CN201306682Y - Heat-dissipating LED module plate - Google Patents
Heat-dissipating LED module plate Download PDFInfo
- Publication number
- CN201306682Y CN201306682Y CNU2008200956621U CN200820095662U CN201306682Y CN 201306682 Y CN201306682 Y CN 201306682Y CN U2008200956621 U CNU2008200956621 U CN U2008200956621U CN 200820095662 U CN200820095662 U CN 200820095662U CN 201306682 Y CN201306682 Y CN 201306682Y
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- China
- Prior art keywords
- metallic plate
- heat sink
- sink part
- led module
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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- 239000000463 material Substances 0.000 claims description 31
- 238000003825 pressing Methods 0.000 claims description 16
- 239000004568 cement Substances 0.000 claims description 11
- 238000001746 injection moulding Methods 0.000 claims description 11
- 239000004411 aluminium Substances 0.000 claims description 10
- 229910052782 aluminium Inorganic materials 0.000 claims description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 229920006128 poly(nonamethylene terephthalamide) Polymers 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
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- 238000005530 etching Methods 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical group [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 238000007731 hot pressing Methods 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
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- 238000007747 plating Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 13
- 230000000694 effects Effects 0.000 abstract description 12
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- 230000017525 heat dissipation Effects 0.000 abstract description 2
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- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical group [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
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- 239000003365 glass fiber Substances 0.000 description 1
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- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
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- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model discloses a heat-dissipating LED module plate, which comprises a metal plate, a circuit board and a plastic part; wherein, the metal plate only retains the metal-plate heat sink part and dispenses with the rest part except the metal-plate heat sink part; the circuit board dispenses with the circuit-board heat sink part; the metal plate and the circuit board are pressed together and share the metal-plate heat sink part; and the plastic part is molded by injection around the metal-plate heat sink part. Consequently, the utility model has the advantages of quick heat dissipation, good lighting effect, simple production technique and low cost.
Description
Technical field
The utility model relates to the LED product scope, relates in particular to a kind of LED module group capable of radiating.
Background technology
LED (Light Emitting Diode, light emitting diode) is a kind of solid luminescence device of partly leading, the wafer that the core of LED is made up of P-type semiconductor and N-type semiconductor, when electric current when the anode of LED flows to negative electrode, semiconductor crystal just sends the light from purple to red different colours, and the power of its light is relevant with size of current.Because LED has advantages such as life-span length, energy-saving and environmental protection, therefore more and more obtain user's favor, LED is except obtaining extensive application in signal indication field at present, and it also is widely used at lighting field.
LED generally is encapsulated on the LED module plate by some led chips and forms; and existing LED module plate is mainly formed by aluminium base and circuit board pressing; electricly on this wiring board be connected with some led chips, use epoxy sealing around then, to play the effect of protecting inner led chip and bonding wire.In order being led chip resin in encapsulation can not to be overflow everywhere loose, also to be provided with an aluminium frame on the wiring board of LED module plate usually these led chips are surrounded simultaneously.Yet the aluminium mount structure that existing LED module plate adds is complex manufacturing cost height again not only, and radiating effect and light efficiency are all very general.
In summary, existing LED module plate obviously exists inconvenience and defective on reality is used, so be necessary to be improved.
The utility model content
At above-mentioned defective, the purpose of this utility model is to provide a kind of LED module group capable of radiating, and it has rapid heat dissipation, light efficiency is good, production technology is simple and low cost and other advantages.
To achieve these goals, the utility model provides a kind of LED module group capable of radiating, comprises metallic plate, wiring board and plastic parts, and described metallic plate keeps the heat sink part of metallic plate, and removes the remainder except the heat sink part of described metallic plate; Described wiring board is removed the heat sink part of wiring board; Described metallic plate and wiring board be pressing and the heat sink part of shared this metallic plate each other; Described plastic parts injection mo(u)lding is around the heat sink part of this metallic plate.
According to LED module group capable of radiating of the present utility model, correspondingly around the heat sink part of described metallic plate on described metallic plate and the wiring board be provided with some plastic cement hand-holes, described plastic cement hand-hole is that countersunk head is poroid, forms described plastic parts by injection moulding plastic material in described plastic cement hand-hole.
According to LED module group capable of radiating of the present utility model, described plastic parts by PA9T plastic material or the injection mo(u)lding of transparent PC plastic material.
According to LED module group capable of radiating of the present utility model, described metallic plate is copper coin or aluminium sheet.
According to LED module group capable of radiating of the present utility model, described metallic plate is removed remainder except the heat sink part of described metallic plate by etching mode, and on the described metallic plate etched thickness than the thick 0.05mm-0.08mm of thickness of described wiring board.
According to LED module group capable of radiating of the present utility model, described wiring board forms by do circuit on single face or two-sided FR-4 plate.
According to LED module group capable of radiating of the present utility model, plating or chemistry are coated with at least one high-thermal conductive metal layer on the surface of the heat sink part of described metallic plate.
According to LED module group capable of radiating of the present utility model, described high-thermal conductive metal layer is gold layer or silver layer.
According to LED module group capable of radiating of the present utility model, also be provided with immobilising PP film between described metallic plate and the wiring board, described immobilising PP film gong is vacated and the close opening of the heat sink portion size of described metallic plate, this opening is for the heat sink part of metallic plate of exposing described metallic plate, and successively described wiring board, immobilising PP film and metallic plate pressing are got up by hot pressing mode, and the heat sink part surface of the metallic plate of described metallic plate and this PCB surface are on same horizontal plane.
According to LED module group capable of radiating of the present utility model, the size of described immobilising PP film gong sky is than the big 0.3mm of the heat sink part of described metallic plate.
The utility model is removed the heat sink part of wiring board of wiring board by the heat sink part of the metallic plate that only keeps metallic plate, and described metallic plate and wiring board be pressing and the heat sink part of shared described metallic plate each other, thereby helps the faster heat radiation of LED module plate; And, the utility model is the injection mo(u)lding plastic parts around the heat sink part of described metallic plate, aluminium frame compared to existing technology, and the production technology of plastic parts is simpler and cost is lower, and plastic parts can also play translucent effect, thereby makes that the light efficiency of LED module plate is better.The PA9T plastic material can shape have a certain degree in injection moulding, the dispersion angle of control light.Transparent PC plastic material can allow the loss of light littler, and lighting angle is bigger.
Description of drawings
Fig. 1 is the front schematic view of the utility model LED module group capable of radiating;
Fig. 2 is the side schematic view of the utility model LED module group capable of radiating;
Fig. 3 is the cross sectional representation of the utility model LED module group capable of radiating;
Fig. 4 is the front schematic view of the preferred metallic plate of the utility model;
Fig. 5 is the manufacture method flow chart of the utility model LED module group capable of radiating;
Fig. 6 is the manufacture method flow chart of the preferred LED module group capable of radiating of the utility model.
The specific embodiment
In order to make the purpose of this utility model, technical scheme and advantage clearer,, the utility model is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the utility model, and be not used in qualification the utility model.
Fig. 1～Fig. 3 shows the structural representation of the utility model LED module group capable of radiating respectively, described LED module group capable of radiating 100 includes metallic plate 10, wiring board 20 and plastic parts 30 at least, the main effect of metallic plate 10 is heats that the fast Absorption led chip distributes, and simultaneously thermal conductance is gone out; Wiring board 20 mainly plays the effect of lead and insulation; Plastic parts 30 significant feature are to prevent that epoxy resin glue from overflowing in the led chip encapsulation, with convenient encapsulation, wherein:
Described metallic plate 10 only keeps the heat sink part 11 of metallic plate, and remove remainder except the heat sink part 11 of described metallic plate, preferably metallic plate 10 is removed remainder except the heat sink part 11 of metallic plate by etching mode, and on the metallic plate 10 etched thickness than the thick 0.05mm-0.08mm of thickness of wiring board 20.The heat sink part 11 of so-called metallic plate just is meant the part that is used to dispel the heat on the metallic plate 10.Described metallic plate 10 is preferably copper coin, and the material of described copper coin can be red metal, red copper or the oxygen-free copper etc. of C1100, and metallic plate 10 also can be an aluminium sheet etc. certainly.
Described wiring board 20 will be removed the heat sink part of wiring board.Wiring board 20 preferred materials of the present utility model are single face or two-sided FR-4 plate, form wiring board 20 by do circuit on this FR-4 plate.Described FR-4 is a kind of code name of flame resistant material grade, and the FR-4 grade material generally is that epoxy resin adds the composite that filler and glass fibre are made, and the FR-4 grade material has that cost is low, adhesion is good and advantage such as agent of low hygroscopicity.
Described metallic plate 10 and wiring board 20 be pressing and the heat sink part 11 of shared metallic plate each other, thereby helps the 100 faster heat radiations of LED module plate.In the described LED module plate 100 as shown in Figure 2, also can be provided with an immobilising PP (palypropylene, polypropylene) film 40 between metallic plate 10 and the wiring board 20, to guarantee in metallic plate 10 and wiring board 20 pressing effects each other.Described immobilising PP film 40 gongs are vacated and the close opening of heat sink part 11 sizes of described metallic plate, this opening is for the heat sink part 11 of metallic plate of exposing metallic plate 10, and successively described wiring board 20, immobilising PP film 40 and metallic plate 10 pressings are got up by the vacuum hotpressing mode, and the heat sink part of the metallic plate of described metallic plate 10 11 surfaces and wiring board 20 surfaces are on same horizontal plane.Preferably, the size of immobilising PP film 40 gong skies should be than about the heat sink part 11 big 0.3mm of metallic plate, to prevent immobilising PP film 40 excessive glue in the pressing process.Metallic plate 10 or wiring board 20 roughly are rectangle among Fig. 1～Fig. 4 of this paper, and in fact metallic plate 10 and wiring board 20 can also be designed to circle according to actual needs and wait other different shapes.Preferably, go back electrodepositable or chemistry on the surface of part 11 that described metallic plate is heat sink and be coated with at least one high-thermal conductive metal layer, so that have better radiating effect, described high-thermal conductive metal layer can be gold layer or silver layer.
Described plastic parts 30 injection mo(u)ldings are around the heat sink part 11 of described metallic plate.Described plastic parts 30 preferred PA9T (Polyamide9T by white, polyamide 9T) plastic material or transparent PC (Polycarbonate, Merlon) plastic material injection mo(u)lding can certainly be adopted other general plastic material such as Merlon, polyformaldehyde, polyphenylene oxide, polyester.The PA9T plastic material can shape have a certain degree in injection moulding, the dispersion angle of control light.Transparent PC plastic material can allow the loss of light littler, and lighting angle is bigger.As shown in Figure 4, described metallic plate 10 correspondence around the heat sink part 11 of metallic plate is provided with some plastic cement hand-holes 12, and on the wiring board 20 also correspondence be provided with some plastic cement hand-holes 12, as shown in Figure 2, described plastic cement hand-hole 12 is that countersunk head is poroid, by forming plastic parts 30 at described plastic cement hand-hole 12 injection moulding plastic materials.Aluminium frame compared to existing technology, the production technology of plastic parts 30 is simpler and cost is lower, and plastic parts 30 can also play translucent effect, thereby makes that the light efficiency of LED module plate 100 is better.
LED module group capable of radiating 100 of the present utility model can be for great power LED, the encapsulation of middle power LED and low-power LED.
Fig. 5 is the manufacture method flow chart of the LED module group capable of radiating that provides of the utility model, and it is used to make as Fig. 1～LED module group capable of radiating 100 shown in Figure 3, and described manufacture method comprises that at least step is as follows:
Step S501 keeps the heat sink part 11 of metallic plate of metallic plate 10, and removes the remainder except the heat sink part 11 of described metallic plate.The preferred etching mode that adopts etches away the heat sink part 11 of metallic plate 10 metallic plate remainder in addition.The present invention preferably with the other parts beyond the heat sink part of metallic plate 11 by etched mode, reduce about height 0.2mm, see also the height H among Fig. 2, purpose is to guarantee that wiring board 20 can guarantee on a similar high plane with the heat sink part 11 of metallic plate.And metallic plate 10 is preferably copper coin.
Step S502, the heat sink part of wiring board of removing wiring board 20.Wiring board 20 preferably forms by doing circuit on single face or the two-sided FR-4 plate.
Step S503, metallic plate 10 and wiring board 20 pressing each other, and described metallic plate 10 and the heat sink part 11 of wiring board 20 shared metallic plates, it helps the 100 faster heat radiations of LED module plate.
Step S504, injection moulding forms plastic parts 30 around the heat sink part 11 of described metallic plate.Preferably by the PA9T plastic material or the injection mo(u)lding of transparent PC plastic material of white, plastic parts 30 is mainly used in and prevents that anti-epoxy resin glue overflows in the led chip encapsulation described plastic parts 30.
Fig. 6 is the manufacture method flow chart of the preferred LED module group capable of radiating 100 of the utility model, and described manufacture method can comprise the steps:
Step S601 leaves some direction locating holes on certain thickness metallic plate 10, described metallic plate 10 can be copper coin or aluminium sheet.
Step S602; by the silk-screen mode heat sink part 11 usefulness acid-proof substances of the metallic plate of metallic plate 10 or alkali-proof substance are sealed; purpose is to guarantee etched the time; protect the smooth of the heat sink part 11 of metallic plate; make the height about heat sink part 11 of metallic plate and copper face formation 0.2mm, see also the height H among Fig. 2.Described acid-proof substances is preferably acid-proof ink, and described alkali-proof substance is preferably alkaline-resisting printing ink.So-called silk-screen is meant that doing mesh by the silk screen seal bites printing ink on stock.
Step S603 uses the acid and alkali-resistance material to seal at the direction locating hole and the back side of metallic plate 10, and described acid and alkali-resistance material is preferably the acid and alkali-resistance adhesive tape.
Step S604, for the metallic plate 10 of sealing the described direction locating hole and the back side, etch away the remainder of the heat sink part 11 of metallic plate that metallic plate 10 do not sealed by acid-proof substances or alkali-proof substance by acidic materials or alkaline matter, described acidic materials can be iron chloride, and described alkaline matter can be ammonium chloride.Generally speaking, just can reach the thickness that needs by etching repeatedly, and etched controllable thickness is built in about 0.15mm.Consider the side reason for corrosion, should be metallic plate 10 etched THICKNESS CONTROL in scope than the thick 0.05mm-0.08mm of thickness of wiring board 20.
Step S605 carries out circuit to form wiring board 20 on single face or two-sided FR-4 plate.The coefficient of expansion difference of considering wiring board 20 and metallic plate 10 is bigger, selects relatively thinner FR-4 plate as far as possible, makes wiring board 20 and metallic plate 10 more intense in the adhesion of vertical direction and horizontal direction.
Step S606, with need on the wiring board 20 to paste led chip the heat sink part of wiring board dash modes such as mill or computer gong with five metals and remove.
Step S607, one immobilising PP film 40 (is preferably Taiwan and joins the production of luxuriant company, thickness is about 0.08mm) with the mode of computer gong, gong is vacated and the close opening of heat sink part 11 sizes of metallic plate, and this opening is for the heat sink part 11 of metallic plate of exposing metallic plate 10.Preferably, the size of immobilising PP film 40 gong skies should be than about the heat sink part 11 big 0.3mm of metallic plate, to prevent immobilising PP film 40 excessive glue in the pressing process.
Step S608 removes the acid and alkali-resistance material that uses on the metallic plate 10, as adhesive tape.
Step S609 gets up by metallic plate 10 pressings that the vacuum hotpressing mode is good with ready-made wiring board 20, immobilising PP film 40 and etching successively.For the good material of pressing, part 11 that the metallic plate of metallic plate 10 is heat sink should be to be on the horizontal plane with wiring board 20 surfaces.
Step S610 electroplates on the surface of the heat sink part 11 of metallic plate or at least one high-thermal conductive metal layer of chemical plating by the Treatment of Metal Surface mode, so that have better radiating effect.Preferably, described high-thermal conductive metal layer is gold layer or silver layer.
Step S611 forms plastic parts 30 by injection machine injection moulding around the heat sink part 11 of metallic plate, and plastic parts 30 can be frame shape shown in Figure 1, also can be other shapes.Described plastic parts 30 can use industry white PA9T plastic material or the injection mo(u)lding of transparent PC plastic material commonly used.Particularly, on pressing good metallic plate 10 and wiring board 20, avoid circuit and around the heat sink part 11 of metallic plate, bore some plastic cement hand-holes 12, being used for injection moulding uses, the mode of boring preferably adopts countersunk head poroid, so that the glue of injection moulding can produce adhesion preferably with metallic plate 10 and wiring board 20.The injection moulding purpose comprises: be led chip can not to be overflow everywhere loose in encapsulation point glue; Can play simultaneously the effect of LED lens.
In summary, the utility model is removed the heat sink part of wiring board of wiring board by the heat sink part of the metallic plate that only keeps metallic plate, and described metallic plate and wiring board be pressing and the heat sink part of shared described metallic plate each other, thereby helps the faster heat radiation of LED module plate; And, the utility model is the injection mo(u)lding plastic parts around the heat sink part of described metallic plate, aluminium frame compared to existing technology, and the production technology of plastic parts is simpler and cost is lower, and plastic parts can also play translucent effect, thereby makes that the light efficiency of LED module plate is better.The PA9T plastic material can shape have a certain degree in injection moulding, the dispersion angle of control light.Transparent PC plastic material can allow the loss of light littler, and lighting angle is bigger.
Certainly; the utility model also can have other various embodiments; under the situation that does not deviate from the utility model spirit and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the utility model, but these corresponding changes and distortion all should belong to the protection domain of the appended claim of the utility model.
Claims (10)
1, a kind of LED module group capable of radiating is characterized in that, comprises metallic plate, wiring board and plastic parts, and described metallic plate keeps the heat sink part of metallic plate, and removes the remainder except the heat sink part of described metallic plate; Described wiring board is removed the heat sink part of wiring board; Described metallic plate and wiring board be pressing and the heat sink part of shared this metallic plate each other; Described plastic parts injection mo(u)lding is around the heat sink part of this metallic plate.
2, LED module group capable of radiating according to claim 1, it is characterized in that, correspondingly around the heat sink part of described metallic plate on described metallic plate and the wiring board be provided with some plastic cement hand-holes, described plastic cement hand-hole is that countersunk head is poroid, forms described plastic parts by injection moulding plastic material in described plastic cement hand-hole.
3, LED module group capable of radiating according to claim 2 is characterized in that, described plastic parts by PA9T plastic material or the injection mo(u)lding of transparent PC plastic material.
4, LED module group capable of radiating according to claim 1 is characterized in that, described metallic plate is copper coin or aluminium sheet.
5, LED module group capable of radiating according to claim 1, it is characterized in that, described metallic plate is removed remainder except the heat sink part of described metallic plate by etching mode, and on the described metallic plate etched thickness than the thick 0.05mm-0.08mm of thickness of described wiring board.
6, LED module group capable of radiating according to claim 1 is characterized in that, described wiring board forms by do circuit on single face or two-sided FR-4 plate.
7, LED module group capable of radiating according to claim 1 is characterized in that, plating or chemistry are coated with at least one high-thermal conductive metal layer on the surface of the heat sink part of described metallic plate.
8, LED module group capable of radiating according to claim 7 is characterized in that, described high-thermal conductive metal layer is gold layer or silver layer.
9, according to each described LED module group capable of radiating of claim 1～8, it is characterized in that, also be provided with immobilising PP film between described metallic plate and the wiring board, described immobilising PP film gong is vacated and the close opening of the heat sink portion size of described metallic plate, this opening is for the heat sink part of metallic plate of exposing described metallic plate, and successively described wiring board, immobilising PP film and metallic plate pressing are got up by hot pressing mode, and the heat sink part surface of the metallic plate of described metallic plate and this PCB surface are on same horizontal plane.
10, LED module group capable of radiating according to claim 9 is characterized in that, the size of described immobilising PP film gong sky is than the big 0.3mm of the heat sink part of described metallic plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200956621U CN201306682Y (en) | 2008-07-18 | 2008-07-18 | Heat-dissipating LED module plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2008200956621U CN201306682Y (en) | 2008-07-18 | 2008-07-18 | Heat-dissipating LED module plate |
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| Publication Number | Publication Date |
|---|---|
| CN201306682Y true CN201306682Y (en) | 2009-09-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2008200956621U Expired - Fee Related CN201306682Y (en) | 2008-07-18 | 2008-07-18 | Heat-dissipating LED module plate |
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| CN (1) | CN201306682Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101894833A (en) * | 2010-06-21 | 2010-11-24 | 深圳市瑞丰光电子股份有限公司 | LED module and LED lighting device |
| CN101901864A (en) * | 2010-06-23 | 2010-12-01 | 深圳市瑞丰光电子股份有限公司 | LED (Light-Emitting Diode) module and LED illumination device |
| CN108601111A (en) * | 2018-05-23 | 2018-09-28 | 深圳市新宜康科技股份有限公司 | The production method of the accurate controllable type fever tablet of size |
-
2008
- 2008-07-18 CN CNU2008200956621U patent/CN201306682Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101894833A (en) * | 2010-06-21 | 2010-11-24 | 深圳市瑞丰光电子股份有限公司 | LED module and LED lighting device |
| CN101901864A (en) * | 2010-06-23 | 2010-12-01 | 深圳市瑞丰光电子股份有限公司 | LED (Light-Emitting Diode) module and LED illumination device |
| CN108601111A (en) * | 2018-05-23 | 2018-09-28 | 深圳市新宜康科技股份有限公司 | The production method of the accurate controllable type fever tablet of size |
| CN108601111B (en) * | 2018-05-23 | 2021-02-12 | 深圳市新宜康科技股份有限公司 | Manufacturing method of heating sheet with accurate and controllable size |
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