CN104035534B - CPU (central processing unit) vacuum heat dissipation system - Google Patents

Abstract

The invention relates to a CPU vacuum cooling system, comprising a vacuum cavity (1), a radiator (2) and a digital temperature controller (3), the lower surface of the vacuum cavity (1) is sealed and connected to a PC mainboard (4), and the vacuum cavity (1) ) is provided with a CPU (5) and a semiconductor refrigeration chip (6), the upper surface of the CPU (5) is connected to the lower surface of the semiconductor refrigeration chip (6), the upper surface of the semiconductor refrigeration chip (6) is sealed and connected to the radiator (2), and the radiator (2) Set above the vacuum chamber (1), the air outlet of the vacuum chamber (1) is connected to the air inlet of the micro vacuum pump (8) through the airflow conduit (7), and the air outlet of the micro vacuum pump (8) is connected to the radiator (2) The air inlet, the miniature vacuum pump (8), and the semiconductor refrigeration chip (6) are respectively connected to the digital temperature controller (3) by a line, and the digital temperature controller (3) is connected to the SATA serial port (9) of the PC motherboard by a data line; the structure of the present invention Simple, stable work, high heat dissipation efficiency, avoiding the complex structure of the air-cooled heat dissipation system, and the phenomenon of damage to computer parts due to water leakage in the water-cooled heat dissipation system.

Description

A CPU vacuum cooling system

[technical field]

The invention relates to the technical field of central processing unit cooling devices, in particular to a CPU vacuum cooling system.

[Background technique]

The CPU is the core unit of the computer. If its heat dissipation is not good, it will be burned. In order to improve its working efficiency, its working temperature must be guaranteed. The existing method is to install a heat dissipation fan (ie, an air-cooled heat dissipation system) or to adopt a water-cooled heat dissipation system. Among them, it is well known that the cooling effect of the cooling fan is not satisfactory. Therefore, people pay more attention to the water cooling system.

The basic principle of the water-cooling system is: the water-cooling system has a water inlet and a water outlet, and there are multiple water channels inside the cooling system, so that the advantages of water-cooling can be fully utilized, and more heat can be taken away. A set of water cooling (liquid cooling) cooling system must have the following components: water block, circulating fluid, water pump, pipeline and water tank or heat exchanger.

Among them, the water cooling block is a metal block with a water channel inside, made of copper or aluminum, which is in contact with the CPU and will absorb the heat of the CPU, so the function of this part is the same as that of the air-cooled heat sink. The advantage is that the water block must have a water channel through which the circulating fluid passes and it is completely sealed, so as to ensure that the circulating fluid does not leak out and cause a short circuit of the electrical appliance. The function of the circulating fluid is similar to that of air, but it can absorb a large amount of heat without changing the temperature significantly. If the liquid is water, it is a well-known water cooling system. The role of the water pump is to push the circulating fluid to flow, so that the liquid that has absorbed the heat of the CPU will flow out of the water block on the CPU, and the new low-temperature circulating fluid will continue to absorb the heat of the CPU. The water pipe is connected to the water pump, the water cooling block and the water tank. Its function is to allow the circulating fluid to circulate in a closed channel without leakage, so that the liquid cooling system can work normally. The water tank is used to store the circulating fluid. The returning circulating fluid releases the heat of the CPU here, and the low-temperature circulating fluid flows into the pipeline again. If the heating power of the CPU is small, the large-capacity circulating fluid stored in the water tank can ensure the circulation of the circulating fluid. The temperature will not rise significantly. If the power of the CPU is large, a heat exchanger is needed to help dissipate the heat of the CPU. The heat exchanger here is similar to a heat sink, and the circulating fluid transfers heat to the heat sink with a large surface area. A fan on the heat sink removes heat from the incoming air. If it is a small closed liquid cooling system, the open water tank can be omitted to allow the liquid to flow back and forth between the water pump, water block and heat exchanger, so as to avoid the deterioration of the circulating liquid exposed to the air.

Therefore, although the water-cooled heat dissipation system reduces the number of fans, it also reduces the vibration and noise generated by the fans, and its heat dissipation effect is much higher than that of the air-cooled heat dissipation system. However, the water-cooling system has the following disadvantages: on the one hand, the equipment required for the water-cooling system is very large and occupies a certain space; on the other hand, the cost of the water-cooling system is higher than that of the air-cooling system. Moreover, because the structure of the water cooling system is more complex than that of the air cooling system, and an additional level of working fluid is added, the reliability is also poor. If the assembly process or materials are not good, water leakage will occur, and even the computer will be damaged. Components.

[Content of the invention]

The purpose of the present invention is to solve the above-mentioned deficiencies and provide a CPU vacuum heat dissipation system, which not only has simple structure, stable and reliable operation, high heat dissipation efficiency, but also avoids the complicated structure of the air-cooled heat dissipation system, and the water-cooled heat dissipation system damages the computer due to water leakage. The phenomenon of parts occurs.

Design a kind of CPU vacuum cooling system for realizing above-mentioned object, comprise vacuum chamber 1, radiator 2 and digital temperature controller 3, described vacuum chamber 1 lower surface is sealed and connected with PC motherboard 4, in described vacuum chamber 1, be provided with CPU5 and Semiconductor refrigeration chip 6, the upper surface of the CPU5 is connected to the lower surface of the semiconductor refrigeration chip 6, the upper surface of the semiconductor refrigeration chip 6 is sealed and connected to the radiator 2, the radiator 2 is arranged above the vacuum chamber 1, and the vacuum chamber 1 The air outlet is connected to the air inlet of the miniature vacuum pump 8 through the airflow conduit 7, and the air outlet of the miniature vacuum pump 8 is connected to the air inlet of the radiator 2 through the airflow conduit 7. A controller 3, the digital temperature controller 3 is connected to the SATA serial port 9 of the PC motherboard through a data line.

A thermal pad 10 is provided between the radiator 2 and the semiconductor cooling chip 6 , and the semiconductor cooling chip 6 is sealed and connected to the radiator 2 through the thermal pad 10 .

The bottom of the PC motherboard 4 is provided with a bottom bracket gasket 11 , the bottom bracket gasket 11 is placed on the bottom bracket 12 , and the PC motherboard 4 is sealed and connected to the vacuum chamber 1 through the bottom bracket gasket 11 .

A pressure sensor is provided in the vacuum chamber 1, and the pressure sensor is connected to a digital temperature controller 3 by a line.

The front of the digital temperature controller 3 is provided with a liquid crystal display, and the button control area on the liquid crystal display is connected with a semiconductor refrigeration chip 6, a miniature vacuum pump 8, a pressure sensor, and a SATA serial port 9 of the PC motherboard by lines.

The front of the digital temperature controller 3 is provided with a control button, and the control button is connected with a semiconductor refrigeration chip 6, a miniature vacuum pump 8, a pressure sensor, and a SATA serial port 9 of the PC motherboard by a line.

Compared with the prior art, the present invention has a novel and simple structure and a reasonable design. The upper surface of the CPU in the vacuum chamber is connected to the lower surface of the semiconductor refrigeration chip, while the upper surface of the semiconductor refrigeration chip is connected to the heat sink through a heat conduction pad, and the vacuum chamber is connected to the lower surface of the semiconductor refrigeration chip. The radiators form a circulation loop of vacuum pumping and gas heat dissipation, which effectively improves the heat dissipation effect; through the connection between the SATA serial port data of the PC motherboard and the digital temperature controller, the temperature of the semiconductor refrigeration chip and the vacuum in the CPU vacuum chamber can be directly controlled. degree, and control the pumping force of the micro-vacuum pump, so that the CPU vacuum chamber is relatively vacuum, which ensures that no condensation occurs in the refrigeration area in the refrigeration environment, and avoids harm to the electronic parts; in addition, the present invention can be manually or automatically The control method realizes the temperature control of the main chip of the PC host at 4°C to 35°C, and the work is stable and reliable, and the heat dissipation efficiency is high, so it is worthy of popularization and application.

[Description of drawings]

Fig. 1 is a structural representation of the present invention;

In the figure: 1. Vacuum cavity 2, radiator 3, digital temperature controller 4, PC motherboard 5, CPU 6, semiconductor cooling chip 7, airflow conduit 8, miniature vacuum pump 9, PC motherboard SATA serial port 10, thermal pad 11, bottom Holder gasket 12, bottom support.

[detailed description]

Below in conjunction with accompanying drawing, the present invention will be further described as follows:

As shown in accompanying drawing 1, the present invention comprises: vacuum chamber 1, radiator 2 and digital temperature controller 3, the lower surface of vacuum chamber 1 is sealed and connected with PC motherboard 4, is provided with CPU5 and semiconductor refrigeration chip 6 in vacuum chamber 1, CPU5 The upper surface is connected to the lower surface of the semiconductor refrigeration chip 6, and the upper surface of the semiconductor refrigeration chip 6 is sealed and connected to the radiator 2. The radiator 2 is arranged above the vacuum chamber 1, and the air outlet of the vacuum chamber 1 is connected to the air inlet of the micro vacuum pump 8 through the airflow conduit 7. The air outlet of the miniature vacuum pump 8 is connected to the air inlet of the radiator 2 through the airflow conduit 7, the miniature vacuum pump 8 and the semiconductor refrigeration chip 6 are respectively connected to the digital temperature controller 3 by a line, and the digital temperature controller 3 is connected to the SATA serial port 9 of the PC motherboard through a data line .

The invention connects the SATA serial port data of the PC motherboard with the digital temperature controller, thereby directly controlling the temperature of the semiconductor refrigeration chip and the vacuum degree in the CPU vacuum chamber; correspondingly controlling the pumping force of the micro-vacuum pump to make the CPU vacuum chamber relatively vacuum , and ensure that no condensation occurs in the cooling area in the cooling environment, which will cause harm to the electronic parts.

In the present invention, a heat conduction pad 10 is provided between the radiator 2 and the semiconductor refrigeration chip 6, and the semiconductor refrigeration chip 6 is sealed and connected to the heat sink 2 through the heat conduction pad 10; a bottom bracket gasket 11 is arranged below the PC motherboard 4, and the bottom bracket gasket 11 is placed on the bottom bracket 12, and the PC motherboard 4 is sealed and connected to the vacuum chamber 1 through the bottom support gasket 11; a pressure sensor is installed in the vacuum chamber 1, and the pressure sensor is connected to the digital temperature controller 3 by a line, so that the vacuum chamber 1 can be controlled The degree of vacuum inside and the temperature of the semiconductor refrigeration chip 6.

The invention can control the temperature of the main chip of the PC host at 4°C to 35°C, which is controlled by a digital temperature controller. The front of the digital temperature controller 3 is provided with a liquid crystal display and/or control buttons, and the key control area and/or control buttons on the liquid crystal display are all connected by lines to the semiconductor refrigeration chip 6, the miniature vacuum pump 8, the pressure sensor, the PC main board SATA serial port 9. Thereby two control modes of the present invention are realized, wherein, the manual control mode can control the temperature to be 4° C. to 35° C.; and the automatic control can keep the temperature in the range of 25° C.

The present invention is not limited by the above-mentioned embodiments, and any other changes, modifications, substitutions, combinations, and simplifications that do not deviate from the spirit and principles of the present invention should be equivalent replacement methods and are included in the present invention. within the scope of protection.

Claims (6)

1. a kind of CPU vacuum radiating systems, it is characterised in that：Including vacuum chamber (1), radiator (2) and digital temperature control (3), vacuum chamber (1) lower surface is tightly connected in PC mainboards (4), the vacuum chamber (1) and is provided with CPU (5) and quasiconductor system Cold core piece (6), CPU (5) upper surface connects semiconductor refrigeration chip (6) lower surface, on the semiconductor refrigeration chip (6) Face seal connection radiator (2), the radiator (2) is arranged on vacuum chamber (1) top, the gas outlet of the vacuum chamber (1) Minipump (8) air inlet is connected by airflow duct (7), minipump (8) gas outlet passes through airflow duct (7) The air inlet of connection radiator (2), the minipump (8), semiconductor refrigeration chip (6) are respectively by connection numeral temperature Degree controller (3), the digital temperature control (3) connects PC mainboards SATA serial ports (9) by data wire.

2. CPU vacuum radiating systems as claimed in claim 1, it is characterised in that：The radiator (2) and semiconductor refrigerating core Heat conductive pad (10) is provided between piece (6), the semiconductor refrigeration chip (6) is tightly connected radiator (2) by heat conductive pad (10).

3. CPU vacuum radiating systems as claimed in claim 2, it is characterised in that：It is close that PC mainboards (4) lower section is provided with collet Packing (11), the collet sealing gasket (11) is placed on bottom bracket (12), and the PC mainboards (4) are by collet sealing gasket (11) It is tightly connected vacuum chamber (1).

4. CPU vacuum radiating systems as claimed in claim 3, it is characterised in that：Pressure sensing is provided with the vacuum chamber (1) Device, the pressure transducer is by connection digital temperature control (3).

5. CPU vacuum radiating systems as claimed in claim 4, it is characterised in that：The front of the digital temperature control (3) LCDs are provided with, the button control zone in the LCDs is by connection semiconductor refrigeration chip (6), miniature true Empty pump (8), pressure transducer, PC mainboards SATA serial ports (9).

6. CPU vacuum radiating systems as described in claim 4 or 5, it is characterised in that：The digital temperature control (3) Front is provided with control knob, and the control knob is passed by connection semiconductor refrigeration chip (6), minipump (8), pressure Sensor, PC mainboards SATA serial ports (9).