CN104226568A - LED (Light emitting diode) fluorescent powder coating method and system based on 3D printing principle - Google Patents
LED (Light emitting diode) fluorescent powder coating method and system based on 3D printing principle Download PDFInfo
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Abstract
本发明涉及一种基于3D打印原理的LED荧光粉涂覆方法及系统。工业上使用的LED荧光粉涂覆方法都存在涂层厚度不均匀的问题,严重影响白光LED的热阻分散性、色品一致性、出光效率等封装质量。本发明通过改进传统的涂覆工艺,先采用真空搅拌除泡装置对荧光粉胶进行除泡处理,然后采用压电涂覆喷头进行加热恒温控制,实现降低和稳定荧光粉胶粘度功能,并采用基于3D打印原理的压电涂覆喷头控制每次喷出的荧光粉胶微滴的大小及数量,采用高精度运动xyz轴运动平台控制每次喷出的荧光粉胶微滴的涂覆位置,实现提高大功率白光LED芯片或芯片模组的荧光粉涂覆精度,从而达到大功率白光LED芯片模组中荧光粉层厚度及形状的保型涂覆要求。
The invention relates to a method and system for coating LED fluorescent powder based on the principle of 3D printing. The LED phosphor coating methods used in industry all have the problem of uneven coating thickness, which seriously affects the packaging quality of white LEDs such as thermal resistance dispersion, chromaticity consistency, and light extraction efficiency. In the present invention, by improving the traditional coating process, the vacuum stirring and defoaming device is used to remove the foam of the fluorescent powder glue, and then the piezoelectric coating nozzle is used for heating and constant temperature control, so as to realize the function of reducing and stabilizing the viscosity of the phosphor powder glue, and The piezoelectric coating nozzle based on the 3D printing principle is used to control the size and quantity of the phosphor glue droplets sprayed each time, and the high-precision motion xyz axis motion platform is used to control the coating position of the phosphor glue droplets sprayed each time , to improve the phosphor coating accuracy of high-power white LED chips or chip modules, so as to meet the conformal coating requirements of the phosphor layer thickness and shape in high-power white LED chip modules.
Description
技术领域technical field
本发明涉及LED荧光粉涂覆技术领域,尤其涉及一种基于3D打印原理的LED荧光粉涂覆方法及系统。The invention relates to the technical field of LED fluorescent powder coating, in particular to a method and system for coating LED fluorescent powder based on the principle of 3D printing.
背景技术Background technique
白光LED是一种新型半导体全固态照明光源。与传统照明技术相比,这种新型光源具有高效节能、长寿命、小体积、易维护、绿色环保、使用安全、耐候性好等领先优势,被公认为是未来照明光源之首选。White LED is a new type of semiconductor all-solid-state lighting source. Compared with traditional lighting technology, this new type of light source has leading advantages such as high efficiency and energy saving, long life, small size, easy maintenance, green environmental protection, safe use, and good weather resistance. It is recognized as the first choice for future lighting sources.
白光LED封装是推动国际半导体照明和显示迅速发展的关键工艺,而荧光粉涂敷是目前国际上实现蓝光LED向白光LED转换的主流技术。而荧光粉涂覆的厚度不均是造成白光LED角向色温差异的主要原因。目前,大功率LED荧光粉涂覆工艺主要是用点胶法和喷涂法两种方法实现的,而这两种传统控制方法都无法保证在大规模的工业生产下,每一次荧光粉涂覆量的一致性,即荧光粉层的涂覆厚度每一次都有细微差别。从而使得生产出的大功率白光LED无法有效提高白光LED封装的热阻分散性、色品一致性、出光效率等封装质量。3D打印技术,是一种以数字模型文件为基础,运用粉末状金属或塑料等可粘合材料,通过逐层打印的方式来构造物体的技术。White LED packaging is a key process to promote the rapid development of international semiconductor lighting and display, while phosphor coating is currently the mainstream technology for realizing the conversion from blue LED to white LED in the world. The uneven thickness of phosphor powder coating is the main reason for the difference in angular color temperature of white light LEDs. At present, the high-power LED phosphor coating process is mainly realized by two methods: dispensing and spraying, and these two traditional control methods cannot guarantee the amount of phosphor coating each time under large-scale industrial production. Consistency, that is, the coating thickness of the phosphor layer is slightly different every time. As a result, the produced high-power white LEDs cannot effectively improve packaging quality such as thermal resistance dispersion, chromaticity consistency, and light extraction efficiency of the white LED packaging. 3D printing technology is a technology that uses bondable materials such as powdered metal or plastic to construct objects by layer-by-layer printing based on digital model files.
本发明在现有涂覆工艺的基础上,增加了真空搅拌除泡装置用于简化现有涂覆工艺,有效清除荧光粉胶混合后含有的微小气泡;增加了喷头恒温控制装置用于对压电荧光粉喷头进行恒温控制,达到降低和稳定所述压电荧光粉喷头内的荧光粉胶粘度的目的;基于3D打印的原理,使用压电荧光粉喷头(例如EFD公司生产的PICO系列压电喷头)把荧光粉层打印到LED芯片,使其克服传统涂覆工艺的缺点,达到高精度高均匀度的涂覆效果。On the basis of the existing coating process, the present invention adds a vacuum stirring and defoaming device to simplify the existing coating process, and effectively removes tiny bubbles contained in the mixed fluorescent powder and glue; adds a nozzle constant temperature control device to control the pressure The electric phosphor nozzle is subjected to constant temperature control to reduce and stabilize the viscosity of the fluorescent powder in the piezoelectric phosphor nozzle; Electrospray head) prints the phosphor layer to the LED chip, so that it overcomes the shortcomings of the traditional coating process and achieves a high-precision and high-uniformity coating effect.
发明内容Contents of the invention
本发明的目的之一在于提供一种基于3D打印原理的LED荧光粉涂覆方法及系统,能有效提高荧光粉涂覆量和涂覆厚度的一致性,提高白光LED的光源品质和成品率,具体技术方案如下。One of the purposes of the present invention is to provide a method and system for coating LED phosphor powder based on the principle of 3D printing, which can effectively improve the consistency of phosphor powder coating amount and coating thickness, and improve the light source quality and yield of white LEDs. The specific technical scheme is as follows.
一种基于3D打印原理的LED荧光粉涂覆系统,用于完成LED芯片上的荧光粉层厚度及形状的保型涂覆工序,包括下位机系统和上位机系统,下位机系统包括压电荧光粉喷头和xyz轴运动平台;上位机系统包括涂覆控制模块和运动控制模块;所述下位机系统还包括喷头恒温控制装置和真空搅拌除泡装置,上位机系统还包括除泡控制模块;涂覆控制模块分别连接压电荧光粉喷头和喷头恒温控制装置,除泡控制模块连接真空搅拌除泡装置,运动控制模块连接xyz轴运动平台,压电荧光粉喷头安装在xyz轴运动平台上;通过涂覆控制模块和运动控制模块基于3D打印原理控制压电荧光粉喷头在LED芯片上涂覆所述荧光粉层。An LED phosphor coating system based on the principle of 3D printing, used to complete the conformal coating process of the thickness and shape of the phosphor layer on the LED chip, including the lower computer system and the upper computer system, the lower computer system includes piezoelectric fluorescent powder spray head and xyz axis motion platform; the upper computer system includes a coating control module and a motion control module; the lower computer system also includes a nozzle constant temperature control device and a vacuum stirring defoaming device, and the upper computer system also includes a defoaming control module; coating The overlay control module is respectively connected to the piezoelectric phosphor nozzle and the nozzle constant temperature control device, the defoaming control module is connected to the vacuum stirring and defoaming device, the motion control module is connected to the xyz axis motion platform, and the piezoelectric phosphor nozzle is installed on the xyz axis motion platform; through The coating control module and the motion control module control the piezoelectric phosphor spray head to coat the phosphor layer on the LED chip based on the 3D printing principle.
进一步优选的,所述压电荧光粉喷头使用压电陶瓷,通过压电陶瓷的形变将喷头内部的荧光粉胶挤压出喷头外部,用于喷涂荧光粉胶。Further preferably, the piezoelectric phosphor nozzle uses piezoelectric ceramics, and the phosphor glue inside the nozzle is extruded out of the nozzle through deformation of the piezoelectric ceramic for spraying phosphor glue.
进一步优选的,所述喷头恒温控制装置包括发热丝和热敏电阻,发热丝和热敏电阻安装在所述压电荧光粉喷头的内部或外部,用于对所述压电荧光粉喷头进行恒温控制。Further preferably, the nozzle constant temperature control device includes a heating wire and a thermistor, and the heating wire and the thermistor are installed inside or outside the piezoelectric phosphor nozzle for constant temperature of the piezoelectric phosphor nozzle. control.
进一步优选的,所述真空搅拌除泡装置包括:荧光粉胶容器,用于存储待涂覆的荧光粉胶;电动搅拌棒,电动搅拌棒从所述荧光粉胶容器开口伸入荧光粉胶容器中,用于搅拌荧光粉胶;空气阀门,空气阀门安装在所述荧光粉胶容器开口,用于抽出荧光粉胶容器内的空气;通过空气阀门把装有待涂覆荧光粉胶的荧光粉胶容器内部的空气抽出,形成真空环境,在真空环境下电动搅拌棒不断的搅拌,把装置内荧光粉胶的气泡从装置的底部搅拌到荧光粉胶表面最终消除。Further preferably, the vacuum stirring and defoaming device includes: a phosphor glue container for storing the phosphor glue to be coated; an electric stirring rod, and the electric stirring rod extends into the phosphor glue container from the opening of the phosphor glue container Among them, it is used to stir the phosphor glue; the air valve, the air valve is installed on the opening of the phosphor glue container, and is used to extract the air in the phosphor glue container; through the air valve, the phosphor glue to be coated The air inside the container is pumped out to form a vacuum environment. In the vacuum environment, the electric stirring rod is continuously stirred to stir the bubbles of the phosphor glue in the device from the bottom of the device to the surface of the phosphor glue and finally eliminate them.
进一步优选的,xyz轴运动平台采用伺服电机和直线电机,用于控制所述压电荧光粉喷头在xyz轴方向上移动。Further preferably, the xyz-axis motion platform uses servo motors and linear motors to control the movement of the piezoelectric phosphor nozzle in the xyz-axis direction.
进一步优选的,涂覆控制模块,用于控制压电荧光粉喷头涂覆过程中荧光粉微滴大小、喷涂数量和控制喷头恒温控制装置对压电荧光粉喷头进行加热恒温控制,从而降低和稳定喷头内部荧光粉胶的粘度;所诉运动控制模块用于控制xyz轴运动平台对压电荧光粉喷头进行xyz轴向的移动;所述除泡控制模块,用于控制真空搅拌除泡装置对刚混合完成的荧光粉胶进行除泡工序。Further preferably, the coating control module is used to control the size of phosphor droplets, the spraying quantity and the constant temperature control device for controlling the piezoelectric phosphor nozzle in the coating process of the piezoelectric phosphor nozzle to control the heating constant temperature of the piezoelectric phosphor nozzle, thereby reducing and stabilizing The viscosity of the fluorescent powder glue inside the nozzle; the motion control module is used to control the xyz axis motion platform to move the piezoelectric phosphor nozzle in the xyz direction; the defoaming control module is used to control the vacuum stirring and defoaming device for rigid The phosphor powder glue that has been mixed is subjected to a defoaming process.
一种使用上述基于3D打印原理的LED荧光粉涂覆系统的涂覆方法,其中涂覆控制模块控制压电荧光粉喷头每次喷出的荧光粉胶微滴的大小及数量;运动控制模块通过控制xyz轴运动平台移动从而控制压电荧光粉喷头每次喷出的荧光粉胶微滴的涂覆位置,具体包括以下步骤:A coating method using the above-mentioned LED phosphor coating system based on the 3D printing principle, wherein the coating control module controls the size and quantity of phosphor glue droplets sprayed by the piezoelectric phosphor nozzle each time; the motion control module passes Control the movement of the xyz-axis motion platform to control the coating position of the phosphor glue droplets sprayed by the piezoelectric phosphor nozzle each time, specifically including the following steps:
4.1在上位机系统设定待涂覆LED芯片位置、大小,荧光粉层的形状和厚度信息,然后计算得出压电荧光粉喷头每次喷出的荧光粉胶微滴的大小及数量的控制参数与压电荧光粉喷头的荧光粉层3D打印喷涂路径控制参数;4.1 Set the position and size of the LED chip to be coated, the shape and thickness information of the phosphor layer in the host computer system, and then calculate the control of the size and quantity of the phosphor glue droplets sprayed by the piezoelectric phosphor nozzle each time Parameters and control parameters of the phosphor layer 3D printing spraying path of the piezoelectric phosphor nozzle;
4.2除泡控制模块控制真空搅拌除泡装置消除荧光粉胶容器内刚混合好的荧光粉胶内部的气泡,与此同时,涂覆控制模块通过喷头恒温控制装置把压电荧光粉喷头加热到工作温度;4.2 The defoaming control module controls the vacuum stirring and defoaming device to eliminate the bubbles inside the fluorescent powder glue that has just been mixed in the phosphor glue container. At the same time, the coating control module heats the piezoelectric phosphor nozzle to work through the nozzle constant temperature control device. temperature;
4.3待步骤4.2完成后,运动控制模块通过控制xyz轴运动平台把压电荧光粉喷头移动到待涂覆的LED芯片上方;4.3 After step 4.2 is completed, the motion control module moves the piezoelectric phosphor nozzle to the top of the LED chip to be coated by controlling the xyz axis motion platform;
4.4待步骤4.3完成后,使用步骤4.1所计算得出的控制参数,涂覆控制模块和运动控制模块基于3D打印原理控制压电荧光粉喷头在LED芯片上涂覆所述荧光粉层,具体是运动控制模块根据3D打印喷涂路径控制参数控制xyz轴运动平台移动,同时涂覆控制模块根据荧光粉胶微滴的大小及数量的控制参数控制压电荧光粉喷头在LED芯片上打印出所需荧光粉层;4.4 After step 4.3 is completed, using the control parameters calculated in step 4.1, the coating control module and motion control module control the piezoelectric phosphor nozzle to coat the phosphor layer on the LED chip based on the 3D printing principle, specifically The motion control module controls the movement of the xyz-axis motion platform according to the control parameters of the 3D printing spraying path. At the same time, the coating control module controls the piezoelectric phosphor nozzle to print the required fluorescent light on the LED chip according to the control parameters of the size and quantity of phosphor glue droplets. Powder layer;
4.5判断是否需要对下一个LED芯片进行涂覆,如果需要,则转到步骤4.3;如果完成,则结束。4.5 Judging whether the next LED chip needs to be coated, if so, go to step 4.3; if finished, then end.
本发明在传统的点胶法和喷涂法两种涂覆工艺的基础上,增加了真空搅拌除泡装置用于简化现有涂覆工艺,有效清除荧光粉胶混合后含有的微小气泡;增加了喷头恒温控制装置用于对压电荧光粉喷头进行恒温控制,达到降低和稳定所述压电荧光粉喷头内的荧光粉胶粘度的目的,并采用基于3D打印原理的压电涂覆喷头控制每次喷出的荧光粉胶微滴的大小及数量,采用高精度运动xyz轴运动平台控制每次喷出的荧光粉胶微滴的涂覆位置,实现精确控制大功率白光LED芯片或芯片模组的荧光粉涂覆过程,从而达到大功率白光LED芯片模组中荧光粉层厚度及形状的保型涂覆要求。On the basis of the traditional dispensing method and spraying method, the present invention adds a vacuum stirring and defoaming device to simplify the existing coating process and effectively remove the tiny air bubbles contained in the mixed phosphor powder and glue; The constant temperature control device of the nozzle is used for constant temperature control of the piezoelectric phosphor nozzle to reduce and stabilize the viscosity of the fluorescent powder in the piezoelectric phosphor nozzle, and adopts the piezoelectric coating nozzle control based on the principle of 3D printing The size and quantity of phosphor glue droplets sprayed each time, using a high-precision motion xyz axis motion platform to control the coating position of phosphor glue droplets sprayed each time, to achieve precise control of high-power white LED chips or chip molds The phosphor powder coating process of the group, so as to meet the conformal coating requirements of the thickness and shape of the phosphor layer in the high-power white LED chip module.
本发明与现有技术相比,具有以下优点和有益效果:本发明采用基于3D打印原理的荧光粉涂覆方法,使用压电荧光粉喷头作为荧光粉打印头,在大功率LED芯片上打印出所需的荧光粉涂层,可以应用于大功率白光LED或LED芯片模组的荧光粉涂覆封装过程中,而且还可以应用在wafer级芯片涂覆中,可以精确控制各种粘度的涂覆用胶的涂覆量、涂层厚度以及图层形状,大大提高荧光粉涂层的涂覆精度,并保证涂层厚度的一致性。Compared with the prior art, the present invention has the following advantages and beneficial effects: the present invention adopts the phosphor coating method based on the 3D printing principle, uses the piezoelectric phosphor nozzle as the phosphor print head, and prints out The required phosphor coating can be applied to the phosphor coating and packaging process of high-power white LED or LED chip modules, and can also be applied to wafer-level chip coating, which can precisely control the coating of various viscosities The amount of glue applied, the thickness of the coating and the shape of the layer greatly improve the coating accuracy of the phosphor coating and ensure the consistency of the coating thickness.
附图说明Description of drawings
图1是本发明提供的基于3D打印原理的LED荧光粉涂覆系统框图。Fig. 1 is a block diagram of an LED phosphor coating system based on the principle of 3D printing provided by the present invention.
具体实施方式Detailed ways
为了对本发明的技术特征、目的和效果有更加清楚的理解,现对照附图详细说明本发明的具体实施方式。In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific implementation manners of the present invention will now be described in detail with reference to the accompanying drawings.
本实例的一种基于3D打印原理的LED荧光粉涂覆系统所述如图1所示,包括上位机系统11和下位机系统10。下位机系统包括压电荧光粉喷头12和xyz轴运动平台14;上位机系统包括涂覆控制模块16和运动控制模块17;所述下位机系统还包括喷头恒温控制装置13和真空搅拌除泡装置15,上位机系统还包括除泡控制模块18;涂覆控制模块分别连接压电荧光粉喷头和喷头恒温控制装置,除泡控制模块连接真空搅拌除泡装置,运动控制模块连接xyz轴运动平台,压电荧光粉喷头安装在xyz轴运动平台上;通过涂覆控制模块和运动控制模块基于3D打印原理控制压电荧光粉喷头在LED芯片上涂覆所述荧光粉层An LED phosphor coating system based on the principle of 3D printing in this example is shown in FIG. 1 , including an upper computer system 11 and a lower computer system 10 . The lower computer system includes a piezoelectric phosphor nozzle 12 and an xyz axis motion platform 14; the upper computer system includes a coating control module 16 and a motion control module 17; the lower computer system also includes a nozzle constant temperature control device 13 and a vacuum stirring and defoaming device 15. The host computer system also includes a defoaming control module 18; the coating control module is respectively connected to the piezoelectric phosphor nozzle and the constant temperature control device of the nozzle, the defoaming control module is connected to the vacuum stirring and defoaming device, and the motion control module is connected to the xyz axis motion platform. The piezoelectric phosphor nozzle is installed on the xyz axis motion platform; the piezoelectric phosphor nozzle is controlled by the coating control module and the motion control module based on the 3D printing principle to coat the phosphor layer on the LED chip
优选的,所述压电荧光粉喷头12使用压电陶瓷,通过压电陶瓷的形变将喷头内部的荧光粉胶挤压出喷头外部,用于喷涂荧光粉胶;所述喷头恒温控制装置13包括发热丝和热敏电阻,发热丝和热敏电阻安装在所述压电荧光粉喷头12的内部或外部,用于对所述压电荧光粉喷头12进行恒温控制;所述真空搅拌除泡装置15包括荧光粉胶容器,用于存储待涂覆的荧光粉胶;电动搅拌棒,电动搅拌棒从所述荧光粉胶容器开口伸入荧光粉胶容器中,用于搅拌荧光粉胶;空气阀门,空气阀门安装在所述荧光粉胶容器开口,用于抽出荧光粉胶容器内的空气;通过空气阀门把装有待涂覆荧光粉胶的荧光粉胶容器内部的空气抽出,形成真空环境,在真空环境下电动搅拌棒不断的搅拌,把装置内荧光粉胶的气泡从装置的底部搅拌到荧光粉胶表面最终消除;xyz轴运动平台14使用伺服电机、直线电机,用于控制所述压电荧光粉喷头12在xyz轴方向上移动。Preferably, the piezoelectric phosphor nozzle 12 uses piezoelectric ceramics, and the phosphor glue inside the nozzle is extruded out of the nozzle through the deformation of the piezoelectric ceramics for spraying phosphor glue; the nozzle constant temperature control device 13 includes A heating wire and a thermistor, the heating wire and a thermistor are installed inside or outside the piezoelectric phosphor nozzle 12 for constant temperature control of the piezoelectric phosphor nozzle 12; the vacuum stirring and defoaming device 15 includes a phosphor glue container for storing the phosphor glue to be coated; an electric stirring rod, which extends into the phosphor glue container from the opening of the phosphor glue container for stirring the phosphor glue; an air valve , the air valve is installed in the opening of the phosphor glue container, and is used to extract the air in the phosphor glue container; through the air valve, the air inside the phosphor glue container to be coated with phosphor glue is drawn out to form a vacuum environment. Under the vacuum environment, the electric stirring rod is continuously stirred, and the bubbles of the phosphor glue in the device are stirred from the bottom of the device to the surface of the phosphor glue and finally eliminated; the xyz axis motion platform 14 uses servo motors and linear motors to control the piezoelectric The phosphor spray head 12 moves in the xyz axis direction.
涂覆控制模块16,用于控制压电荧光粉喷头12涂覆过程中荧光粉微滴大小、喷涂数量和控制喷头恒温控制装置13对压电荧光粉喷头12进行加热恒温控制,从而降低和稳定喷头内部荧光粉胶的粘度;所诉运动控制模块17用于控制xyz轴运动平台14对压电荧光粉喷头12进行xyz轴向的移动;所述除泡控制模块18,用于控制真空搅拌除泡装置15对刚混合好的荧光粉胶进行除泡工序。The coating control module 16 is used to control the size of the phosphor droplet, the spraying quantity, and the constant temperature control device 13 to control the heating and constant temperature of the piezoelectric phosphor nozzle 12 during the coating process of the piezoelectric phosphor nozzle 12, thereby reducing and stabilizing The viscosity of the fluorescent powder glue inside the nozzle; the motion control module 17 is used to control the xyz axis motion platform 14 to move the piezoelectric phosphor nozzle 12 in the xyz direction; the defoaming control module 18 is used to control the vacuum stirring and removing The bubble device 15 performs a defoaming process on the phosphor glue that has just been mixed.
本实例的基于3D打印原理的LED荧光粉涂覆方法,包括以下步骤和内容:The LED phosphor coating method based on the 3D printing principle of this example includes the following steps and contents:
步骤(1)在涂覆控制模块16中,设定待涂覆LED芯片位置、大小,理想荧光粉层的形状和厚度等信息,然后计算得出每次喷出压电荧光粉喷头的荧光粉胶微滴的大小的控制参数与压电荧光粉喷头的理想荧光粉层3D打印喷涂路径控制参数等涂覆控制参数,其算法如下:Step (1) In the coating control module 16, set the position and size of the LED chip to be coated, the shape and thickness of the ideal phosphor layer and other information, and then calculate the phosphor powder sprayed out of the piezoelectric phosphor nozzle each time. Coating control parameters such as the control parameters of the size of the glue droplet and the ideal phosphor layer 3D printing spray path control parameters of the piezoelectric phosphor nozzle, the algorithm is as follows:
αVt=NVr αV t = NV r
其中,Vt为待涂覆LED芯片使用保型涂覆法理论上需要用到的荧光粉胶量,可以通过待涂覆LED芯片的长、宽、高和荧光粉层的厚度等信息计算得出;Vr为压电荧光粉喷头12实际每一次需要喷出的荧光粉微滴的胶量,需要根据不同的LED芯片尺寸和荧光粉层厚度,通过实验得到实际最佳微滴胶量(例如:边长为1.5毫米的大功率LED芯片,所测得的最佳微滴胶量为16微微升;边长为1.0毫米的大功率LED芯片,所测得的最佳微滴胶量为13微微升;边长为0.83毫米的大功率LED芯片,所测得的最佳微滴胶量为10微微升),或者直接使用压电荧光粉喷头可喷出的最小微滴胶量(8微微升);α为理论值与实际值的转换系数,需要根据不同粘度的荧光粉胶,通过实验得到最佳的转换系数;N为待涂覆的LED芯片使用3D打印原理涂覆实际上需要涂覆的微滴数量,可以根据已知的参数Vt、Vr、α计算得出。通过Vr和荧光粉胶的粘度可以计算得出压压电荧光粉喷头12的控制电压与当前LED芯片的3D打印轨迹中下一个待喷出的荧光粉微滴的位置偏移坐标;Among them, V t is the amount of phosphor glue theoretically required by the conformal coating method for the LED chip to be coated, which can be calculated from the length, width, height and thickness of the phosphor layer of the LED chip to be coated. V r is the glue amount of the fluorescent powder micro-droplets that need to be ejected each time actually by the piezoelectric phosphor nozzle 12. It needs to obtain the actual optimum micro-droplet glue amount through experiments according to different LED chip sizes and phosphor layer thicknesses ( For example: for a high-power LED chip with a side length of 1.5 mm, the measured optimal amount of micro-droplet glue is 16 picoliters; for a high-power LED chip with a side length of 1.0 mm, the measured optimal amount of micro-droplet glue is 13 picoliters; for a high-power LED chip with a side length of 0.83 mm, the measured optimum micro-droplet volume is 10 picoliters), or the minimum micro-droplet volume that can be sprayed directly using a piezoelectric phosphor nozzle (8 picoliters); α is the conversion coefficient between the theoretical value and the actual value, and the best conversion coefficient needs to be obtained through experiments according to different viscosities of phosphor glue; N is the LED chip to be coated using the 3D printing principle. The number of droplets coated can be calculated from the known parameters V t , V r , α. The control voltage of the piezoelectric phosphor nozzle 12 and the position offset coordinate of the next phosphor droplet to be ejected in the 3D printing track of the current LED chip can be calculated through V r and the viscosity of the phosphor glue;
步骤(2)使用真空搅拌除泡装置13消除装置内刚混合好的荧光粉胶内部的气泡,与此同时,通过喷头恒温控制装置15把压电荧光粉喷头12加热到工作温度;Step (2) Use the vacuum stirring and defoaming device 13 to eliminate the bubbles inside the fluorescent powder glue that has just been mixed in the device, and at the same time, heat the piezoelectric phosphor nozzle 12 to the working temperature through the nozzle constant temperature control device 15;
步骤(3)待步骤(2)完成后,通过xyz轴运动控制装置14把压电荧光粉喷头12移动到待涂覆的LED芯片上方;Step (3) After step (2) is completed, the piezoelectric phosphor nozzle 12 is moved to the top of the LED chip to be coated through the xyz axis motion control device 14;
步骤(4)待步骤(3)完成后,使用步骤(1)所计算得出的涂覆控制参数,控制压电荧光粉喷头在3D打印轨迹中喷出多个或一个荧光粉微滴(微滴的数量取决于用户的需要。如果需要提高生产效率,则减少单片LED芯片涂覆荧光粉微滴的数量;如果需要提高荧光粉涂覆精度,则增多单片LED芯片涂覆荧光粉微滴的数量),完成当前LED芯片的基于荧光粉涂覆工作;Step (4) After step (3) is completed, use the coating control parameters calculated in step (1) to control the piezoelectric phosphor nozzle to eject multiple or one phosphor droplet (micro The number of drops depends on the needs of the user. If you need to improve production efficiency, reduce the number of single-chip LED chips coated with phosphor droplets; if you need to improve the accuracy of phosphor coating, increase the number of single-chip LED chip coated phosphor droplets The number of drops), to complete the current LED chip-based phosphor coating work;
步骤(5)判断是否需要对下一个LED芯片进行涂覆,如果需要,则转到步骤(3);如果完成,则结束。Step (5) judging whether the next LED chip needs to be coated, if necessary, then go to step (3); if finished, then end.
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Application publication date: 20141224 |