CN104178076B - A kind of heat conductive insulating epoxy resin embedding adhesive and preparation method - Google Patents
A kind of heat conductive insulating epoxy resin embedding adhesive and preparation method Download PDFInfo
- Publication number
- CN104178076B CN104178076B CN201410457717.9A CN201410457717A CN104178076B CN 104178076 B CN104178076 B CN 104178076B CN 201410457717 A CN201410457717 A CN 201410457717A CN 104178076 B CN104178076 B CN 104178076B
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- component
- heat conductive
- conductive insulating
- embedding adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 37
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 37
- 239000000853 adhesive Substances 0.000 title claims abstract description 23
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 23
- 238000002360 preparation method Methods 0.000 title description 6
- 239000000203 mixture Substances 0.000 claims abstract description 24
- 239000000945 filler Substances 0.000 claims abstract description 17
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000012745 toughening agent Substances 0.000 claims abstract description 12
- 239000013530 defoamer Substances 0.000 claims abstract description 11
- 239000003085 diluting agent Substances 0.000 claims abstract description 9
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 8
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 8
- 239000005543 nano-size silicon particle Substances 0.000 claims abstract description 8
- 239000004593 Epoxy Substances 0.000 claims abstract description 7
- 239000002131 composite material Substances 0.000 claims abstract description 7
- -1 0.5~1 part Substances 0.000 claims abstract description 6
- 239000007822 coupling agent Substances 0.000 claims abstract description 6
- 239000000843 powder Substances 0.000 claims abstract description 6
- 229910052582 BN Inorganic materials 0.000 claims abstract description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 5
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229920000459 Nitrile rubber Polymers 0.000 claims abstract description 4
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 claims abstract description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims abstract description 4
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 4
- 239000011777 magnesium Substances 0.000 claims abstract description 4
- 239000002245 particle Substances 0.000 claims abstract description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 3
- 230000008030 elimination Effects 0.000 claims description 3
- 238000003379 elimination reaction Methods 0.000 claims description 3
- 238000010792 warming Methods 0.000 claims description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 2
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 claims description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 claims description 2
- URJFKQPLLWGDEI-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=[C]N1CC1=CC=CC=C1 URJFKQPLLWGDEI-UHFFFAOYSA-N 0.000 claims description 2
- SYEWHONLFGZGLK-UHFFFAOYSA-N 2-[1,3-bis(oxiran-2-ylmethoxy)propan-2-yloxymethyl]oxirane Chemical compound C1OC1COCC(OCC1OC1)COCC1CO1 SYEWHONLFGZGLK-UHFFFAOYSA-N 0.000 claims description 2
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 claims description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 claims description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 claims description 2
- 229930185605 Bisphenol Natural products 0.000 claims description 2
- FNFBFJMQUXIHSI-UHFFFAOYSA-N C(C1CO1)OCC1CO1.NC1=CC=CC=C1 Chemical compound C(C1CO1)OCC1CO1.NC1=CC=CC=C1 FNFBFJMQUXIHSI-UHFFFAOYSA-N 0.000 claims description 2
- 239000004844 aliphatic epoxy resin Substances 0.000 claims description 2
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 claims description 2
- 150000002118 epoxides Chemical class 0.000 claims description 2
- 229920001451 polypropylene glycol Polymers 0.000 claims description 2
- STCOOQWBFONSKY-UHFFFAOYSA-N tributyl phosphate Chemical group CCCCOP(=O)(OCCCC)OCCCC STCOOQWBFONSKY-UHFFFAOYSA-N 0.000 claims description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 claims 1
- 238000005266 casting Methods 0.000 abstract description 6
- 239000003292 glue Substances 0.000 abstract description 6
- 238000009413 insulation Methods 0.000 abstract description 5
- 239000000463 material Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 125000004093 cyano group Chemical group *C#N 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000011863 silicon-based powder Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a kind of heat conductive insulating epoxy resin embedding adhesive, being made up of epoxy resin, firming agent, toughener, diluent, filler, accelerator and defoamer, the weight ratio of each composition is: component A: epoxy resin 100 parts, diluent 10～30 parts, filler 5～15 parts, defoamer, 0.5～1 part, coupling agent 3～5 parts；B component: 78～145 parts of firming agent, toughener 10～40 parts, filler 5～10 parts, accelerator 0.1～3 part, defoamer 0.5～1 part；A/B weight ratio 1: 1。Described toughener is epoxy hydroxyl terminated butadiene acrylonitrile copolymer；Filler is the composite powder of varigrained nano-silicon nitride magnesium, nanometer silicon carbide, nano aluminum nitride, nm-class boron nitride, high sphericity nano aluminium oxide and nano-silicon nitride composition, its particle mean size 40～60nm。This casting glue not only has a good heat conductivity, and good insulation preformance。
Description
Technical field
The present invention relates to adhesive preparing technical field, particularly to heat conductive insulating epoxy resin embedding adhesive and preparation method。
Background technology
Epoxy resin embedding adhesive is the thermosetting polymer composite that a class has the performance such as good bonding, corrosion-resistant, electric insulation, high intensity, it has also become electronics, electrically, machine-building, chemical anticorrosion, Aero-Space, Shipping and other indispensable basic materials of many industrial circles。
Along with microelectronics and integrated circuit develop to high speed, high density, miniaturization, lightweight direction, electronic devices and components, logic circuit volume are constantly compressed, heat produced by electronic equipment unit volume sharply increases, thus heat conductivility will affect the life and reliability of electronic devices and components, electronic equipment。For guaranteeing the properly functioning of electronic devices and components, it is necessary to material possesses high heat-sinking capability, to ensure the quick transmission of heat。And traditional epoxy resin is the non-conductor of heat, heat conductivity is 0.2W m-1·K-1Left and right, is difficult to meet the timely cooling requirements of electronic devices and components；The service efficiency of electronic component and life-span are also had material impact by insulating properties, and good electrical insulating property can improve the service efficiency of electrical equipment, increases the service life。Therefore, one of heat conductivility emphasis becoming research at present how being effectively improved epoxy resin under the premise ensureing insulating properties。
Improving casting glue heat conductivity and mainly have two kinds of approach, a kind of approach is the polymer adding and having heat conductivity, but owing to synthesis thermal conductive polymer cost is high, the tactical rule of high-molecular organic material is poor, and heat conductivility is also not ideal, thus is rarely employed；Another kind of approach is by adding high heat filling, and at present, filling heat filling is widely used method。The heat filling that existing epoxy resin embedding adhesive adds is generally metal (copper, aluminum, ferrum etc.) powder and inorganic filler (graphite, white carbon black, inorganic oxide, nitride etc.)。Although metal material heat conductivity is higher, it is possible to as the filler of heat-conductivity polymer composite, but owing to metal material has electric conductivity, manufactured goods poor insulativity, easily puncture, affect efficiency and the life-span of electronic component。Silicon powder heat conductivity conventional in inorganic heat filling is relatively low, adopts the heat conductivity of the potting compound of silicon powder filling to be relatively low, less than 0.6W/ (m K), is unfavorable for the heat radiation of electric elements。The heat conductivity of the inorganic fillers such as aspherical aluminium oxide, boron nitride, aluminium nitride is higher, but granularity relatively big (general 400 orders), poor with resin affinity, skewness, it is easy to precipitation。
Summary of the invention
First technical problem that the invention solves the problems that is to provide a kind of heat conductive insulating epoxy resin embedding adhesive, and this casting glue not only has a good heat conductivity, and good insulation preformance。
The preparation method that second technical problem that the invention solves the problems that is to provide this heat conductive insulating epoxy resin embedding adhesive a kind of。
Heat conductive insulating epoxy resin embedding adhesive of the present invention, is made up of epoxy resin, firming agent, toughener, diluent, filler, accelerator and defoamer, and the weight ratio of each composition is as follows:
Component A:
B component:
A/B weight ratio 1: 1。
Be suitable in the bisphenol A type epoxy resin of the preferred liquid of epoxy resin of the present invention, bisphenol f type epoxy resin, cycloaliphatic epoxy resin, aliphatic epoxy resin etc. one or more, such as E-51, E-44, E-42, E-54 or EP828 etc.；The firming agent being suitable for is such as liquid anhydride, in hexahydrophthalic anhydride, methylnadic anhydride, hydrogenating methyl carbic anhydride any one or multiple；The toughener such as endurable active toughener being suitable for, its molecule segment is the epoxy hydroxyl terminated butadiene acrylonitrile copolymer with epoxy radicals, cyano group, it is preferable that molecular weight is 1800～2000, and epoxide number is 0.6～1mmol/g, and acrylonitrile content is 3%～7%；Be suitable for diluent be reactive diluent, in polypropylene glycol diglycidyl, diglycidyl ether aniline, glycerin triglycidyl ether any one or multiple；The filler being suitable for is the composite powder of varigrained nano-silicon nitride magnesium, nanometer silicon carbide, nano aluminum nitride, nm-class boron nitride, high sphericity nano aluminium oxide and nano-silicon nitride composition, its particle mean size 40～60nm, is not specially limited composite powder constituent content；Be suitable for accelerator be liquid imidazole class accelerator, in 2-ethyl-4-methylimidazole, 1 benzyl 2 methyl imidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole any one or multiple；Be suitable for coupling agent be silane coupler, in γ aminopropyltriethoxy silane, gamma-amino propyl trimethoxy silicane, γ-glycidoxy trimethoxy silane any one or multiple；The defoamer such as tributyl phosphate etc. being suitable for。
The method preparing heat conductive insulating epoxy resin embedding adhesive of the present invention, comprises the following steps:
(1) prepared by component A:
Epoxy resin, diluent, filler, defoamer, coupling agent are added in stirred tank, is sufficiently stirred for mix homogeneously in a heated condition, obtains component A；
(2) prepared by B component:
Firming agent, toughener, filler, accelerator, defoamer are added in stirred tank, is sufficiently stirred for mix homogeneously in a heated condition, obtains B component；
(3) component A and B component being joined in mix and blend still by weight 1: 1, be warming up to 85 DEG C, vacuum, more than 0.095MPa, continues 30min, evacuation elimination bubble；
(4) adding mixture in mould, 90 DEG C solidify 1h, and 110 DEG C solidify 2h, and 180 DEG C solidify 3h, are naturally down to room temperature。
The endurable active toughener epoxy hydroxyl terminated butadiene acrylonitrile copolymer molecule segment that present invention introduces is with epoxy radicals, cyano group and hydroxyl, good with liquid bisphenol A epoxy resin compatible and viscosity is low, improve the fragility of epoxy resin cured product and eliminate crack performance, epoxy resin embedding adhesive impact resistance and insulating properties can be significantly improved；The filler that present invention introduces, it is made up of the multiple super-high heat-conductive filler of different-grain diameter, good with resin affinity, it is evenly distributed, not easily precipitates, can make to be formed between filler maximum degree of piling up, make the heat conduction network that epoxy pouring sealant System forming is good to the full extent, thus reaching effective conduction of heat and insulation, it is thus achieved that high heat conductive insulating system, and water absorption rate is low。Product of the present invention can be widely applied to electronics, electrically, machine-building, chemical anticorrosion, Aero-Space, Shipping and other many industrial circles, have a extensive future。The preparation method of heat conductive insulating epoxy resin embedding adhesive of the present invention, filler is added in A, B component respectively, and dispersion effect is good, and the casting glue heat conductive insulating excellent performance of preparation, technique is simple。
Detailed description of the invention
Below in conjunction with embodiment, the invention will be further described。The following stated number is weight portion。
Each embodiment heat conductive insulating epoxy resin embedding adhesive is prepared by the following method, and gained casting glue performance is in Table 1。
(1) prepared by component A:
Being added in stirred tank by each composition, then heated and stirred still is to 85 DEG C, is sufficiently stirred for mix homogeneously in a heated condition, obtains component A；
(2) prepared by B component:
Being added in stirred tank by each composition, then heated and stirred still 85 DEG C, are sufficiently stirred for mix homogeneously, obtain B component；
(3) component A and B component being joined in mix and blend still by weight 1: 1, be warming up to 85 DEG C, vacuum, more than 0.095MPa, continues 30min, evacuation elimination bubble；
(4) adding mixture in mould, 90 DEG C solidify 1h, and 110 DEG C solidify 2h, and 180 DEG C solidify 3h, are naturally down to room temperature。
Filler is the composite powder of varigrained nano-silicon nitride magnesium, nanometer silicon carbide, nano aluminum nitride, nm-class boron nitride, high sphericity nano aluminium oxide and nano-silicon nitride six component composition, its particle mean size 50nm。
EP828 is Holland's shell Products。
Embodiment 1
Component A:
B component:
Embodiment 2:
Component A:
B component:
Embodiment 3:
Component A:
B component:
Comparative example
The each embodiment casting glue performance of table 1
| Project | Comparative example | Embodiment 1 | Embodiment 2 | Embodiment 3 |
| Heat conductivity, W/ (m k) | 0.35 | 4.31 | 4.46 | 5.15 |
| Specific insulation, Ω cm | 2.57×1015 | 3.24×1016 | 4.18×1016 | 5.18×1016 |
| Impact strength, kJ/m2 | 1.7 | 18.80 | 21.03 | 25.62 |
| Water absorption rate, % (in 20 DEG C of encroached waters 50 days) | 0.28 | 0.30 | 0.32 | 0.35 |
Claims (9)
1. a heat conductive insulating epoxy resin embedding adhesive, is made up of epoxy resin, firming agent, toughener, diluent, filler, accelerator, coupling agent and defoamer, and the weight ratio of each composition is as follows:
Component A:
B component:
Described toughener is epoxy hydroxyl terminated butadiene acrylonitrile copolymer；Filler is the composite powder of varigrained nano-silicon nitride magnesium, nanometer silicon carbide, nano aluminum nitride, nm-class boron nitride, high sphericity nano aluminium oxide and nano-silicon nitride composition, its particle mean size 40～60nm。
2. heat conductive insulating epoxy resin embedding adhesive according to claim 1, described epoxy resin is one or more in the bisphenol A type epoxy resin of liquid, bisphenol f type epoxy resin, cycloaliphatic epoxy resin, aliphatic epoxy resin。
3. heat conductive insulating epoxy resin embedding adhesive according to claim 1, described firming agent in hexahydrophthalic anhydride, methylnadic anhydride, the hydrogenating methyl carbic anhydride any one or multiple。
4. heat conductive insulating epoxy resin embedding adhesive according to claim 1, described toughener molecular weight is 1800～2000, and its epoxide number is 0.6～1mmol/g, and its acrylonitrile content is 3%～7%。
5. heat conductive insulating epoxy resin embedding adhesive according to claim 1, described diluent in polypropylene glycol diglycidyl ether, diglycidyl ether aniline, the glycerin triglycidyl ether any one or multiple。
6. heat conductive insulating epoxy resin embedding adhesive according to claim 1, described accelerator in 2-ethyl-4-methylimidazole, 1 benzyl 2 methyl imidazole, the 1-cyanoethyl-2-ethyl-4-methylimidazole any one or multiple。
7. heat conductive insulating epoxy resin embedding adhesive according to claim 1, described coupling agent in γ aminopropyltriethoxy silane, gamma-amino propyl trimethoxy silicane, the γ-glycidoxy trimethoxy silane any one or multiple。
8. heat conductive insulating epoxy resin embedding adhesive according to claim 1, described defoamer is tributyl phosphate。
9. the method preparing the described heat conductive insulating epoxy resin embedding adhesive of one of claim 1～8, comprises the following steps:
(1) prepared by component A
Epoxy resin, diluent, filler, defoamer, coupling agent are added in stirred tank, is sufficiently stirred for mix homogeneously in a heated condition, obtains component A；
(2) prepared by B component
Firming agent, toughener, filler, accelerator, defoamer are added in stirred tank, is sufficiently stirred for mix homogeneously in a heated condition, obtains B component；
(3) component A and B component being joined in mix and blend still by weight 1: 1, be warming up to 85 DEG C, vacuum, more than 0.095MPa, continues 30min, evacuation elimination bubble；
(4) adding mixture in mould, 90 DEG C solidify 1h, and 110 DEG C solidify 2h, and 180 DEG C solidify 3h, are naturally down to room temperature。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410457717.9A CN104178076B (en) | 2014-09-11 | 2014-09-11 | A kind of heat conductive insulating epoxy resin embedding adhesive and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410457717.9A CN104178076B (en) | 2014-09-11 | 2014-09-11 | A kind of heat conductive insulating epoxy resin embedding adhesive and preparation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104178076A CN104178076A (en) | 2014-12-03 |
| CN104178076B true CN104178076B (en) | 2016-06-22 |
Family
ID=51959433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410457717.9A Active CN104178076B (en) | 2014-09-11 | 2014-09-11 | A kind of heat conductive insulating epoxy resin embedding adhesive and preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104178076B (en) |
Families Citing this family (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104497491A (en) * | 2014-12-23 | 2015-04-08 | 安徽助成信息科技有限公司 | Method for improving thermal conductivity of epoxy resin based on nanometer silicon carbide |
| CN105419570A (en) * | 2016-01-18 | 2016-03-23 | 苏州法斯特信息科技有限公司 | High-adhesiveness and high-temperature endurable insulating paint composition for electrical machines and electrical apparatuses |
| CN105602485B (en) * | 2016-01-26 | 2017-06-23 | 河北工业大学 | A kind of insulating heat-conductive adhesive of high infrared radiance and preparation method thereof |
| CN105647120B (en) * | 2016-01-27 | 2019-02-05 | 西安交通大学 | A kind of epoxy resin-based nonlinear adaptive nanocomposite insulating material and preparation method thereof |
| CN105907346A (en) * | 2016-05-26 | 2016-08-31 | 张学健 | Epoxy electronic pouring sealant and preparation method thereof |
| CN105950091A (en) * | 2016-06-08 | 2016-09-21 | 蚌埠市正园电子科技有限公司 | Epoxy resin pouring sealant modified by composite silicon nitride thermal conductive filler and used for LED display screen |
| CN105950090A (en) * | 2016-06-08 | 2016-09-21 | 蚌埠市正园电子科技有限公司 | Waterproof epoxy resin pouring sealant filled and modified by composite beryllium oxide and used for LED display screen |
| CN105969278A (en) * | 2016-06-08 | 2016-09-28 | 蚌埠高华电子股份有限公司 | Naleic anhydride toughened and modified composite heat-conduction epoxy pouring sealant for LED display screen |
| CN106189096A (en) * | 2016-08-11 | 2016-12-07 | 苏州柯创电子材料有限公司 | Insulation board be applicable to water and manufacture method thereof |
| CN107057623A (en) * | 2017-05-22 | 2017-08-18 | 重庆江川化工（集团）有限公司 | A kind of filling special epoxy pouring sealant of transformer large volume and preparation method and application |
| CN108913076A (en) * | 2018-06-29 | 2018-11-30 | 佛山市高明区爪和新材料科技有限公司 | A kind of heat conductive insulating casting glue |
| CN109096933A (en) * | 2018-07-11 | 2018-12-28 | 常州澳弘电子有限公司 | A kind of aluminum-based copper-clad plate insulating heat-conductive glue film of low filling high thermal conductivity |
| CN109722197A (en) * | 2019-02-28 | 2019-05-07 | 宁国市奇博电器有限公司 | A kind of encapsulating insulation silica gel of capacitor and preparation method thereof |
| CN111234752A (en) * | 2020-03-31 | 2020-06-05 | 苏州巨峰电气绝缘系统股份有限公司 | High-thermal-conductivity electrical insulation packaging material and preparation method thereof |
| CN111303815A (en) * | 2020-04-01 | 2020-06-19 | 苏州巨峰电气绝缘系统股份有限公司 | High-thermal-conductivity epoxy pouring sealant and preparation method thereof |
| CN111925762B (en) * | 2020-08-31 | 2022-09-30 | 广州市白云化工实业有限公司 | Epoxy resin adhesive and application thereof |
| CN112143175A (en) * | 2020-09-29 | 2020-12-29 | 富通集团（天津）超导技术应用有限公司 | Epoxy resin composite material for superconducting magnet and preparation method thereof |
| CN112297541A (en) * | 2020-10-29 | 2021-02-02 | 河南省科学院应用物理研究所有限公司 | Aluminum-based copper-clad plate and preparation method thereof |
| CN112812503A (en) * | 2021-03-05 | 2021-05-18 | 洛阳嘉斯诺泵业制造有限公司 | Composite material containing epoxidized hydroxyl-terminated polybutadiene and preparation method thereof |
| CN113881376B (en) * | 2021-11-01 | 2022-11-11 | 江南大学 | A kind of bio-based epoxy resin potting glue and preparation method thereof |
| CN114316869B (en) * | 2021-12-31 | 2024-06-11 | 江苏中科科化新材料股份有限公司 | Bi-component thermosetting epoxy resin composition and application thereof, bi-component thermosetting epoxy resin and preparation method and application thereof |
| CN114591597A (en) * | 2022-03-11 | 2022-06-07 | 西安理工大学 | Modified epoxy composite material and preparation method thereof |
| CN115960569A (en) * | 2023-02-03 | 2023-04-14 | 武汉楚辰新材料科技有限公司 | A kind of epoxy resin potting glue |
| CN117736549B (en) * | 2024-02-02 | 2025-02-14 | 广东博汇新材料科技有限公司 | A method for preparing a high thermal conductivity epoxy resin composite |
| CN118026150B (en) * | 2024-02-04 | 2025-07-25 | 华南理工大学 | Nitrogen-doped carbon nano sheet applied to lithium ion battery and preparation method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101508825B (en) * | 2009-03-30 | 2011-04-27 | 汕头市骏码凯撒有限公司 | Epoxy resin embedding glue and method for producing the same |
| CN104066765B (en) * | 2011-11-01 | 2016-05-18 | 蓝立方知识产权有限责任公司 | Liquid epoxies preparation |
| CN102863936B (en) * | 2012-10-09 | 2014-07-02 | 株洲时代新材料科技股份有限公司 | Heating solidification type dual-component epoxy pouring sealant and preparation method thereof |
-
2014
- 2014-09-11 CN CN201410457717.9A patent/CN104178076B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN104178076A (en) | 2014-12-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104178076B (en) | A kind of heat conductive insulating epoxy resin embedding adhesive and preparation method | |
| CN110951254A (en) | Boron nitride composite high-thermal-conductivity insulating polymer composite material and preparation method thereof | |
| CN103951941B (en) | A kind of heat-conduction epoxy resin composite material and preparation method thereof | |
| CN104152093B (en) | A kind of flame-retarded heat-conducting double-component epoxy resin embedding adhesive and preparation method thereof | |
| CN106519581B (en) | A kind of high heat conduction low viscosity epoxy resin composite material and preparation method and application | |
| CN103087665B (en) | High-heat-conductivity insulation low-viscosity epoxy resin pouring sealant and preparation method thereof | |
| JP6000749B2 (en) | Thermosetting resin composition, method for producing thermally conductive resin sheet, thermally conductive resin sheet, and power semiconductor device | |
| TWI520926B (en) | A ceramic mixture, and a thermoconductive resin sheet containing a ceramic composition | |
| CN101831264A (en) | Isotropic high-performance thermal conductive adhesive for filling carbon nano tube | |
| WO2012070289A1 (en) | Thermal conductive sheet and power module | |
| CN103965590B (en) | Epoxy resin composite material of a kind of coordination plasticizing and preparation method thereof | |
| CN104610849A (en) | Heat-conducting insulating coating for electronic components and preparation method thereof | |
| CN107057623A (en) | A kind of filling special epoxy pouring sealant of transformer large volume and preparation method and application | |
| CN109206853B (en) | High-thermal-conductivity epoxy resin-based composite material, and preparation method and application thereof | |
| CN104004482A (en) | Epoxy/organic silicon/graphene hybridization high heat conductivity adhesive and preparation method thereof | |
| CN103965585B (en) | A kind of preparation method of Filled With Hollow Bead epoxy resin composite material | |
| CN102013281A (en) | Conductive silver adhesive for high-power LED | |
| CN102391818A (en) | Insulated thermal conductive adhesive and preparation method thereof | |
| CN106433035A (en) | Aluminum-based filling heat interface composite material and preparation method and application thereof | |
| CN106674891A (en) | High heat conduction and low stress type epoxy resin composition for fully encapsulated semiconductor device | |
| CN114525100A (en) | High-thermal-conductivity low-viscosity epoxy pouring sealant and preparation method thereof | |
| CN110669317A (en) | A kind of preparation method of ternary epoxy resin thermally conductive composite material | |
| CN103665875B (en) | A kind of preparation method of conductive silicon rubber | |
| CN105199619B (en) | Aluminum-based copper-clad plate high-heat-conductivity glue membrane preparation method | |
| JP2015196823A (en) | Thermosetting resin composition, thermally conductive resin sheet and method for producing the same, and power module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |