CN104169084A - Method for laminating works and touch panel - Google Patents

Abstract

The invention provides a lamination method of workpieces with good reworkability, no color development, relatively short processing time, and relatively cheap, and a touch panel manufactured by the method. Bonding is carried out by irradiating ultraviolet rays to the bonded surfaces of the cover glass (11) having a hydrophilic surface and the silicone substrate (17a) introduced with a silane coupling agent, laminating, and pressing/heating. In addition, the surface of the ITO electrode (13) on the hard coat layer (14a) of the PET film (14) having a hydrophobic surface and the bonding surface of the silicone substrate (17a) introduced with a silane coupling agent UV rays are irradiated, laminated, pressurized/heated, and bonded together. Similarly, by the surface of the 2nd ITO electrode (15) on the glass substrate (16) and the surface of the hard coat (14a) of the PET film (14) and the silicone substrate (17b) that has introduced the silane coupling agent The bonding surface is irradiated with ultraviolet rays, laminated, and pressed/heated for bonding.

Description

How to attach workpieces and touch panels

technical field

The present invention relates to a method of laminating workpieces that can be used in the manufacture of touch panels, organic EL (Organic Electro-Luminescence), organic semiconductors, and solar cell panels, and a touch panel manufactured by the method. In addition, in detail, the present invention relates to a workpiece having a hydrophobic surface such as a resin such as PET (Polyethyleneterephthalate: Polyethyleneterephthalate) provided with a hard coat on the surface and a workpiece made of silicone. Components, or for workpieces with a hydrophilic surface such as glass, or workpieces with a hydrophobic surface such as a resin with a hard coat on the surface, and on the surface of glass or components composed of the above resins A method of laminating workpieces that are coated with a transparent conductive film such as ITO (Indium Tin Oxide) transparent electrodes and have a hydrophobic surface with parts made of silicone sandwiched between them, and by laminating Touch panels manufactured with these workpieces.

Background technique

In recent years, organic ELs, organic semiconductors, solar cells, etc. produced by laminating workpieces have attracted attention. Also, a touch panel is known as a device manufactured by bonding workpieces. Touch panels are used to control on-off of switches, data input, etc. by touching a display that can display images with a finger or a pen, and have been rapidly popularized in recent years. For example, touch panels are widely used in accessories such as mobile phones, portable game machines, and tablet terminals, car navigation devices, bank ATMs, ticket vending machines, and the like.

FIG. 18 shows a schematic diagram of a touch panel composed of an image display device and a touch sensor module. As an example, a projected capacitive touch panel is shown.

As shown in FIG. 18 , the touch panel 100 is composed of an image display device 30 such as an LCD panel and a position input device 10 arranged on top of it.

The position input device 10 is composed of a touch sensor module 10a for detecting a portion touched by a finger or a pen on the touch sensor surface, and processes position input information from the touch sensor module 10a and controls an image based on the above information. The touch panel control unit 10b of the display device 30 is configured.

The touch sensor module 10a is a structure in which a PET film 14 with a pattern of a first transparent conductive film (such as an ITO electrode) and a glass substrate 16 with a pattern of a second transparent conductive film (such as an ITO electrode) are laminated. First, the first ITO electrode 13 , the PET film 14 , the second ITO electrode 15 , and the glass substrate 16 are laminated in this order. In addition, on both sides of the PET film 14, in order to prevent the damage of the PET film 14, the translucent hard-coat layer 14a is provided. That is, the first transparent conductive film pattern is provided on the hard coat layer 14a on the PET film 14 . The hard coat layer 14a is formed of, for example, an acrylic resin or the like.

Furthermore, a cover glass 11 was provided on the side of the PET film 14 on which the first ITO electrode 13 was applied. A black matrix 12 is formed on the peripheral portion of the surface of the cover glass 11 on the side of the PET film 14 opposite to the surface on which the first ITO electrode 13 pattern is applied.

On the other hand, a wiring layer 21 electrically connected to the first ITO electrode 13 and the second ITO electrode 15 and further electrically connected to a touch panel control unit 10 b described later is provided on the lower side of the glass substrate 16 .

The wiring layer 21 is arranged on the lower side of the glass substrate 16 so as to be shielded by the black matrix 12 provided on the cover glass 11 when viewed from the cover glass 11 side. That is, the wiring layer 21 is provided at a position where it does not interfere with an image displayed on the touch panel.

The touch panel control unit 10 b is composed of a touch panel (TP) control IC unit 22 and an FPC (flexible printed circuit board) 23 , and the touch panel control IC unit 22 is provided on the FPC 23 . The FPC 23 is a ring-shaped structure with an opening in the central part, so that it is shielded by the black matrix 12 provided on the cover glass 11 when viewed from the cover glass 11 side, and the touch panel control IC part 22 is arranged in the ring-shaped structure part. the upper part. That is, the touch panel control unit 10b is provided on the touch panel at a position where it does not interfere with a displayed image. As described above, the touch panel control unit 10 b is electrically connected to the wiring layer 21 of the touch sensor module 10 a and is also electrically connected to the image display device 30 .

A touch panel is constituted by laminating the touch sensor module 10 a and the touch panel control unit 10 b described above on an image display device 30 constituted by an image display panel 32 such as an LCD panel. Furthermore, a polarizing film 31 is provided on the surface of the image display panel 32 . Furthermore, as shown in FIG. 18, the touch panel formed by stacking the touch sensor module 10a, the touch panel control unit 10b, and the image display device 30 in the order from above is passed through an ultraviolet curable adhesive 24 (UV Resin) to be engaged. That is, the surface of the glass substrate 16 of the touch sensor module 10a on which the wiring layer 21 is provided and the polarizing film on the surface of the touch panel control unit 10b and the image display device 30 are bonded by UV Resin. In addition, the part of the glass substrate 16 of the touch sensor module 10a where the wiring layer 21 is not provided and the opening part of the touch panel control part 10b are in a state filled with UV Resin.

The touch panel detects the position information of a finger touching the cover glass 11 by the touch panel sensor module 10a, and controls the operation of the image display device 30 based on a control signal from the touch panel control unit 10b which receives the position information.

As shown in FIG. 18( b ), the first ITO electrode 13 is an electrode pattern in which a plurality of electrode pattern units extending in the Y direction are arranged in parallel in the X direction. That is, the first ITO electrode 13 is composed of a plurality of electrode pattern units.

On the other hand, as shown in FIG. 18( c ), the second ITO electrode 15 is an electrode pattern in which a plurality of electrode pattern units extending in the X direction are arranged in parallel in the Y direction. That is, the second ITO electrode 15 is composed of a plurality of electrode pattern units.

A high-frequency voltage is applied to each of these electrode pattern units by an unillustrated power supply. If the finger is close to the cover glass 11 of the touch panel, between the finger and the electrode pattern unit disposed in the position close to the finger in the first ITO electrode 13, the electrode disposed in the position close to the finger in the finger and the second ITO electrode 15 Capacitance (capacitance) is formed between the pattern cells, and current flows through them respectively. By detecting this change in current, the position of the finger on the cover glass 11 can be detected.

That is, as is clear from FIG. 18(b)(c), the first ITO electrode 13 detects the position of the finger in the X direction, and the second ITO electrode 15 detects the position of the finger in the Y direction. As shown in FIG. 18( d), by arranging the first ITO electrodes 13 and the second ITO electrodes 15 in a matrix in the X-Y two-dimensional direction, the touch panel sensor module 10a detects the position in the X-Y two-dimensional direction of the finger touching the cover glass 11. .

A signal related to the position of the finger in contact with the cover glass 11 detected by the touch panel sensor module 10 a is sent to the touch panel control unit 10 b.

Here, if between the PET film 14 and the cover glass 11 in the touch panel sensor module 10a (between the surface of the PET film 14 on which the first ITO electrode 13 is applied and the lower surface of the glass cover 11), or the PET film 14 and the glass substrate 16 (between the surface of the hard coat layer 14a of the PET film 14 opposite to the side of the first ITO electrode 13 and the surface of the glass substrate 16 on which the second ITO electrode 15 is provided), an air layer is sandwiched. Due to the difference in the refractive index at the interface between each surface and the air layer, light is reflected at the interface, and the deterioration of the display quality on the touch panel, which is called a decrease in brightness or a decrease in contrast, occurs.

Therefore, in order to remove such an air layer, the air layer is replaced with a transparent material whose refractive index is closer to that of the cover glass 11, PET film 14, or glass substrate 16 than air, thereby suppressing a decrease in brightness or contrast of the touch panel display. decline.

Specifically, the lower surface of the cover glass 11 and the surface of the PET film 14 on the side of the first ITO electrode 13 are joined by a transparent adhesive member 19 having the above-mentioned refractive index compared with air. In addition, the surface of the hard coat layer 14a of the PET film 14 opposite to the side of the first ITO electrode 13 and the surface of the glass substrate 16 on which the second ITO electrode 15 is provided are also bonded by the above-mentioned adhesive member.

As an adhesive member, for example, an optical adhesive tape (Optically Clear Adhesive Tape: hereinafter referred to as OCA tape) using a highly transparent acrylic adhesive as exemplified in Patent Document 1 and Patent Document 2, or a patented Highly transparent curable resin (Optically Clear Resin: hereinafter referred to as OCR) exemplified in Document 3 and Patent Document 4.

prior art literature

patent documents

Patent Document 1: Japanese Patent Application Laid-Open No. 9-251159

Patent Document 2: Japanese Patent Laid-Open No. 2011-74308

Patent Document 3: Japanese Patent Laid-Open No. 2009-48214

Patent Document 4: Japanese Unexamined Patent Publication No. 2010-257208

Patent Document 5: Japanese Patent No. 3714338

Patent Document 6: Japanese Patent Laid-Open No. 2006-187730

Patent Document 7: International Publication No. 2008/087800

Patent Document 8: Japanese Patent Laid-Open No. 2008-19348

Contents of the invention

The problem to be solved by the invention

As described above, the lower surface of the cover glass 11 and the surface of the PET film 14 on the side of the first ITO electrode 13 are bonded by using OCA tape and OCR, and the hard coat layer on the side opposite to the side of the first ITO electrode 13 of the PET film 14 is used. The bonding of the surface of 14a and the surface of the glass substrate 16 on which the second ITO electrode 15 is provided suppresses a decrease in luminance or a decrease in contrast of the touch panel display.

However, when using OCA tape and OCR, the following problems and discomforts need to be considered.

When OCA tape is used, reworkability is lacking due to strong adhesion. In other words, it is difficult to reuse after being temporarily peeled off, so when using the OCA tape, high lamination accuracy is required.

In addition, because the OCA tape is hard, when there is a step structure on the surface of the first ITO electrode 13 side surface of the PET film 14 or the surface of the glass substrate 16 on which the second ITO electrode 15 is provided, it is easy to mix in the above-mentioned step part during mounting. bubble.

In addition, as mentioned above, the OCA tape is poor in reworkability, and air bubbles are easily mixed in the step portion of the surface, so it is difficult to perform the mounting process. Therefore, it is difficult to use the OCA tape when the area of the joining surface is a large-area to-be-joined object. In addition, the OCA tape is relatively expensive.

On the other hand, bonding using OCR is performed as follows. That is, OCR is coated on at least one joint surface of two workpieces, the two workpieces are stacked, and the OCR is cured by heating or irradiating ultraviolet (UV) to join the two workpieces. Here, OCR is generally difficult to apply evenly on the joint surface due to its high viscosity. Therefore, for example, an inconvenience occurs that the bonding surface of the cover glass 11 and the bonding surface of the PET film 14 are bonded in a non-parallel state.

In addition, the OCR heat resistance temperature is low, and when ultraviolet (UV) curable OCR is used, it is necessary to consider the influence of the temperature rise of OCR when UV is irradiated. That is, if the distance between the UV light source 40 and the OCR bonding surface is too short, the OCR will be heated above the heat-resistant temperature of the OCR. Therefore, it is necessary to increase the distance between the UV light source 40 and the OCR bonding surface to some extent, but in this case, the intensity of UV at the OCR bonding surface is weakened. As a result, when using UV curable OCR, the curing process Prolonged.

In addition, OCR is deformed during curing, so the joining state of two workpieces may not be the desired state. For example, when bonding the cover glass 11 and the PET film 14 or bonding the glass substrate 16 and the image display panel 32, the interval between the cover glass 11 and the PET film 14 or the interval between the glass substrate 16 and the image display panel 32 may be uneven. Degrade the performance of the touch panel.

In addition, when OCR is used, the resistance to time is not necessarily sufficient, and if a certain amount of time passes after bonding, the OCR itself will be colored, for example, yellow. Thus, in the case of a touch panel, discoloration of the image can be seen. In addition, the price of OCR is relatively high.

The present invention has been made in view of the above, and an object of the present invention is to provide a method for laminating workpieces, which is good in reworkability, does not develop color even after long-term use, has a relatively short processing time, is relatively inexpensive, and is suitable for bonding. Members with a large surface area can be bonded easily, and a touch panel is provided in which reduction in luminance or contrast is suppressed by such a bonding method.

means to solve the problem

The present invention provides a bonding technology for bonding workpieces having a hydrophilic surface such as glass, workpieces having a hydrophobic surface such as resin, and workpieces having a hydrophobic surface with a transparent conductive film applied to the surface of glass or resin. For workpieces, etc., when workpieces with a hydrophilic surface and workpieces with a hydrophobic surface are bonded together, or when workpieces with a hydrophobic surface are bonded to each other, use parts made of silicone instead of conventional OCA tapes or OCR. Combine these artifacts. In addition, there is provided a technique for bonding the above-mentioned member made of silicone to the above-mentioned second and third workpieces having a hydrophobic surface.

As a specific example, a touch panel will be described. In the touch panel shown in FIG. 18 , when bonding the lower surface of the cover glass 11 (the surface of the first workpiece) and the surface of the PET film 14 on the side of the first ITO electrode 13 (the surface of the second workpiece), or attaching When combining the surface of the hard coat layer 14a (the surface of the first workpiece) on the side opposite to the side of the first ITO electrode 13 of the PET film 14 and the surface of the glass substrate 16 on which the second ITO electrode 15 is provided (the surface of the second workpiece), instead of the conventional The OCA tape, or OCR, uses parts made of silicone.

It is known that when ultraviolet rays are irradiated on the surface of a component made of silicone (hereinafter referred to as a silicone substrate) in the atmosphere, the surface is oxidized and becomes a hydrophilic surface. By laminating a glass substrate or a resin on such a surface As for the substrate, the laminated glass substrate or resin substrate and the silicone substrate irradiated with ultraviolet rays are pressed or heated for a predetermined period of time to bond the two substrates.

For example, as described in Patent Document 5, when the silicone substrate is a polydimethylsiloxane (Polydimethylsiloxane: PDMS) substrate, the surface of the silicone (PDMS) substrate 17, as shown in FIG. Organosiloxane-based surface (hydrophobic surface).

Active oxygen is generated on the surface of the substrate 17 by irradiating the surface of the substrate 17 held in the atmosphere with ultraviolet light having a wavelength of 220 nm or less (for example, ultraviolet light having a center wavelength of 172 nm emitted from a xenon excimer lamp). The surface of the substrate is oxidized as the active oxygen comes into contact with the surface of the substrate. That is, as shown in FIG. 2( b ), the methyl group of the organosiloxane group is detached, and active oxygen is bonded to the silicon atom to which the methyl group was originally bonded.

The above-mentioned active oxygen is bonded to hydrogen due to the presence of moisture in the atmosphere, and as shown in FIG. 2( c ), the surface of the substrate is in a state where hydroxyl groups (OH groups) are bonded to silicon atoms. By laminating the hydrophilic surface of the glass substrate 16 on such a surface and making the two surfaces close together, as shown in FIG. 2( d), a hydrogen bond is formed at the interface between the surface of the PDMS substrate 17 and the glass surface, and the two substrates to be engaged.

Silicone is a relatively stable material, and unlike OCR, coloring of the silicone itself does not occur even after a certain amount of time has elapsed after lamination. Therefore, even if it is used as a bonding material for each substrate of a touch panel display, it does not affect the image of the touch panel due to discoloration.

In addition, since silicone is a relatively soft material, even if there is a step structure on the surface of the hard coat layer 14a on the side of the first ITO electrode 13 of the PET film 14 or the surface of the glass substrate 16 on the side of the first wiring layer 21, the adhesion will not be difficult. Incorporation of air bubbles into the above-mentioned step portion can also be easily suppressed at the time of mounting. In other words, it is easy to join even parts with a large area to be joined.

In addition, as mentioned above, the bonding of silicone substrates does not have the process of coating on the bonding surface like OCR, and it is not bonding that utilizes a curing reaction like OCR, so there is no chance of coating when using OCR. Uniformity issues or distortion issues when curing.

Silicone has a higher heat-resistant temperature than OCR, so it can shorten the distance between the UV light source and the surface of the silicone substrate during surface treatment of the silicone substrate compared to the distance between the ultraviolet (UV) light source and the OCR bonding surface during OCR curing. The UV intensity of the silicone substrate surface is greater than that of the OCR bonding surface. That is, in the UV irradiation step to the silicone substrate, the UV utilization efficiency is higher than in the UV irradiation step to the OCR bonding surface.

In addition, according to the experiments of the inventors, compared with the time required for the UV curing reaction of OCR, the UV irradiation process to the silicone substrate, the heating process or the pressurization process of the substrate to be bonded such as the silicone substrate and the glass substrate The time required is short.

Additionally, silicone substrates are generally inexpensive compared to OCA tape or OCR.

When using a silicone substrate for bonding, the bonding is not completed immediately after laminating the glass substrate or resin substrate and the silicone substrate irradiated with ultraviolet light, but by pressing or heating the two substrates for a predetermined time as described above. End splicing. Therefore, it is easy to separate the two substrates immediately after lamination. Therefore, for example, if the alignment between the glass substrate or the resin substrate and the silicone substrate irradiated with ultraviolet rays is insufficient, immediately after lamination, the bonding process can be carried out by temporarily peeling the two, and then irradiating the silicone substrate with ultraviolet rays again. . In other words, compared with the OCA tape, it is more reworkable.

FIG. 1 shows a configuration example of a touch panel assembled using the bonding method of the present invention.

The basic structure is the same as that shown in FIG. 18 , and is composed of a position input device 10 and an image display device 30. The position input device 10 is composed of a touch sensor module 10a and a touch panel control unit 10b. In the present invention, Between the first ITO electrode 13 provided on the surface of the hard coat layer 14a of the PET film 14 and the cover glass 11, a silicone substrate (for example, PDMS) 17a into which a silane coupling agent was introduced was provided. In addition, a silicone substrate 17 b into which a silane coupling agent was introduced was provided between the hard coat layer 14 a of the PET film 14 and the second ITO electrode 15 provided on the surface of the glass substrate 16 .

Here, based on the experimental results of the inventors, etc., the following findings were obtained. In other words, it is found that even if the surface of a general silicone substrate is irradiated with ultraviolet rays (UV) to make the surface hydrophilic, the hydrophilic surface of the silicone substrate and the PET surface with the first ITO electrode 13 applied Even if the thin film 14 or the glass substrate 16 with the second ITO electrode 15 on the surface is superimposed, it cannot be bonded. Similarly, it was found that even if the hydrophilic surface of the silicone substrate obtained by UV irradiation was superimposed on the surface of the hard coat layer 14 a opposite to the first ITO electrode 13 side of the PET film 14 , bonding was not possible.

That is to say, it is known that: the bonding surface of the silicone substrate, which is a hydrophilic surface, and the surface of the PET film 14 (which is a hydrophobic surface) to which the first ITO electrode 13 is applied, and the surface of the PET film 14 and the surface to which the first ITO electrode 13 is applied The surface of the hard coat layer 14a on the opposite side and the surface of the glass substrate 16 on which the second ITO electrode 15 is applied are difficult to join.

The inventors conducted intensive research and found that by using a silicone substrate with a silane coupling agent introduced instead of a normal silicone substrate and irradiating the surface of the silicone substrate with a silane coupling agent with UV, the The surface is formed as a surface suitable for bonding by laminating the surface suitable for bonding, the surface of the PET film 14 having a hydrophobic surface on which the first ITO electrode 13 is applied, and the side opposite to the surface of the PET film 14 on which the first ITO electrode 13 is applied. The surface of the hard coat layer 14a or the surface of the glass substrate 16 is provided with the surface of the second ITO electrode 15, and the silicone substrate introduced with the silane coupling agent can be bonded to these surfaces.

In addition, it was found that by laminating the surface of the cover glass 11 with a hydrophilic surface and the surface suitable for bonding to the above-mentioned silicone substrate introduced with a silane coupling agent, it was found that the surface of the ordinary silicone substrate laminated by UV irradiation The hydrophilized surface is the same as that of the surface of the cover glass 11 , and the silicone substrate introduced with the silane coupling agent can be bonded to the cover glass 11 .

Here, the silane coupling agent-introduced silicone substrate refers to a silicone substrate formed by introducing a silane coupling agent into an uncured silicone resin and then curing it. By using, for example, an epoxy-based, acrylic-based, or methacrylic-based silane coupling agent as the silane coupling agent, a silicone substrate suitable for bonding according to the present invention can be obtained.

By modifying the surface of the silicone substrate 17a, 17b into which the silane coupling agent is introduced, the surface modified by the surface of the PET film 14 can be applied with the surface of the first ITO electrode 13, and the surface of the PET film 14 with the applied One surface of the first ITO electrode 13 is bonded to either the surface of the opposite hard coat layer 14 a or the surface of the glass substrate 16 on which the second ITO electrode 15 is provided. The mechanism is not necessarily clear, but it is presumed to be the following mechanism. Hereinafter, this supposed mechanism will be described with reference to FIGS. 3 and 4 .

As an example, a case where the surface of the silicone substrate 17a introduced with a silane coupling agent is modified by ultraviolet (UV) irradiation, and the surface is bonded to the surface of the PET film 14 on which the first ITO electrode 13 is applied will be considered. In addition, the silicone substrate 17a introduced with the silane coupling agent in FIG. 3(a) is defined as a substrate to be bonded to the cover glass 11 by the method shown in FIG. 2 in advance.

FIG. 3( a ) shows the state of the silane coupling agent present on the surface of the silicone substrate 17 a into which the silane coupling agent has been introduced.

A silane coupling agent has two types of functional groups with different reactivity in one molecule. In the silicone substrate into which the silane coupling agent has been introduced, it is considered that a part of the silane coupling agent is exposed on the surface of the silicone substrate.

In FIG. 3( a ), a functional group represented by RO (O is oxygen) is a functional group chemically bonded to an inorganic material, and X is a functional group bonded to an organic material. Since the first ITO electrode 13 on the PET film 14 is an inorganic substance, it is chemically bonded to the functional group RO.

As shown in FIG. 3( b ), in an atmosphere containing moisture (H ₂ O) and carbon dioxide (CO ₂ ), the surface of the silicone substrate 17a introduced with a silane coupling agent is irradiated with ultraviolet light (UV light) from an excimer lamp or the like. ) ultraviolet light (UV) emitted by the light source 40 . The silane coupling agent partially exposed on the surface of the silicone substrate 17a introduced with the silane coupling agent is modified by UV irradiation.

Specifically, it is considered that as a result of (a) the decomposition reaction of the functional group X of the silane coupling agent exposed on the surface of the silicone substrate 17a or the chemical reaction of moisture in the air and carbon dioxide caused by UV irradiation, A carboxyl group (-COOH) is formed on a part of the surface of the substrate 17a, or (b) the functional groups RO and X of the silane coupling agent are decomposed and detached, and are formed as a result of chemical reactions with moisture and carbon dioxide in the air caused by ultraviolet irradiation. The generated oxygen radicals react to form hydroxyl groups (—OH) on a part of the surface of the silicone substrate 17a. In addition, it is considered that (c) the undecomposed functional groups RO and X remain on the surface.

In summary, it is considered that the surface of the silicone substrate 17a into which the silane coupling agent has been introduced is mixed with (a) a portion bonded to a carboxyl group (with an OH group at the end), and (b) a portion bonded to an OH group due to an oxidation reaction of oxygen radicals. part, and (c) the part remaining without decomposing and decomposing functional groups RO and X.

That is, by irradiating the surface of the silicone substrate 17a into which the silane coupling agent is introduced with ultraviolet light (UV), a part of the functional groups in the silane coupling agent exposed on the surface is decomposed and detached. Since the decomposed and detached part of the functional group ends in any case as an OH group, it is considered that a part of the surface of the silicone substrate 17 a into which the silane coupling agent is introduced becomes a hydrophilic surface. In addition, the remaining functional group RO as described above has the property of chemically bonding with an inorganic material.

Moreover, as shown in Figure 4(c), by ultraviolet (UV) irradiation treatment, a hydrophilic part and a part where a functional group RO group remains that chemically reacts with an inorganic substance are mixed in a part of the region, and in such a state On the surface of the silicone substrate 17a introduced with a silane coupling agent, the first ITO electrode is applied to the PET film 14 where a part of the original hydrophobic part is modified to a region terminated by an OH group by UV irradiation. 13, so that a hydrogen bond can be formed between the hydrophilic portion on the surface of the above-mentioned silicone substrate 17a and the hydrophilic portion on the surface of the PET film 14 on which the first ITO electrode 13 is applied. On the other hand, a chemical bond occurs between the part where the functional group RO remains on the surface of the silicone substrate 17 a and the hydrophobic part on the surface of the PET film 14 to which the first ITO electrode 13 is applied. Here, it is considered that by heating the surface on which the first ITO electrode 13 is applied to the laminated silicone substrate 17a introduced with the silane coupling agent and the surface of the PET film 14, dehydration of the joint surface occurs, and finally the silane coupling agent is introduced. The silicone substrate 17a and the surface of the PET film 14 on which the first ITO electrode 13 is applied are covalently bonded by oxygen, and the functional group RO remaining on the surface of the above-mentioned silicone substrate 17a is connected to the surface of the PET film 14 on which the first ITO electrode 1 is applied. The surface is bonded by chemical bonding between hydrophobic moieties.

Furthermore, in Fig. 3 and Fig. 4 , the case of joining the surface of the silicone substrate 17a introduced with the silane coupling agent and the surface of the PET film 14 on which the first ITO electrode 13 was applied was considered, but it is considered that the surface of the PET film 14 may be replaced by PET. When the surface of the film 14 on which the first ITO electrode 13 is applied is bonded to the surface of the hard coat layer 14a opposite to the surface of the PET film 14 on which the first ITO electrode 13 is applied or the surface of the glass substrate 16 on which the second ITO electrode 15 is applied , can also be bonded by the same mechanism.

Based on the above circumstances, in the present invention, the above-mentioned problems are solved as follows.

(1) By irradiating ultraviolet rays to the surface of a workpiece having a hydrophobic surface and a part made of silicone into which a silane coupling agent has been introduced, the surface of the workpiece irradiated with ultraviolet rays and the part made of silicone irradiated with ultraviolet rays Laminate in such a way that the surfaces of the stacked workpieces and parts made of silicone are pressed in such a way that the contact surfaces of the above-mentioned laminated workpieces and parts made of silicone are pressed, or the laminated workpieces and parts made of silicone are heated, or the The laminated workpiece and the silicone component are heated while being pressurized so that the contact surface is pressurized, and the workpiece with a hydrophobic surface and the silicone component introduced with a silane coupling agent are bonded together. .

(2) By irradiating ultraviolet rays to one surface of the first workpiece having a hydrophilic surface, one surface of the second workpiece having a hydrophobic surface, and both sides of a member made of silicone into which a silane coupling agent is introduced, The first workpiece, the member made of silicone, and the second workpiece are stacked so that the surfaces irradiated with ultraviolet rays are in contact with each other, and the contact surface is pressurized, or the laminated first and second workpieces and the second workpiece are pressed. Heating the parts made of silicone, or heating the laminated first and second workpieces and the parts made of silicone while pressurizing their contact surfaces, thereby imparting hydrophilicity The first workpiece with a surface and the second workpiece with a hydrophobic surface are bonded with the silicone substrate introduced with the silane coupling agent interposed therebetween.

(3) By irradiating ultraviolet rays to one surface of the first workpiece having a hydrophobic surface, one surface of the second workpiece having a hydrophobic surface, and both sides of a member made of silicone into which a silane coupling agent is introduced, to The above-mentioned first workpiece, the above-mentioned member made of silicone, and the second workpiece are laminated so that the surfaces irradiated with ultraviolet rays are in contact with each other, and the above-mentioned contact surfaces are pressurized, or the laminated first and second workpieces are pressed. The workpiece and the parts made of silicone are heated, or the laminated first and second workpieces and parts made of silicone are heated while being pressurized so that the contact surfaces thereof are pressurized, and the hydrophobic surface The first workpiece and the second workpiece having a hydrophobic surface were bonded with the silicone substrate introduced with the silane coupling agent interposed therebetween.

(4) In a touch panel provided with a touch sensor module having a substrate on which a transparent conductive film is applied and an image display device, a substrate on which a transparent conductive film is applied whose surface is modified by ultraviolet irradiation is provided in the touch sensor module. A substrate, and a silicone member into which a silane coupling agent has been introduced and whose both surfaces have been modified by irradiating ultraviolet rays are laminated so that the surfaces of the substrate and the member made of silicone that have been irradiated with ultraviolet rays face each other.

(5) As the silane coupling agent of the above (1) to (4), an epoxy-based, acrylic-based or methacrylic-based silane coupling agent is used.

Invention effect

In the present invention, the following effects can be obtained.

(1) By irradiating ultraviolet light on the surface of the workpiece having a hydrophobic surface and the silicone component introduced with the silane coupling agent, the surface of the workpiece and the ultraviolet irradiated surface of the silicone component can be formed to be suitable for bonding. The surface can reliably bond the above-mentioned workpiece with a hydrophobic surface and a part made of silicone into which a silane coupling agent has been introduced.

Therefore, resins such as PET with a hydrophobic surface, workpieces with transparent conductive films, etc., can be bonded to parts made of silicone introduced with a silane coupling agent.

(2) By irradiating ultraviolet rays to one surface of a workpiece having a hydrophilic surface and irradiating ultraviolet rays to one surface of a workpiece having a hydrophobic surface, in addition, to a part made of silicone into which a silane coupling agent is introduced UV rays are irradiated on both sides, and the workpiece with a hydrophilic surface, the workpiece with a hydrophobic surface, and the UV-irradiated surface of a silicone component introduced with a silane coupling agent are laminated so that the UV-irradiated surfaces face each other, or the workpiece with a hydrophobic surface One surface of the workpiece is irradiated with ultraviolet rays. In addition, ultraviolet rays are irradiated on both sides of the component made of silicone with a silane coupling agent introduced, so that the workpiece with a hydrophobic surface and the silicone component with a silane coupling agent The parts and workpieces with a hydrophobic surface are laminated so that the UV irradiated surfaces face each other, and they are laminated to obtain the following effects.

(a) Since silicone does not undergo coloration over a long period of time, it does not undergo coloration over a long period of time like when laminating with OCA tape or OCR.

Therefore, by being suitable for the manufacture of touch panels, discoloration does not affect the image of the touch panel.

(b) Even if there is a step structure such as a conductive film on the bonding surface, since the silicone deforms and adheres to the step, it is easy to suppress the incorporation of air bubbles into the step portion during mounting.

(c) It is possible to avoid problems such as difficulty in achieving coating uniformity and deformation during curing when using OCR for lamination. In addition, since silicone has a higher heat-resistant temperature than OCR, it is possible to reduce the ultraviolet radiation light source and silicone. The irradiated surface is close, and the light-irradiated surface of silicone can be modified efficiently.

(d) Generally, parts made of silicone are less expensive than OCA tapes or OCRs, so manufacturing costs can be reduced.

(e) When bonding parts made of silicone, even if the workpiece and the parts made of silicone are laminated, the joining is not terminated immediately, but is completed by applying pressure or heating for a predetermined time. Therefore, it is easy to separate the two substrates immediately after lamination. Therefore, if the alignment between the workpiece and the silicone component is not sufficient, immediately after lamination, the two can be temporarily peeled off, and the silicone component can be irradiated with ultraviolet rays again to perform the bonding process. In other words, compared with the OCA tape, it is more reworkable.

(f) It is possible to bond a member made of silicone, which has been difficult to bond even with surface modification treatment using ultraviolet irradiation, to the surface of a conductive film substrate whose surface is hydrophobic in the touch sensor module. Therefore, when bonding the constituent elements of the touch sensor module, instead of the conventional OCA tape or OCR, a member made of silicone can be used to bond the constituent elements to form the touch sensor module.

(3) By using an epoxy-based, acrylic-based or methacrylic-based silane coupling agent as a silane coupling agent introduced into a part made of silicone, it is possible to obtain a silicone material suitable for bonding with a workpiece having a hydrophobic surface. Parts made of ketones.

Description of drawings

FIG. 1 shows a configuration example of a touch panel assembled using the bonding method of the present invention.

FIG. 2 is a diagram illustrating bonding of a glass substrate with a hydrophilic surface and a PDMS substrate irradiated with ultraviolet light.

Fig. 3 is a diagram (1) illustrating bonding of a surface of a PET film on which an ITO electrode is applied and a silicone substrate into which a silane coupling agent has been introduced.

Fig. 4 is a diagram (2) illustrating the bonding of the surface of the PET film on which the ITO electrode is applied and the silicone substrate introduced with the silane coupling agent.

Fig. 5 is a diagram illustrating a bonding step (A-1) between a cover glass and a PET film on which a first transparent conductive film (ITO electrode) is applied.

6 is a diagram (1) illustrating a bonding process (B-1) of a PET film with a first transparent conductive film (ITO) on its surface and a glass with a second transparent conductive film (ITO) on its surface.

7 is a diagram (2) illustrating a bonding process (B-1) of a PET film with a first transparent conductive film (ITO) on its surface and a glass with a second transparent conductive film (ITO) on its surface.

Fig. 8 is a diagram illustrating a bonding step (A-2) between a cover glass and a PET film on which a first transparent conductive film (ITO) is applied.

9 is a diagram (1) illustrating a bonding process (B-2) of a PET film with a first transparent conductive film (ITO) on its surface and a glass with a second transparent conductive film (ITO) on its surface.

10 is a diagram (2) illustrating a bonding process (B-2) of a PET film with a first transparent conductive film (ITO) on its surface and a glass with a second transparent conductive film (ITO) on its surface.

Fig. 11 is a diagram illustrating a bonding step (A-3) between a cover glass and a PET film on which a first transparent conductive film (ITO) is applied.

12 is a diagram illustrating a bonding step (B-3) of a PET film with a first transparent conductive film (ITO) on its surface and a glass with a second transparent conductive film (ITO) on its surface.

FIG. 13 shows another configuration example of a touch panel assembled using the joining method of the present invention.

Fig. 14 is a diagram illustrating a bonding step (C-1) between a cover glass and a first glass substrate on which a first transparent conductive film (ITO) is applied.

Fig. 15 is a diagram illustrating a bonding process (D-1) of a first glass substrate with a first transparent conductive film (ITO) on its surface and a second glass substrate with a second transparent conductive film (ITO) on its surface .

Fig. 16 is a diagram illustrating a bonding step (C-2) between a cover glass and a first glass substrate on which a first transparent conductive film (ITO) is applied.

Fig. 17 is a diagram illustrating a bonding process (D-2) of a first glass substrate with a first transparent conductive film (ITO) on its surface and a second glass substrate with a second transparent conductive film (ITO) on its surface .

FIG. 18 is a schematic diagram of a touch panel composed of an image display device and a touch sensor module.

Detailed ways

Hereinafter, an embodiment of the present invention will be described taking the case of manufacturing a touch panel as an example, but the present invention is also applicable to the manufacture of the above-mentioned organic EL, organic semiconductor, solar cell, etc. in addition to the touch panel.

(1) Embodiment 1

FIG. 1 is a diagram showing a first configuration example of the touch panel of the present invention described above.

The basic configuration is the same as that shown in FIG. 18 , and the touch panel 100 is composed of an image display device 30 such as an LCD panel and a position input device 10 arranged on top of it.

The position input device 10 is composed of a touch sensor module 10a for detecting a portion touched by a finger, a pen, etc. on the touch sensor surface, and processes position input information from the touch sensor module 10a and controls image display based on the above information. The touch panel control unit 10b of the device 30 is configured.

The touch sensor module 10a is to apply the PET film 14 of the first transparent conductive film (for example ITO electrode) pattern shown in Figure 18 (b) and the second transparent conductive film (for example ITO electrode) shown in Figure 18 (c) ITO electrode) pattern glass substrate 16 laminated structure, from the top according to the glass cover 11, silicone substrate 17a, the first ITO electrode 13, PET film 14, silicone substrate 17b, the second ITO electrode 15, glass substrate 16 stacked in order. In addition, on both surfaces of the PET film 14, in order to prevent the damage of the PET film 14, the translucent hard-coat layer 14a is provided. As described above, the hard coat layer 14a is made of, for example, an acrylic resin or the like.

A black matrix 12 is formed on the peripheral portion of the surface of the cover glass 11 that faces the surface of the PET film 14 on which the first ITO electrode 13 pattern is applied.

On the lower side of the glass substrate 16, the wiring layer 21 electrically connected to the 1st ITO electrode 13 and the 2nd ITO electrode 15, and also electrically connected to the touch panel control part 10b is provided. The wiring layer 21 is arranged on the lower side of the glass substrate 16 so as to be shielded by the black matrix 12 provided on the cover glass 11 when viewed from the cover glass 11 side.

The touch panel control unit 10 b is composed of a touch panel (TP) control IC unit 22 and an FPC (flexible printed circuit board) 23 as described above, and the touch panel control IC unit 22 is provided on the FPC 23 . The FPC 23 is a ring-shaped structure with an opening in the central part, so that it is shielded by the black matrix 12 provided on the cover glass 11 when viewed from the cover glass 11 side, and the touch panel control IC part 22 is arranged in the ring-shaped structure part. the upper part.

The touch panel control unit 10 b is electrically connected to the wiring layer 21 of the touch sensor module 10 a and is also electrically connected to the image display device 30 .

The touch sensor module 10 a and the touch panel control unit 10 b described above are stacked on the image display device 30 to form a touch panel.

In the touch panel shown in FIG. 1, the substrate of the first transparent conductive film (for example, the first ITO electrode 13) in the touch sensor module 10a is a PET film 14, and the substrate of the second transparent conductive film (for example, the second ITO electrode 15). The substrate is an example of a glass substrate 16 . Furthermore, in the configuration example of the touch panel shown in FIG. 1 , the thickness of each substrate and each layer is described exaggeratedly for ease of explanation, and the actual relative relationship of the thickness of each substrate and each layer is the same as that shown in FIG. 1 . relationship is different.

Hereinafter, the lamination process of each workpiece|work for manufacturing the said touch sensor module is demonstrated.

[Process A-1] Bonding process of the cover glass and the PET film with the first transparent conductive film (ITO electrode) applied on the surface

This step is shown in FIG. 5 . This step shows a method of laminating a first workpiece having a hydrophilic surface and a second workpiece having a hydrophobic surface with a silicone substrate interposed therebetween. The cover glass 11 corresponds to the first workpiece having a hydrophilic surface. , which corresponds to the second workpiece having a hydrophobic surface is the PET film 14 on which the first transparent conductive film (ITO electrode 13) is applied on the surface of the hard coat layer 14a.

(a) Bonding of the cover glass 11 and the silicone substrate 17a introduced with a silane coupling agent

Before carrying out the bonding of the first workpiece with a hydrophilic surface, that is, the underside surface of the cover glass 11, and the second workpiece with a hydrophobic surface, that is, the first ITO electrode 13 side surface of the PET film 14, the cover glass 11 is first bonded. Bonding to the silicone substrate 17a introduced with a silane coupling agent.

As shown in FIG. 5(a), by irradiating the surface of the silicone substrate 17a into which the silane coupling agent is introduced with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp, the exposed surface of the silicone substrate 17a The domain of the silane coupling agent is modified so that the hydrophilic domain terminated by the OH group and the residual domain of the functional group RO are mixed. In addition, the region on the surface of the silicone substrate 17a where the silane coupling agent is not exposed is oxidized to be modified into a hydrophilic region. Hereinafter, the surface of the silicone substrate thus modified is referred to as "the surface of the silicone substrate suitable for bonding".

Next, the bonding surface of the cover glass 11 is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp.

Then, the bonding surface of the cover glass 11 and the UV irradiation surface of the silicone substrate 17 a introduced with the silane coupling agent are laminated. Bonding strength is improved by appropriately applying pressure or heating to the laminated cover glass 11 and the silicone substrate 17a into which the silane coupling agent has been introduced.

Furthermore, since the cover glass 11 itself has a hydrophilic surface, it does not necessarily need to be irradiated with UV light. However, by irradiating the bonding surface of the cover glass 11 with UV light, the bonding surface of the cover glass 11 is activated, or impurities on the surface of the cover glass 11 are decomposed and removed, so that the bonding surface of the cover glass 11 can be more reliably introduced. Bonding of the silicone substrate 17a with a silane coupling agent.

In addition, UV irradiation may be performed simultaneously on the surface of the silicone substrate 17 a introduced with the silane coupling agent and the bonding surface of the cover glass 11 .

(b) Bonding of the silicone substrate 17a bonded to the cover glass 11 and the PET film 14

Next, as shown in FIG. 5( b ), by irradiating the surface of the silicone substrate 17 a into which the silane coupling agent has been introduced, UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp, the surface of the silicone substrate 17 a into which the silane coupling agent has been introduced is The UV irradiation surface of the silicone substrate 17a is formed as a silicone substrate surface suitable for bonding.

On the other hand, in the PET film 14 on which the first ITO electrode 13 is applied on the surface of the hard coat layer 14a, the surface on which the first ITO electrode 13 pattern is applied is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp, A part of the surface of the PET film 14 on which the pattern of the first ITO electrode 13 was applied was modified into an OH group-terminated region. Hereinafter, the surface thus modified is referred to as "the surface of the transparent conductive film suitable for bonding".

Then, the UV irradiation-treated surface of the silicone substrate 17a introduced with the silane coupling agent is laminated with the UV-irradiated surface of the PET film 14 on which the first ITO electrode 13 is applied. The silicone substrate 17a and the PET film 14 are pressurized or heated, and the silicone substrate 17a (completely bonded to the cover glass 11) introduced with the silane coupling agent is bonded to the PET film 14 with the first ITO electrode 13 applied on the surface.

That is, the joining method used in this process (A-1) is as follows.

(1) The silicone substrate 17 a into which a silane coupling agent has been introduced is bonded to the lower surface of the cover glass 11 which is the first workpiece having a hydrophilic surface. The bonding method is to irradiate the above-mentioned silicone substrate 17a with ultraviolet rays to form the ultraviolet-irradiated surface as the surface of the silicone substrate suitable for bonding, and to laminate this surface on the cover glass 11 to bond the first workpiece having a hydrophilic surface, that is, The cover glass 11 and the silicone substrate 17a introduced with a silane coupling agent. In addition, as described above, the bonding surface of the cover glass 11 may be irradiated with ultraviolet rays.

(2) On the surface of the silicone substrate 17a that has introduced the silane coupling agent on the first workpiece with a hydrophilic surface, that is, the cover glass 11, and the surface of the second workpiece with a hydrophobic surface, that is, the PET film 14. The surface of the first transparent conductive film (ITO electrode 13) is irradiated with ultraviolet rays, the ultraviolet irradiated surface of the above-mentioned silicone substrate 17a is modified into a silicone substrate surface suitable for bonding, and the ultraviolet irradiated surface of the above-mentioned PET film 14 is formed to be suitable for bonding. surface of the transparent conductive film.

(3) The two ultraviolet irradiation surfaces are superimposed on each other.

(4) From the top, stack the PET film 14 as the second workpiece with a hydrophobic surface, the silicone substrate 17a with a silane coupling agent, and the cover glass 11 as the first workpiece with a hydrophilic surface. The contact surfaces of the combined workpieces are heated while being pressurized.

In addition, in (4) of this joining method, only pressurization may be performed, and only heating may be performed, but it is preferable to perform heating while pressurizing.

[Process B-1] Bonding process of the PET film with the first transparent conductive film (ITO electrode) on the surface and the glass with the second transparent conductive film (ITO electrode) on the surface

This step is shown in FIG. 6 and FIG. 7 . This step shows a method of laminating a first workpiece having a hydrophobic surface and a second workpiece having a hydrophobic surface with a silicone substrate introduced with a silane coupling agent interposed therebetween. The first workpiece having a hydrophobic surface corresponds to The PET film 14 bonded with the cover glass 11 corresponds to the second workpiece having a hydrophobic surface, which is a glass substrate 16 on which a second transparent conductive film (ITO electrode 15 ) is applied.

(a) Bonding of the silicone substrate 17b introduced with the silane coupling agent and the PET film 14 (completed with the cover glass 11)

As shown in FIG. 6(a), UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp is irradiated to the surface of the silicone substrate 17b introduced with a silane coupling agent, and the ultraviolet irradiated surface of the above-mentioned silicone substrate 17b is formed. Silicone substrate surface suitable for bonding.

Next, in the PET film 14 that is bonded with the glass cover 11 by sandwiching the silicone substrate 17a introduced with the silane coupling agent on the surface of the hard coat layer 14a with the first ITO electrode 13 pattern, as shown in Figure 6(a) A part of the surface of the hard coat layer 14a is modified by irradiating UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp to the surface of the hard coat layer 14a opposite to the surface on which the first ITO electrode 13 pattern is applied. OH group-terminated region. Hereinafter, the surface thus modified is referred to as "hard coat surface suitable for bonding".

Then, the UV-irradiated surface of the silicone substrate 17b introduced with the silane coupling agent is superimposed on the UV-irradiated surface of the PET film 14, and the PET film 14 and the above-mentioned silicone substrate 17b are pressed or heated appropriately. Then, the silicone substrate 17b into which the silane coupling agent was introduced was bonded to the PET film 14 on which the first ITO electrode 13 was applied.

(b) Bonding of the PET film 14 (completed with the cover glass 11) and the glass substrate 16

As shown in FIG. 7( b ), by irradiating the surface opposite to the bonding surface of the PET film 14 of the silicone substrate 17 b to which the PET film 14 has been bonded and introduced a silane coupling agent, ultraviolet rays (UV ) UV light emitted from the light source 40 forms the surface as a silicone substrate surface suitable for bonding.

Next, for example, by irradiating the surface of the glass substrate 16 on which the second ITO electrode 15 of the pattern shown in FIG. A part of the surface on which the pattern of the second ITO electrode 15 was applied was modified into an OH group-terminated region. Hereinafter, the surface modified in this way is referred to as a surface of the transparent conductive film suitable for bonding, as in the case of UV irradiation on the surface of the PET film 14 on which the pattern of the first ITO electrode 13 is applied.

Then, the UV irradiated surface of the silicone substrate 17b introduced with the silane coupling agent is superimposed on the UV irradiated surface of the glass substrate 16, and the glass substrate 16 and the silicone substrate 17b introduced with the above-mentioned silane coupling agent are suitably Pressure or heat is applied to bond the silicone substrate 17b bonded to the PET film 14 to the glass substrate 16 on which the second ITO electrode 15 is applied.

In addition, a resin substrate (for example, PET film 14 ) on which the second ITO electrode 15 is applied may be used instead of the glass substrate 16 on which the second ITO electrode 15 is applied, but the order of step 2 remains the same.

That is, the joining method in this process (B-1) is as follows.

(1) The surface of the silicone substrate 17b into which the silane coupling agent has been introduced, and the PET film 14 of the PET film 14 to which the first workpiece having a hydrophobic surface, that is, the cover glass 11, is not bonded to the cover glass. The surface of the hard coat layer 14a of 11 is irradiated with ultraviolet rays, and the ultraviolet irradiation surface of the above-mentioned silicone substrate 17b is modified into a silicone substrate surface suitable for bonding, and the ultraviolet irradiation surface of the PET film 14 bonded to the above-mentioned cover glass 11 is formed to be suitable. Bonded hard-coated surfaces.

(2) The two ultraviolet irradiation surfaces are superimposed on each other.

(3) From the top, the silicone substrate 17b into which the silane coupling agent has been introduced, and the first workpiece with a hydrophobic surface, that is, the PET film 14 (joined with the cover glass 11 ) are laminated in the order while performing Heating is performed while pressurizing.

(4) By bonding the first workpiece with a hydrophobic surface, that is, the PET film 14 (joined with the cover glass 11), the surface of the silicone substrate 17b that has introduced a silane coupling agent, and the second workpiece with a hydrophobic surface. The surface of the workpiece, that is, the glass substrate 16, on which the second transparent conductive film (ITO electrode 15) is applied, is irradiated with ultraviolet rays, and the ultraviolet irradiated surface of the above-mentioned silicone substrate 17b is modified into a silicone substrate surface suitable for bonding, and the above-mentioned glass substrate 16 The ultraviolet irradiation surface is formed as a transparent conductive film surface suitable for bonding.

(5) The two ultraviolet irradiation surfaces are superimposed on each other.

(6) From the top, the first workpiece with a hydrophobic surface, that is, the PET film 14 (joined with the cover glass 11), the silicone substrate 17b with a silane coupling agent, and the second workpiece with a hydrophobic surface That is, the contact surfaces of the successively stacked glass substrates 16 are heated while being pressurized.

In addition, in (3) and (6) of this bonding method, only pressurization may be performed, or only heating may be performed, but it is preferable to perform heating while pressurizing.

The touch sensor module in the touch panel shown in FIG. 1 is comprised via [process A-1] and [process B-1] which employ|adopt the bonding method of this invention.

A touch panel is constituted by laminating the touch sensor module 10 a and the touch panel control unit 10 b on an image display device 30 such as an LCD panel. Here, the configuration example of the touch panel control unit 10b, or the bonding of the touch panel formed by stacking the touch sensor module 10a, the touch panel control unit 10b, and the image display device 30 in this order is the same as the conventional technology, so details will be described here. Description omitted.

In Embodiment 1, a touch sensor module in a touch panel is constructed by the following method. That is, when laminating the components of the touch sensor module, instead of the conventional OCA tape or OCR, the silicone (substrate) introduced with the silane coupling agent is used, and the silicone (substrate) introduced with the silane coupling agent is used. Substrate) and the bonding surface of each constituent element are irradiated with ultraviolet rays.

Further, in the substrate provided with the conductive thin film (for example, ITO electrodes) of the touch sensor module, the surface provided with the conductive thin film is irradiated with ultraviolet rays.

In addition, when the surface of the substrate on which the conductive thin film is not provided is a hydrophobic surface, the surface is also irradiated with ultraviolet rays.

By constructing the touch sensor module by the bonding method of the present invention, the following advantages can be obtained.

That is, unlike OCA tape or OCR, silicone does not undergo coloration over a long period of time, and has no effect of discoloration on the final product, that is, the image of the touch panel.

In addition, even when there is a step structure such as a conductive film on the bonding surface, the silicone deforms and adheres to the step, so it is easy to suppress the incorporation of air bubbles into the step portion during mounting. In addition, it is easy to join even parts with a large area to be joined.

In addition, since OCR is not used for joining using a curing reaction, it is possible to avoid problems unique to OCR such as difficulty in achieving uniformity of coating in the coating process on the joint surface and deformation during curing. In addition, since the heat resistance temperature is higher than that of OCR, the ultraviolet irradiation light source can be brought close to the irradiation surface of the silicone substrate, and the light irradiation surface of the silicone substrate can be modified efficiently. In contrast, when using ultraviolet curable OCR, since the heat resistance of OCR itself is low, the coated surface of ultraviolet curable OCR cannot be brought too close to the ultraviolet irradiation light source 40. The intensity of ultraviolet rays decreases, and the utilization efficiency of ultraviolet rays decreases. Accordingly, the time required for the OCR curing reaction for bonding becomes longer.

Furthermore, silicone substrates are generally inexpensive compared to OCA tape or OCR.

In addition, when bonding a silicone substrate introduced with a silane coupling agent, the bonding is not terminated immediately after laminating the glass substrate or resin substrate and the silicone substrate irradiated with ultraviolet rays and introduced a silane coupling agent. Bonding is completed by applying pressure or heat to both substrates for a predetermined period of time. Therefore, it is easy to separate the two substrates immediately after lamination. Therefore, for example, when the alignment between a glass substrate or a resin substrate and a silicone substrate introduced with a silane coupling agent irradiated with ultraviolet rays is insufficient, if it is just after lamination, the two can be temporarily peeled off, and the silicone substrate can be aligned again. The substrate is irradiated with ultraviolet rays to perform the bonding process. In other words, compared with the OCA tape, it is more reworkable.

In particular, in the bonding method of the present invention, bonding of the conductive film surface of the conductive film substrate of the silicone substrate and the conductive film substrate of the touch sensor module, silicon When bonding a ketone substrate to a conductive film substrate when the surface is hydrophobic, by using a silicone substrate with a silane coupling agent introduced, the surface of the silicone substrate can be modified by ultraviolet irradiation (forming a surface suitable for bonding state), and at the same time, the surface of the conductive film and the hydrophobic surface of the substrate can be modified (formed into a surface state suitable for bonding) by ultraviolet irradiation, so the above-mentioned bonding can be performed.

That is, when laminating the components of the touch sensor module, the silicone (substrate) introduced with the silane coupling agent is used instead of the conventional OCA tape or OCR. (Substrate) and the bonding surface of each constituent element are irradiated with ultraviolet rays, and each constituent element of the touch sensor module can be bonded to form the touch sensor module.

[Modification (1) of Embodiment 1]

In Embodiment 1, an example is shown in which a touch sensor module in the touch panel shown in FIG. 1 is configured via [Step A-1] and [Step B-1] using the bonding method of the present invention.

That is, in [Step A-1], first, the cover glass 11 and the silicone substrate 17a introduced with the silane coupling agent are bonded, and then the cover glass 11 bonded to the silicone substrate 17a introduced with the silane coupling agent is bonded. In order of the silicone substrate 17a and the PET film 14, the cover glass 11 and the PET film 14 on which the first transparent conductive film (ITO electrode 13) was applied were bonded.

In addition, in [Step B-1], first, the PET film 14 bonded to the cover glass 11 with the silicone substrate 17a introduced with the silane coupling agent constituted in [Step A-1] and the silane-introduced The silicone substrate 17b of the coupling agent is then bonded to the sequence of the silicone substrate 17b introduced with the silane coupling agent and the glass substrate 16 on the PET film 14 that has been bonded to the cover glass 11, and then bonded to the PET film 14. The bonded silicone substrate 17b introduced with a silane coupling agent and the glass substrate 16 on which the second ITO electrode 15 is applied constitute a touch sensor module 10b.

However, the order of bonding the workpieces is not limited to the order shown in the above-mentioned [process A-1] [process B-1].

For example, in the above-mentioned [Step A-1], the silicone substrate 17a introduced with the silane coupling agent and the PET film 14 may be joined first, and then the PET film 14 which has been joined with the PET film 14 is joined. In the order of the silicone substrate 17a and the cover glass 11, the cover glass 11 is bonded to the PET film 14 with the first transparent conductive film (ITO electrode) applied on the surface (hereinafter, this step is referred to as [step A-2].) .

Similarly, in the above-mentioned [Step B-1], it is also possible to first bond the silicone substrate 17b and the glass substrate 16 into which the silane coupling agent has been introduced, and then bond the glass substrate 16 to which the silane coupling agent has been introduced. The order of the silicone substrate 17b and the PET film 14 bonded to the cover glass 11 is to bond the PET film 14 bonded to the cover glass 11 and the silicone with a silane coupling agent bonded to the glass substrate 16. The substrate 17b constitutes a touch sensor module (hereinafter, such a process instead of the process B-1 is referred to as [process B-2].).

Hereinafter, using Fig. 8, Fig. 9, and Fig. 10, the process of configuring the touch sensor module in the touch panel shown in Fig. 1 via [Process A-2] and [Process B-2] using the bonding method of the present invention Example to illustrate.

[Process A-2] Bonding process of the cover glass and the PET film with the first transparent conductive film (ITO electrode) applied on the surface

This step is shown in FIG. 8 . This step shows a method of laminating a first workpiece with a hydrophilic surface and a second workpiece with a hydrophobic surface across a silicone substrate introduced with a silane coupling agent, and corresponds to the first workpiece with a hydrophilic surface The cover glass 11 corresponds to the second workpiece having a hydrophobic surface, which is the PET film 14 on which the first transparent conductive film (ITO electrode 13 ) is applied on the surface of the hard coat layer 14a.

(a) Bonding of the silicone substrate 17a introduced with the silane coupling agent and the PET film 14

By irradiating the surface of the silicone substrate 17a introduced with the silane coupling agent with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp, the surface of the silicone substrate 17a introduced with the silane coupling agent is formed to be suitable for bonding. Silicone substrate surface. As mentioned above, the silicone substrate surface suitable for bonding refers to modifying the area where the silane coupling agent is exposed on the surface of the silicone substrate to a hydrophilic area terminated by an OH group and a remaining area of the functional group RO. In addition, in the state where the silane coupling agent is not exposed on the surface of the silicone substrate, the region where the silane coupling agent is not exposed is modified into a hydrophilic region by oxidation.

In addition, for example, in the PET film 14 of the first ITO electrode 13 with the pattern of FIG. 18(b) applied on the surface of the hard coat layer 14a, as shown in FIG. The surface of the hard coat layer 14a is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp, and the surface of the hard coat layer 14a on which the first ITO electrode 13 pattern is applied in the above-mentioned PET film 14 is formed into a transparent conductive material suitable for bonding. membrane surface. As mentioned above, the term "transparent conductive film surface suitable for bonding" refers to modifying a part of the hydrophobic surface (hard coat layer 14a surface) on which the transparent conductive film (first ITO electrode 13 pattern) is applied so that it terminates in OH groups. area of such a surface.

Then, the UV-irradiated surface of the silicone substrate 17a introduced with the silane coupling agent is laminated with the UV-irradiated surface of the PET film 14, and the above-mentioned silicone substrate 17a and the PET film 14 are pressed or heated appropriately, The silicone substrate 17a into which the silane coupling agent was introduced was bonded to the PET film 14 on which the first ITO electrode 13 was applied.

(b) Bonding of the silicone substrate 17a to which the PET film 14 was bonded and the silane coupling agent introduced, and the cover glass 11

Next, as shown in FIG. 8( b ), the surface of the silicone substrate 17a to which the silane coupling agent has been introduced that has been bonded to the PET film 14, which is opposite to the bonding surface to the PET film 14, is irradiated with light from an excimer lamp or the like. The UV light emitted from the ultraviolet (UV) light source 40 forms the UV-irradiated surface of the silicone substrate 17a introduced with the silane coupling agent into a silicone substrate surface suitable for bonding.

In addition, the bonding surface of the cover glass 11 is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp.

Then, the UV irradiation surface of the silicone substrate 17a introduced with the silane coupling agent bonded to the PET film 14 and the bonded surface of the cover glass 11 are laminated by suitably aligning the laminated cover glass 11 and the above-mentioned silicone substrate. 17a is pressurized or heated to increase the bonding strength.

Furthermore, since the cover glass 11 itself has a hydrophilic surface, it does not necessarily need to be irradiated with UV light. However, by irradiating the bonding surface of the cover glass 11 with UV light, the bonding surface of the cover glass 11 is activated, or impurities on the surface of the cover glass 11 are decomposed and removed, so that the bonding surface of the cover glass 11 can be more reliably introduced. Bonding of the silicone substrate 17a with a silane coupling agent.

In addition, UV irradiation may be performed simultaneously on the surface of the silicone substrate 17a to which the silane coupling agent has been introduced and the bonded surface of the cover glass 11 that has been bonded to the PET film 14 .

That is, the joining method in this process (A-2) is as follows.

(1) By irradiating ultraviolet rays to the surface of the silicone substrate 17a introduced with the silane coupling agent and the first transparent conductive film (ITO electrode 13) of the PET film 14 having a hydrophobic surface, the above-mentioned silicone substrate 17a The UV-irradiated surface of the above-mentioned PET film 14 is modified into a surface of a silicone substrate suitable for bonding, and the UV-irradiated surface of the above-mentioned PET film 14 is formed into a surface of a transparent conductive film suitable for bonding.

(2) The two ultraviolet irradiation surfaces are superimposed on each other.

(3) Heating is applied while applying pressure to the contact surface of the workpiece where the PET film 14 , which is the second workpiece having a hydrophobic surface, and the silicone substrate 17 a introduced with the silane coupling agent are laminated.

(4) Next, ultraviolet rays are irradiated on the surface of the silicone substrate 17a that has been bonded to the PET film 14, which is the second workpiece having a hydrophobic surface, and the silane coupling agent has been introduced, so that the ultraviolet irradiated surface is formed as a surface of the silicone substrate suitable for bonding. . In addition, ultraviolet rays are also irradiated to the bonded surface of the cover glass 11 which is the first workpiece having a hydrophilic surface.

(5) The two ultraviolet irradiation surfaces are superimposed on each other.

(6) From the top, stack the PET film 14 as the second workpiece with a hydrophobic surface, the silicone substrate 17a with a silane coupling agent, and the cover glass 11 as the first workpiece with a hydrophilic surface. The contact surfaces of the combined workpieces are heated while being pressurized.

In addition, in (3) and (6) of this bonding method, only pressurization may be performed, or only heating may be performed, but it is preferable to perform heating while pressurizing.

[Process B-2] Bonding process of the PET film with the first transparent conductive film (ITO electrode) on the surface and the glass with the second transparent conductive film (ITO electrode) on the surface

This step is shown in FIGS. 9 and 10 . This step shows a method of laminating a first workpiece with a hydrophobic surface and a second workpiece with a hydrophobic surface across a silicone substrate, and the first workpiece with a hydrophobic surface corresponds to a cover glass 11 bonded thereto. The PET film 14 corresponds to the second workpiece having a hydrophobic surface, which is a glass substrate 16 on which a second transparent conductive film (ITO electrode) is applied.

(a) Bonding of silicone substrate 17b introduced with silane coupling agent and glass substrate 16

As shown in FIG. 9(a), the surface of the above-mentioned silicone substrate 17b is formed into a suitable shape by irradiating the surface of the silicone substrate 17b introduced with a silane coupling agent with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp. Bonded silicone substrate surfaces.

In addition, in the glass substrate 16 on which the second ITO electrode 15 with a pattern such as that shown in FIG. The emitted UV light forms the surface of the glass substrate 16 on which the pattern of the second ITO electrode 15 is applied as a transparent conductive film surface suitable for bonding. As mentioned above, the surface of the transparent conductive film suitable for bonding refers to modifying a part of the surface of the glass substrate 16 on which the transparent conductive film (the second ITO electrode 15 pattern) is applied to have an OH group as the terminal. area such a surface.

Then, the UV-irradiated surface of the silicone substrate 17b into which the silane coupling agent has been introduced is superimposed on the UV-irradiated surface of the glass substrate 16, and the glass substrate 16 and the above-mentioned silicone substrate 17b are pressed or heated appropriately, The silicone substrate 17b into which the silane coupling agent was introduced was bonded to the glass substrate 16 on which the second ITO electrode 15 was applied.

As shown in FIG. 10( b ), by irradiating the surface opposite to the bonding surface of the glass substrate 16 of the silicone substrate 17 b to which the glass substrate 16 is bonded and introduced with a silane coupling agent, ultraviolet rays (UV ) UV light emitted from the light source 40 forms the UV-irradiated surface of the above-mentioned silicone substrate 17b as a silicone substrate surface suitable for bonding.

Next, in the PET film 14 with the cover glass 11 bonded with the silicone substrate 17a sandwiched between the surface on which the first ITO electrode 13 pattern is applied, as shown in FIG. The surface of the hard coat layer 14a on the opposite side is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp to form the surface of the hard coat layer 14a irradiated with UV light as a hard coat surface suitable for bonding. As described above, the surface of the hard coat layer suitable for bonding refers to a surface in which a part of the surface of the hard coat layer 14a is modified to have an OH group-terminated region.

Then, the UV-irradiated surface of the silicone substrate 17b into which the silane coupling agent has been introduced is superimposed on the UV-irradiated surface of the PET film 14, and the PET film 14 and the above-mentioned silicone substrate 17b are pressed or heated appropriately, The silicone substrate 17b to which the silane coupling agent was introduced and bonded to the glass substrate 16 was bonded to the PET film 14 on which the first ITO electrode 13 was applied.

That is, the joining method in this process (B-2) is as follows.

(1) By irradiating the surface of the silicone substrate 17b into which the silane coupling agent is introduced and the surface of the second workpiece having a hydrophobic surface, that is, the glass substrate 16, on which the second transparent conductive film (ITO electrode 15) is applied, ultraviolet rays are applied. The ultraviolet irradiated surface of the silicone substrate 17 b is modified to be a silicone substrate surface suitable for bonding, and the ultraviolet irradiated surface of the glass substrate 16 is formed to be a transparent conductive film surface suitable for bonding.

(2) The two ultraviolet irradiation surfaces are superimposed on each other.

(3) Heating is applied while pressurizing the contact surface of the silicone substrate 17b introduced with the silane coupling agent and the glass substrate 16 which is the second workpiece having a hydrophobic surface.

(4) By bonding the second workpiece with a hydrophobic surface, that is, the surface of the silicone substrate 17b that has introduced a silane coupling agent on the glass substrate 16, and the surface of the first workpiece with a hydrophobic surface, that is, a PET substrate. The surface of the hard coat layer 14a on the opposite side of the first transparent conductive film 13 (ITO electrode) is irradiated with ultraviolet rays, and the ultraviolet irradiated surface of the above-mentioned silicone substrate 17b is modified into a silicone substrate surface suitable for bonding, and the above-mentioned PET film 14 The UV-irradiated surface is formed as a hard coat surface suitable for bonding.

(5) The two ultraviolet irradiation surfaces are superimposed on each other.

(6) From the top, the first workpiece with a hydrophobic surface, that is, the PET film 14 (joined with the cover glass 11), the silicone substrate 17b with a silane coupling agent, and the second workpiece with a hydrophobic surface That is, the contact surfaces of the successively laminated glass substrates 16 are heated while being pressurized.

In addition, in (3) and (6) of this bonding method, only pressurization may be performed, or only heating may be performed, but it is preferable to perform heating while pressurizing.

[Modification (2) of Embodiment 1]

[Process A-1] [Process B-1] of Embodiment 1 and [Process A-2] [Process B-2] of Modification (1) of Embodiment 1 are constituted by repeating bonding of two workpieces. However, it may be configured such that three workpieces are bonded at a time in each step.

For example, in the above-mentioned [Process A-1] [Process A-2], the cover glass 11, the silicone substrate 17a into which the silane coupling agent has been introduced, and the PET film 14 may also be bonded at one time (hereinafter, such a process will be referred to as This is referred to as [Process A-3].).

Similarly, in the above-mentioned [Process B-1] [Process B-2], the PET film 14 that has been bonded to the cover glass 11, the silicone substrate 17b and the glass substrate 16 that have introduced the silane coupling agent can also be bonded at one time. (Hereafter, such a step is referred to as [step B-3].).

Hereinafter, an example in which the touch sensor module in the touch panel shown in FIG. 1 is configured via [Step A-3] and [Step B-3] using the bonding method of the present invention will be described using FIG. 11 and FIG. 12. .

[Process A-3] Bonding process of the cover glass and the PET film with the first transparent conductive film (ITO electrode) applied on the surface

This step is shown in FIG. 11 . This step shows a method of laminating a first workpiece with a hydrophilic surface and a second workpiece with a hydrophobic surface across a silicone substrate introduced with a silane coupling agent, and corresponds to the first workpiece with a hydrophilic surface The cover glass 11 corresponds to the second workpiece having a hydrophobic surface, which is the PET film 14 on which the first transparent conductive film (ITO electrode 13 ) is applied on the surface of the hard coat layer 14a.

By irradiating both sides of the silicone substrate 17a introduced with the silane coupling agent with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp as shown in FIG. Both sides are formed as silicone substrate surfaces suitable for bonding.

In addition, for example, in the PET film 14 on which the first ITO electrode 13 of the pattern shown in FIG. 18(b) is applied on the surface of the hard coat layer 14a, as shown in FIG. UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp forms the surface on which the pattern of the first ITO electrode 13 is applied as a surface of a transparent conductive film suitable for bonding.

In addition, as shown in FIG. 11 , the bonding surface of the cover glass 11 is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp.

Then, the UV-irradiated bonding surface of the cover glass 11 and the UV-irradiated surface of the silicone substrate 17a introduced with the silane coupling agent, and the UV-irradiated surface of the above-mentioned silicone substrate 17a are laminated. The surface of the other side and the surface of the PET film 14 subjected to UV irradiation treatment. Then, the cover glass 11, the silicone substrate 17a, and the PET film 14 laminated in this order are suitably pressed or heated to bond the cover glass 11, the silicon substrate into which the silane coupling agent has been introduced, at one time. The ketone substrate 17a and the PET film 14 on which the first ITO electrode 13 is applied.

Furthermore, since the cover glass 11 itself has a hydrophilic surface, it does not necessarily need to be irradiated with UV light. However, by irradiating the bonding surface of the cover glass 11 with UV light, the bonding surface of the cover glass 11 is activated, or impurities on the surface of the cover glass 11 are decomposed and removed, so that the bonding surface of the cover glass 11 can be more reliably introduced. Bonding of the silicone substrate 17a with a silane coupling agent.

In addition, UV irradiation may be performed on the bonded surface of the cover glass 11, both surfaces of the above-mentioned silicone substrate 17a, and the primer-coated surface of the PET film 14 at the same time, or may be performed individually.

That is, the joining method in this process (A-3) is as follows.

(1) The bonding surface of the cover glass 11, which is the first workpiece with a hydrophilic surface, the both sides of the silicone substrate 17a having a silane coupling agent, and the PET film 14, which is the second workpiece with a hydrophobic surface, The first transparent conductive film (ITO electrode 13) is irradiated with ultraviolet rays, and the ultraviolet irradiation surface of the above-mentioned silicone substrate 17a is modified into a silicone substrate surface suitable for bonding, and the ultraviolet irradiation surface of the above-mentioned PET film 14 is formed into a transparent conductive surface suitable for bonding. membrane surface. The UV-irradiated surface of the cover glass is activated, or impurities on the surface are decomposed and removed.

(2) Then, laminate the bonding surface of the cover glass 11 that has been treated with UV irradiation and the surface of the silicone substrate 17a that has been introduced with a silane coupling agent that has been treated with UV irradiation, and the surface of the silicone substrate 17a that has been treated with UV irradiation. The other surface of the irradiation treatment and the surface of the PET film 14 subjected to the UV irradiation treatment.

(3) Next, heat is applied to the contact surfaces of the workpieces stacked in the order of the cover glass 11, the silicone substrate 17a introduced with the silane coupling agent, and the PET film 14, and the workpieces are bonded at once. .

In addition, in (4) of this joining method, only pressurization may be performed, and only heating may be performed, but it is preferable to perform heating while pressurizing.

[Process B-3] Bonding process of the PET film with the first transparent conductive film (ITO electrode) on the surface and the glass with the second transparent conductive film (ITO electrode) on the surface

This step is shown in FIG. 12 . This step shows a method of laminating a first workpiece having a hydrophobic surface and a second workpiece having a hydrophobic surface with a silicone substrate introduced with a silane coupling agent interposed therebetween. The first workpiece having a hydrophobic surface corresponds to The PET film 14 bonded to the cover glass 11 corresponds to the second workpiece having a hydrophobic surface, which is a glass substrate 16 on which a second transparent conductive film (ITO electrode 15 ) is applied.

The surface of the above-mentioned silicone substrate 17b is formed to be suitable for bonding by irradiating both surfaces of the silicone substrate 17b introduced with a silane coupling agent with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp as shown in FIG. Silicone substrate surface.

In addition, as shown in FIG. 12, in the PET film 14 to which the cover glass 11 is bonded via the silicone substrate 17a introduced with the silane coupling agent, the hard coat on the side opposite to the surface to which the cover glass 11 is bonded The surface of the layer 14a is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp, and the surface of the hard coat layer 14a irradiated with the UV light is formed into a hard coat surface suitable for bonding.

In addition, in the glass substrate 16 on which the second ITO electrode 15 with a pattern such as that shown in FIG. The UV light emitted from the (UV) light source 40 forms the surface of the glass substrate 16 on which the pattern of the second ITO electrode 15 is applied as a transparent conductive film surface suitable for bonding.

Then, the UV-irradiated surface of the PET film 14, the UV-irradiated surface of the silicone substrate 17b introduced with the silane coupling agent, and the UV-irradiated surface of the above-mentioned silicone substrate 17b are laminated. The surface of the glass substrate 16 and the surface treated by UV irradiation.

Then, suitably pressurize or heat the work piece formed by laminating the PET film 14 bonded to the cover glass 11, the above-mentioned silicone substrate 17b, and the glass substrate 16 in this order, and the bonding to the cover glass 11 is completed at one time. The PET film 14, the silicone substrate 17b with the silane coupling agent introduced, and the glass substrate 16 with the second ITO electrode 15 applied on the surface.

Furthermore, as shown in FIG. 12, in the PET film 14 to which the cover glass 11 is bonded across the silicone substrate 17a into which the silane coupling agent is introduced, the opposite side of the side to which the cover glass 11 is bonded can be simultaneously aligned. The surface of the hard coat layer 14a, both surfaces of the silicone substrate 17b, and the surface of the glass substrate 16 on which the second ITO electrode 15 is applied and the ITO electrode 15 pattern applied to the surface may be individually irradiated.

That is, the joining method in this process (B-3) is as follows.

(1) By introducing a silane coupling agent to the surface of the hard coat layer 14a on the opposite side of the side to which the cover glass 11 is bonded to the PET film 14 to which the cover glass 11, which is the first workpiece having a hydrophobic surface, is bonded, Both sides of the silicone substrate 17b and the surface of the glass substrate 16, the second workpiece having a hydrophobic surface, on which the second transparent conductive film (ITO electrode 15) is applied, are irradiated with ultraviolet rays to modify the ultraviolet-irradiated surface of the above-mentioned PET film 14 into The surface of the hard coat layer suitable for bonding is to modify the ultraviolet irradiated surface of the silicone substrate 17b to a silicone substrate surface suitable for bonding, and to form the ultraviolet irradiated surface of the glass substrate 16 into a transparent conductive film surface suitable for bonding.

(2) Then, laminate the UV-irradiated surface of the PET film 14 and the UV-irradiated surface of the silicone substrate 17b introduced with the silane coupling agent, and the UV-irradiated surface of the above-mentioned silicone substrate 17b. The other surface of the glass substrate 16 and the primer-coated surface subjected to the UV irradiation treatment.

(3) Then, by pressing the contact surfaces of the workpieces laminated in the order of the PET film 14 bonded to the cover glass 11, the silicone substrate 17b introduced with the silane coupling agent, and the glass substrate 16, Heating is performed to join each workpiece at one time.

In addition, in (3) of this joining method, only pressurization may be performed, and only heating may be performed, but it is preferable to perform heating while pressurizing.

[Embodiment 2]

In Embodiment 1, the structure example assembled in the touch panel shown in FIG. ) is the bonding method of the present invention used when the substrate is a touch sensor module such as the glass substrate 16 .

In Embodiment 2, the joining method of this invention used when assembling the touch sensor module in the configuration example of the touch panel shown in FIG. 13 is shown.

As a substrate of a transparent conductive film, a glass substrate is superior in visibility and durability compared to a film substrate. In other words, compared with film substrates, glass substrates have higher light transmittance, can reduce light dispersion and the influence of substrate deformation, and also have less discoloration due to ultraviolet rays, so they have advantages over film substrates in terms of visibility. In addition, glass substrates are also excellent in durability and water resistance over a wide temperature range, and have higher weather resistance than film substrates. In touch panels for mechanical equipment or outdoor touch panels that require high visibility and weather resistance, there is an increasing demand for glass substrates to be used as substrates for transparent conductive films. A glass substrate is used as any substrate of the transparent conductive film. In addition, while achieving thinner glass substrates, it is also possible to respond to the degree of freedom in shape and thinner panels like film substrates.

Fig. 13 shows that when both the substrate of the first transparent conductive film (such as ITO electrode 13) and the substrate of the second transparent conductive film (such as ITO electrode 15) are defined as glass substrates 16a, 16b, the bonding method of the present invention is adopted. An example of the configuration of the assembled touch panel. Here, FIG. 13( a ) shows a case where the first transparent conductive film 13 and the second transparent conductive film 15 face each other across the silicone substrate 17 b into which the silane coupling agent has been introduced.

In Fig. 13(a), the touch sensor module 10a is arranged from the top with the cover glass 11, the silicone substrate 17a introduced with the silane coupling agent, the first glass substrate 16a, the first ITO electrode 13, the first ITO electrode 13 introduced with the silane coupling agent. The silicone substrate 17b, the second ITO electrode 15, and the second glass substrate 16b are laminated in this order. Other configurations are the same as in FIG. 1 .

FIG. 13( b ) shows the case where only the second transparent conductive film 15 is in contact with the silicone substrate 17 b into which the silane coupling agent has been introduced, among the first transparent conductive film 13 and the second transparent conductive film 15 .

In Fig. 13(b), the touch sensor module 10a is arranged from the top with the cover glass 11, the silicone substrate 17a with the silane coupling agent introduced, the first ITO electrode 13, the first glass substrate 16a, the silane coupling agent introduced The silicone substrate 17b, the second ITO electrode 15, and the second glass substrate 16b are laminated in this order. Other configurations are the same as those in Fig. 13(a).

Furthermore, in the configuration example of the touch panel shown in FIG. 13 , the thickness of each substrate and each layer is described exaggeratedly for ease of explanation. The actual relative relationship of each substrate and the thickness of each layer is the same as that shown in FIG. 13 . relationship is different.

First, with reference to FIGS. 14 and 15 , the bonding method of the present invention used when manufacturing the touch panel of the configuration example shown in FIG. 13( a ) will be described.

[Step C-1] Step of joining the cover glass to the first glass substrate with the first transparent conductive film (ITO electrode) applied on the surface

This step is shown in FIG. 14 . This step is a step of bonding the cover glass 11 to the first glass substrate 16a on which the first transparent conductive film (ITO electrode) is applied. This step is a pre-step before [Step 3] to which the bonding method of the present invention is applied.

(a) Bonding of the cover glass 11 and the silicone substrate 17a introduced with a silane coupling agent

As shown in FIG. 14(a), the surface of the above-mentioned silicone substrate 17a is formed into a suitable shape by irradiating the surface of the silicone substrate 17a introduced with a silane coupling agent with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp. Bonded silicone substrate surfaces.

Next, the bonding surface of the cover glass 11 is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp.

Then, the bonding surface of the cover glass 11 and the UV irradiation surface of the silicone substrate 17 a introduced with the silane coupling agent are laminated. By appropriately applying pressure or heating to the laminated cover glass 11 and the above-mentioned silicone substrate 17a, the bonding strength is improved.

Furthermore, since the cover glass 11 itself has a hydrophilic surface, it does not necessarily need to be irradiated with UV light. However, by irradiating the bonding surface of the cover glass 11 with UV light, the bonding surface of the cover glass 11 is activated, or impurities on the surface of the cover glass 11 are decomposed and removed, so that the bonding surface of the cover glass 11 can be more reliably introduced. Bonding of the silicone substrate 17a with a silane coupling agent. In addition, UV irradiation may be performed simultaneously on the surface of the above-mentioned silicone substrate 17a and the bonded surface of the cover glass 11 .

(b) Bonding of the first glass substrate 16 and the silicone substrate 17a introduced with a silane coupling agent bonded to the cover glass 11

Next, as shown in FIG. 14( b ), by irradiating the surface of the silicone substrate 17a that has been bonded to the cover glass 11 and introduced the silane coupling agent on the opposite side to the bonded surface of the cover glass 11 from the excimer UV light emitted from an ultraviolet (UV) light source 40 such as a lamp forms the UV-irradiated surface of the silicone substrate 17a as a silicone substrate surface suitable for bonding.

On the other hand, in the first glass substrate 16a on which the first ITO electrode 13 of a pattern such as that shown in FIG. UV light emitted from an ultraviolet (UV) light source 40 .

Then, the UV irradiated surface of the first glass substrate 16 a and the UV irradiated surface of the silane coupling agent-introduced silicone substrate 17 a bonded to the cover glass 11 are laminated. By appropriately applying pressure or heating to the laminated cover glass 11 and the silicone substrate 17a into which the silane coupling agent has been introduced, the bonding strength is improved.

Furthermore, as mentioned above, since the surface (joint surface of the first glass substrate 16a) on the opposite side to the side on which the first ITO electrode 13 is applied in the first glass substrate 16a itself is a hydrophilic surface, it does not necessarily need to be irradiated. UV light. However, by irradiating the bonding surface of the first glass substrate 16a with UV light, the bonding surface of the first glass substrate 16a is activated, or the impurities on the bonding surface of the first glass substrate 16a are decomposed and removed, so that the first step can be performed more reliably. 1 Bonding of the glass substrate 16a and the silicone substrate 17a introduced with a silane coupling agent.

In addition, UV irradiation may be performed on the surface of the silicone substrate 17a and the bonding surface of the first glass substrate 16a at the same time.

[Step D-1] Bonding process of the first glass substrate with the first transparent conductive film (ITO electrode) on the surface and the second glass substrate with the second transparent conductive film (ITO electrode) on the surface

This step is shown in FIG. 15 . This step shows a method of laminating a first workpiece having a hydrophobic surface and a second workpiece having a hydrophobic surface with a silicone substrate introduced with a silane coupling agent interposed therebetween. The first workpiece having a hydrophobic surface corresponds to A first glass substrate 16a that is bonded with a cover glass 11 on one surface and applied with the first ITO electrode 13 on the other surface is equivalent to a second workpiece with a hydrophobic surface on which the second transparent conductive film ( ITO electrode) the second glass substrate 16b.

(a) Bonding of the first glass substrate 16a (joined to the cover glass 11) and the silicone substrate 17b introduced with a silane coupling agent

As shown in FIG. 15(a), the surface of the silicone substrate 17b is formed by irradiating the surface of the silicone substrate 17b into which a silane coupling agent is introduced with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp. Silicone substrate surface suitable for bonding.

Next, as shown in FIG. 15(a), in the first glass substrate 16a to which the cover glass 11 was bonded on one surface and the first ITO electrode 13 was applied to the other surface in the preceding process, the The surface of the first ITO electrode 13 pattern is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp, and the surface of the first glass substrate 16a on which the first ITO electrode 13 pattern is applied is formed into a transparent conductive film suitable for bonding. surface.

Then, the UV-irradiated surface of the silicone substrate 17b into which the silane coupling agent has been introduced is laminated with the UV-irradiated surface of the first glass substrate 16a, and the first glass substrate 16a and the above-mentioned silicone substrate 17b are suitably coated. The silicone substrate 17b introduced with the silane coupling agent is bonded to the first glass substrate 16a having the cover glass 11 bonded to one surface and the first ITO electrode 13 applied to the other surface by pressing or heating.

(b) Bonding of the first glass substrate 16a (completed with the cover glass 11) and the second glass substrate 16b

Next, as shown in FIG. 15( b ), by irradiating the surface of the silicone substrate 17 b to which the silane coupling agent has been introduced, which is bonded to the first glass substrate 16 a, on the opposite side to the bonded surface of the first glass substrate 16 a UV light emitted from an ultraviolet (UV) light source 40 such as a lamp forms the UV-irradiated surface of the silicone substrate 17b as a silicone substrate surface suitable for bonding.

On the other hand, in the second glass substrate 16b on which the second ITO electrode 15 having a pattern such as that shown in FIG. ) The UV light emitted from the light source 40 forms the surface of the second glass substrate 16b on which the pattern of the second ITO electrode 15 is applied as a surface of a transparent conductive film suitable for bonding.

Then, the UV-irradiated surface of the silicone substrate 17b introduced with the silane coupling agent bonded to the first glass substrate 16a is laminated with the UV-irradiated surface of the second glass substrate 16b, and the second glass substrate 16b is suitably Press or heat the above-mentioned silicone substrate 17b that has been bonded to the first glass substrate 16a, and apply the second ITO electrode 15 on the surface of the silicone substrate 17b that has been bonded to the first glass substrate 16a and introduced a silane coupling agent. The second glass substrate 16b is bonded.

That is, the joining method in this process (D-1) is as follows.

(1) By applying the first ITO electrode 13 to the surface of the silicone substrate 17b introduced with the silane coupling agent, the first workpiece having a hydrophobic surface, that is, the first glass substrate 16a (joined with the cover glass 11), The surface is irradiated with ultraviolet rays to modify the ultraviolet-irradiated surface of the silicone substrate 17b into a silicone substrate surface suitable for bonding, and to form the ultraviolet-irradiated surface of the first glass substrate 16a into a transparent conductive film surface suitable for bonding.

(2) The two ultraviolet irradiation surfaces are superimposed on each other.

(3) For each workpiece stacked in order from the top, the silicone substrate 17b introduced with the silane coupling agent, and the first workpiece having a hydrophobic surface, that is, the first glass substrate 16a (joined with the cover glass 11) The contact surface is heated while applying pressure.

(4) By connecting the surface of the silicone substrate 17b with a silane coupling agent introduced into the first workpiece having a hydrophobic surface, that is, the first glass substrate 16a (joined with the cover glass 11), and the surface of the silicone substrate 17b having a hydrophobic surface. The second workpiece, that is, the surface of the second glass substrate 16b is irradiated with ultraviolet rays on the surface of the second transparent conductive film (ITO electrode 15), and the ultraviolet irradiated surface of the above-mentioned silicone substrate 17b is modified into a silicone substrate surface suitable for bonding, The ultraviolet irradiation surface of the said 2nd glass substrate 16b is formed as the surface of the transparent conductive film suitable for bonding.

(5) The two ultraviolet irradiation surfaces are superimposed on each other.

(6) From the top, the first workpiece with a hydrophobic surface, that is, the first glass substrate 16a (joined with the cover glass 11), the silicone substrate 17b with a silane coupling agent, and the first glass substrate 16a with a hydrophobic surface. The two workpieces, that is, the contact surfaces of the sequentially laminated second glass substrates 16b are heated while being pressurized.

In addition, in (3) and (6) of this bonding method, only pressurization may be performed, or only heating may be performed, but it is preferable to perform heating while pressurizing.

Next, the bonding method of the present invention used when manufacturing the touch panel of the configuration example shown in FIG. 13( b ) will be described with reference to FIGS. 16 and 17 .

[Process C-2] Bonding process of the cover glass and the first glass substrate with the first transparent conductive film (ITO electrode) applied on the surface

This step is shown in FIG. 16 . This step shows a method of laminating a first workpiece with a hydrophilic surface and a second workpiece with a hydrophobic surface across a silicone substrate introduced with a silane coupling agent, and corresponds to the first workpiece with a hydrophilic surface The cover glass 11 corresponds to the second workpiece having a hydrophobic surface, which is the first glass substrate 16a on which the first transparent conductive film (ITO electrode) is applied.

(a) Bonding of the cover glass 11 and the silicone substrate 17a introduced with a silane coupling agent

Before the first workpiece, that is, the underside surface of the cover glass 11, and the second workpiece, that is, the first ITO electrode 13 side surface of the first glass substrate 16a, the first ITO electrode 13 side surface of the first glass substrate 16a is first bonded to the silicon surface that has introduced the silane coupling agent. Bonding of the ketone substrate 17a.

As shown in FIG. 16(a), the surface of the silicone substrate 17a is formed into a suitable shape by irradiating the surface of the silicone substrate 17a introduced with a silane coupling agent with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp. Bonded silicone substrate surface.

Next, the bonding surface of the cover glass 11 is irradiated with UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp.

Then, the bonding surface of the cover glass 11 and the UV irradiation surface of the silicone substrate 17 a introduced with the silane coupling agent are laminated. By appropriately applying pressure or heating to the laminated cover glass 11 and the above-mentioned silicone substrate 17a, the bonding strength is improved.

Furthermore, since the cover glass 11 itself has a hydrophilic surface, it does not necessarily need to be irradiated with UV light. However, by irradiating the bonding surface of the cover glass 11 with UV light, the bonding surface of the cover glass 11 is activated, or impurities on the surface of the cover glass 11 are decomposed and removed, so that the cover glass 11 and the introduction can be performed more reliably. Bonding of the silicone substrate 17a with a silane coupling agent.

In addition, UV irradiation may be performed simultaneously on the bonding surface of the silicone substrate surface introduced with the silane coupling agent and the cover glass 11 .

(b) Bonding of the first glass substrate 16a and the silicone substrate 17a introduced with a silane coupling agent bonded to the cover glass 11

Next, as shown in FIG. 16(b), in the first glass substrate 16a on which the first ITO electrode 13 of the pattern shown in FIG. UV light emitted from an ultraviolet (UV) light source 40 such as a lamp forms the UV-irradiated surface of the first glass substrate 16a as a surface of a transparent conductive film suitable for bonding.

On the other hand, by irradiating an ultraviolet (UV) light source 40 such as an excimer lamp to the surface of the silicone substrate 17a to which the silane coupling agent has been introduced and bonded to the cover glass 11, which is opposite to the bonding surface to the cover glass 11, The emitted UV light forms the UV-irradiated surface of the above-mentioned silicone substrate 17a as a silicone substrate surface suitable for bonding.

Then, the UV-irradiated surface of the silicone substrate 17a introduced with the silane coupling agent is laminated with the UV-irradiated surface of the first glass substrate 16a, and the laminated cover glass 11 and the silicon substrate 11 are properly aligned. The silicone substrate 17a is pressurized or heated, and the silicone substrate 17a introduced with the silane coupling agent bonded to the cover glass 11 is bonded to the first glass substrate 16a on which the first ITO electrode 13 is applied.

That is, the bonding method employed in this step (C-2) is as follows.

(1) The silicone substrate 17 a into which a silane coupling agent has been introduced is bonded to the lower surface of the cover glass 11 which is the first workpiece having a hydrophilic surface. The bonding method is to irradiate the above-mentioned silicone substrate 17a with ultraviolet rays to form the ultraviolet irradiated surface as the surface of the silicone substrate suitable for bonding, laminate this surface on the cover glass 11, and insert the cover glass 11, which is the first workpiece, into the surface of the silicone substrate. The silicone substrate 17a coated with a silane coupling agent is bonded. In addition, as described above, the bonding surface of the cover glass 11 may also be irradiated with ultraviolet rays.

(2) By bonding the surface of the silicone substrate 17a introduced with the silane coupling agent on the cover glass 11, which is the first workpiece with a hydrophilic surface, and the first glass substrate 16a, which is the second workpiece with a hydrophobic surface, The surface on which the first transparent conductive film (ITO electrode 13) is applied is irradiated with ultraviolet rays, the ultraviolet irradiation surface of the above-mentioned silicone substrate 17a is modified into a silicone substrate surface suitable for bonding, and the ultraviolet irradiation surface of the above-mentioned first glass substrate 16a is Formed as a transparent conductive film surface suitable for bonding.

(3) The two ultraviolet irradiation surfaces are superimposed on each other.

(4) Each of the coverslips 11, which are the first workpiece having a hydrophilic surface, which is the cover glass 11, the silicone substrate 17a into which the silane coupling agent has been introduced, and the first glass substrate 16a, which is the second workpiece, are stacked in order from above. The contact surface of the workpiece is heated while applying pressure.

In addition, in (4) of this joining method, only pressurization may be performed, and only heating may be performed, but it is preferable to perform heating while pressurizing.

[Step D-2] Bonding process of the first glass substrate with the first transparent conductive film (ITO electrode) on the surface and the second glass substrate with the second transparent conductive film (ITO electrode) on the surface

This step is shown in FIG. 17 . In this step, a method of laminating a first workpiece having a hydrophilic surface and a second workpiece having a hydrophobic surface via a silicone substrate introduced with a silane coupling agent is also shown, which corresponds to The first workpiece is the first glass substrate 16a with the cover glass 11 bonded to the surface on which the first ITO electrode 13 is applied, and the second workpiece corresponding to the hydrophobic surface is applied with the second transparent conductive film on the surface. (ITO electrode) the second glass substrate 16b.

(a) Bonding of the first glass substrate 16a (joined to the cover glass 11) and the silicone substrate 17b introduced with a silane coupling agent

On the surface opposite to the first ITO electrode 13 side where the first glass substrate 16a, which is the first glass substrate 16a having a hydrophilic surface, has been bonded to the cover glass 11, and the second glass substrate 16b, which is a second workpiece having a hydrophobic surface, Before bonding the surface on the side of the second ITO electrode 15, the first glass substrate 16a (completed with the cover glass 11) is bonded to the silicone substrate 17b into which the silane coupling agent has been introduced.

As shown in FIG. 17(a), by irradiating the surface of the silicone substrate 17b into which a silane coupling agent is introduced, UV light emitted from an ultraviolet (UV) light source 40 such as an excimer lamp, the UV-irradiated surface of the above-mentioned silicone substrate 17b Silicone substrate surfaces formed to be suitable for bonding.

Next, as shown in FIG. 17(a), the surface of the first glass substrate 16a on the side opposite to the first ITO electrode 13 side which has been bonded to the cover glass 11 in the previous process is irradiated with ultraviolet rays (UV rays) from an excimer lamp or the like. ) UV light emitted by the light source 40 .

Then, the UV irradiated surface of the silicone substrate 17b introduced with the silane coupling agent is laminated with the UV irradiated surface of the first glass substrate 16a, and the contact surface of the first glass substrate 16a and the above-mentioned silicone substrate 17b is properly heated. The silicone substrate 17b introduced with the silane coupling agent is bonded to the first glass substrate 16a having the cover glass 11 bonded to one surface by pressing or heating.

(b) Bonding of the first glass substrate 16a (completed with the cover glass 11) and the second glass substrate 16b

Next, as shown in FIG. 17( b ), by irradiating the surface of the silicone substrate 17 b to which the silane coupling agent is introduced and bonded to the first glass substrate 16 a, which is opposite to the bonded surface of the first glass substrate 16 a UV light emitted from an ultraviolet (UV) light source 40 such as a lamp forms the UV-irradiated surface of the silicone substrate 17b as a silicone substrate surface suitable for bonding.

On the other hand, in the second glass substrate 16b on which the second ITO electrode 15 having a pattern such as that shown in FIG. The UV light emitted from the UV light source 40 forms the surface of the second glass substrate 16b on which the pattern of the second ITO electrode 15 is applied as a transparent conductive film surface suitable for bonding.

Then, the UV-irradiated surface of the silicone substrate 17b introduced with the silane coupling agent bonded to the first glass substrate 16a is laminated with the UV-irradiated surface of the second glass substrate 16b, and the second glass substrate 16b is suitably The above-mentioned silicone substrate 17b bonded to the first glass substrate 16a is pressed or heated, and the silicone substrate 17b introduced with the silane coupling agent bonded to the first glass substrate 16a and the second ITO electrode 15 applied to the surface are combined. 2 glass substrates 16b are bonded.

That is, the joining method in this process (D-2) is as follows.

(1) The first glass cover glass 11 is bonded to the first workpiece having a hydrophilic surface by sandwiching the silicone substrate 17a into which the silane coupling agent is introduced on the surface on which the first ITO electrode 13 is applied. The other surface of the substrate 16a and the surface of the silicone substrate 17b introduced with a silane coupling agent are irradiated with ultraviolet rays, and the first glass substrate, which is the first workpiece having a hydrophilic surface, is laminated so that the ultraviolet irradiated surfaces of the two workpieces are closely bonded. 16a and the above-mentioned silicone substrate 17b, the first glass substrate 16a, which is the first workpiece having a hydrophilic surface, is bonded to the silicone substrate 17b into which a silane coupling agent has been introduced.

(2) By bonding the first workpiece with a hydrophilic surface, that is, the first glass substrate 16a (joined with the cover glass 11), the surface of the silicone substrate 17b introduced with a silane coupling agent and the surface of the silicone substrate 17b with a hydrophobic surface The surface of the second workpiece, that is, the second glass substrate 16b, on which the second transparent conductive film (ITO electrode 15) is applied is irradiated with ultraviolet rays, and the ultraviolet irradiated surface of the above-mentioned silicone substrate 17b is modified into a silicone substrate surface suitable for bonding. The ultraviolet irradiation surface of the said 2nd glass substrate 16b is formed as the surface of the transparent conductive film suitable for bonding.

(3) The two ultraviolet irradiation surfaces are superimposed on each other.

(4) From the top, the first workpiece with a hydrophilic surface, that is, the first glass substrate 16a (joined with the cover glass 11), the silicone substrate 17b with a silane coupling agent, and the first glass substrate 16a with a hydrophobic surface The contact surfaces of the sequentially stacked second workpieces, that is, the second glass substrates 16b, are heated while being pressurized.

In addition, in (4) of this joining method, only pressurization may be performed, and only heating may be performed, but it is preferable to perform heating while pressurizing.

The touch sensor module in the touch panel shown in FIG. 13( a ) is configured through [Step C-1] and [Step D-1] using the bonding method of the present invention.

Moreover, the touch sensor module in the touch panel shown in FIG.13(b) is comprised through [process C-2] and [process D-2] which employ|adopt the bonding method of this invention.

The touch sensor module 10 a and the touch panel control unit 10 b are stacked on an image display device 30 such as an LCD panel to form a touch panel. Here, the configuration example of the touch panel control unit 10b or the bonding of touch panels stacked in this order of the touch sensor module 10a, the touch panel control unit 10b, and the image display device 30 are the same as those in the prior art, so detailed descriptions are omitted here.

In Embodiment 2, when bonding the components of the touch sensor module, instead of conventional OCA tape or OCR, a silicone (substrate) into which a silane coupling agent has been introduced is used. Ultraviolet rays are irradiated to the bonding surface of the silicone (substrate) and each component (for example, a substrate provided with a conductive thin film such as an ITO electrode). Therefore, the same effects as in the first embodiment can be obtained.

In particular, in the touch sensor module constructed in Embodiment 2, only a glass substrate is used as a substrate of the transparent conductive film, so a touch panel incorporating the touch sensor module can have high visibility and weather resistance.

Experimental example

As described above, in the laminating method of the present invention, the introduction of a surface suitable for bonding is achieved by irradiating ultraviolet rays on the bonding surface of the first workpiece and the second workpiece on which the conductive film is applied. The silicone substrate of the silane coupling agent laminates the first and second workpieces, heats and presses the laminated first and second workpieces, and bonds the first and second workpieces together. In particular, in the laminating method of the present invention, the lamination of the surface of the conductive film of the silicone substrate and the conductive film substrate, which could not be bonded even by surface modification treatment by ultraviolet irradiation, or the silicone substrate Bonding with a conductive film substrate when the surface is hydrophobic, the ultraviolet irradiated surface of the above-mentioned silicone substrate is formed into a surface state of the silicone substrate suitable for bonding by irradiating ultraviolet rays to the silicone substrate introduced with a silane coupling agent, The bonding can be performed by irradiating the conductive film substrate with ultraviolet rays to form the surface of the conductive film substrate irradiated with ultraviolet rays into a surface state of the conductive film suitable for bonding.

Hereinafter, an experimental example in which a silicone substrate introduced with a silane coupling agent is bonded to a conductive film substrate on which a conductive thin film is applied will be shown.

(I) Fabrication of Silicone Substrate Introduced with Silane Coupling Agent

First, a silicone substrate into which a silane coupling agent was introduced was produced. As described above, the silane coupling agent-introduced silicone substrate is formed by introducing a silane coupling agent into an uncured silicone resin and then curing it.

As the uncured silicone resin, the following two resins were used.

(A-1) One-component silicone resin X-32-3095 (manufactured by Shin-Etsu Chemical Co., Ltd.)

(A-2) Two-component silicone resin SIM260 (manufactured by Shin-Etsu Chemical Co., Ltd.)

Here, the one-component silicone resin is a silicone resin in which only the main ingredient is cured by a curing reaction such as thermal curing. On the other hand, the two-component silicone resin contains a main ingredient and a curing agent, and after mixing these two components, it is cured by a curing reaction such as thermal curing.

Moreover, the following 3 types were used as a silane coupling agent.

(B-1) Isocyanate-based silane coupling agent KBE-9007 (manufactured by Shin-Etsu Chemical Co., Ltd.)

(B-2) Epoxy-based silane coupling agent KBE-403 (manufactured by Shin-Etsu Chemical Co., Ltd.)

(B-3) Aminoisocyanate-based silane coupling agent KBM-903 (manufactured by Shin-Etsu Chemical Co., Ltd.)

In addition, the structural formula of each silane coupling agent is described below.

[chemical formula 1]

(I-1) Silicone substrate formation using one-component silicone resin (X-32-3095) and silane coupling agent

Formation of a silicone substrate using a one-component silicone resin and a silane coupling agent is performed in the following procedure.

First, a silane coupling agent was introduced into the uncured X-32-3095 solution so as to have a concentration of 2% by weight, and then stirred for about 10 minutes.

Next, this mixed solution was transferred to a glass petri dish and left to stand at room temperature for 1 hour. This step is a step of defoaming air bubbles generated during stirring.

Next, the mixed solution after defoaming was heated under the condition of maintaining at 80° C. for 4 hours to perform primary curing.

Then, secondary curing was implemented by heating at 150° C. for 0.5 hours. As will be described later, depending on the silane coupling agent, a cured silicone substrate may not necessarily be obtained, but the obtained silicone substrate has a shape of 50 mm in diameter and 3 mm in thickness.

(I-2) Silicone substrate formation using two-component silicone resin (SIM260) and silane coupling agent

Formation of the silicone substrate using a two-component silicone resin and a silane coupling agent is performed in the following procedure.

First, a silane coupling agent was introduced into the SIM260 solution containing the main ingredient and the curing agent so as to have a concentration of 2% by weight relative to the total amount of the SIM260 solution, and then stirred for about 10 minutes.

Next, this mixed solution was transferred to a glass petri dish and left to stand at room temperature for 16 hours. Two-component silicone resin starts curing at the first time by mixing the main agent and curing agent. That is, this step is a step of defoaming and primary solidifying air bubbles generated during stirring.

Then, secondary curing was implemented by heating at 150° C. for 0.5 hours. As will be described later, depending on the silane coupling agent, a cured silicone substrate may not necessarily be obtained, but the obtained silicone substrate has a shape of 50 mm in diameter and 1 mm in thickness.

Table 1 shows the results of implementing the above-mentioned silicone substrate formation procedure using each silicone resin and each silane coupling agent.

Table 1

As can be seen from Table 1, when the isocyanate-based silane coupling agent KBE-9007 is used, which silicone resin among the one-component silicone resin X-32-3095 and the two-component silicone resin SIM260 is Neither cures. In addition, the mixed solutions of each uncured silicone resin and silane coupling agent KBE-9007 were in a cloudy state. That is, for X-32-3095 and SIM260, the silane coupling agent KBE-9007 is considered to be a substance that inhibits curing.

In addition, when the epoxy-based silane coupling agent KBE-403 is used, through the above-mentioned procedures, either one-component silicone resin X-32-3095 or two-component silicone resin SIM260 is cured. . That is, a silicone substrate into which a silane coupling agent was introduced was obtained. It was found that the silicone substrate obtained here is transparent, absorbs almost no light, and is suitable as a material to be sandwiched for bonding each component of a touch panel.

In addition, when using the amino-based silane coupling agent KBM-903, through the above-mentioned procedure, either one of the one-component silicone resin X-32-3095 and the two-component silicone resin SIM260 is cured, A silicone substrate into which a silane coupling agent was introduced was obtained. However, although the air bubbles generated during the stirring of the mixed liquid of the silicone resin and the silane coupling agent were removed by the defoaming process, the result of performing the heating process of the primary curing and the secondary curing of the silicone resin X-32-3095 was , foaming occurred in the silicone substrate. In addition, as a result of performing the heating process for secondary curing of the silicone resin SIM260, foaming occurred in the silicone substrate.

That is, since the silicone substrate obtained here has air bubbles inside, when it is used as a sandwiched material for bonding each component of a touch panel, the visibility of an image is remarkably deteriorated.

As mentioned above, it turns out that an epoxy-type silane coupling agent is preferable as a silane coupling agent introduced into a silicone resin.

(II) Bonding experiment between a silicone substrate introduced with a silane coupling agent and a PET film with a conductive film on its surface

Next, bonding experiments were carried out using two types of silicone substrates prepared as described above and introduced with a silane coupling agent. That is, two types of silicone substrates were used, which were formed by using KBE-403 as the silane coupling agent and X-32-3095 and SIM260 as the silicone resin.

(II-1) When X-32-3095 is used as the silicone resin

Ultraviolet rays were irradiated to the bonding surface of the X-32-3095 series silicone substrate introduced with the silane coupling agent KBE-403 and the surface of the PET film on which the conductive film was applied.

As the ultraviolet light source, an excimer lamp emitting vacuum ultraviolet rays (VUV) with a center wavelength of 172 nm was used. The irradiation conditions were 5 mW/cm ² irradiance on the irradiation surface and 180 seconds of irradiation time.

After the VUV irradiation, the X-32-3095 silicone substrate and the PET film of the X-32-3095 series introduced the silane coupling agent KBE-403 were laminated so that the VUV irradiated surfaces of the PET film and the silicone substrate were in contact with each other. Both were heated so that the temperature of both might become 100 degreeC, applying the pressure of 0.25 MPa. The heating time is 30 seconds. In the above procedure, the X-32-3095-based silicone substrate and PET film introduced with the silane coupling agent KBE-403 were joined.

(II-2) When SIM-260 is used as the silicone resin

Ultraviolet rays were irradiated to the bonding surface of the SIM-260-based silicone substrate introduced with the silane coupling agent KBE-403 and the surface of the PET film on which the conductive film was applied.

As the ultraviolet light source, an excimer lamp emitting vacuum ultraviolet rays (VUV) with a center wavelength of 172 nm was used. The irradiation conditions were 5 mW/cm ² irradiance on the irradiation surface and 180 seconds of irradiation time.

After the VUV irradiation, the silicone substrate and the PET film were laminated so that the VUV irradiated surfaces of the SIM-260-based silicone substrate and the PET film introduced with the silane coupling agent KBE-403 were in contact with each other. While applying a pressure of 0.25 MPa, heating was performed so that both temperatures reached 100°C. The heating time is 30 seconds. Through the above procedures, the SIM-260-based silicone substrate and the PET film introduced with the silane coupling agent KBE-403 were joined.

That is, according to this experiment, it was found that bonding of the conductive thin film surface of the silicone substrate and the conductive thin film substrate, which had been impossible to bond conventionally even by surface modification treatment using ultraviolet irradiation, was possible. Similarly, it is considered that the bonding of the silicone substrate and the conductive film substrate when the surface is hydrophobic is also possible.

Furthermore, in the above-mentioned experimental example, it was shown that the parts made of silicone suitable for bonding according to the present invention were obtained by introducing an epoxy-based silane coupling agent into the parts made of silicone, but as the introduction of the parts made of silicone The silane coupling agent in the parts, in addition to the epoxy system, even if the silane coupling agent of the following (B-4) (B-5) is used, it is confirmed that the same as when the epoxy silane coupling agent is used, can obtain Parts made of silicone suitable for joining according to the invention.

(B-4) Methacrylic silane coupling agent KBM-503 (manufactured by Shin-Etsu Chemical Co., Ltd.)

(B-5) Acrylic silane coupling agent KBM-503 (manufactured by Shin-Etsu Chemical Co., Ltd.)

The structural formula of the said silane coupling agent is described below.

[chemical formula 2]

The bonding method of the present invention is also applicable to the case of configuring a touch sensor module having a configuration other than the one shown in FIGS. 1 and 13 .

For example, in FIG. 13( a ), it is also applicable to the case where the first and second glass substrates 16a and 16b on which the transparent conductive film is applied are used as the first and second resin substrates made of PET film 14 or the like. In this case, [process C-1] shown in FIG. 14 is replaced with [process A-1] shown in FIG. 5 . In addition, the subsequent [Step D-1] can be used as it is.

Symbol Description

10-position input device

10a - Touch Sensor Module

10b-Touch panel control section

11-Glass cover slip

12-black matrix

13-1st ITO electrode (1st transparent conductive film)

14-PET film

14a - hard coat

15-The 2nd ITO electrode (the 2nd transparent conductive film)

16, 16a, 16b - glass substrate

17-Silicone (PDMS) substrate

17a, 17b - Silicone (PDMS) substrate with silane coupling agent introduced

21-Wiring layer

22-Touch panel (TP) control IC part

23-FPC (flexible printed circuit board)

30-image display device

31-Polarizing film

32-image display panel

40-ultraviolet (UV) light source

100-touch panel

Claims (6)

1. A method for laminating workpieces, characterized in that: the method is a method of laminating a workpiece with a hydrophobic surface and a component made of silicone, introducing a silane coupling agent into the component made of silicone; irradiating ultraviolet rays to the workpiece and the component composed of silicone; laminating in such a manner that the ultraviolet ray-irradiated surface of the workpiece is in contact with the ultraviolet ray-irradiated surface of the component composed of silicone; Pressurizing in such a way that the contact surface of the laminated workpiece and the component composed of silicone is pressurized, or heating the laminated workpiece and the component composed of silicone, or heating the laminated workpiece and the component composed of silicone The components are heated while being pressurized so that their contact surfaces are pressurized. 2. A method for laminating workpieces, characterized in that: the method is a method of laminating a first workpiece having a hydrophilic surface and a second workpiece having a hydrophobic surface with parts made of silicone sandwiched between them, introducing a silane coupling agent into the component made of silicone; irradiating ultraviolet rays to one surface of the first workpiece, one surface of the second workpiece, and both surfaces of the member made of silicone; stacking the first workpiece, the member made of silicone, and the second workpiece so that the surfaces irradiated with ultraviolet rays are in contact with each other; Pressurizing such that the contact surface is pressurized, or heating the laminated first and second workpieces and a member made of silicone, or heating the laminated first and second workpieces and a member composed of silicone The components are heated while being pressurized such that their contact surfaces are pressurized. 3. A method for laminating workpieces, characterized in that: the method is a method of laminating a first workpiece having a hydrophobic surface and a second workpiece having a hydrophobic surface with parts made of silicone sandwiched between them, introducing a silane coupling agent into the component made of silicone; irradiating ultraviolet rays to one surface of the first workpiece, one surface of the second workpiece, and both surfaces of the member made of silicone; stacking the first workpiece, the member made of silicone, and the second workpiece so that the surfaces irradiated with ultraviolet rays are in contact with each other; Pressing is performed so that the contact surface is pressurized, or the stacked workpieces are heated, or the stacked workpieces are heated while being pressurized so that the contact surfaces thereof are pressurized. 4. according to claim 1, claim 2 or the bonding method of the described workpiece of any one in claim 3, it is characterized in that: above-mentioned silane coupling agent is epoxy-based, acrylic or methacrylic A silane coupling agent. 5. A touch panel, characterized in that: the touch panel is provided with a touch sensor module having a substrate on which a transparent conductive film is applied, and an image display device, The touch sensor module includes a substrate on which a transparent conductive film is modified by ultraviolet irradiation, and a member made of silicone with a silane coupling agent introduced therein, the surface of which is modified by ultraviolet irradiation. and stacked facing each surface of the member made of silicone to which the ultraviolet ray was irradiated. 6. The touch panel according to claim 5, wherein the silane coupling agent is an epoxy-based, acrylic-based or methacrylic-based silane coupling agent.