CN104048204A - LED light source and manufacturing method thereof - Google Patents
LED light source and manufacturing method thereof Download PDFInfo
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- CN104048204A CN104048204A CN201410325843.9A CN201410325843A CN104048204A CN 104048204 A CN104048204 A CN 104048204A CN 201410325843 A CN201410325843 A CN 201410325843A CN 104048204 A CN104048204 A CN 104048204A
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- groove
- circuit line
- transparency carrier
- led chips
- light source
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- 238000004519 manufacturing process Methods 0.000 title claims abstract 6
- 238000004806 packaging method and process Methods 0.000 claims abstract 9
- 238000000034 method Methods 0.000 claims abstract 3
- 230000013011 mating Effects 0.000 claims 1
- 239000003292 glue Substances 0.000 abstract 3
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Abstract
The invention relates to the technical field of LED light sources, and provides an LED light source which comprises a transparent base plate, multiple segments of circuit lines, a positive pole wiring, a negative pole wiring, a plurality of inverted LED chips and packaging glue. A groove is formed in the transparent base plate, the multiple segments of the circuit lines are laid in the groove in a mutual non-conducting mode, one end of the positive pole wiring and one end of the negative pole wiring are exposed on the transparent base plate, the other end of the positive pole wiring and the other end of the negative pole wiring are connected to two of the multiple segments of the circuit lines respectively, the inverted LED chips are welded on two of the multiple segments of the circuit lines respectively, the packaging glue is arranged in the groove in an pouring mode, and the multiple segments of the circuit lines and the inverted LED chips are packaged in the groove in the transparent base plate through the packaging glue. An LED lamp manufactured through the manufacturing method has the advantages of being simple in structure and process, and capable of improving production efficiency, reducing production cost and further broadening the light-emitting angle.
Description
Technical field
The present invention relates to LED light source technical field, be specifically related to LED light source and manufacture method thereof.
Background technology
While producing LED lamp via LED chip at present, need first LED chip and support to be packaged into LED lamp pearl through die bond, bonding wire, dot fluorescent powder, sealing, cutting etc. operation, and then this LED lamp pearl is mounted on and on aluminium base, makes light source, finally again light source and power supply, lamp holder, radiating piece, lampshade etc. are fitted together, the operation of these production and assembly is various, the complex structure of the LED lamp of simultaneously producing, directly causes that production efficiency is low, production cost is high thus.
In addition, while at present LED chip being encapsulated as to LED light source, generally LED chip has at least the light that a face sends to be blocked by support, thereby the rising angle of LED lamp is limited, and reduces light efficiency.
Summary of the invention
The object of the present invention is to provide LED light source, to solve, the operation of LED lamp production and assembly of prior art is various, complex structure, lighting angle is limited, light efficiency is low problem.
LED light source, comprising:
Transparency carrier, multistage circuit line, anodal wiring, negative pole wiring, a plurality of flip LED chips, packaging plastic;
On described transparency carrier, offer groove,
Described multistage circuit line is being layed in described groove of not conducting mutually,
One end of described anodal wiring and described negative pole wiring is exposed on described transparency carrier, the other end is connected to respectively on the wherein two sections of circuit lines in described multistage circuit line,
Described a plurality of flip LED chips is welded in respectively on the wherein two sections of circuit lines in described multistage circuit line,
Described packaging plastic is filled with and is located in described groove and described multistage circuit line and described a plurality of flip LED chips are packaged in the groove of described transparency carrier.
The present invention also provides the manufacture method of above-mentioned LED light source, comprises the following steps:
A1. on transparency carrier, offer groove,
B1. in described groove, lay the multistage circuit line of not conducting mutually,
C1. the wherein two sections of circuit lines in described multistage circuit line connect respectively anodal wiring, negative pole is wired on described transparency carrier,
D1. a plurality of flip LED chips are welded in respectively on the wherein two sections of circuit lines in described multistage circuit line,
E1. filling with packaging plastic is packaged in described multistage circuit line and described a plurality of flip LED chips in the groove of described transparency carrier.
Adopt this LED light source to manufacture LED lamp, have simple in structure and operation is simple, can enhance productivity and reduce production costs, can also increase rising angle, and improve the advantage of light efficiency.
Accompanying drawing explanation
The decomposition texture schematic diagram one of the LED light source that Fig. 1 provides for embodiment mono-;
The decomposition texture schematic diagram two of the LED light source that Fig. 2 provides for embodiment mono-;
The structural representation of the LED light source that Fig. 3 provides for embodiment mono-;
The decomposition texture schematic diagram one of the LED light source that Fig. 4 provides for embodiment bis-.
The specific embodiment
Below in conjunction with drawings and the specific embodiments, the invention will be further described.
Embodiment mono-:
The LED light source that embodiment mono-provides, comprising:
Transparency carrier 1, multistage circuit line 2, anodal wiring 31, negative pole wiring 32, a plurality of flip LED chips 4, packaging plastic 5;
On transparency carrier 1, offer groove 11,
Being layed in groove 11 of multistage circuit line 2 mutual not conductings,
One end of anodal wiring 31 and negative pole wiring 32 is exposed on transparency carrier 1, the other end is connected to respectively on the wherein two sections of circuit lines 2 in multistage circuit line 2,
A plurality of flip LED chips 4 are welded in respectively on the wherein two sections of circuit lines 2 in multistage circuit line 2,
Packaging plastic 5 is filled with and is located in groove 11 and multistage circuit line 2 and a plurality of flip LED chips 4 are packaged in the groove 11 of transparency carrier 1.
The manufacture method of the LED light source that embodiment mono-provides, comprises the following steps:
A1. on transparency carrier 1, offer groove 11,
B1. in the mutual circuit line 2 of not conducting of the interior laying multistage of groove 11,
C1. the wherein two sections of circuit lines 2 in multistage circuit line 2 connect respectively anodal wiring 31, negative pole wiring 32 to transparency carrier 1,
D1. a plurality of flip LED chips 4 are welded in respectively on the wherein two sections of circuit lines 2 in multistage circuit line 2,
E1. filling with packaging plastic 5 is packaged in multistage circuit line 2 and a plurality of flip LED chips 4 in the groove 11 of transparency carrier 1.
Label in above-mentioned steps is only expression effect, is not represented as the sequencing of step, and the order of some steps wherein can be changed, such as the step of c1 and d1 can be exchanged.
While adopting this LED light source to be assembled into LED lamp, only need this LED light source be fixedly connected on power supply is installed on lamp holder and in lamp holder.Wherein, this LED light source is fixedly connected with lamp holder by transparency carrier 1, and a plurality of flip LED chips 4 are electrically connected to power supply by anodal wiring 31 and negative pole wiring 32.
While adopting the LED lamp work that this LED light source is assembled into, luminous the produced heat of a plurality of LED chips 4 can directly dispel the heat by transparency carrier 1, does not need thus radiating piece; A plurality of LED chips 4 are packaged in by packaging plastic 5 in the groove 11 of transparency carrier 1, do not need thus lampshade; Transparency carrier 1 shown in the drawings is plane, it is only signal, when needs are realized multidirectional rising angle, this transparency carrier 1 can be made into cylindric or spherical etc., and then on cylindric or spherical transparency carrier 1, offer groove 11 and weld a plurality of flip LED chips 4, can increase thus rising angle and realize all-round light.
To sum up, adopt this LED light source to manufacture LED lamp, have simple in structure and operation is simple, can enhance productivity and reduce production costs, can also increase the advantage of rising angle.
Further, transparency carrier 1 can adopt the transparency carrier of reinforced glass substrate or other high temperature resistance and high strength high tenacities, and multistage circuit line 2 can be printed in groove 11 by the mode of printing.
Further, the anodal wiring 31 of illustrated embodiment and one end of negative pole wiring 32 are exposed to outside transparency carrier 1; And in other embodiments, one end of this positive pole wiring 31 and negative pole wiring 32 can be set to the contact on transparency carrier 1.Adopt the structure of different anodal wiring 31 and negative pole wiring 32, can be convenient, flexible be electrically connected to lamp holder.
Further, the transparency carrier 1 of illustrated embodiment is annular transparency carrier 1, groove 11 is for being located on the annular groove 11 of transparency carrier 1, multistage circuit line 2 is for the direction along groove 11 of dotted line shape is layed in annular groove 11, and a plurality of flip LED chips 4 series weldings are connected on two adjacent circuit lines 2; And in other embodiments, transparency carrier 1 can be cylindrical shape or spherical, groove 11 can interlock and be located on transparency carrier 1, and multistage circuit line 2 can be located in groove 11 side by side, and a plurality of flip LED chips 4 also can in parallel be welded on two adjacent circuit lines 2.
Embodiment bis-:
The volume of flip LED chips 4 is very little, therefore from saving the angle of fluting workload, consider, groove 11 is unsuitable wide, when the width of groove 11 is wide in addition, be also unfavorable for encapsulation, thus, 11 li of the less grooves of width, lay multistage circuit lines 2 and weld a plurality of flip LED chips 4 and will have certain difficulty.
Thus, the LED light source that embodiment bis-provides, comprising:
Transparency carrier 1, multistage circuit line 2, anodal wiring 31, negative pole wiring 32, a plurality of flip LED chips 4, packaging plastic 5, base bar 6;
On transparency carrier 1, offer groove 11,
Base bar 6 mates with groove 11 and is arranged in groove 11,
Being layed on base bar 6 of multistage circuit line 2 mutual not conductings,
One end of anodal wiring 31 and negative pole wiring 32 is exposed on transparency carrier 1, the other end is connected to respectively on the wherein two sections of circuit lines 2 in multistage circuit line 2,
A plurality of flip LED chips 4 are welded in respectively on the wherein two sections of circuit lines 2 in multistage circuit line 2,
Packaging plastic 5 is filled with and is located in groove 11 and base bar 6, multistage circuit line 2 and a plurality of flip LED chips 4 are packaged in the groove 11 of transparency carrier 1.
The manufacture method of the LED light source that embodiment bis-provides, comprises the following steps:
A2. on transparency carrier 1, offer groove 11,
B2. on the base bar 6 mating with groove 11, lay the multistage circuit line 2 of not conducting mutually,
C2. a plurality of flip LED chips 4 are welded in respectively on the wherein two sections of circuit lines 2 in multistage circuit line 2,
D2. base bar 6 is positioned in groove 11,
E2. the wherein two sections of circuit lines 2 in multistage circuit line 2 connect respectively anodal wiring 31, negative pole wiring 32 to transparency carrier 1,
F2. filling with packaging plastic 5 is packaged in base bar 6, multistage circuit line 2 and a plurality of flip LED chips 4 in the groove 11 of transparency carrier 1.
Label in above-mentioned steps is only expression effect, is not represented as the sequencing of step.
The LED light source that embodiment bis-provides is compared with the LED light source that embodiment mono-provides, many base bars 6, and this base bar 6 mates with groove 11 and is arranged in groove 11.Thus, when manufacturing this LED light source, can then a plurality of flip LED chips 4 be welded on circuit line 2 prior to laying multistage circuit line 2 on base bar 6, again the base bar that is equipped with circuit line 2 and is welded with flip LED chips 4 be arranged in groove 11 afterwards.Therefore the LED light source that, embodiment bis-provides and manufacture method thereof can be avoided directly at the less interior laying multistage of the groove 11 circuit line 2 of width and weld the existing difficulty of a plurality of flip LED chips 4.
Except base bar 6, the LED light source that embodiment bis-provides is consistent with the structure of the LED light source that embodiment mono-provides, and does not repeat them here.
More than for the present invention illustrates.
Claims (4)
1.LED light source, is characterized in that, comprising:
Transparency carrier (1), multistage circuit line (2), anodal wiring (31), negative pole wiring (32), a plurality of flip LED chips (4), packaging plastic (5);
On described transparency carrier (1), offer groove (11),
Described multistage circuit line (2) is being layed in described groove (11) of not conducting mutually,
It is upper that one end of described anodal wiring (31) and described negative pole wiring (32) is exposed to wherein two sections of circuit lines (2) that described transparency carrier (1) is upper, the other end is connected to respectively in described multistage circuit line (2),
Wherein two sections of circuit lines (2) that described a plurality of flip LED chips (4) is welded in respectively in described multistage circuit line (2) are upper,
Described packaging plastic (5) is filled with and is located in described groove (11) and described multistage circuit line (2) and described a plurality of flip LED chips (4) are packaged in the groove (11) of described transparency carrier (1).
2. the manufacture method of LED light source as claimed in claim 1, is characterized in that, comprises the following steps:
A1. on transparency carrier (1), offer groove (11),
B1. in described groove (11), lay the multistage circuit line (2) of not conducting mutually,
C1. the wherein two sections of circuit lines (2) in described multistage circuit line (2) connect respectively anodal wiring (31), negative pole wiring (32) is upper to described transparency carrier (1),
D1. the wherein two sections of circuit lines (2) that a plurality of flip LED chips (4) are welded in respectively in described multistage circuit line (2) are upper,
E1. filling with packaging plastic (5) is packaged in described multistage circuit line (2) and described a plurality of flip LED chips (4) in the groove (11) of described transparency carrier (1).
3.LED light source, is characterized in that, comprising:
Transparency carrier (1), multistage circuit line (2), anodal wiring (31), negative pole wiring (32), a plurality of flip LED chips (4), packaging plastic (5), base bar (6);
On described transparency carrier (1), offer groove (11),
Described base bar (6) mates with described groove (11) and is arranged in described groove (11),
Described multistage circuit line (2) is being layed on described base bar (6) of not conducting mutually,
It is upper that one end of described anodal wiring (31) and described negative pole wiring (32) is exposed to wherein two sections of circuit lines (2) that described transparency carrier (1) is upper, the other end is connected to respectively in described multistage circuit line (2),
Wherein two sections of circuit lines (2) that described a plurality of flip LED chips (4) is welded in respectively in described multistage circuit line (2) are upper,
Described packaging plastic (5) is filled with and is located in described groove (11) and described base bar (6), described multistage circuit line (2) and described a plurality of flip LED chips (4) is packaged in the groove (11) of described transparency carrier (1).
4. the manufacture method of LED light source as claimed in claim 3, is characterized in that, comprises the following steps:
A2. on transparency carrier (1), offer groove (11),
B2. in the base bar (6) mating with described groove (11), above lay the multistage circuit line (2) of not conducting mutually,
C2. the wherein two sections of circuit lines (2) that a plurality of flip LED chips (4) are welded in respectively in described multistage circuit line (2) are upper,
D2. described base bar (6) is positioned in described groove (11),
E2. the wherein two sections of circuit lines (2) in described multistage circuit line (2) connect respectively anodal wiring (31), negative pole wiring (32) is upper to described transparency carrier (1),
F2. filling with packaging plastic (5) is packaged in described base bar (6), described multistage circuit line (2) and described a plurality of flip LED chips (4) in the groove (11) of described transparency carrier (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410325843.9A CN104048204A (en) | 2014-07-10 | 2014-07-10 | LED light source and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410325843.9A CN104048204A (en) | 2014-07-10 | 2014-07-10 | LED light source and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN104048204A true CN104048204A (en) | 2014-09-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410325843.9A Pending CN104048204A (en) | 2014-07-10 | 2014-07-10 | LED light source and manufacturing method thereof |
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| CN (1) | CN104048204A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105127050A (en) * | 2015-07-22 | 2015-12-09 | 宁波百立光电有限公司 | Sealant pouring process for waterproof lamp strips |
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| US20040173810A1 (en) * | 2003-03-03 | 2004-09-09 | Ming-Der Lin | Light emitting diode package structure |
| CN201866576U (en) * | 2010-10-28 | 2011-06-15 | 王元成 | LED bulb |
| CN203298004U (en) * | 2013-06-08 | 2013-11-20 | 杭州杭科光电股份有限公司 | Annular luminous LED light source module |
| CN203322771U (en) * | 2012-05-29 | 2013-12-04 | 璨圆光电股份有限公司 | Light emitting assembly |
| CN103591480A (en) * | 2012-08-17 | 2014-02-19 | 展晶科技(深圳)有限公司 | LED lighting set |
| CN203517379U (en) * | 2013-09-05 | 2014-04-02 | 深圳市智讯达光电科技有限公司 | Lamp bulb based on inversely-installed LED chips and transparent ceramic substrates |
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2014
- 2014-07-10 CN CN201410325843.9A patent/CN104048204A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040173810A1 (en) * | 2003-03-03 | 2004-09-09 | Ming-Der Lin | Light emitting diode package structure |
| CN201866576U (en) * | 2010-10-28 | 2011-06-15 | 王元成 | LED bulb |
| CN203322771U (en) * | 2012-05-29 | 2013-12-04 | 璨圆光电股份有限公司 | Light emitting assembly |
| CN103591480A (en) * | 2012-08-17 | 2014-02-19 | 展晶科技(深圳)有限公司 | LED lighting set |
| CN203298004U (en) * | 2013-06-08 | 2013-11-20 | 杭州杭科光电股份有限公司 | Annular luminous LED light source module |
| CN203517379U (en) * | 2013-09-05 | 2014-04-02 | 深圳市智讯达光电科技有限公司 | Lamp bulb based on inversely-installed LED chips and transparent ceramic substrates |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105127050A (en) * | 2015-07-22 | 2015-12-09 | 宁波百立光电有限公司 | Sealant pouring process for waterproof lamp strips |
| CN105127050B (en) * | 2015-07-22 | 2019-01-18 | 宁波百立光电有限公司 | A kind of encapsulating adhesive process of water proof lamp band |
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Application publication date: 20140917 |