CN104039079B - Integrated circuit board - Google Patents
Integrated circuit board Download PDFInfo
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- CN104039079B CN104039079B CN201410220254.4A CN201410220254A CN104039079B CN 104039079 B CN104039079 B CN 104039079B CN 201410220254 A CN201410220254 A CN 201410220254A CN 104039079 B CN104039079 B CN 104039079B
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Abstract
The integrated circuit board of the present invention, including insulated base material layer, in the upper of insulated base material layer, lower surface sets gradually line layer and insulating protective layer respectively, integrated circuit is formed on line layer, on, the junction point of vertical conducting is provided between the integrated circuit of the line layer of lower surface, the line layer of its upper and lower surface is made using aluminium foil, the integrated circuit of line layer need to fill the reserved pad position in position of patch electronics unit device, and on pad position, make the laminating layer of copper facing or nickel plating or coated copper or cladding nickel or its combination, pad position to insulating protective layer at formed airbreak window.The present invention realizes safely, effectively transmission signal and heat conduction, the integrated circuit board for radiating and making the service life of electronic devices and components longer, conducting scheme of the proposition in the two-layer integrated circuit layer of the surface mounted electronic devices and components and the two-sided integrated circuit board of aluminum of the surface mounted electronic devices and components of one side integrated circuit board and the two-sided integrated circuit board of aluminum of aluminum integrated circuit layer using two-sided aluminum line layer.
Description
Technical field
The present invention relates to a kind of LED circuit board, more specifically, more particularly to a kind of integrated circuit board.
Background technology
It is well known that the best several metals of electric conductivity are respectively silver, copper, gold, aluminum.Their resistivity is respectively
Silver-colored 1.586Lp2 × 10-8Ω .m, copper 1.678Lp2 × 10-8Ω .m, golden 2.4Lp2 × 10-8Ω .m, aluminum 2.6548Lp2 × 10-8
Ω.m.In electron trade, particularly in integrated circuit board industry, in the optimal metal of several electric conductivities of the above, high cost
High gold and silver are seldom used in integrated circuit board industry, although the little low cost of aluminum density, because aluminum is easily aoxidized, raw
Into aluminium oxide, and aluminium oxide is non-conductive, and the effect with integrated circuit board runs in the opposite direction, and the chemical characteristic of aluminum is also very unstable in addition
It is fixed, easily corroded by the material of acid or alkalescence, therefore aluminum is not used in integrated circuit board industry.
In the heat conduction function of metal, the heat conductivity W/ (m*K) of each metal is respectively silver 429, copper 401, gold 317, aluminum
237.Due to factors such as the light weight of aluminum, low price, sharp processing convenience, and become the preferred material of heat abstractor,
In the application of LED, the heat abstractor of most of LED lamp all adopts aluminum to make, and such as replaces the bulb lamp of electric filament lamp, replaces
T5, T8 fluorescent tube of fluorescent tube, replaces Ceiling light and flat lamp of lamp affixed to the ceiling etc..Its structure is substantially using in aluminum radiating dress
Reserved location is put, screw hole is processed, dress is posted into the integrated circuit board of LED lamp bead, is coated or is pasted adhesive-layer.It is first pre-
It is positioned on aluminum heat abstractor, then stamps screw fixed position, also has in industry and integrated circuit is changed to into PFC integrated circuit boards
, upper adhesive-layer is coated or pasted to the FPC integrated circuit boards that dress posts LED lamp bead, is affixed directly on aluminum heat abstractor, by
It is 23 in the thermal coefficient of expansion (10E-6/K) of aluminum, and the thermal coefficient of expansion of copper is 17.5, and the main material of FPC integrated circuit boards
For copper, using the LED lamp of FPC integrated circuit boards after thermal expansion shrinkage several times, FPC soft integrations circuit is dissipated with aluminum
Thermal is separated, and causes to use.
In current LED industry, solve LED lamp heat dissipation problem, reduces cost with reach family's use level and
Becoming more meticulous for LED lamp is made, lighting is with further improving product practical value and further reduces product cost, improve and use
It is pole need to solve in industry problem that popularity rate etc. is old successively.
In order to solve the problem points of above several respects, using PFC integrated circuit boards, with solve LED lamp become more meticulous it is light
Change, lighting problem makees integrated circuit board using aluminum, to solve, the coefficient of thermal expansion of integrated circuit board and LED heat abstractors is not
Consensus, while reducing the use of copper, reduce manufacturing cost.
As previously described, because the chemical characteristic of aluminum is very unstable, and easily produces nonconducting alumina layer, use
Aluminum manufactures integrated circuit board as material, it is necessary to which the problem of solution is how to fill to paste electronic devices and components and allow integrated in aluminium surface
The conducting between layers of wiring board.
The content of the invention
The technical problem to be solved in the present invention is the above-mentioned deficiency for prior art, and two-sided use aluminum line layer is in guarantor
Card safely, effectively transmission signal and heat conduction, radiating and electronic devices and components service life on the premise of realize effectively reducing
The technique effect of cost.The present invention proposes the surface mounted electronics unit device of the two-sided integrated circuit board in aluminum integrated circuit layer
The conducting scheme of the two-layer integrated circuit layer of part solution and the two-sided integrated circuit board of aluminum.
The technical scheme is that such：A kind of integrated circuit board, including insulated base material layer, in insulated base material layer
Upper and lower surface sets gradually line layer and insulating protective layer respectively, and integrated circuit, the line on upper and lower surface are formed on line layer
The junction point of vertical conducting is provided between the integrated circuit of road floor, wherein：The line layer of upper and lower surface is made using aluminium foil, line
The integrated circuit of road floor makes copper facing or nickel plating or cladding on the reserved pad position in position pad position that need to fill patch electronics unit device
Copper or cladding nickel or its combine laminating layer, pad position to insulating protective layer at formed airbreak window.
A kind of above-mentioned integrated circuit board, the integrated circuit surface of line layer be integrally provided with copper facing or nickel plating or coated copper or
The laminating layer of cladding nickel or its combination, in the optional position of integrated circuit, insulating protective layer is formed on the outside of laminating layer for pad position.
A kind of above-mentioned integrated circuit board, junction point are arranged in pad.
A kind of above-mentioned integrated circuit board, the corresponding insulated base material layer of junction point are communicated with the line layer on upper and lower surface
Via, the line layer of upper surface stretches downwards the line layer of contact lower surface along via, areal stretch formed it is recessed
The filling welding medium conducting in dress patch electronic component in hole.
A kind of above-mentioned integrated circuit board, the line layer and insulated base material layer of the corresponding upper surface of junction point are communicated with down
The via of the line layer on surface, the filling welding medium conducting in dress patch electronic component in via.
A kind of above-mentioned integrated circuit board, insulated base material layer are that glass fabric or Kapton or Merlon are thin
Film or mylar or ceramic material, its it is two-sided with adhesive-layer constitute, or pure tacky film adhesive-layer constitute, upper and lower surface
Line layer by adhesive-layer bonding be integrated.
A kind of above-mentioned integrated circuit board, via are extended downwardly and penetrate following line layer, the line layer of upper surface to
Under be stretched to lower surface line layer via in, its bottom contacts company with the sidewalls of the line layer of lower surface
Connect.
A kind of above-mentioned integrated circuit board, the line layer of upper surface stretch downwards the line layer of contact lower surface along via
Welded using conductive solder technique afterwards.
A kind of above-mentioned integrated circuit board, upper surface line layer stretch downwards the circuit that bottom forms die and lower surface
The via riveting of layer.
A kind of above-mentioned integrated circuit board, the line layer of the upper surface relative with via are provided with the via than insulating barrier
The little perforate in aperture, the hole edge via of perforate stretch downwards the line layer of contact lower surface.
A kind of above-mentioned integrated circuit board, is provided with one layer of conductive viscose layer or conducting solder layer along conducting wall surface of the hole, conductive
Adhesive-layer or conducting solder layer are all covered with or part making in whole via internal ring.Realize conducting wall surface of the hole effectively connection
Along the upper wiring layer of via stretching downwards.The upper wiring layer and lower line layer along via stretching downwards is connected after heating
The space of formation, can increase conducting sectional area and realize conduction superior technique effect.Conducting solder layer is by heating condition
It is allowed to fused to be integrated during 180 degree～280 degree, makes physical contact while conducting, realize the technique effect of sealing conducting.
A kind of above-mentioned integrated circuit board, integrated circuit board gross thickness are less than 800 microns；Wherein adhesive layer thickness is 6
Micron～150 microns, thickness of insulating layer are 10 microns～400 microns, and upper strata integrated circuit thickness degree is 6 microns～150 microns,
6 microns～400 microns of lower floor integrated circuit layer.
A kind of above-mentioned integrated circuit board, conductive solder technique are that tin cream is welded or laser welding or ultrasonic bonding.
Using the invention of above-mentioned technical proposal, by the two-sided insulating barrier with adhesive-layer and its top and bottom respectively by gluing
The line layer of upper and lower surface that layer bonding is integrated, the wherein line layer of upper and lower surface adopt aluminium, integrated made by aluminium
Need to fill the laminating layer of copper facing or nickel plating or coated copper or cladding nickel or its combination on patch electronics unit's device position on circuit, realize collection
The problem that the two-sided use aluminium of energy is simultaneously solved simultaneously on wiring board is how to fill to paste electronic devices and components and allow integrated in aluminium surface
The technical problem for turning between layers of wiring board.Its two-sided aluminium for using can meet power supply and signal transmission and heat conduction will
The carrier asked, and two-sided aluminium is effectively turned on, by being realized with good heat-conducting effect using aluminium and making two-sided making
Aluminium realizes effectively cost-effective technique effect while fully meeting use requirement.Wherein, two-sided band adhesive-layer
Insulating barrier open up via, connect with the line layer physics of lower surface along via stretching downwards by making the line layer of upper surface
Touch conducting.Effectively the production method of the upper and lower surface of conducting can reduce energy resource consumption with improve production efficiency, strengthen electric conductivity
Energy.Then upper and lower circuit is allowed using the filling welding medium conducting in dress patch electronic component in the pit that areal stretch is formed again
Layer and electronic component are permanently welded together, and form permanent conducting body, and then produce the sound integrated circuit of conduction property
Plate.The service life of wiring board is extended effectively.The present invention is especially suitable for the LED of flexible circuit is used.The present invention is adopted
PFC integrated circuit boards are used, is become more meticulous lighting with solving LED lamp, lighting problem makees integrated circuit board using aluminum, with
Solve, the coefficient of thermal expansion inconsistence problems of integrated circuit board and LED heat abstractors, while reducing the use of copper, reduce being manufactured into
This.
The basic structure procedure of processing of integrated circuit board of the present invention is：The processing conducting on the two-sided insulating barrier with adhesive-layer
Behind hole, upper and lower surface distinguishes laminating aluminium foil, with after method fabrication and processing integrated circuit known in industry in the integrated line in two sides
Road, makes copper facing or nickel plating or coated copper or cladding nickel or its pad for being bonded in the position that need to weld electronics unit device.So
Insulating protective layer is made in the line layer outer surface in addition to pad locations afterwards, insulating protective layer then forms airbreak in pad locations
Window be used for weld electronics unit device.Make the operation of copper facing or nickel plating or coated copper or cladding nickel or its pad being bonded
Can make after line layer outer surface makes the operation of insulating protective layer.Its fabrication processing can be reduced to：Insulating sticky
Glue-line processes via, and --- -- --- -- hot pressing --- -- traditional ink makes integrated circuit figure to insulation adhesive-layer cladded aluminum foil at two-sides
--- --- -- wireline inspection --- -- makes copper facing or nickel plating or coated copper or bag in the position that need to weld electronics unit device to shape for-corrosion
Cover --- -- insulating protective layer processing --- -- mark the processing --- -- molding of nickel or its pad for being bonded.In above-mentioned steps
The surface of the integrated circuit of line layer can also whole installation copper facing or nickel plating or coated copper or cladding nickel or its combine it is laminating
Layer, pad is in the optional position of laminating layer.Aluminum copper facing or aluminum nickel plating or aluminum coated copper or aluminum is adopted to coat nickel in above-mentioned steps
Manufacture operation and can be arranged in before printing ink to manufacture integrated graphics operation and make, or before insulating protective layer manufacturing procedure or
Make after insulating protective layer manufacturing procedure, or make after labelling manufacturing procedure, with the strong effect of motility.Above-mentioned plating
Copper, nickel plating process are made using the technique of chemical plating, reduce the use of conventional plating process.
The concrete scheme of the present invention is as follows：
(1) line layer in above-mentioned integrated circuit board is due to being two-sided employing aluminium foil, the line of the aluminium foil line layer of upper surface
Electronic devices and components are used as by the pad that aluminum copper facing or aluminum nickel plating or aluminum coated copper or aluminum cladding nickel make and veneer are filled to meet in road
The electronic devices and components dress patch of integrated circuit.When circuit integral manufacturing aluminum copper facing or aluminum nickel plating or aluminum coated copper or the aluminum bag of line layer
When covering nickel, pad can be in the optional position of laminating layer.
(2) above-mentioned integrated circuit board using aluminium foil make integrated circuit layer, be at the same play transmission of electricity and signal transmission and
Two functions of heat conduction.
(3) above-mentioned integrated circuit board is such as not required to heat conduction function, and its function is also complete and effective.
(4), in above-mentioned integrated circuit board, via is formed in the line layer of insulated base material layer and lower surface, the line of upper surface
Road floor is stretched along via downwards, its side wall forms contact conducting, and the line layer of lower surface can slightly be stretched out in its bottom
The via riveting of die and the line layer of lower surface is formed after lower surface.
(5) in above-mentioned integrated circuit board, the via of the aperture of the perforate of the line layer of upper surface than insulated base material layer
Aperture it is little, make base material when, to play the effect of inducing QI and upper and lower two-layer physical contact conducting, computational methods：Upper surface
Line layer perforate radius less than insulating barrier via radius deduct substrate layer thickness (set the thickness of insulating barrier as A,
The conducting pore radius of substrate layer is B, and the perforate of the line layer of upper surface is C, then C ＜ B-A) the line layer perforate of upper surface
As long as radius can meet the condition of " C ＜ B-A " exemplified as above just can, its size can be according to the glue of selected insulated base material layer
Selecting, without fixed requirement, if the perforate of the line layer of insulating layer perforating and upper surface is non-circular, perforate is big for viscous characteristic
It is little to meet condition exemplified as above, enable the line layer on upper and lower surface to contact conducting and just may be used.
(6) in above-mentioned integrated circuit board the line layer of its upper and lower two-layer conduction method, can also be in via
Orifice ring or inner hole wall make one layer of conductive viscose layer allows the line layer extrusion outside wall surface of upper surface to pass through conductive viscose and following table
The line layer in face is adhesively-bonded together to form conducting body.Conductive viscose layer can be that whole insulating barrier via internal ring is all covered with
, or part make conductive viscose, only need to meet function needs and just may be used.
(7), in above-mentioned integrated circuit board, the line layer of the upper and lower two-layer of the conducting that contacts can pass through the method shape of welding
Into conducting is permanently fixed, laser welding or ultrasonic bonding can be adopted.Leading when being arranged between such as tin cream conductive viscose layer
Electric welding technique is welded for tin cream.
(8) above-mentioned integrated circuit board, described insulated base material layer are the two-sided glass fabric with adhesive-layer or polyamides
Imines thin film or the material such as polycarbonate film or mylar or ceramics.
(9) insulated base material layer described in above-mentioned integrated circuit board can also be without glass fabric or Kapton
Or the pure tacky film of polycarbonate film or mylar etc..
(10) adhesive layer on the insulating barrier two sides described in above-mentioned integrated circuit board or pure tacky film insulating barrier, can lead
Heat, or athermanous, its heat conductivity can be depending on circuit board be required accordingly.
(11) line layer of upper surface can also be perforate at via, and the aperture of perforate is than the integrated line in upper strata
Road leads that passing hole exterior open cell is little, and which can fill weldering in its pit for being formed after connecing downwards the line layer for stretching contact lower surface
Cream is connect, the line layer on the upper and lower surface of sealing is played and is formed contact point, become permanent conducting body.
(12) line layer of upper surface along via stretch downwards the line layer of contact lower surface when the pit that formed in fill out
The welding medium for filling can be pre-charged with or the filling when dress pastes electronic component, realize saving operation and disposably turn on and solid
Envelope forms the purpose of permanent conduction.
(13) protective layer of the outer surface of the line layer on upper and lower surface can be protection film type, or insulation
Ink, the material such as paint and pure glue glued membrane.
(14) protective layer of the line layer outer surface on upper and lower surface, mentioned protecting film, dielectric ink, paint, pure glue
Film etc., can be heat-conducting type, or non-conductive type, and its heat conductivity can be set because of the requirement of integrated circuit board.
(15) protective layer of the line layer outer surface on upper and lower surface, mentioned protecting film, its material can be that polyamides is sub-
Amine thin film, or poly- carbonic acid thin film can also be mylars etc..
(16) above-mentioned integrated circuit board, the circuit made on the line layer of the line layer or lower surface of upper surface cause to be one less
Group or more than one group.Every group of integrated circuit includes positive pole and negative pole respectively.
(17) its preferred gross thickness of above-mentioned integrated circuit board is less than 800 microns, for the soft of less than 400 microns gross thickness
Property wiring board is more superior.
(18) the adhesive layer thickness of above-mentioned double-sided wiring board can be 6 microns～150 microns, preferably 10 microns～
100 microns.
(19) thickness of insulating layer of above-mentioned integrated circuit board is 10 microns～400 microns, and preferably 10 microns～250 is micro-
Rice；
(20) the aluminium foil line layer and copper facing aluminium foil or nickel plating aluminium foil or coated copper aluminum above above-mentioned integrated circuit board
The thickness of paper tinsel or cladding nickel aluminium foil is 6 microns～150 microns, preferably 10 microns～75 microns.
(21) thickness of the aluminium foil line layer below above-mentioned integrated circuit board is 6 microns～400 microns, and preferably 10 is micro-
Rice～300 microns.
(22) the upper wiring layer perforate described in above-mentioned integrated circuit board is less than base material via, after base material pressing, on
Line layer can be formed in lower line layer brought into physical contact and be turned on.
(23) above-mentioned integrated circuit board on the basis of two sandwich circuit boards for constituting in upper surface line layer or lower surface
The wiring board that line layer constitutes more than two-layer can be increased on line layer, between the line layer of corresponding increase and basic line layer
Relative set insulating barrier, its protective layer are then formed in corresponding outer surface.
It is of the invention compared with traditional integrated circuit board, calculate traditional integrated line by manufacture method well known in industry
The operation that road plate needs is 17 big basic operations, and the heat-conducting type dual platen of the present invention only needs eight basic operations, greatly
It is big to save the production time.In addition, traditional double-sided wiring board, it is necessary to use electroplating technology, to environmental concerns, collection is made
Must also be imaged using dry film into during line layer, cost intensive, and this double-sided wiring board, its operation is simplified, no electroplating technology,
Do not use dry film to be imaged, saved time and cost, reduce the destruction to environment.
Description of the drawings
Below in conjunction with the embodiment in accompanying drawing, the present invention is described in further detail, but does not constitute to the present invention
Any restriction.
Cross-sectional view when Fig. 1 is 1 encapsulation state of the specific embodiment of the invention；
Fig. 2 is the cross-sectional view after the completion of the specific embodiment of the invention 1 is encapsulated；
Cross-sectional view when Fig. 3 is 1 encapsulation state of the specific embodiment of the invention；
Fig. 4 is the cross-sectional view after the completion of the specific embodiment of the invention 1 is encapsulated；
Cross-sectional view when Fig. 5 is 1 further improvement project encapsulation state of the specific embodiment of the invention；
Cross-sectional view when Fig. 6 is 2 encapsulation state of the specific embodiment of the invention；
Cross-sectional view when Fig. 7 is 2 encapsulation state of the specific embodiment of the invention；
Fig. 8 is the cross-sectional view after the completion of the encapsulation of 2 further improvement project of the specific embodiment of the invention；
Cross-sectional view when Fig. 9 is 3 encapsulation state of the specific embodiment of the invention；
Figure 10 is the cross-sectional view after the completion of the specific embodiment of the invention 3 is encapsulated；
Figure 11 is the structural representation of the line layer of specific embodiment of the invention 1-3 upper surface.
In figure：Insulated base material layer 1, via 11, line layer 2, pit 22, die 23, insulating protective layer 3, electronics unit device
4, welding medium 5.
Specific embodiment
Embodiment 1, as shown in Fig. 1～5, Figure 11, a kind of two-sided integrated circuit board of the present invention, including insulated base material layer 1,
Line layer 2 and insulating protective layer 3 are set gradually respectively on the upper and lower surface of insulated base material layer 1, it is each on line layer 2 to form one
Group integrated circuit N, P, are provided with the junction point of vertical conducting between the integrated circuit of the line layer 2 on upper and lower surface, upper and lower surface
Line layer 2 is made using aluminium foil, and the integrated circuit of line layer 2 is reserved pad position and welded in the position that need to fill patch electronics unit device
Copper facing or nickel plating or coated copper or cladding nickel or its laminating layer 21 for combining are made on disk position, pad position to insulation protection
The window 31 of airbreak is formed at layer 3.Junction point is arranged on pad position central part.2 He of line layer of the corresponding upper surface of junction point
Insulated base material layer 1 is communicated with the via 11 of the line layer 2 of lower surface, the filling weldering in dress patch electronic component in via 11
Connect medium 5 to turn on.Insulated base material layer 1 is glass fabric or Kapton or polycarbonate film or mylar or pottery
Ceramic material, which is two-sided to be constituted with adhesive-layer, or the adhesive-layer of pure tacky film is constituted, and the line layer 2 of upper and lower surface is by viscous
Glue-line bonding is integrated.
As shown in figs. 34, the corresponding insulated base material layer of junction point 1 is communicated with the conducting of the line layer 2 on upper and lower surface
Hole 11, the line layer 2 of upper surface contact the line layer 2 of lower surface along the stretching downwards of via 11, in the recessed of areal stretch formation
The filling welding medium conducting in dress patch electronic component in hole 22.
In embodiment 1, the integral surface of the integrated circuit of line layer 2 is provided with copper facing or nickel plating or coated copper or cladding nickel
Or the laminating layer of its combination, pad position is formed on the outside of laminating layer in the optional position of integrated circuit, insulating protective layer 3.
Embodiment 2, as shown in fig. 6, on the basis of embodiment 1 or 2, the line layer of the upper surface relative with via 11
3 are provided with the perforate less than the via aperture of insulating barrier, the line of the lower surface of stretching contact downwards of hole edge via 11 of perforate
Road floor.
Embodiment 3, as shown in fig. 7, on the basis of embodiment 2, via 11 is extended downwardly and penetrates following line layer
3, the line layer 2 of upper surface is stretched in the via 11 of the line layer 2 of lower surface downwards, the circuit of its bottom and lower surface
11 sidewall contact of the via connection of layer 2.
Embodiment 4, as shown in Figure 9, Figure 10, on the basis of embodiment 4, upper surface line layer 2 stretches downwards bottom
Form 11 riveting of via of die 23 and the line layer 2 of lower surface.
On the basis of embodiment 1 or 2 or 3, the line layer 2 of upper surface is along the lower surface of stretching contact downwards of via 11
Welded using conductive solder technique after line layer 2.Conductive solder technique is laser welding or ultrasonic bonding.
As shown in Figure 5 and Figure 8, on the basis of embodiment 2 or 3, one layer of conductive viscose layer is provided with along 11 wall of via
12 or conducting solder layer, conductive viscose layer 12 or conducting solder layer are all to be covered with whole via internal ring or part makes.
Conductive solder technique is welded for tin cream.
The gross thickness of the integrated circuit board of above-described embodiment is less than 800 microns；Wherein adhesive layer thickness be 6 microns～
150 microns, thickness of insulating layer is 10 microns～400 microns, and upper strata integrated circuit thickness degree is 6 microns～150 microns, lower floor's collection
Into 6 microns～400 microns of line layer.
Can increase on the line layer of upper surface line layer or lower surface on the basis of two sandwich circuit boards of above-described embodiment
Plus line layer constitutes the wiring board of more than two-layer, relative set insulation between the line layer of corresponding increase and basic line layer
Layer, its protective layer are then formed in corresponding outer surface.
The present invention is in concrete production stage：
(1) according to the design data of double-sided wiring board, positioning is got out using digital control drilling machine on insulant 1 and is turned on
Hole 11；
(2) location hole is got out using same data on the aluminium foil 2 of top and bottom；
(3) insulant 1 for having been bored via and the aluminium foil 2 for having bored location hole, position in order and are placed on traditional pressure
Pressing and forming on conjunction machine or fast press, its pressing condition is：Pressure is 120KG/CM, and temperature is 180 DEG C ± 10 DEG C, pressing time
For 30～80 seconds, pressing post cure condition was 165 DEG C of ± 10 DEG C of X60min
(4) according to the design data of double-sided wiring board, using known method integration circuit in industry；
(5) outer surface laminating protection of the design data and location hole of foundation double-sided wiring board in double-deck integrated circuit layer
Layer, pad locations to insulating protective layer 3 at formed airbreak window.Pressure is 120KG/CM, and temperature is 180 DEG C ± 10
DEG C, pressing time is 30～80 seconds, and pressing post cure condition is 165 DEG C of ± 10 DEG C of X60min.
(6) copper facing or nickel plating or coated copper or cladding nickel or its pad for being bonded are made；
(7) reference lamina of double-sided wiring board makes；
(8) molding of double-sided wiring board, shipment.
Material selection：
(1) it is 75 microns from gross thickness, two-sided is respectively 25 microns with its thickness of 25 micron thickness adhesive layers
Kapton bores location hole and via as insulant, and via is a diameter of 1000 microns；
(2) aluminium foil above is 35 microns from thickness, bores the perforate at location hole and via, conducting according to design data
Opening diameter at hole is 600 microns；
(3) aluminium foil below from thickness be 150 microns with the polyimide film for boring via and 35 microns of aluminium foil
On pressing machine, positioning is pressed, and condition is:It is 185 DEG C that pressure is 120KG/CM temperature, and the time is 60 seconds, presses rear curing time
For 165 DEG C of X60min；
(4) rust-proof oil ink print two sides integrated circuit will be adopted after the base material for having pressed cleaning；
(5) integrated circuit corrosion；
(6) computer test of integrated circuit；
(7) the laminating polyimide type protecting film of integrated circuit two sides appearance, condition is:Pressure is 120KG/CM, and temperature is
180 DEG C, the time is 60 seconds, and condition of cure is 165 DEG C of X60min；
(8) copper facing or nickel plating or coated copper or cladding nickel or its pad for being bonded are made；
(9) make character marking；
(10) integrated circuit sheet metal forming.
Illustrate more than and can be seen that, traditional LED (integrated circuit board), based on well known manufacture method is come in industry
Calculate, its operation for needing is 17 big basic operations, and this novel heat-conducting type dual platen only needs eight basic operations, significantly
Save the production time.In addition, traditional double-sided wiring board, it is necessary to use electroplating technology, to environmental concerns, make integrated
Must also be imaged using dry film during line layer, cost intensive, and this integrated circuit board, its operation is simplified, no electroplating technology, no
It is imaged using dry film, has saved time and cost, reduces the destruction to environment.
In sum, the present invention makes actual sample and Jing is used for multiple times test such as description and diagramatic content, from making
Seen with the effect of test, the provable present invention can reach its desired purpose, and practical value is unquestionable.It is provided above
Embodiment is only used for the convenient illustration present invention, not makees any pro forma restriction, any affiliated technology neck to the present invention
Have usually intellectual in domain, if in the range of without departing from the carried technical characteristic of the present invention, using disclosed technology
The Equivalent embodiments that the done local of content is changed or modified, and without departing from the technical characteristic content of the present invention, still fall within
In the range of the technology of the present invention feature.
Claims (10)
1. a kind of integrated circuit board, including insulated base material layer (1), is set gradually respectively on the upper and lower surface of insulated base material layer (1)
Line layer (2) and insulating protective layer (3), form integrated circuit on line layer (2), the line layer (2) on upper and lower surface it is integrated
The junction point of vertical conducting is provided between circuit, it is characterised in that：The line layer (2) of upper and lower surface is made using aluminium foil, line
The integrated circuit of road floor (2) makes copper facing or nickel plating in the reserved pad position in position that need to fill patch electronic component and on pad position
Or coated copper or cladding nickel or its laminating layer (21) for combining, pad position to insulating protective layer (3) place form airbreak
Window (31), via (11) are extended downwardly and penetrate following line layer (2), and the line layer (2) of upper surface is stretched to down downwards
In the via (11) of the line layer (2) on surface, via (11) sidewall contact of the line layer (2) of its bottom and lower surface
Connection, upper surface line layer (2) stretch downwards the via (11) that bottom forms die (23) and the line layer (2) of lower surface
Riveting, the corresponding insulated base material layer of junction point (1) are communicated with the via (11) of the line layer (2) on upper and lower surface, on
Line layer (2) of the line layer (2) on surface along via (11) lower surface of stretching contact downwards, in the pit that areal stretch is formed
In dress patch electronic component when filling welding medium conducting.
2. a kind of integrated circuit board according to claim 1, it is characterised in that：The entirety of the integrated circuit of line layer (2)
Surface is provided with the laminating layer of copper facing or nickel plating or coated copper or cladding nickel or its combination, and pad position is in any position of integrated circuit
Put, insulating protective layer (3) is formed on the outside of laminating layer.
3. a kind of integrated circuit board according to claim 1, it is characterised in that：Junction point is arranged in pad position.
4. a kind of integrated circuit board according to claim 1, it is characterised in that：Insulated base material layer (1) is glass fabric
Or Kapton or polycarbonate film or mylar or ceramic material, which is two-sided with adhesive-layer composition, upper following table
The line layer (2) in face is integrated by adhesive-layer bonding.
5. a kind of integrated circuit board according to claim 1, it is characterised in that：Insulated base material layer (1) is by pure tacky film
Adhesive-layer is constituted, and the line layer (2) of upper and lower surface is integrated by adhesive-layer bonding.
6. a kind of integrated circuit board according to claim 1, it is characterised in that：The line layer (2) of upper surface is along via
(11) line layer (2) of the lower surface of stretching contact downwards is welded using conductive solder technique afterwards.
7. a kind of integrated circuit board according to claim 1, it is characterised in that：The manufacture method of the die is：First go up
Perforate on the line layer (2) on surface, the aperture of the perforate are less than the via (11) of insulating barrier, the upper table upper thread that perforate is located
Along via (11), stretching forms the line layer that die contacts lower surface to road floor (2) downwards.
8. a kind of integrated circuit board according to claim 1, it is characterised in that：One layer is provided with along via (11) wall to lead
Electric adhesive-layer (12) or conducting solder layer, conductive viscose layer (12) or conducting solder layer are all covered with whole via internal ring
Or part makes.
9. a kind of integrated circuit board according to claim 4, it is characterised in that：Integrated circuit board gross thickness is 800 microns
Below；Wherein adhesive-layer thickness is 6 microns～150 microns, and insulated base material layer (1) thickness is 10 microns～400 microns, upper strata collection
It is 6 microns～150 microns into line layer thickness, 6 microns～400 microns of lower floor integrated circuit layer.
10. a kind of integrated circuit board according to claim 6, it is characterised in that：Conductive solder technique be tin cream weld or
Laser welding or ultrasonic bonding, integrated circuit board is on the basis of two sandwich circuit boards for constituting in upper surface line layer or following table
The wiring board that line layer constitutes more than two-layer, the line layer of corresponding increase and basic line layer can be increased on the line layer in face
Between relative set insulating barrier, its protective layer is then formed in corresponding outer surface.
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| CN201410220254.4A CN104039079B (en) | 2013-12-01 | 2014-04-25 | Integrated circuit board |
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| CN201320894893 | 2013-12-01 | ||
| CN201320894893X | 2013-12-01 | ||
| CN201320894893.X | 2013-12-01 | ||
| CN201410220254.4A CN104039079B (en) | 2013-12-01 | 2014-04-25 | Integrated circuit board |
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| CN104039079B true CN104039079B (en) | 2017-03-29 |
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| WO2015100711A1 (en) * | 2014-01-02 | 2015-07-09 | 俞宛伶 | Printed circuit board structure with high thermal conductivity |
| CN104754862A (en) * | 2015-04-10 | 2015-07-01 | 松扬电子材料(昆山)有限公司 | Aluminum foil copper plating substrate for flexible circuit board and manufacturing method of aluminum foil copper plating substrate |
| CN105407638A (en) * | 2015-12-01 | 2016-03-16 | 杨小荣 | High-thermal-conductivity low-cost flexible circuit board and production method thereof |
| CN105430896B (en) * | 2015-12-29 | 2018-06-29 | 广东欧珀移动通信有限公司 | Flexible PCB and mobile terminal |
| CN206100596U (en) * | 2016-08-09 | 2017-04-12 | 王定锋 | Contain LED lamp band wire way matrix group that multi -functional aluminium foil was made |
| CN106413249A (en) * | 2016-08-09 | 2017-02-15 | 王定锋 | LED lamp band circuit board module containing multifunctional aluminum foil, and manufacturing method |
| CN110964935A (en) * | 2019-12-04 | 2020-04-07 | 江苏鼎胜新能源材料股份有限公司 | Manufacturing method of aluminum material with good corrosion resistance for new energy automobile circuit board |
| CN113853058A (en) * | 2021-10-25 | 2021-12-28 | 深圳市宝明科技股份有限公司 | A circuit board and method of making the same |
| CN119198535A (en) * | 2024-11-07 | 2024-12-27 | 苏州群策科技有限公司 | A method for detecting bonding force of blind holes in circuit boards |
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| CN104039079A (en) | 2014-09-10 |
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