CN105907346A - Epoxy electronic pouring sealant and preparation method thereof - Google Patents
Epoxy electronic pouring sealant and preparation method thereof Download PDFInfo
- Publication number
- CN105907346A CN105907346A CN201610358132.0A CN201610358132A CN105907346A CN 105907346 A CN105907346 A CN 105907346A CN 201610358132 A CN201610358132 A CN 201610358132A CN 105907346 A CN105907346 A CN 105907346A
- Authority
- CN
- China
- Prior art keywords
- epoxy
- pouring sealant
- agent
- component
- electron pouring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004593 Epoxy Substances 0.000 title claims abstract description 39
- 239000000565 sealant Substances 0.000 title claims abstract description 24
- 238000002360 preparation method Methods 0.000 title claims abstract description 5
- 239000003822 epoxy resin Substances 0.000 claims abstract description 10
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 8
- 239000003085 diluting agent Substances 0.000 claims abstract description 7
- 239000012745 toughening agent Substances 0.000 claims abstract description 7
- 239000000945 filler Substances 0.000 claims description 11
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 7
- 239000006185 dispersion Substances 0.000 claims description 7
- 150000002118 epoxides Chemical class 0.000 claims description 6
- 239000012752 auxiliary agent Substances 0.000 claims description 5
- 239000013530 defoamer Substances 0.000 claims description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 239000000080 wetting agent Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 238000001291 vacuum drying Methods 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 2
- 239000011863 silicon-based powder Substances 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 230000003647 oxidation Effects 0.000 claims 1
- 238000007254 oxidation reaction Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 abstract 4
- 239000000654 additive Substances 0.000 abstract 2
- 235000010290 biphenyl Nutrition 0.000 abstract 2
- 239000004305 biphenyl Substances 0.000 abstract 2
- 238000012856 packing Methods 0.000 abstract 2
- 230000000996 additive effect Effects 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 238000005266 casting Methods 0.000 description 6
- 239000003292 glue Substances 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000003063 flame retardant Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical group N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Epoxy Resins (AREA)
- Sealing Material Composition (AREA)
Abstract
The invention discloses an epoxy electronic pouring sealant and a preparation method thereof. The epoxy electronic pouring sealant is prepared from E-51 biphenyl A epoxy resin, an epoxy diluent, an epoxy toughening agent, a curing agent, packing and additives in a mixed manner. According to the epoxy electronic pouring sealant disclosed by the invention, the biphenyl A epoxy resin is taken as main body resin, the types and the additive amounts of the accelerant and the packing are screened, and thus optimal formulae can be selected. The prepared epoxy electronic pouring sealant is good in heat conduction property, good in flame retardancy, small in internal product stress and applicable to pouring sealing of large-power electronic elements, and various properties of the epoxy electronic pouring sealant are superior to those of similar pouring sealants in China and other countries.
Description
Technical field
The present invention relates to casting glue field, be specifically related to a kind of epoxy electron pouring sealant.
Background technology
The globality of casting glue energy strengthening electronic device prepared by epoxy resin, improves external shock, the opposing of vibrations
Power, keeps the insulating properties of electronic device, the beneficially miniaturization of electronic device, lightweight, it is to avoid electronic component and circuit
Directly exposing, can greatly improve the waterproof and moistureproof performance of electronic device, the service life and the reduction that extend electronic device make
Use cost.But, along with the development of electric industry, the requirement to epoxy fill-sealing materials is more and more higher.Pure epoxy tree
The solidfied material elastic modelling quantity that fat casting glue is formed is poor, and fragility is big, easy to crack, it is difficult to meet the use requirement of some occasion.For
Ensure the reliability of embedding device, good heat-sinking capability and the electrical insulation properties of excellence, it is necessary to epoxy pouring sealant
Formula is adjusted and optimizes, and to improve fire-retardant, the heat conductivity of casting glue, reduces internal stress.
Summary of the invention
Present invention aim at, it is provided that a kind of excellent heat conductivity and also there is flame retardant epoxy electron pouring sealant.
It is another object of the present invention to provide the preparation method of a kind of epoxy electron pouring sealant.
The technical solution adopted in the present invention is:
A kind of epoxy electron pouring sealant, it is characterised in that be mixed with according to percentage by weight by following components and form:
E-51 bisphenol A epoxide resin 15-25 part
Epoxide diluent 3-7 part
Epoxy toughening agent 3-7 part
Firming agent 1-4 part
Filler 50-75 part
Auxiliary agent 3-8 part.
Further, described filler includes silicon powder, aluminium oxide, ground calcium carbonate.
Further, described auxiliary agent includes defoamer, wetting agent, epoxy accelerator.
The method wherein preparing above-mentioned epoxy electron pouring sealant, its step is as follows:
(1) being proportionally added into epoxy resin, epoxide diluent, epoxy toughening agent, epoxy accelerator, defoamer is to high speed dispersor
In, dispersion machine speed is 1000r/min, is uniformly dispersed, and then dispersion limit in limit adds partial filler, continues to be uniformly dispersed, finally
Vacuum defoamation, prepares component A；
(2) in proportion firming agent, wetting agent joins in high speed dispersor, mix homogeneously, is subsequently adding remaining filler, continues
Continue and be uniformly dispersed, last vacuum defoamation, prepare B component；
(3) respectively A, B component are heated to 30 DEG C, weigh A, B component for 1:1 in mass ratio and be uniformly mixed, then existing
Deaeration 10min in vacuum drying oven, injects in encapsulating die, solidifies 3h, i.e. obtain epoxy electron pouring sealant at 120 DEG C.
The present invention provides the benefit that relative to prior art: the epoxy electron pouring sealant of the present invention, uses bisphenol A-type ring
Accelerator, filling kind and addition, as matrix resin, are screened, select optimization formula by epoxy resins.The epoxy prepared
Casting glue heat conductivity is good, and has anti-flammability, and product internal stress is little, and properties is superior to external similar casting glue, is suitable for
Embedding in great-power electronic element uses.
Detailed description of the invention
Below with reference to embodiment, the design of the present invention and the technique effect of generation are clearly and completely described, with
It is completely understood by the purpose of the present invention, feature and effect.Obviously, described embodiment is the part enforcement of the present invention
Example rather than all embodiment, based on embodiments of the invention, those skilled in the art is not before paying creative work
Put other embodiments obtained, belong to the scope of protection of the invention.
Embodiment 1: a kind of epoxy electron pouring sealant, is mixed with according to percentage by weight by following components and forms:
E-51 bisphenol A epoxide resin 18 parts
Epoxide diluent 5 parts
Epoxy toughening agent 4 parts
3 parts of firming agent
Filler 64 parts
Auxiliary agent 6 parts.
Embodiment 2: a kind of method preparing epoxy electron pouring sealant, its step is as follows:
(1) adding 20 parts of epoxy resin, 5 parts of epoxide diluents, 5 parts of epoxy toughening agent, 2 parts of epoxy accelerator, 1 part of defoamer arrives
In high speed dispersor, dispersion machine speed is 1000r/min, is uniformly dispersed, and then dispersion limit in limit adds 22 parts of fillers, continues dispersion
Uniformly, last vacuum defoamation, prepare component A；
(2) 4 parts of firming agent, 2 parts of wetting agent join in high speed dispersor, mix homogeneously, are subsequently adding 39 parts of fillers, continue
It is uniformly dispersed, last vacuum defoamation, prepare B component；
(3) respectively A, B component are heated to 30 DEG C, weigh A, B component for 1:1 in mass ratio and be uniformly mixed, then existing
Deaeration 10min in vacuum drying oven, injects in encapsulating die, solidifies 3h, i.e. obtain epoxy electron pouring sealant at 120 DEG C.
Above the better embodiment of the present invention is illustrated, but the invention is not limited to described enforcement
Example, those of ordinary skill in the art also can make all equivalent modifications on the premise of spirit of the present invention or replace
Changing, modification or the replacement of these equivalents are all contained in the application claim limited range.
Claims (4)
1. an epoxy electron pouring sealant, it is characterised in that be mixed with according to percentage by weight by following components and form:
E-51 bisphenol A epoxide resin 15-25 part
Epoxide diluent 3-7 part
Epoxy toughening agent 3-7 part
Firming agent 1-4 part
Filler 50-75 part
Auxiliary agent 3-8 part.
Epoxy electron pouring sealant the most according to claim 1, it is characterised in that described filler includes silicon powder, oxidation
Aluminum, ground calcium carbonate.
Epoxy electron pouring sealant the most according to claim 1, it is characterised in that described auxiliary agent includes defoamer, moistening
Agent, epoxy accelerator.
4. the method for preparation epoxy electron pouring sealant described in claim 1, its step is as follows:
(1) being proportionally added into epoxy resin, epoxide diluent, epoxy toughening agent, epoxy accelerator, defoamer is to high speed dispersor
In, dispersion machine speed is 1000r/min, is uniformly dispersed, and then dispersion limit in limit adds partial filler, continues to be uniformly dispersed, finally
Vacuum defoamation, prepares component A；
(2) in proportion firming agent, wetting agent joins in high speed dispersor, mix homogeneously, is subsequently adding remaining filler, continues
Continue and be uniformly dispersed, last vacuum defoamation, prepare B component；
(3) respectively A, B component are heated to 30 DEG C, weigh A, B component for 1:1 in mass ratio and be uniformly mixed, then existing
Deaeration 10min in vacuum drying oven, injects in encapsulating die, solidifies 3h, i.e. obtain epoxy electron pouring sealant at 120 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610358132.0A CN105907346A (en) | 2016-05-26 | 2016-05-26 | Epoxy electronic pouring sealant and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610358132.0A CN105907346A (en) | 2016-05-26 | 2016-05-26 | Epoxy electronic pouring sealant and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105907346A true CN105907346A (en) | 2016-08-31 |
Family
ID=56741565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610358132.0A Withdrawn CN105907346A (en) | 2016-05-26 | 2016-05-26 | Epoxy electronic pouring sealant and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105907346A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110699026A (en) * | 2019-10-22 | 2020-01-17 | 亿铖达（深圳）新材料有限公司 | Flexible epoxy pouring sealant |
| CN111654992A (en) * | 2020-06-01 | 2020-09-11 | 贵州航天控制技术有限公司 | Anti-overload large-temperature-impact-resistant four-channel steering engine controller |
| CN112409969A (en) * | 2020-11-10 | 2021-02-26 | 中国船舶重工集团公司第七0七研究所 | Pouring sealant for filling and sealing torque motor rotor and filling and sealing method |
| CN115746768A (en) * | 2022-12-20 | 2023-03-07 | 杭州之江有机硅化工有限公司 | Two-component adhesive for bar planting and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104178076A (en) * | 2014-09-11 | 2014-12-03 | 黎明化工研究设计院有限责任公司 | Heat-conducting electric-insulating epoxy resin potting adhesive and preparation method thereof |
| CN104332309A (en) * | 2014-11-17 | 2015-02-04 | 苏州科茂电子材料科技有限公司 | Potting material of metallic film capacitor |
-
2016
- 2016-05-26 CN CN201610358132.0A patent/CN105907346A/en not_active Withdrawn
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104178076A (en) * | 2014-09-11 | 2014-12-03 | 黎明化工研究设计院有限责任公司 | Heat-conducting electric-insulating epoxy resin potting adhesive and preparation method thereof |
| CN104332309A (en) * | 2014-11-17 | 2015-02-04 | 苏州科茂电子材料科技有限公司 | Potting material of metallic film capacitor |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110699026A (en) * | 2019-10-22 | 2020-01-17 | 亿铖达（深圳）新材料有限公司 | Flexible epoxy pouring sealant |
| CN111654992A (en) * | 2020-06-01 | 2020-09-11 | 贵州航天控制技术有限公司 | Anti-overload large-temperature-impact-resistant four-channel steering engine controller |
| CN112409969A (en) * | 2020-11-10 | 2021-02-26 | 中国船舶重工集团公司第七0七研究所 | Pouring sealant for filling and sealing torque motor rotor and filling and sealing method |
| CN115746768A (en) * | 2022-12-20 | 2023-03-07 | 杭州之江有机硅化工有限公司 | Two-component adhesive for bar planting and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104152093B (en) | A kind of flame-retarded heat-conducting double-component epoxy resin embedding adhesive and preparation method thereof | |
| CN103131381B (en) | High-performance environmentally-friendly flame retardant type organic electron pouring sealant and preparation method thereof | |
| JP6415104B2 (en) | Liquid encapsulant and electronic parts using it | |
| TWI711132B (en) | Epoxy resin composition | |
| CN105907346A (en) | Epoxy electronic pouring sealant and preparation method thereof | |
| CN102191002B (en) | High-humidity and high-temperature resisting single component epoxy adhesive and its preparation method | |
| US10597526B2 (en) | Resin composition | |
| WO2021128895A1 (en) | High-thermal-conductivity insulating layer material, metal substrate, and preparation method | |
| CN106244069B (en) | Epoxy resin adhesive for automobile capacitor and preparation method thereof | |
| CN105969277A (en) | Heat-dissipating pouring sealant for packaging electronic devices | |
| CN105482753B (en) | A kind of high CTI resin combinations and its application | |
| US20130109786A1 (en) | Epoxy resin composition | |
| CN104559892A (en) | Novel epoxy resin sealant adhesive and preparation method thereof | |
| JP2012522848A5 (en) | ||
| WO2018121048A1 (en) | Heat-resistant packaging adhesive for high-power led and manufacturing method thereof | |
| CN103589119A (en) | Epoxy-resin insulating material for outer coating and preparation method thereof | |
| CN108682659B (en) | A kind of wide bandgap semiconductor silicon carbide power device encapsulating structure for new-energy automobile | |
| CN117229738A (en) | High-heat-conductivity flame-retardant insulating epoxy resin pouring sealant and preparation method thereof | |
| CN106085318A (en) | A kind of composite epoxy casting glue of LED display magnetic heat radiation | |
| CN111892749B (en) | Boron nitride high-thermal-conductivity insulating filler with imidazole-copper complex adsorbed on surface, insulating and heat-dissipating epoxy resin composition and preparation method thereof | |
| KR20190114968A (en) | Liquid epoxy resin sealant and semiconductor device | |
| CN107739587A (en) | A kind of LED crystal-bonding adhesives of graphene-containing and preparation method thereof | |
| CN113881382A (en) | A thermally conductive epoxy potting material | |
| CN109401708A (en) | A kind of normal temperature cure casting glue and its application method | |
| CN110577722A (en) | Epoxy resin mixed heat-conducting insulating material for air-core reactor and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20160831 |