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CN104332452B - 芯片封装模组 - Google Patents

芯片封装模组 Download PDF

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Publication number
CN104332452B
CN104332452B CN201410414557.XA CN201410414557A CN104332452B CN 104332452 B CN104332452 B CN 104332452B CN 201410414557 A CN201410414557 A CN 201410414557A CN 104332452 B CN104332452 B CN 104332452B
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CN
China
Prior art keywords
chip
pad
package module
module according
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201410414557.XA
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English (en)
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CN104332452A (zh
Inventor
吴宝全
龙卫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Goodix Technology Co Ltd
Original Assignee
Shenzhen Huiding Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Huiding Technology Co Ltd filed Critical Shenzhen Huiding Technology Co Ltd
Priority to CN201410414557.XA priority Critical patent/CN104332452B/zh
Priority to PCT/CN2014/088300 priority patent/WO2016026199A1/zh
Priority to KR1020167035726A priority patent/KR20170010814A/ko
Priority to EP14900185.1A priority patent/EP3113222A4/en
Publication of CN104332452A publication Critical patent/CN104332452A/zh
Priority to US15/372,392 priority patent/US9831216B2/en
Application granted granted Critical
Publication of CN104332452B publication Critical patent/CN104332452B/zh
Expired - Fee Related legal-status Critical Current
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Abstract

本发明公开了一种芯片封装模组，包括：第一芯片，所述第一芯片的邻近前表面一侧具有第一焊盘；至少一个第二芯片，至少一个所述第二芯片设在所述第一芯片的后侧，每个所述第二芯片具有第二焊盘，其中所述第一芯片的所述第一焊盘通过重布线层与所述第二芯片的所述第二焊盘进行连接。根据本发明的芯片封装模组，通过将第二芯片设置在第一芯片的后侧，且将第一焊盘通过重布线层与第二焊盘相连，通过多芯片表面进行重布线技术，巧妙地把指纹识别芯片的正面焊盘引线绕到背面进行互联，从而使得芯片正表面的感应区可以和人体进行充分接触。此外，多芯片重布线技术也能极大缩小芯片之间的互联距离，提高芯片之间通讯效率。

Description

芯片封装模组
技术领域
本发明涉及半导体封装技术在电容型指纹识别装置中的应用，尤其是涉及一种基于电容型指纹识别芯片的芯片封装模组。
背景技术
指纹识别装置已逐渐应用于各种终端设备，如移动终端、银行系统、考勤系统等。最常见的指纹识别装置通常包括基本的传感电路，控制电路和存储电路等，这些电路的互联通常分芯片内互联或芯片间的互联。采用传统打线封装工艺指纹识别芯片表面的焊盘必须有打线的弧线高度，此弧线高度的存在使得人体手指与芯片识别区域不能进行接触，否则会损坏打线。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一。为此，本发明的一个目的在于提出一种芯片封装模组，以解决指纹识别装置表面不能使用传统打线工艺的难题。
根据本发明实施例的芯片封装模组，包括：第一芯片，所述第一芯片的邻近前表面一侧具有第一焊盘；至少一个第二芯片，至少一个所述第二芯片设在所述第一芯片的后侧，每个所述第二芯片具有第二焊盘，其中所述第一芯片的所述第一焊盘通过重布线层与所述第二芯片的所述第二焊盘进行连接。
根据本发明实施例的芯片封装模组，通过将第二芯片设置在第一芯片的后侧，且将第一焊盘通过重布线层与第二焊盘相连，通过多芯片表面进行再布线技术，把互连线路做在第一芯片的背面，从而使得第一芯片的正面的指纹感应区能和人体生物进行直接接触。同时多芯片之间通讯距离大大降低，芯片之间的通信效率得以提高。
可选地，所述第一焊盘邻近所述第一芯片的前表面设置，或从所述第一芯片的前表面露出。
可选地，所述重布线层与所述第一焊盘直接相连，或者通过硅通孔与所述第一焊盘连接。
具体地，所述重布线层通过所述硅通孔与所述第一焊盘连接，所述第一芯片的侧面的前部具有向外凸出的凸台，所述第一焊盘设在所述凸台内，所述第一焊盘的后表面和所述第一芯片的后表面之间形成所述硅通孔，所述硅通孔内填充有金属导电物，所述重布线层的一端覆盖所述硅通孔以与所述第一焊盘相连。
进一步地，所述第一芯片的侧面形成为从前到后倾斜向内延伸的斜面，所述重布线层在前后方向上沿着所述斜面延伸。
进一步地，所述第一芯片的后表面形成凹槽，所述凹槽的内壁具有绝缘层，至少一个所述第二芯片设在所述凹槽内且第二芯片的后表面与所述凹槽的底壁接触。
进一步地，所述第一芯片的后表面设置平坦化介质层。
可选地，所述平坦化介质层为有机树脂层或无机物硅化物层。
进一步地，所述第一芯片的前表面形成有第一凹入部，所述重布线层的一端延伸至所述第一凹入部的底壁。
更进一步地，所述第一芯片的后表面上形成有向前凹入的第二凹入部，所述第二芯片设在所述第二凹入部内。
可选地，所述第一芯片为指纹识别芯片。
本发明的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本发明的实践了解到。
附图说明
本发明的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：
图1是根据本发明第一个实施例的芯片封装模组的剖面图；
图2是图1中所示的芯片封装模组的俯视图；
图3是根据本发明第二个实施例的芯片封装模组的剖面图；
图4是根据本发明第三个实施例的芯片封装模组的剖面图；
图5是根据本发明第四个实施例的芯片封装模组的剖面图；
图6是根据本发明第五个实施例的芯片封装模组的剖面图；
图7是根据本发明第六个实施例的芯片封装模组的剖面图。
附图标记：
11：第一芯片；12：前表面；13：后表面；15：第一焊盘；
14：指纹识别感应区；16：重布线层；17：第二焊盘；18：平坦化介质层；
19：第二芯片；31：硅通孔；32：凸台；21：槽；
41：打线；9：衬底；91：衬底焊盘。
具体实施方式
下面详细描述本发明的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
在本发明的描述中，需要理解的是，术语“中心”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本发明的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本发明中的具体含义。
下面参考图1-图7描述根据本发明实施例的芯片封装模组。
如图1所示，根据本发明实施例的芯片封装模组，包括第一芯片11和至少一个第二芯片19。可以直接在指纹识别感应区14进行生物识别。
参照图1，第一芯片11的邻近前表面12一侧具有传感器信号接收端子形成的矩阵、以及邻近该矩阵的具有外部信号互联功能的第一焊盘15，也就是说，第一焊盘15与第一芯片11的前表面12之间的距离小于第一焊盘15与第一芯片11的后表面13之间的距离。其中，第一芯片11可以为硅芯片。可以理解，第一焊盘15的个数可以根据实际要求具体布置，本发明对此不作具体限定。
第一焊盘15的前表面的至少部分从第一芯片11的前表面12露出，如图1、图3和图4-图6所示，换言之，从前向后看，只能看见第一焊盘15的前表面的一部分。当然，第一焊盘15的前表面还可以从第一芯片11的前表面12完全露出，此时可以看见第一焊盘15的前表面的全部。
至少一个第二芯片19设在第一芯片11的后侧。例如，第二芯片19可以设在第一芯片11的后表面上，如图1-图6所示。当然，当第一芯片11的后表面上设有衬底9时，第二芯片19也可以设在衬底9上，此时第二芯片19位于第一芯片11的后方。
第一芯片11的第一焊盘15通过重布线层16与第二芯片19的第二焊盘17进行连接。其中，重布线层是指对第一芯片11的第一焊盘15进行位置重置的金属层，重置的位置与第一焊盘15在不同的表面。
具体而言，重布线层16沿从第一芯片11的前表面12到第一芯片11的后表面13的方向延伸，即重布线层16沿前后方向延伸，且重布线层16的第一端(例如，图1中的前端)与第一焊盘15连接，重布线层16的第二端(例如，图1中的后端)适于与第二芯片19的第二焊盘17相连。重布线层16可以通过金属沉积和光刻、蚀刻等工艺形成。
这里，需要说明的是，可以选用两者中面积较大的芯片作为第一芯片11，即第一芯片11的面积大于第二芯片19的面积。其中，第一芯片为指纹识别芯片，第二芯片19可以为主控芯片或其他辅助芯片等。
进一步地，第二芯片19为两个，且两个第二芯片19均设在第一芯片11的后表面13上，两个第二芯片19的第二焊盘17之间可以通过重布线层16连接，也可以通过打线41连接。其中，每个第二芯片19与第一芯片11的连接方式在上面已经详细描述，在此不再赘述。
根据本发明实施例的芯片封装模组，通过将第二芯片19设置在第一芯片11的后侧，且将第一焊盘15通过重布线层16与第二焊盘17相连，通过多芯片表面进行再布线技术，把互连线路做在第一芯片11的后表面13，从而使得第一芯片11的前表面12的指纹识别感应区14能和人体生物进行直接接触。同时多芯片之间通讯距离大大降低，芯片之间的通信效率得以提高。
根据本发明的第一个可选实施例，参照图1，第一焊盘15邻近第一芯片11的前表面12设置，且从第一芯片11的侧面露出，重布线层16的一端从第一芯片11的侧面与第一焊盘15连接。如图1所示，从第一芯片11的侧面可以看到第一焊盘15，第一焊盘15优选与第一芯片11的侧面平齐，重布线层16一端与第一芯片11的侧面的对应第一焊盘15的位置相连，并沿着第一芯片11的侧面向后延伸至第一芯片11的后表面13，并与第一芯片11的后表面13上的第二芯片19的第二焊盘17连接。
其中，第一芯片11的侧面形成为从前到后倾斜向内延伸的斜面，重布线层16在前后方向上沿着斜面延伸，换言之，重布线层16沿着上述斜面进行互联布线，以方便布置重布线层16。
图2是图1中所示的芯片封装模组的俯视图，重布线层16数量不限，取决于芯片焊盘设计。重布线层16从第一芯片11的前表面12引出到后表面13，如图2所示平面。在后表面13上与第二芯片19的第二焊盘17进行互连。
根据本发明的第二个可选实施例，如图3所示，第一芯片11的后表面13挖出槽21(即凹槽)，在槽21内表面涂上绝缘层，在第一芯片11的后表面13涂上平坦化介质层18，再将第二芯片19置于槽21中，第二芯片19的后表面与槽21的底壁接触。其中，绝缘层可以为平坦化介质层18，此时平坦化介质层18可以作为绝缘层使用。可选地，平坦化介质层18为有机树脂层或无机物硅化物层。
第二芯片19的前表面优选与第一芯片11的后表面13处于一个水平面，然后利用重布线层16把第一芯片11的第一焊盘15和第二芯片19的第二焊盘17连接起来。第二芯片19的第二焊盘17与第一芯片11的第一焊盘15进行互联的重布线之前应该包含有一层表面平坦化介质层18。
根据本发明的第三个可选实施例，如图4所示，此方案中利用重布线层16把第一芯片11的第一焊盘15连接至第一芯片的后表面13，第二芯片19的第二焊盘17与重布线层16通过打线41进行互连。此方案的特殊点在于不使用平坦化介质层18。
图5是本方案的第四个可选实施例，具体而言，第一芯片11的侧面的前部具有向外凸出的凸台32，第一焊盘15设在凸台32内，第一焊盘15的后表面和第一芯片11的后表面13之间形成硅通孔，例如，第一焊盘15的前表面的部分从第一芯片11的前表面12露出，硅通孔31形成在凸台32的后表面上，硅通孔31内部填充有金属导电物，重布线层16的一端覆盖硅通孔31以与第一焊盘15相连。
其中，参照图3和图4，金属导电物可以为铜等，重布线层16覆盖凸台32的后表面的对应硅通孔31的位置处以通过金属导电物间接地与第一焊盘15相连。
在第一芯片11梯形凸台结构的加工方式包括物理刻蚀和化学刻蚀两种。
图6是本发明的第五个可选实施例，同样地，图6中采用与图5中相同的凸台结构。同样地，第一芯片11后表面13具有槽21，此槽21形成方式包括物理刻蚀和化学刻蚀两种。槽21表面涂有平坦化介质层18，第二芯片19置于其中，第二芯片19表面与第一芯片11的后表面13处于同一平面，在此平面上通过重布线层16进行互连。
图7是本发明的第六个可选实施例，此实施例不同于前面方案第一芯片11的前表面12形成有第一凹入部，重布线层16的一端延伸至第一凹入部的底壁。具体而言，第一芯片11的前表面12的第一焊盘15的一侧通过加工形成了凸台32，重布线层16一端连接着第一焊盘15，另一端走线到凸台32。同样地，第一芯片11的后表面13有形成槽21，此槽形状可为梯形或者方形，可选地，此槽21采用物理切割、干法蚀刻或者化学腐蚀蚀刻方法形成。
衬底9作为此方案的载体，衬底9一般为PCB(Printed Circuit Board)印刷电路基板或者软硬板，表面印制有衬底焊盘91，不同位置衬底焊盘91通过衬底9内部印刷线路预先进行互连，互连关系取决于电路功能。衬底焊盘91与第一芯片11重布线层16一端通过打线41进行互连，同样地，第二芯片19的第二焊盘17与衬底焊盘91也是通过打线41进行互连。
根据本发明实施例的芯片封装模组，利用第一芯片11的后表面13空间进行重布线互连，从而可以提高芯片的封装效率，并降低不良率，且极大地降低了成本。
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示意性实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
尽管已经示出和描述了本发明的实施例，本领域的普通技术人员可以理解：在不脱离本发明的原理和宗旨的情况下可以对这些实施例进行多种变化、修改、替换和变型，本发明的范围由权利要求及其等同物限定。

Claims (10)

1.一种芯片封装模组，其特征在于，包括：
第一芯片，所述第一芯片的邻近前表面一侧具有第一焊盘；
至少一个第二芯片，至少一个所述第二芯片设在所述第一芯片的后侧，每个所述第二芯片具有第二焊盘，其中所述第一芯片的所述第一焊盘通过重布线层与所述第二芯片的所述第二焊盘进行连接，所述第一芯片的侧面形成为从前到后倾斜向内延伸的斜面，所述重布线层在前后方向上沿着所述斜面延伸。
2.根据权利要求1所述的芯片封装模组，其特征在于，所述第一焊盘邻近所述第一芯片的前表面设置，或从所述第一芯片的前表面露出。
3.根据权利要求1所述的芯片封装模组，其特征在于，所述重布线层与所述第一焊盘直接相连，或者通过硅通孔与所述第一焊盘连接。
4.根据权利要求3所述的芯片封装模组，其特征在于，所述重布线层通过所述硅通孔与所述第一焊盘连接，所述第一芯片的侧面的前部具有向外凸出的凸台，所述第一焊盘设在所述凸台内，所述第一焊盘的后表面和所述第一芯片的后表面之间形成所述硅通孔，所述硅通孔内填充有金属导电物，所述重布线层的一端覆盖所述硅通孔以与所述第一焊盘相连。
5.根据权利要求1所述的芯片封装模组，其特征在于，所述第一芯片的后表面形成凹槽，所述凹槽的内壁具有绝缘层，至少一个所述第二芯片设在所述凹槽内且所述第二芯片的后表面与所述凹槽的底壁接触。
6.根据权利要求1所述的芯片封装模组，其特征在于，所述第一芯片的后表面设置平坦化介质层。
7.根据权利要求6所述的芯片封装模组，其特征在于，所述平坦化介质层为有机树脂层或无机物硅化物层。
8.根据权利要求1所述的芯片封装模组，其特征在于，所述第一芯片的前表面形成有第一凹入部，所述重布线层的一端延伸至所述第一凹入部的底壁。
9.根据权利要求8所述的芯片封装模组，其特征在于，所述第一芯片的后表面上形成有向前凹入的第二凹入部，所述第二芯片设在所述第二凹入部内。
10.根据权利要求9所述的芯片封装模组，其特征在于，所述第一芯片为指纹识别芯片。
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CN102629177A (zh) * 2012-03-30 2012-08-08 敦泰科技有限公司 电容式触摸屏及制作方法
CN103663362A (zh) * 2012-08-29 2014-03-26 飞思卡尔半导体公司 传感器封装方法以及传感器封装

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