CN104357051B - 一种荧光材料及其制备方法,和发光装置 - Google Patents
一种荧光材料及其制备方法,和发光装置 Download PDFInfo
- Publication number
- CN104357051B CN104357051B CN201410627319.7A CN201410627319A CN104357051B CN 104357051 B CN104357051 B CN 104357051B CN 201410627319 A CN201410627319 A CN 201410627319A CN 104357051 B CN104357051 B CN 104357051B
- Authority
- CN
- China
- Prior art keywords
- fluorescent material
- light
- compound
- salt containing
- fluorescent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000463 material Substances 0.000 title claims abstract description 85
- 238000002360 preparation method Methods 0.000 title abstract description 15
- 239000000126 substance Substances 0.000 claims abstract description 24
- 230000005284 excitation Effects 0.000 claims abstract description 22
- 150000001875 compounds Chemical class 0.000 claims abstract description 13
- 150000003839 salts Chemical class 0.000 claims abstract description 13
- 229910052688 Gadolinium Inorganic materials 0.000 claims abstract description 11
- 229910052744 lithium Inorganic materials 0.000 claims abstract description 11
- 229910052727 yttrium Inorganic materials 0.000 claims abstract description 11
- 229910052788 barium Inorganic materials 0.000 claims abstract description 10
- 229910052790 beryllium Inorganic materials 0.000 claims abstract description 10
- 229910052791 calcium Inorganic materials 0.000 claims abstract description 10
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 10
- 229910052700 potassium Inorganic materials 0.000 claims abstract description 10
- 229910052708 sodium Inorganic materials 0.000 claims abstract description 10
- 229910052712 strontium Inorganic materials 0.000 claims abstract description 10
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 10
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 9
- 229910052693 Europium Inorganic materials 0.000 claims abstract description 6
- 230000004907 flux Effects 0.000 claims abstract description 6
- 229910052684 Cerium Inorganic materials 0.000 claims abstract description 5
- 229910052771 Terbium Inorganic materials 0.000 claims abstract description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000001301 oxygen Substances 0.000 claims abstract description 5
- 229910052692 Dysprosium Inorganic materials 0.000 claims abstract description 4
- 229910052689 Holmium Inorganic materials 0.000 claims abstract description 4
- 229910052779 Neodymium Inorganic materials 0.000 claims abstract description 4
- 229910052772 Samarium Inorganic materials 0.000 claims abstract description 4
- 229910052775 Thulium Inorganic materials 0.000 claims abstract description 4
- 229910052769 Ytterbium Inorganic materials 0.000 claims abstract description 4
- 229910052746 lanthanum Inorganic materials 0.000 claims abstract description 4
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims abstract description 4
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 4
- 229910052733 gallium Inorganic materials 0.000 claims abstract 2
- 239000002994 raw material Substances 0.000 claims description 19
- 239000000203 mixture Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 13
- 238000000295 emission spectrum Methods 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 8
- 238000001354 calcination Methods 0.000 claims description 4
- 238000003837 high-temperature calcination Methods 0.000 claims description 4
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- 229910052793 cadmium Inorganic materials 0.000 claims description 2
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims description 2
- 238000010298 pulverizing process Methods 0.000 claims description 2
- 238000007873 sieving Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000002425 crystallisation Methods 0.000 abstract description 2
- 230000008025 crystallization Effects 0.000 abstract description 2
- 238000000227 grinding Methods 0.000 abstract 1
- 229910017855 NH 4 F Inorganic materials 0.000 description 16
- 238000009877 rendering Methods 0.000 description 11
- 230000003595 spectral effect Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000000843 powder Substances 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 238000004020 luminiscence type Methods 0.000 description 6
- -1 rare earth cerium ions Chemical class 0.000 description 6
- 229910052736 halogen Inorganic materials 0.000 description 5
- 229910052573 porcelain Inorganic materials 0.000 description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 229910002601 GaN Inorganic materials 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000695 excitation spectrum Methods 0.000 description 2
- 239000002223 garnet Substances 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 2
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052784 alkaline earth metal Inorganic materials 0.000 description 1
- 150000001342 alkaline earth metals Chemical class 0.000 description 1
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 1
- 229910052789 astatine Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 230000004298 light response Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- GZCRRIHWUXGPOV-UHFFFAOYSA-N terbium atom Chemical compound [Tb] GZCRRIHWUXGPOV-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Luminescent Compositions (AREA)
Abstract
Description
实施例 | 主要原材料 |
6 | SrCO3,Li2CO3,Eu2O3,NH4F |
7 | BaCO3,Li2CO3,Eu2O3,NH4F |
8 | SrCO3,Li2CO3,Eu2O3,NH4F,SmO3 |
9 | BaCO3,Li2CO3,Eu2O3,NH4F,SmO3 |
10 | Na2CO3,Eu2O3,MoO3,LiF |
11 | K2CO3,Eu2O3,MoO3,LiF |
12 | CaCO3,Eu2O3,NH4Cl,K2CO3 |
13 | BaCO3Eu2O3,NH4Br,Li2CO3 |
14 | Na2CO3,Eu2O3,MoO3,NH4F |
15 | K2CO3,Eu2O3,MoO3,NH4F |
16 | Li2CO3,NH4Cl,Eu2O3,MoO3 |
17 | Na2CO3,Eu2O3,WO3,LiF |
18 | K2CO3,Eu2O3,WO3,LiF |
19 | K2CO3,Eu2O3,WO3,NH4Br |
20 | CaCO3,Eu2O3,WO3,NaF |
21 | BaCO3,,Eu2O3,WO3,Li2CO3,LiF |
22 | SrCO3,Eu2O3,WO3,Li2CO3,LiF |
23 | CaCO3,Eu2O3,WO3,MoO3,NaF |
24 | BaCO3,Eu2O3,WO3,Li2CO3,MoO3,LiF |
25 | SrCO3,Eu2O3,WO3,Li2CO3,MoO3,LiF |
26 | BaCO3,Eu2O3,WO3,Li2CO3,MoO3,LiF,SmO3 |
27 | BaCO3,Eu2O3,WO3,Li2CO3,MoO3,LiF,SmO3,Dy2O3 |
28 | SrCO3,Eu2O3,WO3,Li2CO3,MoO3,LiF,Pr6O11 |
29 | BaCO3,Eu2O3,WO3,Li2CO3,MoO3,NH4Cl, |
30 | BaCO3,Eu2O3,WO3,Li2CO3,MoO3,NH4Br |
31 | Gd2O3,Eu2O3,MoO3 |
32 | Gd2O3,Eu2O3,MoO3,Li2CO3 |
33 | Gd2O3,Eu2O3,MoO3,Li2CO3,LiF |
34 | Y2O3,Eu2O3,MoO3 |
35 | Y2O3,Eu2O3,MoO3,Li2CO3 |
36 | Y2O3,Eu2O3,MoO3,Li2CO3,NH4F |
37 | Y2O3,Eu2O3,MoO3,Li2CO3,NH4F,SmO3 |
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410627319.7A CN104357051B (zh) | 2014-11-10 | 2014-11-10 | 一种荧光材料及其制备方法,和发光装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410627319.7A CN104357051B (zh) | 2014-11-10 | 2014-11-10 | 一种荧光材料及其制备方法,和发光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104357051A CN104357051A (zh) | 2015-02-18 |
CN104357051B true CN104357051B (zh) | 2016-08-24 |
Family
ID=52524370
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410627319.7A Active CN104357051B (zh) | 2014-11-10 | 2014-11-10 | 一种荧光材料及其制备方法,和发光装置 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104357051B (zh) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105733579B (zh) * | 2016-04-13 | 2017-10-27 | 厦门大学 | 一种紫外激发的红色荧光粉及其制备方法 |
CN107033897B (zh) * | 2017-05-08 | 2020-02-21 | 陕西科技大学 | 一种近紫外光激发的氟掺杂的钨钼酸盐发光材料及合成方法 |
CN107338051A (zh) * | 2017-06-28 | 2017-11-10 | 陕西科技大学 | 适用于白光led的钼酸盐基掺钐红色荧光粉及其制备方法 |
CN107365582A (zh) * | 2017-06-28 | 2017-11-21 | 陕西科技大学 | 适用于白光led的钼酸盐基掺铕红色荧光粉及其制备方法 |
CN113387565B (zh) * | 2020-03-13 | 2022-04-05 | 包头稀土研究院 | 荧光玻璃及其制备方法和用途 |
JP7650006B2 (ja) | 2020-03-31 | 2025-03-24 | パナソニックIpマネジメント株式会社 | ハロゲン化物の製造方法 |
EP4129913A1 (en) | 2020-03-31 | 2023-02-08 | Panasonic Intellectual Property Management Co., Ltd. | Method for producing halide |
CN112062682B (zh) * | 2020-08-31 | 2021-06-08 | 华南理工大学 | 一种复合双季胺盐锰金属卤化物发光材料及其制备方法与应用 |
CN113462391A (zh) * | 2021-07-27 | 2021-10-01 | 上海同晔科技有限公司 | 一种铕镝共掺杂白光led用钨酸盐红色荧光粉及其制备方法 |
CN113683407B (zh) * | 2021-09-10 | 2023-01-13 | 江苏师范大学 | 一种高亮度高热稳定性黄绿光荧光陶瓷及其制备方法 |
CN114479854B (zh) * | 2021-12-28 | 2023-11-21 | 吉林化工学院 | 电荷补偿型钼钨酸盐红色发光材料及其制备方法和应用 |
CN115011341B (zh) * | 2022-06-06 | 2023-08-22 | 渤海大学 | 一种发射宽带绿光的荧光粉及其制备方法 |
CN115820254A (zh) * | 2022-12-08 | 2023-03-21 | 广西贺源科技发展有限责任公司 | 一种近紫外光激发钼酸盐红色荧光粉的合成与应用 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070018573A1 (en) * | 2004-02-18 | 2007-01-25 | Showa Denko K,K. | Phosphor, production method thereof and light-emitting device using the phosphor |
CN101619214B (zh) * | 2009-07-31 | 2013-10-30 | 中国地质大学(武汉) | 一种白钨矿物相红色荧光粉及其制备方法 |
CN101698798B (zh) * | 2009-10-20 | 2012-10-17 | 中国地质大学(武汉) | 一种高亮度钼酸盐红色荧光粉及其制备方法 |
CN101928562B (zh) * | 2009-10-21 | 2013-11-06 | 南昌大学 | 一种可同时被近紫外和蓝色led光有效激发的红色荧光粉 |
CN101928564B (zh) * | 2010-07-05 | 2013-04-24 | 北京工商大学 | 碱金属或碱土金属的钼酸盐系双模式发光材料及其制备方法 |
CN101974327B (zh) * | 2010-10-29 | 2012-06-06 | 广西师范大学 | 一种CaMoO4:Eu3+,Li+红色荧光粉的制备方法 |
CN102071022A (zh) * | 2010-11-29 | 2011-05-25 | 天津理工大学 | 一种黄绿光可强激发的钼酸盐红色荧光材料及其制备方法 |
CN102120931B (zh) * | 2010-12-03 | 2013-06-19 | 深圳职业技术学院 | 一种红色荧光体及其制备方法 |
CN102277163B (zh) * | 2011-06-14 | 2013-05-01 | 上海华明高技术(集团)有限公司 | 白光led用稀土红色荧光粉及其制备方法 |
CN103333691B (zh) * | 2013-06-09 | 2014-08-13 | 西北大学 | 以Li8Bi2(MoO4)7为基质的发光材料及其制备方法 |
CN103980898A (zh) * | 2014-05-21 | 2014-08-13 | 陕西科技大学 | 一种以钨酸盐为基质的红色荧光粉及其制备方法 |
-
2014
- 2014-11-10 CN CN201410627319.7A patent/CN104357051B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN104357051A (zh) | 2015-02-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN104357051B (zh) | 一种荧光材料及其制备方法,和发光装置 | |
CN102268256B (zh) | 一种蓝光激发发射红绿光的荧光材料及其制备方法 | |
WO2008022552A1 (en) | Silicate-base luminescent material with muti-emission peak, a method of manufacturing the same and a lighting apparatus using the same | |
CN105778913B (zh) | 一种单基质三掺杂白色荧光材料及其制备方法与应用 | |
CN105331364A (zh) | 一种YAG:Mn红色荧光粉以及其制备方法和应用 | |
US20110155972A1 (en) | One silicon-aluminate light-conversion fluorescence material co-activated with halogen for white-light led | |
CN113249125B (zh) | Ce3+掺杂的硅酸盐基绿色荧光粉及其制备方法和应用 | |
CN116144357B (zh) | 一种紫外激发的绿光发射荧光粉及其制备方法与应用 | |
CN102391859A (zh) | 白光led用绿色荧光粉及其制备方法和应用 | |
CN103242830A (zh) | 一种氟硅酸盐基蓝绿色荧光粉、制备方法及应用 | |
CN114410302B (zh) | 一种近红外荧光粉及其光学装置 | |
CN104377294B (zh) | 一种发光装置 | |
CN102629655B (zh) | 一种具有余辉特性的高显色白光led器件 | |
CN105038789A (zh) | 一种单相白光荧光粉及其制备方法 | |
CN103396800A (zh) | 一种硼铝酸盐基蓝色荧光粉、制备方法及应用 | |
CN103468249A (zh) | 一种Eu2+激活的硅酸钠钙绿色荧光粉、制备及应用 | |
CN103320131B (zh) | 一种磷酸盐基红色荧光粉、制备方法及应用 | |
CN104059640B (zh) | 一种硼酸盐荧光粉基质及荧光粉的制备方法 | |
CN108276998B (zh) | 三价钐离子掺杂钛酸钆钡红色荧光粉及其制备方法 | |
CN114395394B (zh) | 一种近红外荧光粉及包含该荧光粉的光学装置 | |
CN115873595A (zh) | 一种可调控红光与近红外稀土发光材料及制备方法和红外led装置 | |
CN107216876A (zh) | 以钒酸盐为基质的掺铕红色荧光粉及其制备方法 | |
CN106978174A (zh) | 一种掺杂的钨硼酸镧荧光粉及其制备方法与应用 | |
CN106634974A (zh) | 发光材料及其制备方法、白光led装置 | |
CN106367062A (zh) | 白光led用全光谱荧光粉及其制备方法和白光led发光装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170104 Address after: Zhao Wuda road 010022 Inner Mongolia Hohhot Saihan District No. 81 Inner Mongolia Normal University Patentee after: INNER MONGOLIA NORMAL University Address before: Zhao Wuda road in Saihan District of Hohhot City, No. 81 the Inner Mongolia Autonomous Region 010022 Patentee before: Chao Ke Fu |
|
TR01 | Transfer of patent right |
Effective date of registration: 20240826 Address after: Room 502, Building 2, No. 7 Qiankeng South Road, Qiankeng Community, Fucheng Street, Longhua District, Shenzhen City, Guangdong Province 518055 Patentee after: Micro Nano Photonics (Shenzhen) Co.,Ltd. Country or region after: China Address before: No. 81 Zhaowuda Road, Saihan District, Hohhot, Inner Mongolia 010022 Inner Mongolia Normal University Patentee before: INNER MONGOLIA NORMAL University Country or region before: China |
|
TR01 | Transfer of patent right |