CN204901412U - A kind of LED light bulb - Google Patents

Abstract

The utility model provides a LED bulb, includes the printing opacity cell-shell, be equipped with the stem of taking the lead-out wire in the printing opacity cell-shell, be fixed with at least one LED encapsulation on the lead-out wire, the LED encapsulation links to each other through driver and electric connector, printing opacity cell-shell and stem seal, form airtight space, its characterized in that inside the printing opacity cell-shell: the LED package comprises a substrate, wherein a plurality of LED chips are arranged on the substrate, the substrate is a strip-shaped substrate, at least one groove extending along the length direction of the substrate is formed in the substrate, and the LED chips on the substrate are connected in series and/or in parallel through connecting wires. This LED bulb can be through the discontinuous fluting in the middle of the base plate, and the LED chip on with the base plate is established ties or is parallelly connected, conveniently sets the LED chip to different light-emitting blocks, can carry out solitary circuit control to the LED chip of different blocks, forms intelligent lighting control system.

Description

A kind of LED light bulb

technical field

The utility model relates to an LED light source, in particular to an LED bulb.

Background technique

In the prior art, there are different LED packaging methods, including pin (Lamp) LED packaging, chip-on-board (ChipOnBoard) LED packaging, surface mount (SurfaceMountDevice) LED packaging, system (SystemInPackage) LED packaging, etc. According to different LED packaging methods, different packaging substrates will be used.

In general, the substrate for chip-on-board (ChipOnBoard) LED packaging is a substrate made of a circuit board or a single material, such as metal, PVC, plexiglass, plastic, etc., and its shape is mostly flat and rectangular. Round or flat strips, etc., and the edges of the substrate are usually smooth curves or straight lines.

Moreover, after the LED chip is installed on the existing substrate and the fluorescent glue is sealed, the emitted light is planar light. Even if multiple substrates are arranged as a three-dimensional luminous body, due to the incomplete design of the overall structure, it is easy to appear around the luminous body. The phenomenon of uneven light emission. In addition, when the substrate is a light-transmitting material, although it can emit light in 360 degrees, it usually encounters heat dissipation problems. Azimuth glow.

All in all, the existing ChipOnBoard (ChipOnBoard) LED packaging substrates and light bulbs are not uniform enough to emit light at multiple angles and layers, and are also prone to heat dissipation problems, which affect luminous efficiency.

Utility model content

The technical problem to be solved by the utility model is to provide an LED light bulb that is easy to dissipate heat, and is easy to distribute LED chips to realize multi-level and multi-color light emission, and can realize omni-directional and multi-angle light emission of the LED light bulb.

The technical scheme adopted by the utility model to solve the above-mentioned technical problems is: an LED light bulb, including a light-transmitting bulb, a stem with a lead-out line is arranged inside the light-transmittance bulb, and at least one is fixed on the lead-out line LED package, the LED package is connected through a driver and an electrical connector, the light-transmitting bulb and the stem are sealed to form a closed space inside the light-transmitting bulb, characterized in that: the LED package includes a substrate, the A plurality of LED chips are arranged on the substrate, the substrate is a strip-shaped substrate, and at least one slot extending along the length direction of the substrate is provided on the substrate, and the plurality of LED chips on the substrate are connected in series through connecting wires and/or in parallel.

Preferably, when there are multiple slots, the multiple slots are arranged at intervals along the length direction and the width direction of the substrate, and LED chips are arranged on the substrates on both sides of the slots.

As another embodiment of the present invention, the slot includes a plurality of discontinuous circular through holes distributed at intervals along the length direction of the substrate.

In order to better control the light emission of the LED chips, the substrates are multiple, and the multiple substrates are sequentially connected end-to-end through connecting members.

In order to facilitate control and connection, the connecting member includes a non-conductive part that wraps and connects the ends of adjacent substrates, and a conductive part located in the non-conductive part, and the non-conductive part is not in contact with the substrates connected by the connecting member. , the conductive portion is electrically connected to the LED chip on the substrate connected to the connecting member through a connecting wire.

As another embodiment of the light bulb of the present invention, at least one end of the substrate is connected with an electrode lead wire, and the electrode lead wire is connected to the substrate through a connecting member or a connecting material.

In order to control and divide the LED chips on the substrate into multiple parts, the middle part of the substrate is provided with leads, and the leads are electrically connected to the LED chips on the substrate.

Preferably, the substrate is a spiral-shaped substrate, and the spiral lines of the substrate are not in contact with each other at intervals when they are on the same plane.

Preferably, the substrate is arc-shaped, wave-shaped, or a strip-shaped substrate formed by splicing multiple polygons or circles.

In order to control the LED chips more diversely, the connection member is electrically connected to the LED chips on at least some of the plurality of substrates, and the connection member is electrically connected to lead wires through which lead wires are connected to lead-out wires.

Compared with the prior art, the utility model has the advantage that the LED light bulb can connect the LED chips on the substrate in series or in parallel through the discontinuous slot in the middle of the substrate, so that the LED chips can be conveniently arranged into different light-emitting blocks. The LED chips in different light-emitting blocks can form different colors, color temperatures, brightness, and display fingers, etc., and can perform separate circuit control on the LED chips in different blocks to form an intelligent lighting control system. Air circulation and heat dissipation make the life of LED bulbs longer.

Description of drawings

Fig. 1 is a schematic diagram of an LED light bulb according to an embodiment of the present invention.

FIG. 2 is a schematic diagram of the substrate of the LED package of the first embodiment of the LED light bulb of the present invention.

Fig. 3 is a schematic diagram of the LED package of the first embodiment of the LED light bulb of the present invention.

Fig. 4 is a schematic diagram of the LED package of the second embodiment of the LED light bulb of the present invention.

FIG. 5 is a schematic diagram of the substrate of the LED package of the third embodiment of the LED light bulb of the present invention.

FIG. 6 is a schematic diagram of the LED package of the third embodiment of the LED light bulb of the present invention.

Fig. 7 is a side view of the middle part of the LED package of the third embodiment of the LED light bulb of the present invention.

Fig. 8 is a side view of the end of the LED package of the third embodiment of the LED light bulb of the present invention.

FIG. 9 is a schematic diagram of the LED package of the fourth embodiment of the LED light bulb of the present invention.

FIG. 10 is a schematic diagram of the LED package of the fifth embodiment of the LED light bulb of the present invention.

Detailed ways

The utility model is described in further detail below in conjunction with the accompanying drawings.

As shown in FIG. 1 , it is a schematic diagram of the LED light bulb of the present invention. The light bulb includes a light-transmitting bulb shell 20 , a stem 30 is arranged inside the light-transmitting bulb shell 20 , and a lead-out wire 31 is arranged on the stem 30 , and at least one LED package 40 is fixedly connected to the lead-out wire 31 . The electrode lead wire 2 of the LED package 40 and the lead wire 6 in the middle of the substrate 1 are connected to the driver 50 through the lead wire 31. The driver 50 is connected to the electrical connector 60 and is located in the electrical connector 60. The electrical connector 60 is located in the light-transmitting The bottom of the bulb shell 20 is used for connecting external power supply. The light-transmitting bulb 20 and the stem 30 are sealed. The airtight space formed by the light-transmitting bulb 20 can be filled with a gas that protects the LED package and facilitates heat dissipation of the LED package. The gas can be helium or hydrogen-helium mixed gas. The light-transmitting bulb 20 is made of transparent, milky white, frosted, or colored bulbs, and can also be partially provided with reflective layers, or partially provided with small prisms and small lenses. The shape of the light-transmitting bulb 20 is A-type, G-type, R-type, PAR-type, T-type, candle-type or other existing bulb bulb shapes. The electrical connector 60 is one of existing electrical connectors such as E40, E27, E26, E14, and GU.

As shown in Figures 2 and 3, the first embodiment of the LED light bulb of the present invention, the LED package in this embodiment includes a strip-shaped substrate 1, the two ends of the substrate 1 are provided with electrode lead-out wires 2, and the electrode lead-out wires 2 The two ends of the substrate are fixed by the connecting member 3 and/or the connecting material, which can be glue, ceramic glue, low-melting glass, silver paste or plastic. The electrode leads 2 are connected to the substrate 1 through the connecting member 3, and one end of the substrate 1 is provided with the electrode leads 2, and the other end is not provided with the electrode leads, and the whole substrate is used as another electrode lead. The entire substrate is used as another electrode lead-out line, which is more conducive to the heat dissipation of the LED chip on the substrate.

Preferably, the substrate is a spiral-shaped substrate, as shown in FIG. 2 , and the spiral lines of the substrate 1 have intervals and do not contact each other when they are on the same plane. The substrate can be a circular spiral line, an elliptical spiral line, or a spiral line spliced by other polygons such as squares, pentagons, and hexagons, which can be regular geometric shapes or irregular geometric shapes. The helical substrate 1 includes at least 1/2 helical turns.

The material of the substrate 1 can be one of metal, plexiglass, PVC, plastic, sapphire, ceramic or silica gel, or multiple materials among the above materials can be made by splicing or nesting.

As shown in Figure 2, the substrate 1 is provided with at least one slot 5 extending along the length direction of the substrate 1. When there are multiple slots 5, they can be arranged at intervals along the The substrate 1 is arranged at intervals in the width direction, or a plurality of substrates 1 may be arranged at intervals along the length direction and the width direction at the same time. The slot 5 divides the substrate 1 into a plurality of interconnected parts. The arrangement of the slot 5 can not only increase the heat dissipation of the substrate 1, but also facilitate the arrangement and arrangement of the LED chips on the substrate. For example, as shown in FIG. 1 , the substrate 1 is provided with a plurality of slots 5 arranged at intervals along the length direction of the substrate 1 . As shown in Figures 2 and 3, a plurality of LED chips 10 are fixed on the substrate 1, and the LED chips 10 are fixed on the substrate 1 by transparent glue or conductive glue, such as silica gel, modified resin, epoxy resin, silver glue or copper glue.

The LED chips 10 on the substrate 1 on both sides of each slot 5 can be connected in series with each other through connecting wires, and the two groups of LED chips 10 on both sides of the slot 5 can be connected in parallel or in series with each other through connecting wires 11. Connections can be made as needed.

In Fig. 3, the substrate 1 is provided with a plurality of slots 5 extending at intervals along the length direction of the substrate 1, and the slots 5 divide the substrate 1 into two parts in the width direction, and a plurality of LEDs on one side of each slot 5 The chips 10 are all connected in series, that is, a plurality of LED chips 10 on one side of each slot 5 form a group, and each group of LED chips 10 on both sides of the slot 5 are connected in parallel. As shown in Figure 2, lead wires 6 are also provided between the two slots 5, and the lead wires 6 are electrically connected to the series-connected LED chips on both sides of the slots 5, so that multiple groups of LED chips on both sides of the multiple slots 5 are connected in parallel. A plurality of LED chips 10 are connected in series through connection wires 11 , and multiple groups of LED chips 10 are also connected in series through connection wires 11 .

This makes the arrangement and control of the LED chips simpler and more diverse. Users can connect multiple LED chips in series and in parallel as required, and arrange LED chips of different colors. Moreover, the existence of the slot 5 also makes the brightness of the entire LED package higher, so that the light of the LED chip can be transmitted to the back or other surfaces through the slot 5, and the luminous angle is more comprehensive. Moreover, if a printed circuit is printed on the substrate 1 , the LED chips on the substrate 1 may not be connected to each other through the connecting wire 11 , or the LED chips may be directly connected to each other through the printed circuit.

Moreover, the surface of the LED chip 10 and the substrate 1 is coated with a protective or luminescent dielectric layer, which is one or a combination of silica gel, epoxy resin glue and LED luminescent powder glue.

As shown in Figure 4, it is the second embodiment of the LED light bulb. In this embodiment, the structure of the LED package in the LED light bulb is the same as that in the first embodiment, including a substrate 1, and the two ends of the substrate 1 At least one end is provided with an electrode lead-out wire 2, and the electrode lead-out wire 2 is connected to the substrate 1 through a connecting member 3. The substrate 1 is provided with a plurality of slots 5 arranged at intervals along its length direction and extending along the length direction. 5. Divide the substrate 1 into two side parts from the width direction, each side of the two sides of the slot 5 is respectively provided with a plurality of LED chips 10, and the plurality of LED chips 10 on each side are connected to each other through connecting wires 11. In series connection, the LED chips 10 on each side are connected to the electrode leads 2 at both ends of the substrate 1 through connection wires 11, so that two groups of LED chips 10 on both sides of the slot 5 are connected in parallel.

And it is also possible to set the lead wire 6 in the middle of the substrate 1, and the substrate 1 is divided into multiple sections of LED chips 10 along the length direction. The leads 6 are connected in parallel or in series. That is to say, multiple groups of different LED chips can be arranged on the substrate 1 , and each group of chips can be connected in parallel or in series, and can be arranged as required.

As shown in Figures 5, 6, 7 and 8, it is the third embodiment of the LED light bulb. In this embodiment, in the LED light bulb: the LED package includes a plurality of substrates 1 connected head to tail to form a whole. The substrates 1 are connected to each other through the connecting member 3 , and the connecting member 3 not only connects the substrates 1 structurally, but also electrically connects the LED chips 10 on the substrate 1 . Each substrate 1 is provided with slots 5 extending along the length direction of the substrate 1. The distribution of the slots 5 on the substrate 1 is the same as that of the first and second embodiments. , there may also be a plurality of them arranged in parallel and at intervals along the width direction.

Preferably, the structure of the connecting member 3 is as shown in Figures 7 and 8, as shown in Figure 7, it is a schematic structural diagram of the connecting member 3 connecting two substrates 1, as shown in Figure 7, it is the connecting member 3 connecting the substrate 1 Schematic diagram with electrode lead-out wire 2. As shown in FIG. 7, the connection member 3 includes a non-conductive portion 31 that wraps and connects the ends of the two substrates 1 with each other, and a conductive portion 32 located in the non-conductive portion 31, and the conductive portion 32 is connected to the conductive portion 31. The substrates 1 to which the components 3 are connected are not in contact with each other. Since the non-conductive portion 31 is non-conductive, it only serves to structurally connect the ends of the substrate 1 . In FIG. 7 , the LED chips 10 near the end where the substrate 1 is connected to the connecting member 3 are respectively connected to the conductive parts 32 in the connecting member 3 through connecting wires 11. Therefore, the two substrates 1 are also electrically connected through the connecting member 3. . The material of the non-conductive part 31 of the connecting member 3 is plastic, ceramic or silica gel, and the material of the conductive part 32 is metal.

As shown in FIG. 8 , this figure is a schematic structural diagram of the interconnection between the substrate 1 and the electrode lead wires 2 through the connecting member 3 . That is, one of the substrates 1 in FIG. 4 can be replaced with an electrode lead-out wire 2 . And through the above-mentioned connection member 3, the connection member 3 can only connect a plurality of substrates 1 structurally and realize the disconnection of the electrical connection, that is, the LED chips on the substrate 1 on the connection member 3 can not connect to each other through the connection member 3. are electrically connected, and are electrically connected through other leads 6 provided on the substrate 1 . The connecting member 3 only functions to connect the substrate 1 .

It can also be shown in FIG. 6, including two substrates 1, which are connected to each other through an intermediate connecting member 3. The connecting member 3 connects the two substrates 1 structurally, and the connecting member can also be electrically connected to the two substrates 1 respectively. LED chip 10 on the LED chip 10, and the connection member 3 is led out to the electrode lead-out line 2 through the lead wire 6 electrically connected thereto, and connected to the driver 50 and the electrical connector 60 through the electrode lead-out line. The structure of the connecting member 3 may be the same as that of the above connecting member 3, and may function to isolate the two substrates, and may also function to lead out the LED chips on the substrate. Each substrate 1 is provided with a plurality of slots 5 arranged at intervals along its length direction and extending along the length direction, the two sides of the slots 5 are divided into multiple groups of LED chips 10, and the substrate 1 may also be provided with leads 6 It is electrically connected with the LED chips 10, so that the LED chips 10 on the substrate 1 are connected in series and/or in parallel.

Such a structure can realize a variety of connection modes between multiple LED chips on the substrate 1, that is, there can be multiple conductive parts 32 in the non-conductive part 31, and each substrate 1 is equipped with The slots 5 separate the substrate 1 into multiple parts, and the LED chips 10 on the multiple parts can be connected to different conductive parts 32 to realize the series or parallel connection of the LED chips 10 .

As shown in Figure 9, it is the fourth embodiment of the LED light bulb, the substrate 1 and the electrode lead wire 2 are connected to each other through the connecting member 3, and the substrate 1 is provided with a plurality of A plurality of slots 5 arranged in a matrix shape. In addition, there are multiple columns of LED chips 10 separated in the width direction of the substrate 1 , and the LED chips 10 in each column are connected in series with each other, while the multiple columns are connected in parallel with each other. The end portion of the substrate 1 is connected to the electrode lead wire 2 through the connecting member 3, the structure of the connecting member 3 is the same as the connecting member in the second embodiment above, and the non-conductive part 31 of the connecting member 3 connects the electrode lead wire 2 and the electrode lead wire 2. The substrate 1 and the conductive part 32 are connected to the LED chips 10 and the electrode lead wires 2 on the substrate 1 respectively through connecting wires 11 , and the conductive part 32 is not in direct contact with the substrate 1 and the electrode lead wires 2 . That is, the connection member 3 structurally connects the two parts, and may also electrically connect the electrode lead wire 2 and the LED chip 10 . The connection member connecting the electrode lead wire 2 and the substrate 1 can also be used to connect a plurality of substrates 1 .

As shown in Fig. 10, it is the fifth embodiment of the LED light bulb. The structure of the substrate 1 is different from that of the above-mentioned first, second, third and fourth embodiments. The first, second and third embodiments The substrate 1 in the figure is a square strip substrate, while the substrate 1 in the fifth embodiment is a plurality of circular spliced strip substrates. The slot 5 is a plurality of discontinuous circular through-holes 51 arranged at intervals along the length direction of the substrate 1 on the substrate 1. The circular through-holes 51 are arranged concentrically with the circle on the substrate. The holes 51 are arranged at intervals along the length direction of the substrate 1 . The slot 5 can also be in the shape of a strip, that is, the slot 5 can span multiple circles, and the substrate 1 can also be in other shapes, such as spliced squares of different sizes, or in other shapes. In this embodiment, one end of the substrate 1 is provided with an electrode lead-out line 2 , and the other end is not provided with an electrode lead-out line, and the entire substrate is used as another electrode lead-out line. Therefore, the shape of the substrate 1 can be arc-shaped, wave-shaped, or a strip formed by splicing multiple polygons, or a strip-shaped substrate formed by splicing multiple circular shapes. And it can be understood from this embodiment that the slot 5 on the substrate can be in various other shapes, not necessarily a strip shape, or a plurality of circular holes, or irregularly shaped slots and other regular shapes. Slotting of shapes, such as squares, polygons, etc.

The LED light bulb can connect the LED chips on the substrate in series or in parallel through the discontinuous slots in the middle of the substrate, so that the LED chips can be arranged in different light-emitting blocks conveniently. The LED chips in the different light-emitting blocks can form different colors, Color temperature, brightness and CRI, etc., can be used for separate circuit control of LED chips in different blocks to form an intelligent lighting control system. Moreover, the setting of slots is conducive to the air circulation and heat dissipation of the package, making the life of LED bulbs longer.

Although the preferred embodiments of the present invention have been described in detail above, it should be clearly understood that the present invention can have various modifications and changes for those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model shall be included in the protection scope of the present utility model.

Claims (10)

1. a LED bulb, comprise printing opacity cell-shell (20), the stem stem (30) of band lead-out wire (31) is provided with in described printing opacity cell-shell, described lead-out wire (31) is fixed with at least one LED (40), described LED (40) is connected with electric connector (60) by driver (50), described printing opacity cell-shell (20) and stem stem (30) seal, confined space is formed in printing opacity cell-shell (20) inside, it is characterized in that: described LED (40) comprises substrate (1), described substrate (1) is provided with multiple LED chip (10), the substrate that described substrate (1) is strip, described substrate (1) is provided with the fluting (5) that at least one length direction along substrate (1) extends, multiple LED chip (10) on described substrate (1) are by connecting line (11) series connection and/or parallel connection mutually.

2. LED bulb as claimed in claim 1, it is characterized in that: when described fluting (5) is for time multiple, multiple described fluting (5) is arranged along the length direction of described substrate (1) and width interval, and the substrate (1) of (5) both sides of slotting is equipped with LED chip (10).

3. LED bulb as claimed in claim 1, is characterized in that: described fluting (5) comprises along the length direction of substrate (1) multiple discontinuous manhole (51) spaced apart.

4. the LED bulb according to any one of claim 1-3, is characterized in that: described substrate (1) is polylith, is joined end to end successively between the plurality of substrate (1) by connecting elements (3).

5. LED bulb as claimed in claim 4, it is characterized in that: described connecting elements (3) comprises the non-conducting portion (31) connected by the end of adjacent substrate parcel, and be positioned at the current-carrying part (32) of non-conducting portion (31), the substrate that described non-conducting portion (31) connects with connecting elements (3) does not all contact, and the LED chip (10) on the substrate (1) that described current-carrying part (32) is connected with connecting elements (3) is electrically connected by connecting line (11).

6. the LED bulb according to any one of claim 1-3, it is characterized in that: at least one end of described substrate (1) is connected with electrode outlet line (2), is connected between described electrode outlet line (2) with substrate (1) by connecting elements (3) or connecting material.

7. the LED bulb according to any one of claim 1-3, it is characterized in that: the mid portion of described substrate (1) is provided with lead-in wire (6), described lead-in wire (6) is electrically connected to the LED chip (10) on substrate (1).

8. LED bulb as claimed in claim 1, is characterized in that: described substrate (1) is helix bar shaped substrate, and the spiral curve of substrate (1) has interval does not each other contact when same plane.

9. LED bulb as claimed in claim 8, is characterized in that: described substrate (2) is arc, waveform, or the bar shaped substrate that multiple polygon or circle are spliced to form.

10. LED bulb as claimed in claim 4, it is characterized in that: described connecting elements (3) is electrically connected with the LED chip (10) at least part of substrate (1) on multiple substrate (1), and described connecting elements (3) is electrically connected to lead-in wire (6), be connected to lead-out wire (31) by described lead-in wire (6).