CN104315486A - Foam metal wick hot plate heat radiator of SiO2 nano working fluid - Google Patents
Foam metal wick hot plate heat radiator of SiO2 nano working fluid Download PDFInfo
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- CN104315486A CN104315486A CN201410522681.8A CN201410522681A CN104315486A CN 104315486 A CN104315486 A CN 104315486A CN 201410522681 A CN201410522681 A CN 201410522681A CN 104315486 A CN104315486 A CN 104315486A
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- liquid
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 61
- 239000002184 metal Substances 0.000 title claims abstract description 61
- 239000006260 foam Substances 0.000 title claims abstract description 59
- 239000012530 fluid Substances 0.000 title claims abstract description 56
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title abstract 8
- 229910052681 coesite Inorganic materials 0.000 title abstract 4
- 229910052906 cristobalite Inorganic materials 0.000 title abstract 4
- 239000000377 silicon dioxide Substances 0.000 title abstract 4
- 235000012239 silicon dioxide Nutrition 0.000 title abstract 4
- 229910052682 stishovite Inorganic materials 0.000 title abstract 4
- 229910052905 tridymite Inorganic materials 0.000 title abstract 4
- 238000009434 installation Methods 0.000 claims abstract description 22
- 238000010521 absorption reaction Methods 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims description 73
- 238000003466 welding Methods 0.000 claims description 23
- 229910000679 solder Inorganic materials 0.000 claims description 13
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 9
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Substances CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 9
- WSFSSNUMVMOOMR-UHFFFAOYSA-N formaldehyde Substances O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- 238000004020 luminiscence type Methods 0.000 claims description 6
- 230000008016 vaporization Effects 0.000 claims description 4
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 3
- 230000005855 radiation Effects 0.000 abstract description 6
- 239000002245 particle Substances 0.000 description 19
- 230000000694 effects Effects 0.000 description 11
- 239000000126 substance Substances 0.000 description 10
- 239000011148 porous material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000001704 evaporation Methods 0.000 description 4
- 230000008020 evaporation Effects 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- SCGJLFGXXZTXSX-UHFFFAOYSA-N copper;ethanol Chemical compound [Cu].CCO SCGJLFGXXZTXSX-UHFFFAOYSA-N 0.000 description 2
- YYCULGQEKARBDA-UHFFFAOYSA-N copper;formaldehyde Chemical compound [Cu].O=C YYCULGQEKARBDA-UHFFFAOYSA-N 0.000 description 2
- PTVDYARBVCBHSL-UHFFFAOYSA-N copper;hydrate Chemical compound O.[Cu] PTVDYARBVCBHSL-UHFFFAOYSA-N 0.000 description 2
- GEBVYLHOCNKBAH-UHFFFAOYSA-N copper;propan-2-one Chemical compound [Cu].CC(C)=O GEBVYLHOCNKBAH-UHFFFAOYSA-N 0.000 description 2
- 238000004512 die casting Methods 0.000 description 2
- LMZURCXQQZLYNR-UHFFFAOYSA-N ethanol;silver Chemical compound [Ag].CCO LMZURCXQQZLYNR-UHFFFAOYSA-N 0.000 description 2
- OIUSLRACRMDIAV-UHFFFAOYSA-N formaldehyde;silver Chemical compound [Ag].O=C OIUSLRACRMDIAV-UHFFFAOYSA-N 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- JUADHDHZVNYPHD-UHFFFAOYSA-N propan-2-one;silver Chemical compound [Ag].CC(C)=O JUADHDHZVNYPHD-UHFFFAOYSA-N 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- AYKOTYRPPUMHMT-UHFFFAOYSA-N silver;hydrate Chemical compound O.[Ag] AYKOTYRPPUMHMT-UHFFFAOYSA-N 0.000 description 2
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- 241000276425 Xiphophorus maculatus Species 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000011258 core-shell material Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000005474 detonation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2101/00—Point-like light sources
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a foam metal wick hot plate heat radiator of SiO2 nano working fluid, which belongs to the technical field of an integrated hot pipe heat radiator. The foam metal wick hot plate heat radiator of the SiO2 nano working fluid comprises a passive heat radiator and an installation assembly, wherein the passive heat radiator comprises a heat transfer soleplate with a heat absorption end surface, a shell which is connected to the heat transfer soleplate and heat radiating fins which are connected to the shell, wherein each heat radiating fin is of a hollow cubic barrel structure. Compared with the prior art, the foam metal wick hot plate heat radiator of the SiO2 nano working fluid has advantages of high heat radiating efficiency, simple and compact structure, capability of realizing effective heat radiation of a high-power LED (light emitting diode) lamp), and the like.
Description
Technical field
The invention belongs to integrated heat pipe technical field, in particular, belong to a kind of and use SiO
2liquid nano working medium is as heat-conducting work medium and use the hot plate radiator of foam metal liquid-sucking core
Background technology
Due to the extensive application of electric energy, various electrical equipment all in various degree there is heat dissipation problem.Common large-power light-emitting diodes (Light Emitting Diode, hereinafter referred to as LED) street lamp.The junction temperature of LED does not generally allow the limit more than 85 DEG C, and when LED junction temperature is more than 85 DEG C, often more than 5 DEG C, then the life-span of LED can corresponding minimizing 50%, and the brightness of LED street lamp also can with the velocity attenuation of every half a year more than 50%.Therefore, the transfer of heat how to be produced by LED node becomes one to the road lamp cooling problem in environment and extends the LED street lamp life-span, delays the key issue of its brightness decay.
LED street lamp radiator structure used in the prior art is generally die casting or extruding aluminium alloy radiator, as shown in Figure 1, LED bulb 1 is arranged on lamp socket 2, heat transfer base plate 3 die casting of aluminium alloy is connected on the lamp socket 2 of LED bulb 1, heat transfer base plate 3 is vertically connected with radiating fin 4, radiating fin 4 is generally set and outwards stretches.In the process realizing heat radiation, rely on the heat that LED bulb 1 produced of metal heat-conducting through lamp socket 2, heat transfer base plate 3, radiating fin 4, and finally spread and be delivered among air.But, the defect of aluminium alloy radiator structure is: the thermal conductivity factor of aluminium alloy is 100 Watt per meter Kelvin (W/MK), in the distance that heat transmits, temperature reduces very large, even if this radiator preparation has larger surface area, but because the thermal resistance of its inner heat conduction is large, so the actual efficiently radiates heat area of radiator is very little, radiating effect is bad.
The another kind of LED street lamp radiator structure of prior art adopts loop heat pipe (Loop Heat Pipe, hereinafter referred to as LHP) radiator.LHP is typical linear heat transfer element, its radiating principle as shown in Figure 2, heat radiation working medium filling is entered in heat-radiation loop pipe 100, to contact with the heating region of electronic component at evaporation ends 110 and absorb heat, be evaporated to gaseous state from liquid refrigerant, working medium of then dispelling the heat from the evaporation ends 110 of heat-radiation loop pipe 100 at the flows by action of liquid-sucking core 120 to condensation end 130, in the process heat is delivered to larger heat-delivery surface, heat radiation working medium is changed to liquid state from gaseous state again, comes back to evaporation ends 110.When application LHP radiator is as LED street lamp radiator structure, be generally laid with heat-radiation loop pipe in the outside of lampshade, and at thermal source place, be generally the evaporation ends that lampshade top place lays heat-radiation loop pipe.But also there is some problems in this LHP radiating mode, heat-radiation loop pipe and heat dissipation region contact area little, thermal contact resistance is large, and can not obtain larger effective expansion area of dissipation, radiating effect is not good yet.
Summary of the invention
The present invention, in order to solve above technical problem, gives a kind of foam metal liquid-sucking core hot plate radiator of liquid nano working medium.
The foam metal liquid-sucking core hot plate radiator of liquid nano working medium of the present invention, it is characterized in that: described radiator comprises the heat transfer base plate being provided with heat absorption end face, the radiating fin being connected to the housing on described heat transfer base plate and connecting on the housing, and described radiating fin is hollow cubic body tubular structure; Wherein, described heat absorption end face is arranged on the side that described heat transfer base plate deviates from described housing, and described heat absorbing end end face is for installing LED luminescence chip; The upper surface of described heat transfer base plate has installation pit, and described heat transfer base plate is inserted by described installation pit in the bottom of described housing; Described housing comprises: flat riser and foam metal liquid-sucking core, described flat riser forms a cavity, described flat riser is connected with described heat transfer base plate, and wherein said cavity is vacuum and pours into the liquid nano working medium with heat vaporizing property; Described foam metal liquid-sucking core is arranged in described cavity and with the sidewall weld of riser and is connected.
According to the foam metal liquid-sucking core hot plate radiator of above-described liquid nano working medium, preferably: described housing is vertical with described heat transfer base plate; Described installation pit has the first relative welding side and the second welding side, and bottom surface; The upper surface of described heat transfer base plate is also vertically installed with the first board wall and the second board wall; Side is welded on one vertical surface of described first board wall with first of described installation pit coplanar; Described housing welds with described first respectively in the space of welding between side in side and described second and is filled with solder.
According to the foam metal liquid-sucking core hot plate radiator of above-described liquid nano working medium, preferred: described second board wall comprises the first wedge-shaped part and the second wedge-shaped part, the first inclined surface of described first wedge-shaped part is corresponding with the second inclined surface of described second wedge-shaped part; Described first wedge-shaped part is arranged on the upper surface of described heat transfer base plate, under the state that the bottom of described housing is inserted into described installation pit, described second wedge-shaped part is bolted on described first wedge-shaped part, and described bolt is through described first inclined surface and described second inclined surface.
According to the foam metal liquid-sucking core hot plate radiator of above-described liquid nano working medium, preferably: the quantity of described radiating fin is multiple, being divided into two groups is symmetricly set on the symmetrical surface of two of described housing; Described radiating fin is connected with the described surface of described housing is vertical, and the opening of one end of the described heat transfer base plate of vicinity of described radiating fin is air inlet, and the opening of one end away from described heat transfer base plate of described radiating fin is air outlet.
According to the foam metal liquid-sucking core hot plate radiator of above-described liquid nano working medium, preferably: the liquid nano working medium in described cavity can be copper-water nano-fluid, copper-acetone nano-fluid, copper-ethanol nano-fluid, copper-formaldehyde nano-fluid.
According to the foam metal liquid-sucking core hot plate radiator of above-described liquid nano working medium, preferably: the liquid nano working medium in described cavity can be silver-water nano-fluid, silver-acetone nano-fluid, silver-ethanol nano-fluid, silver-formaldehyde nano-fluid.
According to the foam metal liquid-sucking core hot plate radiator of above-described liquid nano working medium, preferably: the liquid nano working medium in described cavity can be Al
2o
3-water nano-fluid, Al
2o
3-acetone nano-fluid, Al
2o
3-ethanol nano-fluid, Al
2o
3-formaldehyde nano-fluid.
According to the foam metal liquid-sucking core hot plate radiator of above-described liquid nano working medium, preferably: the liquid nano working medium in described cavity can be Fe
2o
3-water nano-fluid, Fe
2o
3-acetone nano-fluid, Fe
2o
3-ethanol nano-fluid, Fe
2o
3-formaldehyde nano-fluid.
According to the foam metal liquid-sucking core hot plate radiator of above-described liquid nano working medium, preferably: the liquid nano working medium in described cavity can be CuO-water nano-fluid, CuO-acetone nano-fluid, CuO-ethanol nano-fluid, CuO-formaldehyde nano-fluid.
According to the foam metal liquid-sucking core hot plate radiator of above-described liquid nano working medium, preferably: the liquid nano working medium in described cavity can be SiO
2-water nano-fluid, SiO
2-acetone nano-fluid, SiO
2-ethanol nano-fluid, SiO
2-formaldehyde nano-fluid.
The heat produced in LED luminescence chip luminescence process in the present invention can pass to bottom flat riser by heat transfer base plate, liquid nano working medium in riser is vaporized after absorbing heat and is diffused to the low region of temperature in closed cavity and release heat in the region liquefaction that temperature is low, these heats come from heat transfer base plate can pass to rapidly radiating fin by riser, and radiating fin finally can by conduct heat away in air.Liquid nano working medium has extraordinary heat-conducting effect, and above-mentioned mentioned various liquid nano working medium can make hot plate have the more excellent capacity of heat transmission.Riser in the present invention uses foam metal as liquid-sucking core, foam metal has very high support strength, uses foam metal can make not need supporting member in the cavity of riser as liquid-sucking core, can meet riser in the radiator course of work because the pressure that extraneous atmospheric pressure or the vaporization of internal liquid working medium produce causes deformation effect to riser.
The present invention is compared with prior art: have the advantages such as radiating efficiency is high, simple and compact for structure, the efficiently radiates heat that can realize high-power LED lamp.Efficiently solve the heat radiation difficult problem existed in prior art, can ensure that high-power LED lamp has higher service life, extraordinary result of use can be obtained in practical application.
Accompanying drawing explanation
Accompanying drawing 1 is the structural representation of the heat abstractor of LED lamp equipment in prior art;
Accompanying drawing 2 is the heat abstractor LHP radiating principle schematic diagram of LED lamp equipment in prior art;
Accompanying drawing 3A is the perspective view of foam metal liquid-sucking core hot plate radiator of the present invention;
Accompanying drawing 3B is the Split type structure schematic diagram of foam metal liquid-sucking core hot plate radiator of the present invention;
Accompanying drawing 4 is structural representations of foam metal liquid-sucking core hot plate of the present invention;
Accompanying drawing 5A is the structural representation one of radiator heat transfer base plate of the present invention;
Accompanying drawing 5B is the structural representation two of radiator heat transfer base plate of the present invention;
Accompanying drawing 5C is the partial enlarged drawing of radiator heat transfer base plate of the present invention.
Detailed description of the invention
Fig. 3 A is the perspective view of foam metal liquid-sucking core hot plate radiator of the present invention; Fig. 3 B is the detonation configuration schematic diagram of foam metal liquid-sucking core hot plate radiator of the present invention.The foam metal liquid-sucking core hot plate radiator of liquid nano working medium of the present invention, comprise passive radiator and installation component, passive radiator comprises the heat transfer base plate 2 being provided with heat absorption end face 201, the radiating fin 3 being connected to the housing 1 on heat transfer base plate 2 and being connected on housing 1, and radiating fin 3 is hollow cubic body tubular structure; The end face 201 that wherein absorbs heat is arranged on the side that heat transfer base plate 2 deviates from housing 1, and heat absorption end face 201 is for installing LED luminescence chip; Housing 1 comprises flat riser 101, and flat riser 101 forms a cavity 102, and flat riser 101 is connected with heat transfer base plate 2, and its cavity 102 is vacuum and pours into the liquid nano working medium with heat vaporizing property; Foam metal liquid-sucking core 103, is arranged in cavity 102; The side of the heat transfer base plate 2 of passive radiator is connected with LED luminescence chip.
Fig. 5 A and Fig. 5 B is the structural representation of radiator heat transfer base plate of the present invention, Fig. 5 C is the partial enlarged drawing of radiator heat transfer base plate of the present invention, have in installation groove on the upper surface of heat transfer base plate 2 and install pit 202, heat transfer base plate 2 is inserted by installing pit 202 in the bottom of housing 1.Housing 1 is vertical with heat transfer base plate 2, installs pit 202 and has the first relative welding side 2022, welding side 2021, second, and bottom surface 2023; It is corresponding that side 2022 is welded in first welding side 2021 and second; The vertical surperficial side 2021 of welding with first of installation pit 202 upper surface of heat transfer base plate 2 being also vertically installed with the first board wall 203 and the second board wall 204, first board wall 203 is coplanar.
The first inclined surface that second board wall 204 comprises the first wedge-shaped part 2041 and the second wedge-shaped part 2042, first wedge-shaped part 2041 is corresponding with the second inclined surface of the second wedge-shaped part 2042; First wedge-shaped part 2041 is arranged on the upper surface of heat transfer base plate 2, under being inserted into the state of installing pit 202 in the bottom of housing 1, second wedge-shaped part 2042 is connected on the first wedge-shaped part 2041 by the connector such as bolt or screw, and connector is connected with heat transfer base plate 2 with the second inclined surface through the first inclined surface.
The upper surface of heat transfer base plate 2 has and installs pit 202, heat transfer base plate 2 is inserted by installing pit 202 in the bottom of housing 1.The riser 101 of housing 1 can keep at right angle setting state with heat transfer base plate 2; The installation pit 202 of heat transfer base plate 2 has the first relative welding side 2021 and the second welding side 2022, and bottom surface 2023; The upper surface of heat transfer base plate 2 is also vertically installed with the first board wall 203 and the second board wall 204; One vertical surperficial side 2021 of welding with first of installation pit 202 of the first board wall 203 is coplanar.Heat transfer base plate 2 is with housing 1 welding process, and the solder being in molten condition can be filled in and insert in the installation pit 202 of housing 1; Housing 1 welds the solder that the space of welding between side 2022 and bottom surface 2023, side 2021, second is melted state and is full of with first, can ensure, between housing 1 and heat transfer base plate 2, there is extraordinary installation effect after solder solidification, housing 1 welds side 2021, second and welds solder between side 2022 and bottom surface 2023 and ensure to realize close contact between them with first, heat transfer base plate 2 and housing 1 have and are extraordinaryly connected effect, can ensure that the heat from heat transfer base plate 2 in radiator course of normal operation can pass to housing 1 well like this.
The first inclined surface that second board wall 204 comprises the first wedge-shaped part 2041 and the second wedge-shaped part 2042, first wedge-shaped part 2041 is corresponding with the second inclined surface of the second wedge-shaped part 2042; First wedge-shaped part 2041 is arranged on the upper surface of heat transfer base plate 2, under being inserted into the state of installing pit 202 in the bottom of housing 1, second wedge-shaped part 2042 is bolted on the first wedge-shaped part 2041, and bolt is through the first inclined surface and the second inclined surface.
Radiating fin 3 is hollow cubic body tubular structure, the quantity of radiating fin 3 is multiple, being divided into two groups is symmetricly set on the symmetrical surface of two of housing 1, radiating fin 3 is connected with the surface of housing 1 is vertical, the opening of contiguous heat transfer base plate 2 one end of radiating fin 3 is air inlet, and the opening away from heat transfer base plate 2 one end of radiating fin 3 is air outlet.Flowed out by air outlet after the air inlet inflow air of radiating fin 3, the heat on radiating fin 3 is dispersed in air by air, substantially increases the integral heat sink effect of radiator.Radiating fin 3 is connected with the surface of housing 1 is vertical.Preferably be arranged in parallel between radiating fin 3, form the space of a direct cold air circulation between every two radiating fins 3, this space can play a role to the heat radiation of radiating fin 3.Because radiating fin 3 is hollow cubic body tubular structure, the opening of each radiating fin 3 contiguous heat transfer base plate 2 one end is air inlet, opening away from heat transfer base plate 2 one end is air outlet, each radiating fin 3 forms the passage of a direct cold air circulation, and this passage extends through the top of radiating fin 3 from the bottom of radiating fin 3, this passage can improve air circulation effect, and then improves the radiating effect of radiator.Radiating fin as shown in Figure 3A, each radiating fin is independently, the radiating fin that the present embodiment provides.
Housing 1 is at right angle setting state with heat transfer base plate 2, the upper surface of heat transfer base plate 2 has pit 202 is installed, pit 202 is installed there is the first relative welding side 2021 and the second welding side 2022, and bottom surface 2023, the bottom of housing 1 is inserted in heat transfer base plate 2 by installing pit 202, housing 1 welds side 2021 and second and welds side 2022 with first, and bottom surface 2023 contacts.The vertical surperficial side 2021 of welding with first of installation pit 202 upper surface of heat transfer base plate 2 being also vertically installed with the first board wall 203 and the second board wall 204, first board wall 203 is coplanar.Housing 1 welds with first respectively in the space of welding between side 2022 and bottom surface 2023 in side 2021, second and is filled with solder.Preferably, to comprise the first inclined surface of the first wedge-shaped part 2041 and the second wedge-shaped part 2042, first wedge-shaped part 2041 corresponding with the second inclined surface of the second wedge-shaped part 2042 for the second board wall 204.First wedge-shaped part 2041 is arranged on the upper surface of heat transfer base plate 2, under being inserted into the state of installing pit 202 in the bottom of housing 1, second wedge-shaped part 2042 is bolted on the first wedge-shaped part 2041, and bolt is through the first inclined surface and the second inclined surface.
The platy structure of heat transfer base plate 2 can be a cross section be similar rectangle, shape bottom the shape of installation pit 202 that heat transfer base plate 2 is arranged and housing 1 adapts, pit 202 is installed there are three plane surfaces, be respectively the first welding side 2021, bottom surface 2023 and the second welding side 2022.First board wall 203 is fixedly connected on the upper surface of heat transfer base plate 2, first wedge-shaped part 2041 of the second board wall 204 is fixedly connected on the upper surface of heat transfer base plate 2, due to the first board wall 203 one vertically to weld side 2021 with first of installation pit 202 coplanar on surface, in actual installation process, housing 1 is inserted into and installs in pit 202, solder is filled in housing 1 with the space of installation pit 202, namely housing 1 welds the space between side 2021 with first, housing 1 and second welds in the space between side 2022 and is filled with solder, solder is filled with in space between housing 1 and bottom surface 2023, by high temperature action, solder is melted in welding process to realize the connection between pit 202 and housing 1 is installed to be full of space.Be placed on by second wedge-shaped part 2042 on first wedge-shaped part 2041, the first inclined surface of the first wedge-shaped part 2041 is relative with the second inclined surface of the second wedge-shaped part 2042.First wedge-shaped part 2041 is provided with bolt hole, second wedge-shaped part 2042 is also provided with bolt hole, by bolt through the bolt hole on the second wedge-shaped part 2042 and the bolt hole on the first wedge-shaped part 2041, second wedge-shaped part 2042 is arranged on the first wedge-shaped part 2041, by in the process of bolt tightening, one vertical surface of the second wedge-shaped part 2042 is pressed close to housing 1 and produces a horizontal force to promote housing 1, move to the direction of the first board wall 203 to make housing 1, overstocked housing 1 welds the solder between side 2021 and the vertical surface of the first board wall 203 with install pit 202 first, gas in solder is all discharged ensure to obtain extraordinary welding effect, and then the heat-transfer effect improved between heat transfer base plate 2 and housing 1.
Fig. 4 is foam metal liquid-sucking core shell structure schematic diagram of the present invention, the inside of inventive shell 1 uses foam metal liquid-sucking core 103, foam metal self has very high intensity, and porosity is very high simultaneously, foam metal liquid-sucking core 103 can also be played a supporting role, riser 101 does not deform when ensureing that extraneous atmospheric pressure acts on the sidewall of housing 1, effectively can ensure the normal working performance of housing 1 like this.Foam metal liquid-sucking core 103 effectively welds with the sidewall of housing 1 and fits together, after also can ensureing the liquid working substance gasification of housing 1 inside simultaneously, create be greater than atmospheric internal pressure after the structure in housing 1 is not damaged, foam metal liquid-sucking core 103 can fit together tightly with the side of riser 101.
Liquid nano working medium adds nanoscale metal particles or nanosize metal oxide particle according to certain ratio and mode in a liquid, uses liquid nano working medium effectively can improve the thermal conductivity factor of liquid working substance in cavity 102 as heat-conducting medium in the present invention.The advantage of foam metal liquid-sucking core 103 and liquid nano working medium is combined in the present embodiment; the pore diameter of foam metal liquid-sucking core 103 is far longer than the diameter of nano metal or metal oxide, and nano-metal particle or metal oxide particle can not block the hole of foam metal liquid-sucking core 103.
Liquid nano working medium in hot plate sealed cavity can be copper-water nano-fluid, copper-acetone nano-fluid, copper-ethanol nano-fluid, copper-formaldehyde nano-fluid.Copper liquid nano working medium adds nanosized copper particle according to certain ratio and mode in a liquid, uses copper liquid nano working medium effectively can improve the thermal conductivity factor of liquid working substance as heat-conducting medium in the present invention.Combine the advantage of foam metal liquid-sucking core 103 and liquid nano working medium in the present embodiment, the pore diameter of foam metal liquid-sucking core 103 is far longer than the diameter of nano copper particle, and nano copper particle can not block the hole of foam metal liquid-sucking core 103.
Liquid nano working medium in hot plate sealed cavity also can be silver-water nano-fluid, silver-acetone nano-fluid, silver-ethanol nano-fluid, silver-formaldehyde nano-fluid.Silver nanoparticle liquid working substance adds Silver Nanoparticles according to certain ratio and mode in a liquid, uses silver nanoparticle liquid working substance effectively can improve the thermal conductivity factor of liquid working substance as heat-conducting medium in the present invention.Also can combine the advantage of foam metal liquid-sucking core 103 and liquid nano working medium in the present embodiment, the pore diameter of foam metal liquid-sucking core 103 is far longer than the diameter of nano-Ag particles, and nano-Ag particles can not block the hole of foam metal liquid-sucking core 103.
Liquid nano working medium in hot plate sealed cavity also can be Al
2o
3-water nano-fluid, Al
2o
3-acetone nano-fluid, Al
2o
3-ethanol nano-fluid, Al
2o
3-formaldehyde nano-fluid.Al
2o
3liquid nano working medium adds nanoscale Al according to certain ratio and mode in a liquid
2o
3particle, uses Al in the present invention
2o
3liquid nano working medium can improve the thermal conductivity factor of liquid working substance effectively as heat-conducting medium.Also can combine the advantage of foam metal liquid-sucking core 103 and liquid nano working medium in the present embodiment, the pore diameter of foam metal liquid-sucking core 103 is far longer than nanometer Al
2o
3the diameter of particle, nanometer Al
2o
3particle can not block the hole of foam metal liquid-sucking core 103.
Liquid nano working medium in hot plate sealed cavity also can be Fe
2o
3-water nano-fluid, Fe
2o
3-acetone nano-fluid, Fe
2o
3-ethanol nano-fluid, Fe
2o
3-formaldehyde nano-fluid.Fe
2o
3liquid nano working medium adds nanoscale Fe according to certain ratio and mode in a liquid
2o
3particle, uses Fe in the present invention
2o
3liquid nano working medium can improve the thermal conductivity factor of liquid working substance effectively as heat-conducting medium.Also can combine the advantage of foam metal liquid-sucking core 103 and liquid nano working medium in the present embodiment, the pore diameter of foam metal liquid-sucking core 103 is far longer than nanometer Fe
2o
3the diameter of particle, nanometer Fe
2o
3particle can not block the hole of foam metal liquid-sucking core 103.
Liquid nano working medium in hot plate sealed cavity also can be CuO-water nano-fluid, CuO-acetone nano-fluid, CuO-ethanol nano-fluid, CuO-formaldehyde nano-fluid.CuO liquid nano working medium adds nanoscale CuO particle according to certain ratio and mode in a liquid, uses CuO liquid nano working medium effectively can improve the thermal conductivity factor of liquid working substance as heat-conducting medium in the present invention.Also can combine the advantage of foam metal liquid-sucking core 103 and liquid nano working medium in the present embodiment, the pore diameter of foam metal liquid-sucking core 103 is far longer than the diameter of nanometer CuO particle, and nanometer CuO particle can not block the hole of foam metal liquid-sucking core 103.
Liquid nano working medium in hot plate sealed cavity can be SiO
2-water nano-fluid, SiO
2-acetone nano-fluid, SiO
2-ethanol nano-fluid, SiO
2-formaldehyde nano-fluid.SiO
2liquid nano working medium adds nanoscale SiO according to certain ratio and mode in a liquid
2particle, uses SiO in the present invention
2liquid nano working medium can improve the thermal conductivity factor of liquid working substance effectively as heat-conducting medium.Also can combine the advantage of foam metal liquid-sucking core 103 and liquid nano working medium in the present embodiment, the pore diameter of foam metal liquid-sucking core 103 is far longer than Nano-meter SiO_2
2the diameter of particle, Nano-meter SiO_2
2particle can not block the hole of foam metal liquid-sucking core 103.
Claims (1)
1. a SiO
2the foam metal liquid-sucking core hot plate radiator of liquid nano working medium, is characterized in that:
Described radiator comprises the heat transfer base plate being provided with heat absorption end face, the radiating fin being connected to the housing on described heat transfer base plate and connecting on the housing, and described radiating fin is hollow cubic body tubular structure; Wherein, described heat absorption end face is arranged on the side that described heat transfer base plate deviates from described housing, and described heat absorbing end end face is for installing LED luminescence chip; The upper surface of described heat transfer base plate has installation pit, and described heat transfer base plate is inserted by described installation pit in the bottom of described housing;
Described housing comprises: flat riser and foam metal liquid-sucking core, described flat riser forms a cavity, described flat riser is connected with described heat transfer base plate, and wherein said cavity is vacuum and pours into the liquid nano working medium with heat vaporizing property; Described foam metal liquid-sucking core is arranged in described cavity and with the sidewall weld of riser and is connected;
Described housing is vertical with described heat transfer base plate;
Described installation pit has the first relative welding side and the second welding side, and bottom surface;
The upper surface of described heat transfer base plate is also vertically installed with the first board wall and the second board wall;
Side is welded on one vertical surface of described first board wall with first of described installation pit coplanar;
Described housing welds with described first respectively in the space of welding between side in side and described second and is filled with solder;
Described second board wall comprises the first wedge-shaped part and the second wedge-shaped part, and the first inclined surface of described first wedge-shaped part is corresponding with the second inclined surface of described second wedge-shaped part;
Described first wedge-shaped part is arranged on the upper surface of described heat transfer base plate, under the state that the bottom of described housing is inserted into described installation pit, described second wedge-shaped part is bolted on described first wedge-shaped part, and described bolt is through described first inclined surface and described second inclined surface;
The quantity of described radiating fin is multiple, is divided into two groups and is symmetricly set on the symmetrical surface of two of described housing;
Described radiating fin is connected with the described surface of described housing is vertical, and the opening of one end of the described heat transfer base plate of vicinity of described radiating fin is air inlet, and the opening of one end away from described heat transfer base plate of described radiating fin is air outlet;
Liquid nano working medium in described cavity can be SiO
2-water nano-fluid, SiO
2-acetone nano-fluid, SiO
2-ethanol nano-fluid, SiO
2-formaldehyde nano-fluid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410522681.8A CN104315486A (en) | 2013-04-20 | 2013-04-20 | Foam metal wick hot plate heat radiator of SiO2 nano working fluid |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410522681.8A CN104315486A (en) | 2013-04-20 | 2013-04-20 | Foam metal wick hot plate heat radiator of SiO2 nano working fluid |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310159782.9A Division CN103225792B (en) | 2013-04-20 | 2013-04-20 | Flat plate heat pipe employing nano working liquid and foam metal wick |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104315486A true CN104315486A (en) | 2015-01-28 |
Family
ID=52370759
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410522681.8A Pending CN104315486A (en) | 2013-04-20 | 2013-04-20 | Foam metal wick hot plate heat radiator of SiO2 nano working fluid |
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Application publication date: 20150128 |