CN104378929B - Circuit board production method - Google Patents
Circuit board production method Download PDFInfo
- Publication number
- CN104378929B CN104378929B CN201410715291.2A CN201410715291A CN104378929B CN 104378929 B CN104378929 B CN 104378929B CN 201410715291 A CN201410715291 A CN 201410715291A CN 104378929 B CN104378929 B CN 104378929B
- Authority
- CN
- China
- Prior art keywords
- blind hole
- circuit board
- core plate
- area
- distribution map
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a circuit board production method. The method includes comparing the area of a blind hole of a circuit board to be produced with a standard value, and judging whether the blind hole of the circuit board is filled additionally as required before lamination or not; if so, producing a first core board, and drilling a hole in the first core board in a penetrating manner; producing a second core board; filling the hole of the first core board; performing lamination on the first and second core boards through the prepreg, and obtaining the circuit board with the blind hole. The circuit board comprises the first core board and the second core board, and the blind hole is formed in the first core board. By the aid of the method, whether the blind hole of the circuit board is filled additionally before lamination or not can be judged rapidly and accurately, the production quality and efficiency of the circuit board with the blind hole can be improved, and the cost is reduced.
Description
Technical field
The present invention relates to the making field of circuit board, more particularly to a kind of preparation method of the circuit board with blind hole.
Background technology
As board design is more and more intensive, the design of blind hole is also more and more.In process blind hole need by
Resin filling is full, and to prevent in follow-up microetch or etching process, being opened a way in hole is occurred by liquid medicine corrosion in blind hole, makes circuit
Plate cannot meet most basic electrical connection.In the high temperature and high pressure environment of circuit board laminates, for being bonded core plate half
Cured sheets can produce gummosis enter blind hole in, but part prepreg due to mobility it is poor, it is impossible to blind hole is clogged by resin
Full, this part blind hole needs individually to do filling holes with resin.
In current industry, for judging whether blind hole needs individually to do filling holes with resin, there is no preferable method.Do not enter typically
Whole circuit boards are directly individually done filling holes with resin by row judgement, cause circuit board making cost increase；Otherwise it is exactly decision rule
It is unreasonable, the blind hole that can not judge to need individually to do filling holes with resin is easily caused, make to exist on circuit board finished product and do not filled out by resin
Full blind hole is gorged, circuit board is ultimately resulted in and quality problems is occurred.
The content of the invention
The embodiment of the present invention proposes a kind of preparation method of circuit board, can be quickly and accurately blind on decision circuit plate
Whether hole needs before being laminated separately consent, so that the quality of production and efficiency of blind hole circuit board are improved, and reduces cost.
The embodiment of the present invention provides a kind of preparation method of circuit board, including：
S1, the area and standard value of the blind hole on circuit board to be produced are contrasted, judged on the circuit board
Whether blind hole needs separately is clogged before being laminated；The circuit board to be produced includes the first core plate and the second core plate, blind hole
Positioned on first core plate；
S2, if it is determined that blind hole on the circuit board needs separately to clog before being laminated, then perform step S3, S4, S5
And S6；Otherwise perform step S3, S4 and S6；
S3, the first core plate of making, drill on first core plate, and first core plate is run through in the hole；
S4, the second core plate of making；
S5, the hole on first core plate is clogged；
S6, first core plate and second core plate are laminated using prepreg, are made the electricity with blind hole
Road plate.
Further, the step S1 is specifically included：
Obtain the blind hole distribution map of circuit board to be produced；The blind hole distribution map includes N number of blind hole, N >=1；It is described N number of
Blind hole is located on first core plate；
M determinating area, M >=1 are marked on the blind hole distribution map；
The gross area of the blind hole in each determinating area is calculated, and maximum is selected from the M gross area；
The maximum and standard value are contrasted, if the maximum is more than the standard value, described the is judged
Blind hole on one core plate needs separately to clog before being laminated, otherwise judges that the blind hole on first core plate need not be in lamination
Separately clog before.
Wherein, the blind hole distribution map is to carry out wires design to circuit theory diagrams using electronic design automation software
Afterwards, the PCB routing figure for obtaining, positional information of the PCB routing figure comprising the blind hole on first core plate；Or
Person, the blind hole distribution map is in the manufacturing process of the circuit board, to be carried out by the plate face circuit to first core plate
Take pictures or scan, and the PCB routing figure obtained after being positioned to blind hole, the PCB routing figure includes described the
The positional information of the blind hole on one core plate.
In one embodiment, it is described to mark M determinating area on the blind hole distribution map, specifically include：Respectively
Centered on each blind hole on the blind hole distribution map, M determinating area is marked on the blind hole distribution map, make M to sentence
Determine region to be corresponded with N number of blind hole respectively, N=M.
In another embodiment, it is described to mark M determinating area on the blind hole distribution map, specifically include：Will
The blind hole distribution map is divided equally into M determinating area.
Further, the area of the determinating area is S, and the depth capacity of the blind hole on first core plate is H, institute
Stating standard value refers to：When being laminated to first core plate and second core plate using prepreg, area is the half of S
The depth that the gummosis of cured sheets can be filled up on first core plate is the maximum of the gross area of the blind hole of H.
The preparation method of circuit board provided in an embodiment of the present invention, blind hole electricity is made using prepreg be laminated
Before the plate of road, first the area of the blind hole on circuit board to be produced and standard value are contrasted, judged on the circuit board
Whether blind hole needs separately is clogged before being laminated.If desired, then illustrate that the blind hole on the circuit board can not be laminated process
In the gummosis of prepreg fill up, then, it is necessary to before being laminated first to the circuit board during circuit board is made
On blind hole separately clog so that ensure circuit board finished product blind hole clogged by resin it is full, improve circuit board production matter
Amount.If need not, illustrate the blind hole on the circuit board can be laminated during the gummosis of prepreg fill up, then
In the manufacturing process of circuit board, the operation to the other consent of circuit board is not performed before being laminated, so that formation efficiency is improved,
And reduce production cost.
Brief description of the drawings
Fig. 1 is the schematic flow sheet of one embodiment of the preparation method of the circuit board that the present invention is provided；
Fig. 2 is that the flow of one embodiment of the consent determination step in the preparation method of the circuit board that the present invention is provided is shown
It is intended to；
Fig. 3 is the structure of one embodiment of the circuit board applied in the preparation method of the circuit board that the present invention is provided
Figure；
Fig. 4 be the present invention provide consent determination step in set up determinating area one embodiment schematic diagram；
Fig. 5 be the present invention provide consent determination step in set up determinating area another embodiment schematic diagram.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
It is the schematic flow sheet of one embodiment of the preparation method of the circuit board that the present invention is provided referring to Fig. 1.
The present invention provides a kind of preparation method of circuit board, including step S1 to S6, specific as follows：
S1, the area and standard value of the blind hole on circuit board to be produced are contrasted, judged on the circuit board
Whether blind hole needs separately is clogged before being laminated；The circuit board to be produced includes the first core plate and the second core plate, blind hole
Positioned on first core plate；
S2, if it is determined that blind hole on the circuit board needs separately to clog before being laminated, then perform step S3, S4, S5
And S6；Otherwise perform step S3, S4 and S6；
S3, the first core plate of making, drill on first core plate, and first core plate is run through in the hole；
Wherein, first core plate is lamina or multi-layer sheet.
S4, the second core plate of making；
Wherein, second core plate is lamina or multi-layer sheet.
S5, the hole on first core plate is clogged；
Specifically, in step s 5, the hole on first core plate can be clogged using resin.
S6, first core plate and second core plate are laminated using prepreg, are made the electricity with blind hole
Road plate.
Wherein, step S1 be laminated execution before being made blind hole circuit board using prepreg, for judging to treat
Whether the blind hole on the circuit board of making needs separately is clogged before being laminated, for convenience of describing, step S1 is referred to as into " plug below
Hole determination step ".
With reference to Fig. 2 to Fig. 5, to the consent determination step in the preparation method of circuit board provided in an embodiment of the present invention
It is described in detail.
Referring to Fig. 2, be the circuit board that the present invention is provided preparation method in consent determination step one embodiment
Schematic flow sheet.
The consent determination step of consent determination step provided in an embodiment of the present invention, including step S101 to S104, specifically
It is as follows：
S101, the blind hole distribution map for obtaining circuit board to be produced；The blind hole distribution map includes N number of blind hole, N >=1；Institute
Stating circuit board to be produced includes the first core plate and the second core plate, and N number of blind hole is located on first core plate.
Specifically, the blind hole distribution map can be that circuit theory diagrams are connected up using electronic design automation software
After design, and the PCB routing figure for obtaining, position letter of the PCB routing figure comprising the blind hole on first core plate
Breath.
Additionally, the blind hole distribution map can also be in the manufacturing process of the circuit board, by first core
The plate face circuit of plate is taken pictures or is scanned, and the PCB routing figure obtained after being positioned to blind hole, the printed board
Positional information of the wiring diagram comprising the blind hole on first core plate.
That is, consent determination step provided in an embodiment of the present invention, can be before circuit board is made or in system
During making circuit board, whether wiring diagram according to the circuit board needs before being laminated come the blind hole judged on the circuit board
Separately consent.
S102, on the blind hole distribution map mark M determinating area, M >=1.
In step s 102, the method for setting up determinating area includes at least two embodiments.In one embodiment, it is above-mentioned
Step S102 is specifically included：Respectively centered on each blind hole on the blind hole distribution map, drawn on the blind hole distribution map
Go out M determinating area, M determinating area is corresponded with N number of blind hole respectively, N=M.
In another embodiment, above-mentioned steps S102 is specifically included：The blind hole distribution map is divided equally into M to sentence
Determine region.
During specific implementation, the determinating area is circular, oval, regular polygon or irregular polygon.Wherein,
The regular polygon is the equal polygon of each length of side, such as equilateral triangle, square, regular pentagon, regular hexagon etc.；
The irregular polygon be the unequal polygon of each length of side, and the length of side be straight line or curve, such as it is trapezoidal etc..
Preferably, the determinating area is square, and the length of side is 16mm.
It should be pointed out that for those skilled in the art, under the premise without departing from the principles of the invention,
The length of side can be set as other numerical value, or the determinating area is set to other shapes, these improvement are also considered as this hair
Bright protection domain.
The gross area of S103, the blind hole calculated in each determinating area, and maximum is selected from the M gross area.
During specific implementation, in step s 103, can be calculated every according to the positional information of the blind hole on blind hole distribution map
The area of individual blind hole, then the gross area of blind hole in each determinating area is calculated respectively.Then, then by way of contrast,
Draw the maximum in the M gross area.
S104, the maximum and standard value are contrasted, if the maximum is more than the standard value, judged institute
Stating blind hole on the first core plate needs separately to clog before being laminated, otherwise judges that blind hole on first core plate need not be
Separately clogged before lamination.
In process for manufacturing circuit board, when being pressed to multilayer circuit board using prepreg, prepreg is because high
Warm high pressure and the gummosis that produces can enter in blind hole, be analyzed by the gummosis ability to prepreg in lamination process,
The prepreg of a certain size can be counted in lamination process, the size of the blind hole to be filled up of its gummosis.
Assuming that the area of the determinating area is S, the depth capacity of the blind hole on first core plate is H, the standard
Value refers to：When being laminated to first core plate and second core plate using prepreg, area is the prepreg of S
The depth that can fill up on first core plate of gummosis be the maximum of the gross area of the blind hole of H.
The maximum of the gross area of the blind hole in the determinating area that the embodiment of the present invention will draw in above-mentioned steps S103, with
Standard value is contrasted, if the maximum is more than the standard value, judges that the blind hole on the circuit board can not be laminated
During the gummosis of prepreg fill up, it is necessary to separately be clogged to the blind hole on the circuit board before being laminated；If described
Maximum be less than or equal to the standard value, then judge the blind hole on the circuit board can be laminated during prepreg
Gummosis fill up, it is not necessary to the blind hole on the circuit board is separately clogged before being laminated.
The embodiment of the present invention can be quickly and accurately on decision circuit plate blind hole whether need separately to fill in before being laminated
Hole, if it is not required, then in the manufacturing process of circuit board, do not perform the operation to the other consent of circuit board before being laminated,
So as to improve formation efficiency, and reduce production cost；If it is required, then in the manufacturing process of circuit board, holding before being laminated
The operation gone to the other consent of circuit board, so as to ensure that the blind hole of circuit board finished product is clogged full, raising circuit board by resin
The quality of production.
Referring to Fig. 3, be the circuit board that the present invention is provided preparation method applied in circuit board one embodiment
Structure chart.
A kind of circuit board (circuit board i.e. to be produced) for needing to carry out consent judgement of embodiment of the present invention offer, including the
One core plate 201 and the second core plate 202.Offered on first core plate 201 first blind hole A1, the second blind hole A2, the 3rd blind hole A3 and
4th blind hole A4.In the manufacturing process of circuit board, the first core plate 201 and the second core plate 202 are needed by 203 layers of prepreg
Consolidation.
It should be noted that foregoing circuit plate may be used also in addition to being the two-ply for including the first core plate and the second core plate
To be three ply board, four laminates etc., and above-mentioned first core plate and the second core plate can be lamina, or multi-layer sheet.
Referring to Fig. 4, the schematic diagram of one embodiment of determinating area is set up in the consent determination step for being present invention offer.
Blind hole distribution map is the blind hole distribution map of the circuit board for needing to carry out consent judgement, has 4 on the blind hole distribution map
Individual blind hole, respectively the first blind hole A1, the second blind hole A2, the 3rd blind hole A3 and the 4th blind hole A4, above-mentioned 4 blind holes are all in place
In on the first core plate 201.
Respectively centered on each blind hole on blind hole distribution map, 4 determinating areas are marked on blind hole distribution map, make 4
Individual determinating area is corresponded with 4 blind holes respectively, specific as follows：Centered on the first blind hole A1, drawn on blind hole distribution map
Go out the first determinating area B1；Centered on the second blind hole A2, the second determinating area B2 is marked on blind hole distribution map；It is blind with the 3rd
Centered on the A3 of hole, the 3rd determinating area B3 is marked on blind hole distribution map；Centered on the 4th blind hole A4, on blind hole distribution map
Mark the 4th determinating area B4.
Positional information according to each blind hole is calculated, and the area for drawing the first blind hole A1 is SA1, the second blind hole A2's
Area is SA2, the area of the 3rd blind hole A3 is SA3, the area of the 4th blind hole A4 is SA4。
Assuming that the gross area of the blind hole in the first determinating area B1 is SB1, then SB1=SA1。
Assuming that the gross area of the blind hole in the second determinating area B2 is SB2, then SB2=SA2+SA3。
Assuming that the gross area of the blind hole in the 3rd determinating area B3 is SB3, then SB3=SA2+SA3。
Assuming that the gross area of the blind hole in the 4th determinating area B4 is SB4, then SB4=SA4。
Due to SB2=SB3, therefore maximum in 4 gross areas is SB2And SB3。
By by SB2(or SB3) and standard value be compared, if SB2Less than standard value, then the whole on decision circuit plate
Or part blind hole can not be laminated during the gummosis of prepreg fill up, it is necessary to before being laminated on the circuit board
All blind holes separately clog；If SB2Less than or equal to standard value, then judge that all blind holes on the circuit board being capable of tegillum
The gummosis of the prepreg during pressure fills up, it is not necessary to the blind hole on the circuit board is separately clogged before being laminated.
Referring to Fig. 5, the signal of another embodiment of determinating area is set up in the consent determination step for being present invention offer
Figure.
Blind hole distribution map is the blind hole distribution map of the circuit board for needing to carry out consent judgement, has 4 on the blind hole distribution map
Individual blind hole, respectively the first blind hole A1, the second blind hole A2, the 3rd blind hole A3 and the 4th blind hole A4, above-mentioned 4 blind holes are all in place
In on the first core plate 201.
Blind hole distribution map is divided equally into 4 determinating areas, including the first determinating area C1, the second determinating area C2,
3rd determinating area C3 and the 4th determinating area C4.
Positional information according to each blind hole is calculated, and the area for drawing the first blind hole A1 is SA1, the second blind hole A2's
Area is SA2, the area of the 3rd blind hole A3 is SA3, the area of the 4th blind hole A4 is SA4。
Assuming that the gross area of the blind hole in the first determinating area C1 is SC1, then SC1=SA1。
Assuming that the gross area of the blind hole in the second determinating area C2 is SC2, then SC2=SA2+SA3。
Assuming that the gross area of the blind hole in the 3rd determinating area C3 is SC3, then SC3=0.
Assuming that the gross area of the blind hole in the 4th determinating area C4 is SC4, then SC4=SA4。
Therefore the maximum in 4 gross areas is SC3。
By by SC3It is compared with standard value, if SC3It is less than standard value, then all or part of on decision circuit plate
The gummosis of prepreg during blind hole can not be laminated is filled up, it is necessary to before being laminated to all blind on the circuit board
Separately clog in hole；If the SC3Less than or equal to standard value, then judge all blind holes on the circuit board can tegillum press through
The gummosis of the prepreg in journey fills up, it is not necessary to the blind hole on the circuit board is separately clogged before being laminated.
It should be noted that in 4 determinating areas in the present embodiment, not comprising blind in each determinating area
Hole.
It should be further stated that, above-described embodiment is only illustrated by taking M=4 as an example.It should be pointed out that for this technology
For the those of ordinary skill in field, under the premise without departing from the principles of the invention, M can be set as other numerical value, and correspondence
Modification standard value, can equally realize that consent judges, these improvement are also considered as protection scope of the present invention.
Only with circuit board as doubling plate, determinating area does not represent this to above-described embodiment to be illustrated as a example by square
Invention can be only applied to above-described embodiment.In the middle of specific implementation, circuit board can also be the multi-layer sheet such as three ply board, four laminates,
Determinating area can also be the other shapes such as circle, ellipse, regular pentagon.
The preparation method of circuit board provided in an embodiment of the present invention, blind hole electricity is made using prepreg be laminated
Before the plate of road, first the area of the blind hole on circuit board to be produced and standard value are contrasted, judged on the circuit board
Whether blind hole needs separately is clogged before being laminated.If desired, then illustrate that the blind hole on the circuit board can not be laminated process
In the gummosis of prepreg fill up, then, it is necessary to before being laminated first to the circuit board during circuit board is made
On blind hole separately clog so that ensure circuit board finished product blind hole clogged by resin it is full, improve circuit board production matter
Amount.If need not, illustrate the blind hole on the circuit board can be laminated during the gummosis of prepreg fill up, then
In the manufacturing process of circuit board, the operation to the other consent of circuit board is not performed before being laminated, so that formation efficiency is improved,
And reduce production cost.
One of ordinary skill in the art will appreciate that all or part of flow in realizing above-described embodiment method, can be
The hardware of correlation is instructed to complete by computer program, described program can be stored in a computer read/write memory medium
In, the program is upon execution, it may include such as the flow of the embodiment of above-mentioned each method.Wherein, described storage medium can be magnetic
Dish, CD, read-only memory (Read-Only Memory, ROM) or random access memory (Random Access
Memory, RAM) etc..
The above is the preferred embodiment of the present invention, it is noted that for those skilled in the art
For, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications are also considered as
Protection scope of the present invention.
Claims (8)
1. a kind of preparation method of circuit board, it is characterised in that including：
S1, the area and standard value of the blind hole on circuit board to be produced are contrasted, judged the blind hole on the circuit board
Whether need separately to clog before being laminated；The circuit board to be produced includes the first core plate and the second core plate, and blind hole is located at
On first core plate；
S2, if it is determined that blind hole on the circuit board needs separately to clog before being laminated, then perform step S3, S4, S5 and S6；
Otherwise perform step S3, S4 and S6；
S3, the first core plate of making, drill on first core plate, and first core plate is run through in the hole；
S4, the second core plate of making；
S5, the hole on first core plate is clogged；
S6, first core plate and second core plate are laminated using prepreg, are made the circuit board with blind hole；
Wherein：The step S1 is specifically included：
Obtain the blind hole distribution map of circuit board to be produced；The blind hole distribution map includes N number of blind hole, N >=1；N number of blind hole
Positioned on first core plate；
M determinating area, M >=1 are marked on the blind hole distribution map；
The gross area of the blind hole in each determinating area is calculated, and maximum is selected from the M gross area；
The maximum and standard value are contrasted, if the maximum is more than the standard value, first core is judged
Blind hole on plate needs separately to clog before being laminated, otherwise judges that the blind hole on first core plate need not be before being laminated
Separately clog；
Wherein, when the area of the determinating area is S, when the depth capacity of the blind hole on first core plate is H, the standard
Value refers to：When being laminated to first core plate and second core plate using prepreg, area is the prepreg of S
The depth that can fill up on first core plate of gummosis be the maximum of the gross area of the blind hole of H.
2. the preparation method of circuit board as claimed in claim 1, it is characterised in that the blind hole distribution map is set using electronics
After meter automated software carries out wires design to circuit theory diagrams, and the PCB routing figure for obtaining, the PCB routing figure
Positional information comprising the blind hole on first core plate；
Or, the blind hole distribution map is in the manufacturing process of the circuit board, by the plate face line to first core plate
Road is taken pictures or is scanned, and the PCB routing figure obtained after being positioned to blind hole, and the PCB routing figure is included
The positional information of the blind hole on first core plate.
3. the preparation method of circuit board as claimed in claim 2, it is characterised in that described to be marked on the blind hole distribution map
M determinating area, specifically includes：
Respectively centered on each blind hole on the blind hole distribution map, M determinating area is marked on the blind hole distribution map,
M determinating area is set to be corresponded with N number of blind hole respectively, N=M.
4. the preparation method of circuit board as claimed in claim 2, it is characterised in that described to be marked on the blind hole distribution map
M determinating area, specifically includes：
The blind hole distribution map is divided equally into M determinating area.
5. the preparation method of circuit board as claimed in claim 1, it is characterised in that the determinating area for it is circular, oval,
Regular polygon or irregular polygon.
6. the preparation method of circuit board as claimed in claim 1, it is characterised in that first core plate is lamina or many
Laminate.
7. the preparation method of circuit board as claimed in claim 1, it is characterised in that second core plate is lamina or many
Laminate.
8. the preparation method of circuit board as claimed in claim 1, it is characterised in that in the step S5, using resin pair
Clogged in hole on first core plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410715291.2A CN104378929B (en) | 2014-11-28 | 2014-11-28 | Circuit board production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410715291.2A CN104378929B (en) | 2014-11-28 | 2014-11-28 | Circuit board production method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104378929A CN104378929A (en) | 2015-02-25 |
| CN104378929B true CN104378929B (en) | 2017-05-24 |
Family
ID=52557486
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410715291.2A Active CN104378929B (en) | 2014-11-28 | 2014-11-28 | Circuit board production method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104378929B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112305409A (en) * | 2020-10-30 | 2021-02-02 | 珠海太川云社区技术股份有限公司 | Circuit board testing device and manufacturing method thereof |
| CN114430628B (en) * | 2022-01-25 | 2023-07-21 | 金禄电子科技股份有限公司 | Multilayer circuit board and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7396885B2 (en) * | 2001-09-27 | 2008-07-08 | San-Ei Kagaku Co., Ltd. | Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board |
| CN101720175A (en) * | 2009-11-24 | 2010-06-02 | 深圳崇达多层线路板有限公司 | Manufacturing method of multi-layer circuit board with high aspect ratio blind hole and multi-layer circuit board |
-
2014
- 2014-11-28 CN CN201410715291.2A patent/CN104378929B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7396885B2 (en) * | 2001-09-27 | 2008-07-08 | San-Ei Kagaku Co., Ltd. | Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board |
| CN101720175A (en) * | 2009-11-24 | 2010-06-02 | 深圳崇达多层线路板有限公司 | Manufacturing method of multi-layer circuit board with high aspect ratio blind hole and multi-layer circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104378929A (en) | 2015-02-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102098884B (en) | Standard laminated plate and manufacturing method thereof | |
| CN103533748B (en) | Laser alignment testing structure and method for high-density interconnected printed circuit board | |
| CN100596253C (en) | Method for detecting inter-layer displacement of multi-layer flexible printed circuit board | |
| CN103179812A (en) | Manufacturing method of high-order multistage HDI (High Density Interconnection) printed circuit board | |
| CN103533741A (en) | Double-side thick copper plate and manufacturing method thereof | |
| CN107509302A (en) | A kind of multi-functional wiring board detection module and detection method | |
| CN106572600A (en) | Novel PCB linear expansion control method | |
| CN104378929B (en) | Circuit board production method | |
| CN104582330B (en) | The production method of the ATE plates of buried blind via structure | |
| CN105517349B (en) | Back drill detection method | |
| CN104113995A (en) | Printed circuit board manufacturing method and printed circuit board | |
| CN102917554A (en) | Manufacturing method of multilayer double-copper conductor plate | |
| CN104918423B (en) | A kind of method for manufacturing circuit board of detectable internal layer orifice ring | |
| CN104519681A (en) | Manufacturing method of ultralarge line-card type printed circuit boards with large layer number and high alignment degree | |
| CN109152241A (en) | A method of making edges of boards metal half bore | |
| US7925999B2 (en) | Method of modifying vias connection of printed circuit boards | |
| CN103582324A (en) | Press fitting and glue filling method and equipment for circuit board | |
| CN107613674A (en) | The preparation method of one stepped PCB board | |
| CN104363719B (en) | A kind of preparation method of the circuit board with blind hole | |
| CN102111961A (en) | Method for detecting process capability of inner and outer layers of circuit board | |
| CN110933849A (en) | Method for manufacturing small half-hole circuit board | |
| CN105072824B (en) | A kind of preparation method of embedded lines plate | |
| CN104411121B (en) | The decision method and device of consent | |
| CN110493963A (en) | A kind of pcb board intelligence edge sealing setting method | |
| CN104411120B (en) | Hole filling judgment method and device for blind holes of circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |