the absolute value of the difference is equal to or greater than the preset first discrimination threshold, then: 微处理单元MCU进一步输出警告信息,警告信息表示为湿度传感器芯片存在故障,或性能已老化,提示需要检修或更换。The microprocessor unit MCU further outputs a warning message, which indicates that the humidity sensor chip is faulty, or its performance is aging, indicating that it needs to be repaired or replaced. 15.如权利要求14所述的湿度传感器芯片,其特征在于:微处理单元MCU中的判别功能模块还预设有第二判别阈值,第二判别阈值大于第一判别阈值;15. The humidity sensor chip according to claim 14, wherein the discrimination function module in the micro-processing unit MCU is further preset with a second discrimination threshold, and the second discrimination threshold is greater than the first discrimination threshold; 若差的绝对值小于预设的第一判别阈值,则:If the absolute value of the difference is less than the preset first discrimination threshold, then: 环境空气湿度参考值a和环境空气湿度参考值b的均方根值或平均值作为结果输出,且表示湿度传感器芯片工作正常;The root mean square value or average value of the ambient air humidity reference value a and the ambient air humidity reference value b is output as the result, and it indicates that the humidity sensor chip works normally; 若差的绝对值等于或大于预设的第一判别阈值且小于第二判别阈值,则:If the absolute value of the difference is equal to or greater than the preset first judgment threshold and less than the second judgment threshold, then: 微处理单元MCU输出警告信息,警告信息表示为湿度传感器芯片可能存在故障,或性能已轻微老化,推荐检修或更换;The microprocessor unit MCU outputs a warning message, which indicates that the humidity sensor chip may be faulty, or the performance has been slightly aged, and it is recommended to repair or replace it; 若差的绝对值等于或大于预设的第二判别阈值,则:If the absolute value of the difference is equal to or greater than the preset second discrimination threshold, then: 微处理单元MCU输出错误信息,错误信息表示为湿度传感器芯片存在故障,或性能已严重老化,必须检修或更换。The micro-processing unit MCU outputs an error message, which indicates that the humidity sensor chip is faulty, or the performance has been seriously aged, and must be repaired or replaced.
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CN113189149A (en) * 2021-03-30 2021-07-30 华帝股份有限公司 Humidity detection method and device applying same
CN113702448B (en) * 2021-07-29 2022-09-27 南京农业大学 Wearable plant leaf surface moisture content monitoring devices
CN114034741A (en) * 2021-11-09 2022-02-11 南方电网科学研究院有限责任公司 SF6On-line monitoring method for gas moisture content in circuit breaker
US20240175833A1 (en) * 2022-03-01 2024-05-30 Sensylink Microelectronics Inc. Drift-Free Humidity Sensor And Calibration Method Thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101308110A (en) * 2008-07-11 2008-11-19 中国电子科技集团公司第四十九研究所 Low-power consumption double module integrated humidity sensitive chip with heating function and its manufacture method
CN101532975A (en) * 2008-03-12 2009-09-16 中国科学院电子学研究所 Constant temperature measurement-type micro humidity sensor and producing method thereof
CN102095784A (en) * 2011-02-16 2011-06-15 西安交通大学 Carbon nano tube film three-electrode gas humidity sensor and humidity measuring method thereof
CN105319245A (en) * 2015-06-16 2016-02-10 中国计量学院 Flexible organic film capacitive sensor capable of sensing humidity and gas simultaneously and manufacturing method thereof
CN107290241A (en) * 2017-07-31 2017-10-24 成都信息工程大学 A kind of QCM humidity sensors and preparation method thereof
CN108414603A (en) * 2018-01-29 2018-08-17 江南大学 A kind of humidity sensor and preparation method thereof based on electric double layer thin film transistor (TFT)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01240848A (en) * 1988-03-22 1989-09-26 Matsushita Electric Ind Co Ltd Humidity-sensitive element
CN1182386C (en) * 2002-05-24 2004-12-29 杨慕杰 Compound polymer resistor type film humidity-sensitive element and its making process
EP2275805A1 (en) * 2009-07-16 2011-01-19 Acreo AB Moister sensor
CN103645219B (en) * 2013-11-30 2016-11-23 江苏物联网研究发展中心 Multrirange CMOS MEMS capacitive humidity sensor
CN203940940U (en) * 2014-06-13 2014-11-12 江苏多维科技有限公司 A kind of sensor chip for many physical quantities
CN104914138A (en) * 2015-07-03 2015-09-16 深圳市共进电子股份有限公司 Humidity sensor, humidity sensor array and preparation method thereof
TWI601954B (en) * 2016-09-09 2017-10-11 長庚大學 Capacitor-based fluid sensing unit and the method of use
US10317356B2 (en) * 2017-03-13 2019-06-11 King Abdulaziz University Copper(II) oxide and cellulose acetate composite resistance-based humidity sensor
CN108489541B (en) * 2018-03-21 2020-11-03 北京中硕众联智能电子科技有限公司 Artificial skin and method for detecting pressure, temperature and humidity thereof
EP3576503A1 (en) * 2018-05-31 2019-12-04 Airbus Operations, S.L. Implementation process of a humidity control sensor for 3d-printing of a smart tool and process for manufacturing a humidity control sensor via 3d-printing technology
CN110108762A (en) * 2019-04-08 2019-08-09 浙江省北大信息技术高等研究院 A kind of humidity sensor and its manufacturing method
CN110286150A (en) * 2019-06-21 2019-09-27 电子科技大学 A kind of flexible humidity electronic sensor and preparation method thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101532975A (en) * 2008-03-12 2009-09-16 中国科学院电子学研究所 Constant temperature measurement-type micro humidity sensor and producing method thereof
CN101308110A (en) * 2008-07-11 2008-11-19 中国电子科技集团公司第四十九研究所 Low-power consumption double module integrated humidity sensitive chip with heating function and its manufacture method
CN102095784A (en) * 2011-02-16 2011-06-15 西安交通大学 Carbon nano tube film three-electrode gas humidity sensor and humidity measuring method thereof
CN105319245A (en) * 2015-06-16 2016-02-10 中国计量学院 Flexible organic film capacitive sensor capable of sensing humidity and gas simultaneously and manufacturing method thereof
CN107290241A (en) * 2017-07-31 2017-10-24 成都信息工程大学 A kind of QCM humidity sensors and preparation method thereof
CN108414603A (en) * 2018-01-29 2018-08-17 江南大学 A kind of humidity sensor and preparation method thereof based on electric double layer thin film transistor (TFT)

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
电极结构对高分子电阻型湿度传感器性能的影响;刘若望;《材料科学与工程学报》;20110620;第29卷(第03期);第437-440页 *

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