CN104202928A - Production method for rigid-flex board - Google Patents
Production method for rigid-flex board Download PDFInfo
- Publication number
- CN104202928A CN104202928A CN201410467173.4A CN201410467173A CN104202928A CN 104202928 A CN104202928 A CN 104202928A CN 201410467173 A CN201410467173 A CN 201410467173A CN 104202928 A CN104202928 A CN 104202928A
- Authority
- CN
- China
- Prior art keywords
- rigid
- rigid flex
- semi
- flex
- finished product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000011265 semifinished product Substances 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 claims abstract description 21
- 239000012043 crude product Substances 0.000 claims abstract description 16
- 238000004381 surface treatment Methods 0.000 claims abstract description 7
- 239000002699 waste material Substances 0.000 claims abstract description 7
- 238000005520 cutting process Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 11
- 238000000465 moulding Methods 0.000 claims description 6
- 238000009713 electroplating Methods 0.000 claims description 3
- 238000003825 pressing Methods 0.000 abstract description 3
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000005553 drilling Methods 0.000 abstract 1
- 238000003698 laser cutting Methods 0.000 abstract 1
- 238000005192 partition Methods 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 238000003466 welding Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- 238000003854 Surface Print Methods 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a production method for a rigid-flex board. The production method includes the following steps: producing line graphs on the upper surface and the lower surface of a flexible-board substrate and adhering cover films to the line graphs, and producing line graphs on one surface of a rigid-board semi-finished product; pressing the flexible-board substrate, the covering films, a semi-curing piece and the rigid-board semi-finished product together; connecting the rigid-board semi-finished product in rigid-flex flexible-board billets with the flexible-board substrate through drilling and plating, and producing the line graphs on the other surface of the rigid-board semi-finished product; printing partition welding ink layer on the upper surface and the lower surface of rigid-flex flexible board crude product, performing scoop-type processing on rigid-flex waste edges of the rigid-flex flexible board crude product, and then performing laser cutting on the rigid-flex waste edges of the rigid-flex flexible board crude product; performing surface treatment on rigid-flex flexible board semi-finished product; cutting a rigid-flex flexible board sheet into rigid-flex flexible board blocks; performing die stamping on the portions discovered to expose from the rigid-flex flexible blocks by using a die. By the production method, process variation is decreased, and production time is shortened.
Description
Technical field
The invention discloses a kind of manufacture method of printed substrate, the present invention especially relates to a kind of manufacture method of Rigid Flex.
Background technology
At present, along with consumer electronics product multifunction, lightening, integrated development trend, its printed circuit board (PCB) aligning accuracy is required and product ageing more and more higher.In current rigid-flex, soft board carries out (being called for short the front moulding of soft board) before being molded over rigid-flex pressing, and the method moulding has following shortcoming:
(1), destroy the integrality of soft board, affect the dimensional stability of rigid-flex, increase contraposition difficulty between layers;
(2), soft board need separate and carry out when doing some identical surface treatments with hardboard, the prolongation production time;
(3), soft board could make need obtain soft board harmomegathus while using mould stamp mode time, prolongation production is consuming time.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide a kind of process variation that can reduce can shorten the manufacture method of a kind of Rigid Flex of production time again.
According to technical scheme provided by the invention, the manufacture method of described a kind of Rigid Flex comprises the following steps:
A, in the upper and lower surface of commercially available soft board substrate 1, all make line pattern and stick coverlay 2, on a surface of commercially available hardboard semi-finished product 3, make line pattern;
B, on upper and lower two coverlay 2 surfaces equal superimposed prepreg 4 and hardboard semi-finished product 3 that dragged for window, soft board substrate 1, coverlay 2, prepreg 4 and hardboard semi-finished product 3 are pressed together, make to make the surface of hardboard semi-finished product 3 of line pattern towards soft board substrate 1, obtain Rigid Flex blank;
C, by holing and electroplating the hardboard semi-finished product 3 in Rigid Flex blank and 1 conducting of soft board substrate, on another surface of hardboard semi-finished product 3, make line pattern, obtain Rigid Flex crude product;
D, the upper and lower surface of Rigid Flex crude product all print every weldering ink layer 5, soft or hard at Rigid Flex crude product is dragged for type processing in conjunction with waste material limit, again the soft or hard of Rigid Flex crude product is carried out to radium-shine cutting in conjunction with non-waste material limit, make the degree of depth of line of cut arrive the surface of this side coverlay 2, by taking off lid, coverlay 2 is exposed, obtain Rigid Flex semi-finished product;
E, Rigid Flex semi-finished product are carried out to surface treatment, obtain Rigid Flex sheet material;
F, Rigid Flex sheet material is cut into Rigid Flex bulk;
G, by having been taken off the soft board that exposes of lid on Rigid Flex bulk, partly use the moulding of mould stamp mode.
The thickness of described soft board substrate is 0.049 ~ 0.70mm.
The thickness of described coverlay is 0.0280 ~ 0.0610mm.
The half-finished thickness of described hardboard is 0.500 ~ 1.600mm.
The thickness of described prepreg is 0.025 ~ 0.075mm mm.
The described thickness every weldering ink layer is 0.0101 ~ 0.0305mm.
In step b, pressure force when soft board substrate, coverlay, prepreg and hardboard semi-finished product press together is controlled at 2.6 ~ 2.8MPa.
The present invention can guarantee the integrality of plank size in process of production greatly, can guarantee that again soft board and hardboard carry out surface treatment simultaneously, have reduced process variation and have shortened the production time again.
Accompanying drawing explanation
Fig. 1 is the structural representation of having made the soft board substrate of line pattern in the present invention.
Fig. 2 is the structural representation of coverlay in the present invention.
Fig. 3 is the half-finished structural representation of hardboard in the present invention.
Fig. 4 is the structural representation of Rigid Flex blank in the present invention.
Fig. 5 is the half-finished structural representation of Rigid Flex in the present invention.
Embodiment
Below in conjunction with specific embodiment, the invention will be further described.
The soft board substrate You Songyang Electron Material Co., Ltd that following examples are used provides, and its model is A-2005RD and A-1005ED, and its material consists of polyimides and copper.
The coverlay You Tai rainbow Electron Material Co., Ltd that following examples are used provides, and its model is FHK1025, and its material consists of polyimides and epoxy resin.
The hardboard semi-finished product You Tai photoelectron material Co., Ltd that following examples are used provides, and its model is EM-285, and its material consists of epoxy resin and copper.
The platform photoelectron material Co., Ltd of prepreg You Tai rainbow Electron Material Co., Ltd that following examples are used provides, and its model is BT25 and EM-285, and its material consists of epoxy resin.
What following examples were used is provided by Taiyo Ink Manufacturing Co., Ltd every weldering ink layer, and its model is PSR2000, and its material consists of acrylic type resin and acetic acid-2-(2-ethoxy ethoxy) ethyl ester.
Embodiment 1
1. first on soft board substrate 1, press dry film, then after exposure, development and etching, obtain the soft board substrate with figure, then use pressure programming that coverlay 2 is pressed together on the soft board substrate 1 with figure;
2. hardboard semi-finished product 3 are after press mold, exposure, development and etching, and obtaining one side is the hardboard semi-finished product of full copper face containing figure, one side;
3. use is dragged for type machine and on prepreg, is pulled window out;
4. on soft board substrate 1 surface, all superimposed prepreg 4 and the hardboard semi-finished product 3 that dragged for window (have figure one facing to soft board substrate 1, through pressing, soft board substrate 1, prepreg 4 and hardboard semi-finished product 3 are solidified togather, obtain Rigid Flex blank;
5. by holing and electroplating the hardboard semi-finished product 3 of Rigid Flex blank and 1 conducting of soft board substrate, in rigid-flex semi-finished product, the full copper face of hardboard semi-finished product 3 is made figure after press mold, exposure, development etching, obtains Rigid Flex crude product;
In the upper and lower surface printing of Rigid Flex crude product every weldering ink layer 5, after baking box baking by ink solidification the surface at Rigid Flex crude product;
7. in the soft or hard of Rigid Flex crude product, in conjunction with waste material limit, drag for type processing, soft or hard handing-over line position to Rigid Flex crude product carries out radium-shine cutting, depth of cut just arrives the surface of this side coverlay 2, by taking off lid, coverlay 2 is exposed, and obtains soft board semi-finished product in soft or hard combination;
8. in pair soft or hard combination, soft board semi-finished product carry out surface treatment, obtain soft board sheet material in soft or hard combination;
9. soft board sheet material in soft or hard combination is cut into soft board bulk in soft or hard combination;
10. will on soft board bulk in soft or hard combination, have been taken off and covered the part use mould stamp mode moulding of exposing.
With respect to traditional soft board molding mode, use the method for this patent, can in producing, processing procedure guarantee the integrality of soft board, avoided the harmomegathus that causes because soft board is damaged abnormal, guaranteed interlayer alignment precision and dimensional stability, improve product yield; Simultaneously when soft board will carry out identical surface treatment with hardboard, soft board and hardboard can together with carry out, can shorten production procedure, reduce the production time, and then improve factory's production capacity.
Claims (7)
1. a manufacture method for Rigid Flex, is characterized in that this manufacture method comprises the following steps:
A, in the upper and lower surface of commercially available soft board substrate (1), all make line pattern and stick coverlay (2), on a surface of commercially available hardboard semi-finished product (3), make line pattern;
B, on upper and lower two coverlays (2) surfaces equal superimposed prepreg (4) and hardboard semi-finished product (3) that dragged for window, soft board substrate (1), coverlay (2), prepreg (4) and hardboard semi-finished product (3) are pressed together, make to make the surface of hardboard semi-finished product (3) of line pattern towards soft board substrate (1), obtain Rigid Flex blank;
C, by holing and electroplating the hardboard semi-finished product (3) in Rigid Flex blank and soft board substrate (1) conducting, on another surface of hardboard semi-finished product (3), make line pattern, obtain Rigid Flex crude product;
D, the upper and lower surface of Rigid Flex crude product all print every weldering ink layer (5), soft or hard at Rigid Flex crude product is dragged for type processing in conjunction with waste material limit, again the soft or hard of Rigid Flex crude product is carried out to radium-shine cutting in conjunction with non-waste material limit, make the degree of depth of line of cut arrive the surface of this side coverlay (2), by taking off lid, coverlay (2) is exposed, obtain Rigid Flex semi-finished product;
E, Rigid Flex semi-finished product are carried out to surface treatment, obtain Rigid Flex sheet material;
F, Rigid Flex sheet material is cut into Rigid Flex bulk;
G, by having been taken off the soft board that exposes of lid on Rigid Flex bulk, partly use the moulding of mould stamp mode.
2. the manufacture method of a kind of Rigid Flex as claimed in claim 1, is characterized in that: the thickness of described soft board substrate is 0.049 ~ 0.70mm.
3. the manufacture method of a kind of Rigid Flex as claimed in claim 1, is characterized in that: the thickness of described coverlay is 0.028 ~ 0.061mm.
4. the manufacture method of a kind of Rigid Flex as claimed in claim 1, is characterized in that: the half-finished thickness of described hardboard is 0.05 ~ 1.60mm.
5. the manufacture method of a kind of Rigid Flex as claimed in claim 1, is characterized in that: the thickness of described prepreg is 0.025 ~ 0.075mm.
6. the manufacture method of a kind of Rigid Flex as claimed in claim 1, is characterized in that: the described thickness every weldering ink layer is 0.010 ~ 0.031mm.
7. the manufacture method of a kind of Rigid Flex as claimed in claim 1, is characterized in that: in step b, pressure force when soft board substrate, coverlay, prepreg and hardboard semi-finished product press together is controlled at 2.6 ~ 2.8MPa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410467173.4A CN104202928A (en) | 2014-09-12 | 2014-09-12 | Production method for rigid-flex board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410467173.4A CN104202928A (en) | 2014-09-12 | 2014-09-12 | Production method for rigid-flex board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104202928A true CN104202928A (en) | 2014-12-10 |
Family
ID=52088131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410467173.4A Pending CN104202928A (en) | 2014-09-12 | 2014-09-12 | Production method for rigid-flex board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104202928A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105228379A (en) * | 2015-10-26 | 2016-01-06 | 江苏弘信华印电路科技有限公司 | A kind of four layers of smooth copper face laminating method of rigid-flex combined board |
| CN105246265A (en) * | 2015-11-06 | 2016-01-13 | 高德（江苏）电子科技有限公司 | Manufacturing method for rigid-flex board photosensitive film productive flexible board |
| CN105491789A (en) * | 2016-02-15 | 2016-04-13 | 广东欧珀移动通信有限公司 | Flexible printed circuit board |
| CN106973524A (en) * | 2017-04-20 | 2017-07-21 | 高德（无锡）电子有限公司 | A kind of uncovering method of Rigid Flex |
| CN108076589A (en) * | 2016-11-18 | 2018-05-25 | 同泰电子科技股份有限公司 | Rigid-flexible combined board structure |
| CN108156758A (en) * | 2017-12-28 | 2018-06-12 | 信利光电股份有限公司 | A kind of soft or hard junction burr ameliorative way of Rigid Flex |
| CN110012622A (en) * | 2019-04-11 | 2019-07-12 | 信丰迅捷兴电路科技有限公司 | A kind of Rigid Flex production method of flexible board area pad laser windowing |
| CN113645767A (en) * | 2021-07-30 | 2021-11-12 | 高德（江苏）电子科技有限公司 | Finger fishing process for soft board area of rigid Flexible Printed Circuit (FPC) |
| CN114206030A (en) * | 2021-12-06 | 2022-03-18 | 博罗县精汇电子科技有限公司 | Production process of thin rigid-flex board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0590756A (en) * | 1991-09-28 | 1993-04-09 | Ibiden Co Ltd | Production of rigid/flexible board |
| JP2004031682A (en) * | 2002-06-26 | 2004-01-29 | Sony Corp | Method of manufacturing printed wiring board |
| CN101272660A (en) * | 2008-05-05 | 2008-09-24 | 上海美维电子有限公司 | Soft and hard combined printed wiring board production method |
-
2014
- 2014-09-12 CN CN201410467173.4A patent/CN104202928A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0590756A (en) * | 1991-09-28 | 1993-04-09 | Ibiden Co Ltd | Production of rigid/flexible board |
| JP2004031682A (en) * | 2002-06-26 | 2004-01-29 | Sony Corp | Method of manufacturing printed wiring board |
| CN101272660A (en) * | 2008-05-05 | 2008-09-24 | 上海美维电子有限公司 | Soft and hard combined printed wiring board production method |
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105228379A (en) * | 2015-10-26 | 2016-01-06 | 江苏弘信华印电路科技有限公司 | A kind of four layers of smooth copper face laminating method of rigid-flex combined board |
| CN105228379B (en) * | 2015-10-26 | 2018-04-06 | 江苏弘信华印电路科技有限公司 | A kind of smooth copper face laminating method of four layers of rigid-flex combined board |
| CN105246265A (en) * | 2015-11-06 | 2016-01-13 | 高德（江苏）电子科技有限公司 | Manufacturing method for rigid-flex board photosensitive film productive flexible board |
| CN105246265B (en) * | 2015-11-06 | 2018-05-01 | 高德（江苏）电子科技有限公司 | The production method that Rigid Flex light-sensitive surface protects soft board |
| CN105491789A (en) * | 2016-02-15 | 2016-04-13 | 广东欧珀移动通信有限公司 | Flexible printed circuit board |
| CN105491789B (en) * | 2016-02-15 | 2019-07-16 | Oppo广东移动通信有限公司 | Flexible Printed Circuit Board |
| CN108076589A (en) * | 2016-11-18 | 2018-05-25 | 同泰电子科技股份有限公司 | Rigid-flexible combined board structure |
| CN106973524A (en) * | 2017-04-20 | 2017-07-21 | 高德（无锡）电子有限公司 | A kind of uncovering method of Rigid Flex |
| CN108156758A (en) * | 2017-12-28 | 2018-06-12 | 信利光电股份有限公司 | A kind of soft or hard junction burr ameliorative way of Rigid Flex |
| CN108156758B (en) * | 2017-12-28 | 2020-12-25 | 信利光电股份有限公司 | Method for improving burrs at soft and hard combination part of soft and hard combination board |
| CN110012622A (en) * | 2019-04-11 | 2019-07-12 | 信丰迅捷兴电路科技有限公司 | A kind of Rigid Flex production method of flexible board area pad laser windowing |
| CN113645767A (en) * | 2021-07-30 | 2021-11-12 | 高德（江苏）电子科技有限公司 | Finger fishing process for soft board area of rigid Flexible Printed Circuit (FPC) |
| CN113645767B (en) * | 2021-07-30 | 2023-02-28 | 高德(江苏)电子科技股份有限公司 | Finger fishing process for flexible printed circuit board and flexible board area |
| CN114206030A (en) * | 2021-12-06 | 2022-03-18 | 博罗县精汇电子科技有限公司 | Production process of thin rigid-flex board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104202928A (en) | Production method for rigid-flex board | |
| CN105430899A (en) | Rigid-flex board with pad in flexible area and manufacturing method thereof | |
| CN104125727A (en) | Method for manufacturing rigid-flexible printed circuit board with multiple layers of soft boards | |
| CN101695217A (en) | Method for producing printed board combining rigidness and flexibleness | |
| CN101360397B (en) | How to make a hollow circuit board | |
| KR20110113732A (en) | Method for manufacturing multi-layer printed circuit board, anti-stick material, multi-layer printed circuit board and use of such method | |
| CN107846791A (en) | Uncapped before a kind of Rigid Flex and protect the production method of soft board | |
| CN105246263A (en) | Process for protecting goldfinger and bonding pad in rigid-flex printed circuit board | |
| CN106535508B (en) | The exposed technique of golden finger built in multi-layer board flexible circuit board | |
| CN112040670A (en) | Uncovering method of ultrathin rigid-flex printed circuit board | |
| CN107548235A (en) | A kind of radium-shine cuttings of UV drag for groove with machinery and dock the processing method uncapped | |
| CN110213912A (en) | The radium-shine blind hole alignment method of HDI multi-layer board | |
| CN104943430A (en) | UV transferring method for transparent plate | |
| CN102045948B (en) | Method for manufacturing PCB (printed Circuit Board) by adopting non-flowing prepreg to press metal substrate | |
| CN109743846B (en) | Manufacturing process of hollow flexible circuit board of new energy automobile | |
| WO2008111309A1 (en) | Recognition mark, and circuit substrate manufacturing method | |
| CN101610645A (en) | Manufacturing method of soft and hard board | |
| CN106231814B (en) | A kind of process for pressing for the multilayer Rigid Flex that light-sensitive surface thickens | |
| CN102647857B (en) | Manufacture process of printed circuit board | |
| CN103874331A (en) | Manufacturing method of teflon high-frequency circuit board | |
| CN103874334A (en) | Manufacturing method of teflon high-frequency circuit board | |
| CN103207515B (en) | A kind of Three-dimensional mask plate and its preparation process | |
| CN104846372A (en) | Method for manufacturing three-dimensional member via local etching and positioning tool | |
| CN103987209A (en) | Method for manufacturing resistance welding plug holes through epoxy sheet | |
| CN104363718B (en) | Production method of soft and hard combined circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141210 |
|
| RJ01 | Rejection of invention patent application after publication |