CN103874334A - Manufacturing method of teflon high-frequency circuit board - Google Patents
Manufacturing method of teflon high-frequency circuit board Download PDFInfo
- Publication number
- CN103874334A CN103874334A CN201410114366.1A CN201410114366A CN103874334A CN 103874334 A CN103874334 A CN 103874334A CN 201410114366 A CN201410114366 A CN 201410114366A CN 103874334 A CN103874334 A CN 103874334A
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- board
- copper
- circuit
- circuit board
- wiring board
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 38
- 239000004809 Teflon Substances 0.000 title claims abstract description 20
- 229920006362 Teflon® Polymers 0.000 title claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 43
- 229910052802 copper Inorganic materials 0.000 claims abstract description 43
- 239000010949 copper Substances 0.000 claims abstract description 43
- 238000000034 method Methods 0.000 claims abstract description 35
- 238000004140 cleaning Methods 0.000 claims abstract description 27
- 238000003801 milling Methods 0.000 claims abstract description 18
- 238000005530 etching Methods 0.000 claims abstract description 12
- 239000005011 phenolic resin Substances 0.000 claims abstract description 5
- 229920001568 phenolic resin Polymers 0.000 claims abstract description 5
- 239000007789 gas Substances 0.000 claims description 12
- 238000007689 inspection Methods 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 11
- 238000003466 welding Methods 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 238000000465 moulding Methods 0.000 claims description 5
- 230000002378 acidificating effect Effects 0.000 claims description 4
- 239000002253 acid Substances 0.000 claims description 3
- 229910052786 argon Inorganic materials 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical group [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 150000002431 hydrogen Chemical class 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 230000002000 scavenging effect Effects 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 230000008719 thickening Effects 0.000 claims description 3
- 238000009834 vaporization Methods 0.000 claims description 3
- 230000008016 vaporization Effects 0.000 claims description 3
- 230000007547 defect Effects 0.000 abstract description 7
- 238000005520 cutting process Methods 0.000 abstract description 5
- 238000009713 electroplating Methods 0.000 abstract description 2
- 238000005553 drilling Methods 0.000 abstract 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 1
- 239000003292 glue Substances 0.000 abstract 1
- 238000002360 preparation method Methods 0.000 abstract 1
- 238000007493 shaping process Methods 0.000 abstract 1
- 239000003814 drug Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- 239000003365 glass fiber Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000011538 cleaning material Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000005021 gait Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003622 knife milling Methods 0.000 description 1
- 230000001473 noxious effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
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- Manufacturing Of Printed Wiring (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a manufacturing method of a Teflon high-frequency circuit board, which has the key points of the technical scheme that plasma cleaning is adopted to replace the traditional glue removing process after the drilling process, so that the defects of no copper in a hole, open circuit of the circuit board and the like are effectively avoided, and the product yield is improved; adopt negative film development etching process after the board is continuous, directly etch out the circuit part, the pattern electroplating process has been reduced, the preparation time has been saved, production cost has also effectively been saved, can make more meticulous circuit simultaneously, adopt twolip milling cutter gong board at last in the shaping process, quality defects such as effectively avoiding criticizing cutting edge of a knife or a sword, burr, and reduced milling cutter's use quantity, production cost has been saved, the while has all cushioned phenolic resin backing plates on the upper and lower two sides of circuit board in drilling and gong board process, quality problems such as reducible board is crooked.
Description
[technical field]
The present invention relates to wiring board and make field, particularly relate to a kind of manufacture method of Teflon high-frequency circuit board.
[background technology]
At present, when wiring board is in the time making circuit, need porose interior copper and circuit copper, the electroplating liquid medicine in graphic plating may cause etching short circuit to the impact of dry film, and existing positive is due to higher to the thick uniformity requirement of copper, is difficult for for doing fine-line; The heavy copper cash of tradition, except in adhesive process, can use the harmful liquid such as organic solvent, volatility liquid medicine, the glass fibre of copper-clad plate material is stung to erosion property stronger, is prone to resin cavity hole in, sinks after copper and occurs Kong Wutong, will cause the quality defects such as wiring board open circuit; Be glass fiber net because Teflon plate construction is similar in addition, in moulding gong plate technique, disconnect as adopted plain cutter gong plate glass can be pulled out and being difficult for milling, cause occurring a large amount of quality defects such as cutting edges of a knife or a sword, burr of criticizing.
[summary of the invention]
The present invention seeks to have overcome the deficiencies in the prior art, the manufacture method of the Teflon high-frequency circuit board that a kind of production method is simple, conforming product rate is high is provided.
The present invention is achieved by the following technical solutions:
A manufacture method for Teflon high-frequency circuit board, its feature comprises that step is as follows:
(1) sawing sheet: to qualified on inspection wiring board according to designing requirement sawing sheet, surface clean and oven dry;
(2) boring: the wiring board after step (1) sawing sheet is got out to all kinds of holes that client needs according to making indication;
(3) plasma cleaning: impurity or greasy dirt on PCB surface and the hole inwall of the plasma removal step (2) producing with the high frequency voltage within the scope of radio wave;
(4) heavy copper: deposit one deck conducting thin copper layer between layers at the wiring board hole wall of step (3);
(5) electric plating of whole board: the thickness of copper in thickening step (4) PCB surface and hole;
(6) negative film dry film develops: in the copper-clad plate obtaining after step (5) is processed, paste blue layer dry film, then paste exposure in the circuit board with the negative film film, after exposure, on the negative film film, the part of colourless printing opacity is circuit, the part that black is in the light is unnecessary copper sheet, through developing apparatus, the dry film on unnecessary copper sheet is removed, after developing, exposed copper sheet is out copper sheet unnecessary on wiring board, and what under blue dry film, cover is circuit pack;
(7) acid etching: exposed copper sheet after etching away step (6) dry film and develop with acidic etching liquid, the circuit that remaining blue dry film covers;
(8) move back film: the blue dry film in step (7) is all returned, copper face and circuit are exposed;
(9) figure inspection: adopt scanner to open short circuit phenomenon inspection to circuit;
(10) anti-welding: the uniform welding resistance ink of local silk-screen one deck that does not need in the circuit board soldering of electronic components;
(11) wiring board divides plate: cut apart the connection between each production board in large plate with miniature carving cutter;
(12) moulding gong plate: adopt Double-edged milling cutter to go out finished product profile by customer requirement gong;
(13) subsequent handling: electric property and outward appearance that the described production board of detecting step (12) is each layer, on the solder side of described production board, plate under one deck normal temperature stable, can prevent copper surface oxidisation and not affect the organic film of welding function, finally production board is packed to shipment.
The manufacture method of Teflon high-frequency circuit board as above, is characterized in that: in described step (12), wiring board upper and lower surface is all lined with phenolic resins backing plate.
The manufacture method of Teflon high-frequency circuit board as above, is characterized in that: in described step (12), milling cutter is the right-spiral Double-edged milling cutter that hard metal material is made.
The manufacture method of Teflon high-frequency circuit board as above, is characterized in that: the step of described plasma cleaning is as follows:
1) wiring board being cleaned is sent into vacuum chamber fixing, the air in discharge vacuum chamber is to 0.1-0.2torr;
2) gas of using to vacuum chamber introducing plasma cleaning makes its pressure remain on 0.15-0.25torr;
3) in vacuum chamber, apply high frequency voltage within the scope of radio wave and produce plasma wiring board is cleaned, scavenging period be tens seconds to a few minutes;
4) clean completely, cut off high frequency voltage, the dirt of Exhaust Gas and vaporization simultaneously blasts air in vacuum chamber, makes its air pressure rise to an atmospheric pressure.
The manufacture method of Teflon high-frequency circuit board as above, is characterized in that: the gas of described cleaning use is oxygen, hydrogen, argon gas or nitrogen.
Compared with prior art, the present invention has the following advantages:
1, the present invention adopts negative film development etch process, directly etches circuit pack, has reduced graphic plating technique, has saved Production Time, has also effectively saved production cost, can make meticulousr circuit simultaneously.
2, the present invention adopts plasma cleaning to replace tradition except adhesive process, and except compared with adhesive process, plasma cleaning has the advantage of the following aspects with the heavy copper cash of tradition:
A. after plasma cleaning, wiring board plate face is very dry, and drying processing can be sent to next procedure again.
B. plasma cleaning technique not with an organic solvent, the harmful liquid such as volatility liquid medicine, after cleaning, can not produce noxious pollutant yet, belong to environmentally friendly green cleaning method.
C. the plasma that adopts the high-frequency discharge within the scope of radio wave to produce cleans, its directivity is not strong, can go deep into the fine eyelet of wiring board and the inside of depression and complete cleaning task, not be subject to the impact of cleaned material shape, can be better to those difficult cleaning performances that clean position.
D. the vacuum degree that plasma cleaning need to be controlled is 0.15-0.25torr, and this vacuum degree is easy to realize in plant produced.Equipment cost is not high, and cleaning process does not need to use expensive organic solvent or other liquid medicine yet, therefore plasma cleaning operating cost is far below traditional adhesive process that removes.
E. due to plasma cleaning do not need to cleaning fluid transport, store, the treatment measures such as discharge, so production site easily keeps hygienically clean.
F. plasma cleaning is under vacuum condition, PCB surface to be cleaned, and can not contact any organic solvent or liquid medicine, can effectively avoid the generation of the defect such as Kong Wutong, wiring board open circuit, improving product acceptance rate, thereby the company of saving production cost.
3, in moulding gong plate technique of the present invention, adopt hard metal Double-edged milling cutter, can effectively avoid the quality defects such as batch cutting edge of a knife or a sword, burr, and reduce the usage quantity of milling cutter, save production cost, in boring and gong plate operation, be all lined with phenolic resins backing plate at the upper and lower surface of wiring board simultaneously, can reduce the quality problem such as plate bending.
[accompanying drawing explanation]
Fig. 1 is process chart of the present invention;
Fig. 2 is negative film process chart of the present invention;
Fig. 3 is plasma cleaning flow chart of the present invention.
[embodiment]
Below in conjunction with accompanying drawing, the invention will be further described:
A manufacture method for Teflon high-frequency circuit board, comprises that step is as follows:
(1) sawing sheet: to qualified on inspection wiring board according to designing requirement sawing sheet, surface clean and oven dry;
(2) boring: the wiring board after step (1) sawing sheet is got out to all kinds of holes that client needs according to making indication, as the edges of boards tooling hole of wiring board, tooling hole, insert hole etc.;
(3) plasma cleaning: impurity or greasy dirt etc. on PCB surface and the hole inwall of the plasma removal step (2) producing by the high-frequency discharge within the scope of radio wave;
(4) heavy copper: deposit one deck conducting thin copper layer between layers at the wiring board hole wall of step (3);
(5) electric plating of whole board: the thickness of copper in thickening step (4) PCB surface and hole, reaches customer requirement;
(6) negative film dry film develops: in the copper-clad plate obtaining, stick blue layer dry film after step (5) is processed, expose by negative film film aligning, after developing, exposed copper sheet is out copper unnecessary on wiring board, and what under blue dry film, cover is circuit pack;
(7) acid etching: exposed copper after etching away step (6) dry film and develop with acidic etching liquid, the circuit that remaining blue dry film covers;
(8) move back film: the blue dry film in step (7) is all returned, copper face and circuit are exposed;
(9) figure inspection: adopt scanner to circuit open short circuit phenomenon inspection, in industry, claim " AOI ";
(10) anti-welding: not need in the circuit board the uniform welding resistance ink of local silk-screen one deck of soldering of electronic components, mainly in the time of client's welding component, play and prevent that scolding tin from connecting the effect of short circuit, obtains production board;
(11) wiring board divides plate: cut apart the connection between each production board in large plate with V-CUT cutter (miniature carving cutter);
(12) moulding gong plate: adopt hard metal Double-edged milling cutter to go out finished product profile by customer requirement gong, to reduce the peripheral batch cutting edge of a knife or a sword of finished product;
(13) open-short circuit: the electric property that the described production board of detecting step (12) is each layer;
(14) finished product inspection: be mainly function and the outward appearance that checks production board;
(15) there is organizational security weldering film: stabilization energy prevents copper surface oxidisation and do not affect the organic film of welding function, title " OSP " in industry under solder side plating one deck normal temperature of production board;
(16) finished product packing: by the qualified production board packing shipment of inspection eventually.
Described negative film technique concrete steps as shown in Figure 2, first paste in the circuit board blue layer dry film, then paste exposure in the circuit board with the negative film film, after exposure, on the negative film film, the part of colourless printing opacity is circuit, the part that black is in the light is unnecessary copper sheet, through developing apparatus, the dry film on unnecessary copper sheet is removed, after developing, exposed copper sheet is out copper sheet (copper sheet not using) unnecessary on wiring board, what under blue dry film, cover is circuit pack, the copper thickness of this circuit pack has thickeied in heavy copper coin electrician order the required thickness that enough clients specify, therefore no longer do graphic plating technique, but directly etch away exposed copper sheet through acidic etching liquid, the circuit that remaining blue dry film covers, again through moving back film, dry to wait and make circuit.
In described step (12), milling cutter is the right-spiral Double-edged milling cutter that hard metal material is made.Be glass fiber net because Teflon plate construction is similar, glass can be pulled out and be difficult for milling and disconnect when regular knife milling plate, right-spiral catling can avoid this problem to occur, in described step (12), wiring board upper and lower surface is all lined with phenolic resins backing plate.Teflon plate is clipped in the middle, be equivalent to increase the hardness of sheet material, can avoid milling plate time, Teflon sheet deformation, affects the quality defects such as size, when milling plate, adjust again each milling board parameter, reduce such as reducing lower cutter speed, increase rotating speed, reduction gait of march etc. the appearance of criticizing cutting edge of a knife or a sword burr.
The step of described step (3) plasma cleaning is as follows:
1) wiring board being cleaned is sent into vacuum chamber fixing, the air of discharging in vacuum chamber is pressure unit to 0.1-0.2torr(torr, and Chinese is translated into holder, and 1 holder is decided to be 1/760 times of normal atmospheric pressure);
2) gas of using to vacuum chamber introducing plasma cleaning makes its pressure remain on 0.15-0.25torr, according to the difference of cleaning material, can select respectively the gases such as oxygen, hydrogen, argon gas or nitrogen;
3) in vacuum chamber, apply high frequency voltage within the scope of radio wave and produce plasma wiring board is cleaned, scavenging period be tens seconds to a few minutes;
4) clean completely, cut off high frequency voltage, the dirt of Exhaust Gas and vaporization simultaneously blasts air in vacuum chamber, makes its air pressure rise to an atmospheric pressure.
Claims (5)
1. a manufacture method for Teflon high-frequency circuit board, its feature comprises that step is as follows:
(1) sawing sheet: to qualified on inspection wiring board according to designing requirement sawing sheet, surface clean and oven dry;
(2) boring: the wiring board after step (1) sawing sheet is got out to all kinds of holes that client needs according to making indication;
(3) plasma cleaning: impurity or greasy dirt on PCB surface and the hole inwall of the plasma removal step (2) producing with the high frequency voltage within the scope of radio wave;
(4) heavy copper: deposit one deck conducting thin copper layer between layers at the wiring board hole wall of step (3);
(5) electric plating of whole board: the thickness of copper in thickening step (4) PCB surface and hole;
(6) negative film dry film develops: in the copper-clad plate obtaining after step (5) is processed, paste blue layer dry film, then paste exposure in the circuit board with the negative film film, after exposure, on the negative film film, the part of colourless printing opacity is circuit, the part that black is in the light is unnecessary copper sheet, through developing apparatus, the dry film on unnecessary copper sheet is removed, after developing, exposed copper sheet is out copper sheet unnecessary on wiring board, and what under blue dry film, cover is circuit pack;
(7) acid etching: exposed copper sheet after etching away step (6) dry film and develop with acidic etching liquid, the circuit that remaining blue dry film covers;
(8) move back film: the blue dry film in step (7) is all returned, copper face and circuit are exposed;
(9) figure inspection: adopt scanner to open short circuit phenomenon inspection to circuit;
(10) anti-welding: the uniform welding resistance ink of local silk-screen one deck that does not need in the circuit board soldering of electronic components;
(11) wiring board divides plate: cut apart the connection between each production board in large plate with miniature carving cutter;
(12) moulding gong plate: adopt Double-edged milling cutter to go out finished product profile by customer requirement gong;
(13) subsequent handling: electric property and outward appearance that the described production board of detecting step (12) is each layer, on the solder side of described production board, plate under one deck normal temperature stable, can prevent copper surface oxidisation and not affect the organic film of welding function, finally production board is packed to shipment.
2. the manufacture method of Teflon high-frequency circuit board according to claim 1, is characterized in that: in described step (12), wiring board upper and lower surface is all lined with phenolic resins backing plate.
3. the manufacture method of Teflon high-frequency circuit board according to claim 1, is characterized in that: in described step (12), milling cutter is the right-spiral Double-edged milling cutter that hard metal material is made.
4. the manufacture method of Teflon high-frequency circuit board according to claim 1, is characterized in that: the step of described plasma cleaning is as follows:
1) wiring board being cleaned is sent into vacuum chamber fixing, the air in discharge vacuum chamber is to 0.1-0.2torr;
2) gas of using to vacuum chamber introducing plasma cleaning makes its pressure remain on 0.15-0.25torr;
3) in vacuum chamber, apply high frequency voltage within the scope of radio wave and produce plasma wiring board is cleaned, scavenging period be tens seconds to a few minutes;
4) clean completely, cut off high frequency voltage, the dirt of Exhaust Gas and vaporization simultaneously blasts air in vacuum chamber, makes its air pressure rise to an atmospheric pressure.
5. the manufacture method of Teflon high-frequency circuit board according to claim 4, is characterized in that: the gas of described cleaning use is oxygen, hydrogen, argon gas or nitrogen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410114366.1A CN103874334A (en) | 2014-03-25 | 2014-03-25 | Manufacturing method of teflon high-frequency circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410114366.1A CN103874334A (en) | 2014-03-25 | 2014-03-25 | Manufacturing method of teflon high-frequency circuit board |
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| CN103874334A true CN103874334A (en) | 2014-06-18 |
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| CN201410114366.1A Pending CN103874334A (en) | 2014-03-25 | 2014-03-25 | Manufacturing method of teflon high-frequency circuit board |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108323011A (en) * | 2018-01-25 | 2018-07-24 | 深圳崇达多层线路板有限公司 | A kind of production method of multilayer Teflon wiring board |
| CN108696999A (en) * | 2018-04-24 | 2018-10-23 | 珠海元盛电子科技股份有限公司 | A kind of subtractive process technology of manufacture FPC |
| CN109168265A (en) * | 2018-10-25 | 2019-01-08 | 铜陵市超远科技有限公司 | A kind of high-frequency microwave plate high density interconnection board manufacturing method |
| CN111263526A (en) * | 2020-03-23 | 2020-06-09 | 西安微电子技术研究所 | Dry-type milling method for aluminum-based printed circuit board |
| CN112004339A (en) * | 2020-07-07 | 2020-11-27 | 广德三生科技有限公司 | High-frequency and high-speed printed circuit board and manufacturing method thereof |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108323011A (en) * | 2018-01-25 | 2018-07-24 | 深圳崇达多层线路板有限公司 | A kind of production method of multilayer Teflon wiring board |
| CN108323011B (en) * | 2018-01-25 | 2020-04-14 | 深圳崇达多层线路板有限公司 | Manufacturing method of multilayer teflon circuit board |
| CN108696999A (en) * | 2018-04-24 | 2018-10-23 | 珠海元盛电子科技股份有限公司 | A kind of subtractive process technology of manufacture FPC |
| CN109168265A (en) * | 2018-10-25 | 2019-01-08 | 铜陵市超远科技有限公司 | A kind of high-frequency microwave plate high density interconnection board manufacturing method |
| CN111263526A (en) * | 2020-03-23 | 2020-06-09 | 西安微电子技术研究所 | Dry-type milling method for aluminum-based printed circuit board |
| CN112004339A (en) * | 2020-07-07 | 2020-11-27 | 广德三生科技有限公司 | High-frequency and high-speed printed circuit board and manufacturing method thereof |
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Application publication date: 20140618 |
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