CN104302090A - Stack structure of wireless communication antenna and manufacture method thereof - Google Patents
Stack structure of wireless communication antenna and manufacture method thereof Download PDFInfo
- Publication number
- CN104302090A CN104302090A CN201310297634.3A CN201310297634A CN104302090A CN 104302090 A CN104302090 A CN 104302090A CN 201310297634 A CN201310297634 A CN 201310297634A CN 104302090 A CN104302090 A CN 104302090A
- Authority
- CN
- China
- Prior art keywords
- wireless communication
- layer
- communication antenna
- antenna plate
- structure folded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004891 communication Methods 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 title claims abstract description 9
- 229920001721 polyimide Polymers 0.000 claims abstract description 32
- 239000004642 Polyimide Substances 0.000 claims abstract description 31
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000000696 magnetic material Substances 0.000 claims abstract description 15
- 239000011889 copper foil Substances 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims abstract description 6
- 239000011248 coating agent Substances 0.000 claims abstract description 5
- 238000000576 coating method Methods 0.000 claims abstract description 5
- 238000005530 etching Methods 0.000 claims abstract description 4
- 239000010949 copper Substances 0.000 claims description 11
- 229910052802 copper Inorganic materials 0.000 claims description 11
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims description 6
- 230000000996 additive effect Effects 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000000975 dye Substances 0.000 claims description 3
- 239000000049 pigment Substances 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 4
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 38
- 238000013461 design Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000010030 laminating Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/06—Coating on the layer surface on metal layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2255/00—Coating on the layer surface
- B32B2255/26—Polymeric coating
Landscapes
- Details Of Aerials (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
The present invention discloses a stack structure of wireless communication antenna and a manufacture method thereof,The manufacture method comprises steps of coating the rough surface of a copper foil with polyimide to make a one-side copper foil substrate, then etching the copper foil of the one-side copper foil substrate into the a required circuit layer, and making amagnetic material layer on the surface of circuit layer lastly to make the stack structure of wireless communication antenna which iscomposed of the polyimide layer, the circuit layer and the magnetic material layer. The stack structure of wireless communication antenna in the present invention have the advantages of a ultrathin propertysimple structure etc., The antenna board manufacturing saves a fitting carrier film on protection layer compared with traditional protective film, thereby saving manufacture cost and process flow to some extent and simultaneously achieving a shielding and heat dissipation effect by adjusting the polyimide layer thickness.
Description
Technical field
The present invention relates to a kind of wireless communication antenna plate and fold structure and preparation method thereof.
Background technology
Polyimide resin has been widely used in electronic material, wherein, for the polyimide copper foil substrate of flexible printed wiring board, generally divides into single sided board or double sided board.Usually, the problem of polyimide copper foil substrate in application is limited to composition and the thickness thereof of polyimide material, the wiring material of small-sized electronic product adopts flexible printed wiring board (the Flexible Printed Circuit that design freedom is high, bendability is good mostly, hereinafter referred to as FPC), and constantly to high speed, frequency applications trend, electronic product is now made all to need to use high-frequency circuit tellite to support, to reach at a high speed and running effect of high frequency.
These small-sized electronic products not only will to more small-sized, lightweight development, and the design having more the degree of freedom is also a large key element.In FPC field, be not only the intelligent mobile phone to main flow, to contact panel design new demand also in continuous expansion.
Antenna plate circuit needs at present two-sided laminating carrier film (carrier film) increase its very property in manufacturing process, and the loaded down with trivial details and thickness limits by traditional protection film of technological process cannot develop to more small-sized, lightweight.
Summary of the invention
In order to overcome above-mentioned defect, the invention provides a kind of wireless communication antenna plate and folding structure and preparation method thereof, this wireless communication antenna plate fold structure have ultra-thin, structure is simple and manufacture craft is simple, save the advantages such as cost of manufacture.
The present invention in order to the technical scheme solving its technical problem and adopt is:
Structure folded by a kind of wireless communication antenna plate, and be made up of polyimide layer, line layer and magnetic material layer, described line layer has relative two sides, and described polyimide layer and described magnetic material layer are formed at the relative two sides of described line layer respectively.
The present invention in order to the further technical scheme solving its technical problem and adopt is:
The thickness of described polyimide layer is 8 ~ 25 μm, preferably 13 μm.
The thickness of described line layer is 9 ~ 35 μm, preferably 12 μm, 18 μm or 35 μm.
The thickness of described magnetic material layer is 5 ~ 25 μm.
Described polyimide layer is containing coloured female additive, and described look female additive is at least one in material with carbon element, titanium dioxide, pigment, dyestuff and toner.
The manufacture method of structure folded by above-mentioned wireless communication antenna plate, carries out in the steps below:
One, Copper Foil matsurface coating polyimides and in addition prebake conditions form polyimide layer, obtain an one side copper clad laminate;
Two, toast described one side copper clad laminate, polyimide layer is solidified, then by described one side copper clad laminate through etching machine, Copper Foil is etched into required line layer;
Three, do one deck magnetic material layer on described line layer surface, structure folded by obtained wireless communication antenna plate of the present invention.
The invention has the beneficial effects as follows: the present invention obtains one side copper clad laminate at the matsurface coating polyimides of Copper Foil, again the Copper Foil of one side copper clad laminate is etched into required line layer, one deck magnetic material layer is done on floor surface, final online road, obtained of the present invention by polyimide layer, structure folded by the wireless communication antenna plate that line layer and magnetic material layer are formed, wireless communication antenna plate of the present invention is folded structure and is had ultra-thin, advantages of simple structure and simple, the present invention eliminates when antenna plate makes relative to traditional protection film at its protective layer laminating carrier film (carrier film), manufacturing cost and technological process are saved to a certain extent, can be covered and radiating effect to have by adjustment polyimides layer thickness simultaneously.
Accompanying drawing explanation
Fig. 1 is the structure chart that structure folded by wireless communication antenna plate of the present invention.
Embodiment
Below by way of particular specific embodiment accompanying drawings the specific embodiment of the present invention, those skilled in the art can understand advantage of the present invention and effect easily by content disclosed in the present specification.The present invention also can be implemented in further, different ways, that is, not departing under disclosed category, can give different modifications and change.
Embodiment: structure folded by a kind of wireless communication antenna plate, be made up of polyimide layer 1, line layer 2 and magnetic material layer 3, described line layer 2 has relative two sides, and described polyimide layer 1 and described magnetic material layer 3 are formed at the relative two sides of described line layer 2 respectively.
The thickness of described polyimide layer 1 is 8 ~ 25 μm, preferably 13 μm.
The thickness of described line layer 2 is 9 ~ 35 μm, preferably 12 μm, 18 μm or 35 μm.
The thickness of described magnetic material layer 3 is 5 ~ 25 μm.
Described polyimide layer 1 is containing coloured female additive, and described look female additive is at least one in material with carbon element, titanium dioxide, pigment, dyestuff and toner.
The manufacture method of structure folded by above-mentioned wireless communication antenna plate, carries out in the steps below:
One, Copper Foil matsurface coating polyimides and in addition prebake conditions form polyimide layer, obtain an one side copper clad laminate;
Two, toast described one side copper clad laminate, polyimide layer is solidified, then by described one side copper clad laminate through etching machine, Copper Foil is etched into required line layer;
Three, do one deck magnetic material layer on described line layer surface, structure folded by obtained wireless communication antenna plate of the present invention.
Above-described embodiment is only the illustrative principle of the invention and effect thereof, but not for limiting the present invention.The scope of the present invention, should listed by claims.
Claims (8)
1. structure folded by a wireless communication antenna plate, it is characterized in that: be made up of polyimide layer (1), line layer (2) and magnetic material layer (3), described line layer (2) has relative two sides, and described polyimide layer (1) and described magnetic material layer (3) are formed at the relative two sides of described line layer (2) respectively.
2. structure folded by wireless communication antenna plate as claimed in claim 1, it is characterized in that: the thickness of described polyimide layer (1) is 8 ~ 25 μm.
3. structure folded by wireless communication antenna plate as claimed in claim 2, it is characterized in that: the thickness of described polyimide layer (1) is 13 μm.
4. structure folded by wireless communication antenna plate as claimed in claim 1, it is characterized in that: the thickness of described line layer (2) is 9 ~ 35 μm.
5. structure folded by wireless communication antenna plate as claimed in claim 4, it is characterized in that: the thickness of described line layer (2) is 12 μm, 18 μm or 35 μm.
6. structure folded by wireless communication antenna plate as claimed in claim 1, it is characterized in that: the thickness of described magnetic material layer (3) is 5 ~ 25 μm.
7. structure folded by wireless communication antenna plate as claimed in claim 1, it is characterized in that: described polyimide layer (1) is containing coloured female additive, and described look female additive is at least one in material with carbon element, titanium dioxide, pigment, dyestuff and toner.
8. the manufacture method of structure folded by the wireless communication antenna plate according to any one of claim 1 to 7, it is characterized in that: carry out in the steps below:
One, Copper Foil matsurface coating polyimides and in addition prebake conditions form polyimide layer, obtain an one side copper clad laminate;
Two, toast described one side copper clad laminate, polyimide layer is solidified, then by described one side copper clad laminate through etching machine, Copper Foil is etched into required line layer;
Three, do one deck magnetic material layer on described line layer surface, structure folded by obtained wireless communication antenna plate of the present invention.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310297634.3A CN104302090A (en) | 2013-07-16 | 2013-07-16 | Stack structure of wireless communication antenna and manufacture method thereof |
| TW103212082U TWM488754U (en) | 2013-07-16 | 2014-07-08 | Wireless communication antenna plate lamination structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310297634.3A CN104302090A (en) | 2013-07-16 | 2013-07-16 | Stack structure of wireless communication antenna and manufacture method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104302090A true CN104302090A (en) | 2015-01-21 |
Family
ID=52109627
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310297634.3A Pending CN104302090A (en) | 2013-07-16 | 2013-07-16 | Stack structure of wireless communication antenna and manufacture method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104302090A (en) |
| TW (1) | TWM488754U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110661090A (en) * | 2019-09-18 | 2020-01-07 | 湖南智领通信科技有限公司 | Thermoplastic polyimide plate based airborne antenna of unmanned aerial vehicle in '∞' shape |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101281992A (en) * | 2007-04-03 | 2008-10-08 | 联想(北京)有限公司 | Wireless chip and radio installation |
| CN101615619A (en) * | 2004-03-12 | 2009-12-30 | 株式会社半导体能源研究所 | Semiconductor device |
| CN201499374U (en) * | 2009-05-12 | 2010-06-02 | 昆山雅森电子材料科技有限公司 | Double-side copper foil baseplate structure |
| CN101735575A (en) * | 2009-12-11 | 2010-06-16 | 广东生益科技股份有限公司 | Resin composition and method for preparing FPC coverlay by using same |
| CN101777698A (en) * | 2009-12-30 | 2010-07-14 | 上海集成电路研发中心有限公司 | On-chip antenna structure in integrated circuit and manufacturing method thereof |
| CN102079956A (en) * | 2010-12-18 | 2011-06-01 | 广东生益科技股份有限公司 | White covering film and manufacturing method thereof |
| CN102299408A (en) * | 2010-06-22 | 2011-12-28 | 佳邦科技股份有限公司 | FPC Antenna Structure |
| CN202997050U (en) * | 2012-12-10 | 2013-06-12 | 北京神州龙芯集成电路设计有限公司 | Flexible circuit board antenna having magnetic conductive film |
| CN203026638U (en) * | 2012-12-20 | 2013-06-26 | 蒋石正 | Wireless near-field communication antenna |
| CN203446098U (en) * | 2013-07-16 | 2014-02-19 | 昆山雅森电子材料科技有限公司 | Wireless communication antenna board stacking structure |
-
2013
- 2013-07-16 CN CN201310297634.3A patent/CN104302090A/en active Pending
-
2014
- 2014-07-08 TW TW103212082U patent/TWM488754U/en not_active IP Right Cessation
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101615619A (en) * | 2004-03-12 | 2009-12-30 | 株式会社半导体能源研究所 | Semiconductor device |
| CN101281992A (en) * | 2007-04-03 | 2008-10-08 | 联想(北京)有限公司 | Wireless chip and radio installation |
| CN201499374U (en) * | 2009-05-12 | 2010-06-02 | 昆山雅森电子材料科技有限公司 | Double-side copper foil baseplate structure |
| CN101735575A (en) * | 2009-12-11 | 2010-06-16 | 广东生益科技股份有限公司 | Resin composition and method for preparing FPC coverlay by using same |
| CN101777698A (en) * | 2009-12-30 | 2010-07-14 | 上海集成电路研发中心有限公司 | On-chip antenna structure in integrated circuit and manufacturing method thereof |
| CN102299408A (en) * | 2010-06-22 | 2011-12-28 | 佳邦科技股份有限公司 | FPC Antenna Structure |
| CN102079956A (en) * | 2010-12-18 | 2011-06-01 | 广东生益科技股份有限公司 | White covering film and manufacturing method thereof |
| CN202997050U (en) * | 2012-12-10 | 2013-06-12 | 北京神州龙芯集成电路设计有限公司 | Flexible circuit board antenna having magnetic conductive film |
| CN203026638U (en) * | 2012-12-20 | 2013-06-26 | 蒋石正 | Wireless near-field communication antenna |
| CN203446098U (en) * | 2013-07-16 | 2014-02-19 | 昆山雅森电子材料科技有限公司 | Wireless communication antenna board stacking structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110661090A (en) * | 2019-09-18 | 2020-01-07 | 湖南智领通信科技有限公司 | Thermoplastic polyimide plate based airborne antenna of unmanned aerial vehicle in '∞' shape |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM488754U (en) | 2014-10-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206490891U (en) | The low-dielectric loss FRCC substrates of structure are folded with combined type | |
| CN206840863U (en) | Combined type LCP high-frequency high-speed Double-sided copper clad laminates | |
| CN111867260A (en) | Coating forming method of novel material layer structure of high-frequency circuit board and product thereof | |
| CN206932462U (en) | Combined type LCP high-frequency high-speed FRCC base materials | |
| CN106413238B (en) | The production method of flexible circuit board | |
| CN111844958A (en) | Preparation method of novel material layer structure of circuit board and product thereof | |
| CN205255668U (en) | Low dielectricity glued membrane | |
| CN203818668U (en) | Combined type two-sided copper foil base plate of transparent insulating layer | |
| CN204442830U (en) | For the black polyamide copper clad laminate of flexible circuit board | |
| TWI701478B (en) | Composite stacked liquid crystal polymer substrate and preparation method thereof | |
| CN203446098U (en) | Wireless communication antenna board stacking structure | |
| CN108307579B (en) | Low dielectric loss FRCC substrate with composite stacking structure and preparation method thereof | |
| CN102638935A (en) | Production method of green environment-friendly flexible printed circuit (FPC) antenna | |
| CN104302090A (en) | Stack structure of wireless communication antenna and manufacture method thereof | |
| CN211843506U (en) | Coating method high-frequency MPI flexible copper-clad plate | |
| CN104010436A (en) | Flexible metal-coated substrate with electromagnetic shielding effect and manufacturing technology | |
| CN204272492U (en) | A single-sided flexible circuit board | |
| CN202979466U (en) | Composite flexible printed circuit board structure | |
| CN103029375B (en) | Composite double-face copper foil substrate and manufacture method thereof | |
| JP6748338B1 (en) | Flat antenna board | |
| CN103192563A (en) | Composite double-faced copper foil substrate for flexible printed circuit board | |
| CN103379748B (en) | High-frequency mixed-compression board and preparation method thereof | |
| CN202782009U (en) | Composite double-sided copper clad laminate | |
| CN207014920U (en) | A kind of coloured ultra-thin cover layer of high frequency | |
| CN205105448U (en) | Combined type is folded and is constructed low dielectricity glued membrane of high frequency |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150121 |
|
| RJ01 | Rejection of invention patent application after publication |