CN104250815A - SW-200 polishing agent - Google Patents
SW-200 polishing agent Download PDFInfo
- Publication number
- CN104250815A CN104250815A CN201410023532.7A CN201410023532A CN104250815A CN 104250815 A CN104250815 A CN 104250815A CN 201410023532 A CN201410023532 A CN 201410023532A CN 104250815 A CN104250815 A CN 104250815A
- Authority
- CN
- China
- Prior art keywords
- surfactant
- polishing agent
- rumbling compound
- triethanolamine
- agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 title abstract description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 8
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical class OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims abstract description 8
- GOQYKNQRPGWPLP-UHFFFAOYSA-N heptadecan-1-ol Chemical compound CCCCCCCCCCCCCCCCCO GOQYKNQRPGWPLP-UHFFFAOYSA-N 0.000 claims abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 6
- AOMUHOFOVNGZAN-UHFFFAOYSA-N N,N-bis(2-hydroxyethyl)dodecanamide Chemical compound CCCCCCCCCCCC(=O)N(CCO)CCO AOMUHOFOVNGZAN-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000008367 deionised water Substances 0.000 claims abstract description 4
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 4
- RHPXYIKALIRNFA-UHFFFAOYSA-L disodium;2-[carboxylatomethyl(carboxymethyl)amino]acetate Chemical compound [Na+].[Na+].OC(=O)CN(CC([O-])=O)CC([O-])=O RHPXYIKALIRNFA-UHFFFAOYSA-L 0.000 claims abstract description 4
- 150000001875 compounds Chemical class 0.000 claims description 14
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 9
- 108010037003 Buserelin Proteins 0.000 claims description 3
- 239000013543 active substance Substances 0.000 claims description 3
- CUWODFFVMXJOKD-UVLQAERKSA-N buserelin Chemical compound CCNC(=O)[C@@H]1CCCN1C(=O)[C@H](CCCN=C(N)N)NC(=O)[C@H](CC(C)C)NC(=O)[C@@H](COC(C)(C)C)NC(=O)[C@@H](NC(=O)[C@H](CO)NC(=O)[C@H](CC=1C2=CC=CC=C2NC=1)NC(=O)[C@H](CC=1NC=NC=1)NC(=O)[C@H]1NC(=O)CC1)CC1=CC=C(O)C=C1 CUWODFFVMXJOKD-UVLQAERKSA-N 0.000 claims description 3
- 229960002719 buserelin Drugs 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 229960004418 trolamine Drugs 0.000 claims description 3
- REIUXOLGHVXAEO-UHFFFAOYSA-N pentadecan-1-ol Chemical compound CCCCCCCCCCCCCCCO REIUXOLGHVXAEO-UHFFFAOYSA-N 0.000 abstract 2
- 239000004094 surface-active agent Substances 0.000 abstract 2
- AXQALUPQQROVIX-UHFFFAOYSA-N C(C)NC(CC(O)(C(=O)O)CC(=O)O)=O Chemical compound C(C)NC(CC(O)(C(=O)O)CC(=O)O)=O AXQALUPQQROVIX-UHFFFAOYSA-N 0.000 abstract 1
- 239000013556 antirust agent Substances 0.000 abstract 1
- 230000007613 environmental effect Effects 0.000 abstract 1
- 239000002736 nonionic surfactant Substances 0.000 abstract 1
- 229940051841 polyoxyethylene ether Drugs 0.000 abstract 1
- 229920000056 polyoxyethylene ether Polymers 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 229910052759 nickel Inorganic materials 0.000 description 6
- 239000007789 gas Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000003599 detergent Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000009956 embroidering Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
Landscapes
- Detergent Compositions (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
The invention relates to an SW-200 polishing agent, which comprises the following components: (weight percentage) 15% of a nitrilotriacetic acid disodium salt, 2% of a triethanolamine salt of citric acid ethyl amide, 2.2% of pentadecanol to heptadecanol polyoxyethylene ether, 0.3% of triethanolamine, 1.2% of a surfactant, 0.4% of an antirust agent, 5% of ethanol, 70% of deionized water, 1.6% of lauric acid diethanolamine and the balance water. Specifically, the surfactant is non-ionic surfactant 6501. The polishing agent provided by the invention has stable performance, strong light coverage ability, fast polishing speed, small dosage and no corrosive gas, thus being conducive to environmental protection and staff health.
Description
Technical field
The present invention relates to a kind of rumbling compound, be mainly applicable to the polished finish of the metallic surfaces such as nickel layer.
Background technology
Metal products in use, due to oxidation in air, moist or reason such as contact chemical substance and corrosive gases etc., cause surface of metal product corrosion, adhere to dirty greasy dirt situation, bright and clean in order to increase surface of metal product, usually adopt the metal detergent of chemistry or metal polish to process.Existing metal detergent or rumbling compound kind numerous, the mixing acid of nitric acid and hydrofluoric acid is used mostly for nickel layer metal, moves back nickel agent or vinegar is removed, but majority all to there is cleaning performance not strong, polishing velocity too low with, required various preparation consumptions are large and there is the number of drawbacks such as corrosive gases, especially for part or the goods of complexity, exist and return the problem of embroidering fast, bright hiding power difference.
Summary of the invention
The object of the invention is for above task design a kind of SW-200 rumbling compound, the surface smoothness of metal products particularly nickel layer metal products can be improved, and this rumbling compound polishing velocity is fast, consumption is few, on the healthy nothing impact of operator, there is not the etching problem to factory building and equipment yet.
The present invention is achieved by the following technical solutions:
A kind of SW-200 rumbling compound, comprise following composition: (weight percent) nitrilotriacetic acid disodium salt 15%, the triethanolamine salt 2% of citric acid buserelin, 10 five to heptadecanol Soxylat A 25-7s 2.2%, trolamine 0.3%, tensio-active agent 1.2%, rust-preventive agent 0.4%, ethanol 5%, deionized water 70%, lauric acid diethanolamine 1.6% and excess water.
Described glass or plastic containers 6501.
Rumbling compound of the present invention is a kind of flaxen transparent liquid, and the density range under normal temperature is 1.03-1.07 kilogram/every cubic decimeter, and pH value, in alkalescence, is specially 8-9.
Compared with prior art, the invention has the beneficial effects as follows:
1, rumbling compound stable performance of the present invention, cleaning performance is strong, and polishing velocity is fast, and dosage amounts is few, can increase metallic surface brightness, is the desirable rumbling compound of nickel layer metal;
2, brightness coverage capability of the present invention is strong, simultaneously product not chlorine-containing components, and degradation production is few, non-corrosiveness gas, can not cause environmental pollution, healthy harmless to staff.
Embodiment
A kind of SW-200 rumbling compound, comprise following composition: (weight percent) nitrilotriacetic acid disodium salt 15%, the triethanolamine salt 2% of citric acid buserelin, 10 five to heptadecanol Soxylat A 25-7s 2.2%, trolamine 0.3%, tensio-active agent 1.2%, rust-preventive agent 0.4%, ethanol 5%, deionized water 70%, lauric acid diethanolamine 1.6% and excess water.
Described glass or plastic containers 6501.
The rumbling compound utilizing above-mentioned formula to make uses through domestic production and proves, not only cleaning performance is strong, polishing velocity is fast, and consumption dosage is few, do not produce corrosive gases, to the healthy fanout free region of staff, performance and consumption all reaching similar products at home and abroad standard, is the desirable rumbling compound of nickel layer.
In sum, be only preferred embodiment of the present invention, not be used for limiting scope of the invention process, all equalizations of doing according to shape, structure, feature and the spirit described in the claims in the present invention scope change and modify, and all should be included in right of the present invention.
Claims (2)
1. a SW-200 rumbling compound, is characterized in that: be prepared into by the triethanolamine salt of 15% nitrilotriacetic acid disodium salt of weight percent, 2% citric acid buserelin, 2.2% ten five to heptadecanol Soxylat A 25-7,0.3% trolamine, 1.2% tensio-active agent, 0.4% rust-preventive agent, 5% ethanol, 70% deionized water, 1.6% lauric acid diethanolamine and excess water.
2. SW-200 rumbling compound according to claim 1, is characterized in that: described glass or plastic containers 6501.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410023532.7A CN104250815A (en) | 2014-01-17 | 2014-01-17 | SW-200 polishing agent |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410023532.7A CN104250815A (en) | 2014-01-17 | 2014-01-17 | SW-200 polishing agent |
Publications (1)
Publication Number | Publication Date |
---|---|
CN104250815A true CN104250815A (en) | 2014-12-31 |
Family
ID=52186055
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410023532.7A Pending CN104250815A (en) | 2014-01-17 | 2014-01-17 | SW-200 polishing agent |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104250815A (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5047095A (en) * | 1988-01-14 | 1991-09-10 | Henkel Kommanditgesellschaft Auf Aktien | Process for simultaneous smoothing, cleaning, and surface protection of metal objects |
US20050211951A1 (en) * | 2004-03-24 | 2005-09-29 | Kelley Francis J | Compositions and methods for polishing copper |
CN101368068A (en) * | 2007-08-16 | 2009-02-18 | 江苏海迅实业集团股份有限公司 | Nano-silicon dioxide abrasive material polishing solution for polishing copper |
CN101532137A (en) * | 2009-04-21 | 2009-09-16 | 刘丽 | Metal polishing agent |
CN102140313A (en) * | 2011-01-06 | 2011-08-03 | 清华大学 | In-situ combination abrasive particle copper polishing composition |
CN102796460A (en) * | 2012-08-31 | 2012-11-28 | 安特迪(天津)科技有限公司 | Silicon dioxide-based CMP (Chemical Mechanical Polishing) solution and preparation method thereof |
-
2014
- 2014-01-17 CN CN201410023532.7A patent/CN104250815A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5047095A (en) * | 1988-01-14 | 1991-09-10 | Henkel Kommanditgesellschaft Auf Aktien | Process for simultaneous smoothing, cleaning, and surface protection of metal objects |
US20050211951A1 (en) * | 2004-03-24 | 2005-09-29 | Kelley Francis J | Compositions and methods for polishing copper |
CN101368068A (en) * | 2007-08-16 | 2009-02-18 | 江苏海迅实业集团股份有限公司 | Nano-silicon dioxide abrasive material polishing solution for polishing copper |
CN101532137A (en) * | 2009-04-21 | 2009-09-16 | 刘丽 | Metal polishing agent |
CN102140313A (en) * | 2011-01-06 | 2011-08-03 | 清华大学 | In-situ combination abrasive particle copper polishing composition |
CN102796460A (en) * | 2012-08-31 | 2012-11-28 | 安特迪(天津)科技有限公司 | Silicon dioxide-based CMP (Chemical Mechanical Polishing) solution and preparation method thereof |
Non-Patent Citations (1)
Title |
---|
杨继生: "《表面活性剂原理与应用》", 31 December 2012 * |
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PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20141231 |