CN103975189A - Side-emitting guidepipe technology on led lamp to make filament effect - Google Patents
Side-emitting guidepipe technology on led lamp to make filament effect Download PDFInfo
- Publication number
- CN103975189A CN103975189A CN201180075479.XA CN201180075479A CN103975189A CN 103975189 A CN103975189 A CN 103975189A CN 201180075479 A CN201180075479 A CN 201180075479A CN 103975189 A CN103975189 A CN 103975189A
- Authority
- CN
- China
- Prior art keywords
- light
- leg
- lamp
- light guide
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005516 engineering process Methods 0.000 title description 3
- 238000004891 communication Methods 0.000 claims abstract description 3
- 239000000463 material Substances 0.000 claims description 10
- 230000002349 favourable effect Effects 0.000 claims 1
- 238000001228 spectrum Methods 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K2/00—Non-electric light sources using luminescence; Light sources using electrochemiluminescence
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
- F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
- F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
- F21V3/08—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material comprising photoluminescent substances
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Planar Illumination Modules (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
灯(10)包括与散热器进行热传输的至少两个发光二极管(12、40)。还提供一种接收从发光二极管(12、40)所发射的光的半透明外壳(14)。光导(16)定位成接收从发光二极管的至少一个(12)所发射的光。光导(16)包括离开散热器朝外壳(14)的内部延伸的第一支柱以及相对于第一支柱成角度的发光第二支柱。第二支柱能够至少基本上垂直于灯(10)的纵轴。
A lamp (10) includes at least two light emitting diodes (12, 40) in heat communication with a heat sink. A translucent housing (14) receiving light emitted from the light emitting diodes (12, 40) is also provided. A light guide (16) is positioned to receive light emitted from at least one (12) of the light emitting diodes. The light guide (16) includes a first leg extending away from the heat sink towards the interior of the housing (14) and a light emitting second leg angled relative to the first leg. The second leg can be at least substantially perpendicular to the longitudinal axis of the lamp (10).
Description
背景技术 Background technique
包括发光二极管(LED)的固态照明技术长期以来一直被看作是产生具有比常规白炽灯要大的能量效率以及比常规紧凑荧光灯要少的不利环境影响的灯的方式。相应地,引入了使用固态照明技术的许多所谓改型灯。 Solid state lighting technology, including light emitting diodes (LEDs), has long been seen as a way to produce lamps with greater energy efficiency than conventional incandescent lamps and less adverse environmental impact than conventional compact fluorescent lamps. Accordingly, many so-called retrofit lamps using solid state lighting technology have been introduced.
但是,从客户的观点来看,这些固态改型灯的显著缺点在于,它们没有常规白炽灯的外观。此外,LED主要提供点源光分布。为了提供传统白炽灯泡的一般外观,涂层能够设置在灯壳上,以创建朗伯光分布(lambertian light distribution)。但是,没有创建灯丝生成光的传统白炽外观。对于意在替代常规烛台样式(candelabra-style)白炽灯的改型,情况尤其是这样。 However, a significant disadvantage of these solid state retrofit lamps from the customer's point of view is that they do not have the appearance of conventional incandescent lamps. Furthermore, LEDs primarily provide point source light distribution. To provide the general appearance of a traditional incandescent bulb, a coating can be provided on the lamp envelope to create a lambertian light distribution. However, the traditional incandescent look of filament-generated light is not created. This is especially the case for retrofits intended to replace conventional candelabra-style incandescent lamps.
发明内容 Contents of the invention
按照第一实施例,提供一种灯。该灯包括与散热器进行热传输的至少两个发光二极管。还提供一种接收从发光二极管所发射的光的半透明外壳。光导定位成接收从发光二极管的至少一个所发射的光。光导包括离开散热器朝外壳内部延伸的第一支柱以及相对于第一支柱成角度的发光第二支柱。第二支柱能够至少基本上垂直于灯的纵轴。 According to a first embodiment, a lamp is provided. The lamp includes at least two light emitting diodes in heat communication with a heat sink. A translucent housing that receives light emitted from the light emitting diode is also provided. A light guide is positioned to receive light emitted from at least one of the light emitting diodes. The light guide includes a first leg extending away from the heat sink toward the interior of the housing and a light emitting second leg that is angled relative to the first leg. The second leg can be at least substantially perpendicular to the longitudinal axis of the lamp.
按照第二实施例,提供一种包括至少基本上围绕光导的透明外壳的灯。光导包括第一支柱,其中第一端与发光二极管具有光接收关系。光导包括第二支柱,其相对于第一支柱成角度,并且定向成至少基本上垂直于灯的纵轴。第二支柱还包括使光从其中发射的元件。 According to a second embodiment, there is provided a lamp comprising a transparent envelope at least substantially surrounding a light guide. The light guide includes a first leg with a first end in light receiving relationship with the light emitting diode. The light guide includes a second leg angled relative to the first leg and oriented at least substantially perpendicular to the longitudinal axis of the lamp. The second strut also includes an element for emitting light therethrough.
附图说明 Description of drawings
图1是典型灯实施例的截面中的部分侧视图;以及 Figure 1 is a partial side view in section of a typical lamp embodiment; and
图2是图1的灯的截面中的部分顶视图。 FIG. 2 is a partial top view in section of the lamp of FIG. 1 .
具体实施方式 Detailed ways
现在参照图1和图2,灯组件10包括第一对发光二极管(LED)12,其设置在外壳14中。外壳14可由介电材料、例如聚合物或玻璃来形成。设想外壳14能够是透明或者半透明的。当预期传统烛台样式灯时,可选择透明形式。在外壳上包含光漫射涂层以创建光分布的更为朗伯样式时,选择半透明。LEDf12将光发射到光导16中。 Referring now to FIGS. 1 and 2 , a light assembly 10 includes a first pair of light emitting diodes (LEDs) 12 disposed within a housing 14 . Housing 14 may be formed from a dielectric material such as polymer or glass. It is contemplated that housing 14 could be transparent or translucent. Optional clear form when traditional candelabra style light is expected. Select Translucent when including a light-diffusing coating on the housing to create a more Lambertian style of light distribution. LED f12 emits light into light guide 16 .
光导能够是柱状结构,光线经过其通过全内反射来引导或传送。全内反射防止光从光导内侧传递到光导外侧。当光以比临界角要大的角照射于光导与围绕光导的大气之间的界面时,全内反射发生。临界角是光导的介质和周围大气的介质的折射率的函数。光导16能够由诸如玻璃、聚碳酸酯、丙烯酸或者其它适当塑料之类的透光材料来形成。 The light guide can be a columnar structure through which light is guided or transmitted by total internal reflection. Total internal reflection prevents light from passing from the inside of the light guide to the outside of the light guide. Total internal reflection occurs when light strikes the interface between the light guide and the atmosphere surrounding the light guide at an angle greater than the critical angle. The critical angle is a function of the refractive indices of the medium of the light guide and the medium of the surrounding atmosphere. Light guide 16 can be formed from a light transmissive material such as glass, polycarbonate, acrylic, or other suitable plastic.
在一个实施例中,光导包括附连端18,其具有限定包围LED 12的腔19的端壁,以基本上捕获LED所生成的全部光。附连端18与印刷电路板20(其上安装LED 12)紧密配合。印刷电路板提供到LED的电连接,并且能够是金属核印刷电路板(MCPCB),以提供散热。在这点上,散热能够只包括MCPCB或者其它典型放热装置,例如与MCPCB进行热传输的热耗散翼片。 In one embodiment, the light guide includes an attachment end 18 having an end wall defining a cavity 19 surrounding the LED 12 to capture substantially all of the light generated by the LED. Attachment end 18 is a snug fit with printed circuit board 20 on which LED 12 is mounted. The printed circuit board provides electrical connections to the LEDs and can be a metal core printed circuit board (MCPCB) to provide heat dissipation. In this regard, heat dissipation can include only the MCPCB or other typical heat dissipation devices, such as heat dissipating fins in heat transfer with the MCPCB.
透明环氧树脂21能够填充腔19,并且将光导管16的光附连端18固定到LED 12和电路板20,以及将光导16定向成接收发光二极管12所发射的光。光经过光导16、经由全内反射从附连端18传送到远程端24。光导16能够是整体注入模塑部件。为了从光导生成可见光,有可能将磷或其它波长转换材料与LED 12关联。备选地,将波长转换材料与光导管16关联是可选的。可预期光导管发射光具有大约2700K至10000K的范围中的色温度CCT。 Transparent epoxy 21 can fill cavity 19 and secure light attachment end 18 of light guide 16 to LED 12 and circuit board 20 and orient light guide 16 to receive light emitted by light emitting diode 12 . Light travels through the light guide 16 from the attachment end 18 to the remote end 24 via total internal reflection. The light guide 16 can be an integral injection molded part. In order to generate visible light from the light guide, it is possible to associate a phosphor or other wavelength converting material with the LED 12 . Alternatively, associating a wavelength converting material with light pipe 16 is optional. The light pipe emitting light is expected to have a color temperature CCT in the range of approximately 2700K to 10000K.
光导16的远程端24能够包括内部或外部反射条或者其它表面元件,其反射照射于表面元件的光。反射光的至少一部分以比光导-大气界面的临界角要小的角到达光导的外表面与周围大气之间的界面,从而允许光作为发射光从光导逸出。 The distal end 24 of the light guide 16 can include internal or external reflective strips or other surface elements that reflect light impinging on the surface elements. At least a portion of the reflected light reaches the interface between the outer surface of the light guide and the surrounding atmosphere at an angle less than the critical angle of the light guide-atmosphere interface, thereby allowing light to escape from the light guide as emitted light.
单独反射表面元件28的带或图案26能够设置在光导16的远程端24上。表面元件28可相互分离。表面元件28可印刷或者以其它方式附于光导16的外表面30。备选地,表面元件28可在光导16的内侧形成。 A strip or pattern 26 of individual reflective surface elements 28 can be provided on the distal end 24 of the light guide 16 . The surface elements 28 can be separated from each other. Surface elements 28 may be printed or otherwise affixed to outer surface 30 of light guide 16 . Alternatively, the surface elements 28 may be formed on the inside of the light guide 16 .
在一个实施例中,表面元件28反射照射于表面元件28的光。例如,经过光导16传送的光的至少一部分到达表面元件28,并且由表面元件28来反射或散射。由表面元件所反射的至少一部分可作为发射光32离开光导16。发射光32可沿灯纵轴34的横向的方向从光导16发出。当然,发射光32可沿多种方向从光导16发出。 In one embodiment, the surface elements 28 reflect light impinging on the surface elements 28 . For example, at least a portion of the light transmitted through light guide 16 reaches surface element 28 and is reflected or scattered by surface element 28 . At least a portion reflected by the surface elements may exit light guide 16 as emitted light 32 . Emitted light 32 may emerge from light guide 16 in a direction transverse to lamp longitudinal axis 34 . Of course, emitted light 32 may emerge from light guide 16 in a variety of directions.
表面元件28的图案26可沿光导远程端24的长度、按照形状和分布的一个或多个来设置,以便提供从光导16发出的光32的预期分布。发射光32可具有通过长度和投影角所限定的分布。长度表示沿光导16的远程端、在与横向轴38平行的方向、光32在纵轴的横向的方向从光导16发出的距离。投影角是光在光导16的表面上延伸的径向距离。在一个典型实施例中,分布角从大约30°延伸到大约330°(其中0°面向印刷电路板),以提供通常与白炽灯丝关联的光图案。 The pattern 26 of surface elements 28 may be arranged along the length of the light guide distal end 24 in one or more of shape and distribution to provide a desired distribution of light 32 emitted from the light guide 16 . The emitted light 32 can have a distribution defined by the length and the angle of projection. Length represents the distance along the distal end of light guide 16 that light 32 emanates from light guide 16 in a direction parallel to transverse axis 38 and transverse to the longitudinal axis. The projection angle is the radial distance that light extends over the surface of the light guide 16 . In a typical embodiment, the distribution angle extends from about 30° to about 330° (with 0° facing the printed circuit board) to provide the light pattern typically associated with an incandescent filament.
备选地,与成型元件相反,表面元件28可包括光透射元件,其具有与光导16的折射率不同的折射率。表面元件28与光导16之间的界面可改变全内反射所需的临界角。例如,表面元件28可具有增加光导16与表面元件28之间的界面处的临界角的折射率。增加临界角可减少光导16中内部反射的光量,并且可增加从光导16发出的光量。由表面元件28反射的光可经过表面元件28从光导16发出。例如,发出的折射光可在接近光导16的光导16的同一侧(其上设置表面元件28)上离开光导16。 Alternatively, surface elements 28 may comprise light transmissive elements having a different refractive index than that of light guide 16 , as opposed to shaped elements. The interface between surface element 28 and light guide 16 can change the critical angle required for total internal reflection. For example, surface element 28 may have an index of refraction that increases the critical angle at the interface between light guide 16 and surface element 28 . Increasing the critical angle reduces the amount of light reflected internally in the light guide 16 and increases the amount of light emitted from the light guide 16 . Light reflected by surface elements 28 may exit light guide 16 through surface elements 28 . For example, the emitted refracted light may exit the light guide 16 on the same side of the light guide 16 proximate to the light guide 16 on which the surface elements 28 are disposed.
通过控制表面元件28或图案26的大小和/或密度,可沿纵轴38控制发射光32的量。例如,光32可从光导16发出,使得不存在发射光32的强度的可感知梯度,或者它可设计成在接近纵轴34时作为横向轴38的强度的增加。 By controlling the size and/or density of surface elements 28 or patterns 26 , the amount of emitted light 32 can be controlled along longitudinal axis 38 . For example, light 32 may be emitted from light guide 16 such that there is no perceivable gradient in the intensity of emitted light 32 , or it may be designed to act as an increase in intensity in transverse axis 38 as longitudinal axis 34 is approached.
灯组件10还包括一对辅助LED 40,其设置在印刷电路板20上。LED 40发射光,其直接辐射到外壳14上。在一个实施例中,LED 40能够以第一辐射进行发射,以激励与外壳14关联的磷光材料42(或者其它光转换材料),供转换为预期可见光谱(例如白光)。备选地,磷光材料能够与LED 40直接关联,例如直接涂敷于其上。作为另一选项,应当利用多个彩色LED装置,其中每个的辐射光经过混合,以得到预期光谱输出(例如R-G-B混合以产生白光)。当然,灯并不局限于任何特定数量的辅助LED或者光导照射LED。电子封装(未示出)能够设置在连接器底座44中。 The lamp assembly 10 also includes a pair of auxiliary LEDs 40 disposed on the printed circuit board 20 . LED 40 emits light, which radiates directly onto housing 14 . In one embodiment, LED 40 is capable of emitting a first radiation to excite phosphorescent material 42 (or other light conversion material) associated with housing 14 for conversion into a desired visible spectrum (eg, white light). Alternatively, the phosphorescent material can be directly associated with the LED 40, eg coated directly thereon. As another option, multiple colored LED devices should be utilized where the radiated light from each is mixed to obtain the desired spectral output (eg R-G-B mixing to produce white light). Of course, the lamp is not limited to any particular number of auxiliary LEDs or light guide illumination LEDs. An electronic package (not shown) can be disposed in the connector mount 44 .
参照优选实施例描述了示范实施例。显而易见,通过阅读和理解前面的详细描述,修改和变更将是本领域的技术人员会想到的。预期示范实施例被理解为包括所有这类修改和变更,只要它们落入所附权利要求或其等效物的范围之内。 Exemplary embodiments have been described with reference to preferred embodiments. Obviously, modifications and alterations will occur to those skilled in the art upon reading and understanding the preceding detailed description. It is intended that the exemplary embodiments be understood to embrace all such modifications and alterations provided they come within the scope of the appended claims or their equivalents.
Claims (19)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2011/083943 WO2013086694A1 (en) | 2011-12-14 | 2011-12-14 | Side-emitting guidepipe technology on led lamp to make filament effect |
Publications (1)
Publication Number | Publication Date |
---|---|
CN103975189A true CN103975189A (en) | 2014-08-06 |
Family
ID=48611806
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201180075479.XA Pending CN103975189A (en) | 2011-12-14 | 2011-12-14 | Side-emitting guidepipe technology on led lamp to make filament effect |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP2791573A4 (en) |
KR (1) | KR20140097346A (en) |
CN (1) | CN103975189A (en) |
WO (1) | WO2013086694A1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104456223A (en) * | 2014-12-12 | 2015-03-25 | 欧普照明股份有限公司 | Lighting device and lamp |
CN104482437A (en) * | 2014-12-12 | 2015-04-01 | 欧普照明股份有限公司 | Lighting device |
CN105650497A (en) * | 2012-05-04 | 2016-06-08 | 通用电气照明解决方案有限责任公司 | Reflector and lamp comprised thereof |
CN110573791A (en) * | 2017-05-02 | 2019-12-13 | 昕诺飞控股有限公司 | Lighting fixtures and lamps |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015124469A1 (en) * | 2014-02-24 | 2015-08-27 | Koninklijke Philips N.V. | Lamp assembly |
US9702512B2 (en) | 2015-03-13 | 2017-07-11 | Cree, Inc. | Solid-state lamp with angular distribution optic |
US10172215B2 (en) | 2015-03-13 | 2019-01-01 | Cree, Inc. | LED lamp with refracting optic element |
US9909723B2 (en) | 2015-07-30 | 2018-03-06 | Cree, Inc. | Small form-factor LED lamp with color-controlled dimming |
GB2539190B (en) * | 2015-06-05 | 2021-02-03 | Graphene Lighting Plc | An LED light bulb |
EP3561367B1 (en) * | 2018-04-23 | 2020-12-02 | Xiamen Eco Lighting Co., Ltd. | Light apparatus with enlightened pattern |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004342411A (en) * | 2003-05-14 | 2004-12-02 | Sharp Corp | Illuminating device and illuminating system including the same |
US20050152141A1 (en) * | 2004-01-13 | 2005-07-14 | Nobuyuki Suzuki | LED lamp with light guide |
CN101107474A (en) * | 2004-09-29 | 2008-01-16 | 皇家飞利浦电子股份有限公司 | lighting device |
CN101922671A (en) * | 2010-04-30 | 2010-12-22 | 苏州京东方茶谷电子有限公司 | Adjustable-light allochroic bulb |
CN101956918A (en) * | 2010-09-21 | 2011-01-26 | 深圳安嵘光电产品有限公司 | LE D light guide plate bulb and manufacturing method thereof |
CN201992379U (en) * | 2010-12-10 | 2011-09-28 | 林学进 | Lighting device |
JP2013030418A (en) * | 2011-07-29 | 2013-02-07 | Mitsubishi Electric Lighting Corp | Lighting device |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1627178B1 (en) * | 2003-05-05 | 2018-11-07 | GE Lighting Solutions, LLC | Led-based light bulb |
CN100554766C (en) * | 2004-06-16 | 2009-10-28 | 奥斯兰姆施尔凡尼亚公司 | LED light lamp with light pipe |
US7600897B2 (en) * | 2007-09-05 | 2009-10-13 | Hua-Hsin Tsai | Light emitting unit having light source inside a lamp tube with ceramic fins |
US8506103B2 (en) * | 2008-11-26 | 2013-08-13 | Keiji Iimura | Semiconductor lamp and light bulb type LED lamp |
CN201326924Y (en) * | 2008-11-27 | 2009-10-14 | 佑浩股份有限公司 | Bulb structure |
US7976206B2 (en) * | 2008-12-17 | 2011-07-12 | U-How Co., Ltd. | Structure of light bulb |
CN201892080U (en) * | 2010-10-30 | 2011-07-06 | 潘家红 | LED bulb with light guide |
EP3653924B1 (en) * | 2010-12-22 | 2024-04-17 | Signify Holding B.V. | Lighting device |
CN202203686U (en) * | 2011-04-08 | 2012-04-25 | 浙江雄邦节能产品有限公司 | Light-emitting diode (LED) lamp bulb with light pipes |
-
2011
- 2011-12-14 EP EP11877255.7A patent/EP2791573A4/en not_active Withdrawn
- 2011-12-14 CN CN201180075479.XA patent/CN103975189A/en active Pending
- 2011-12-14 WO PCT/CN2011/083943 patent/WO2013086694A1/en active Application Filing
- 2011-12-14 KR KR1020147015899A patent/KR20140097346A/en not_active Ceased
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004342411A (en) * | 2003-05-14 | 2004-12-02 | Sharp Corp | Illuminating device and illuminating system including the same |
US20050152141A1 (en) * | 2004-01-13 | 2005-07-14 | Nobuyuki Suzuki | LED lamp with light guide |
CN101107474A (en) * | 2004-09-29 | 2008-01-16 | 皇家飞利浦电子股份有限公司 | lighting device |
CN101922671A (en) * | 2010-04-30 | 2010-12-22 | 苏州京东方茶谷电子有限公司 | Adjustable-light allochroic bulb |
CN101956918A (en) * | 2010-09-21 | 2011-01-26 | 深圳安嵘光电产品有限公司 | LE D light guide plate bulb and manufacturing method thereof |
CN201992379U (en) * | 2010-12-10 | 2011-09-28 | 林学进 | Lighting device |
JP2013030418A (en) * | 2011-07-29 | 2013-02-07 | Mitsubishi Electric Lighting Corp | Lighting device |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105650497A (en) * | 2012-05-04 | 2016-06-08 | 通用电气照明解决方案有限责任公司 | Reflector and lamp comprised thereof |
CN104456223A (en) * | 2014-12-12 | 2015-03-25 | 欧普照明股份有限公司 | Lighting device and lamp |
CN104482437A (en) * | 2014-12-12 | 2015-04-01 | 欧普照明股份有限公司 | Lighting device |
CN104482437B (en) * | 2014-12-12 | 2016-08-24 | 欧普照明股份有限公司 | A kind of illuminator |
CN110573791A (en) * | 2017-05-02 | 2019-12-13 | 昕诺飞控股有限公司 | Lighting fixtures and lamps |
Also Published As
Publication number | Publication date |
---|---|
WO2013086694A1 (en) | 2013-06-20 |
EP2791573A1 (en) | 2014-10-22 |
KR20140097346A (en) | 2014-08-06 |
EP2791573A4 (en) | 2015-07-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103975189A (en) | Side-emitting guidepipe technology on led lamp to make filament effect | |
JP5711147B2 (en) | Light source with LED, light guide and reflector | |
JP5815982B2 (en) | LED light bulb | |
KR101981717B1 (en) | Lighting device | |
CN204045629U (en) | Light-emitting device and lighting device | |
US9310052B1 (en) | Compact lens for high intensity light source | |
CN203215308U (en) | Lamp provided with lamp holder and luminaire | |
US20130083555A1 (en) | Lightung module and illuminant decice having the same | |
KR20110106919A (en) | An optical element having an LED, and a light source including the same | |
US9360190B1 (en) | Compact lens for high intensity light source | |
US9995439B1 (en) | Glare reduced compact lens for high intensity light source | |
JP2013219004A (en) | Led light tube for use in fluorescent lamp attachment tool | |
CN101988646A (en) | Lamp | |
TW201309964A (en) | Light bulb with thermal features | |
JP6217972B2 (en) | lighting equipment | |
US11519563B2 (en) | Light-emitting device | |
CN102971586A (en) | Lamp with a truncated reflector cup | |
CN103375714A (en) | LED Lighting Tubes for Fluorescent Lighting Fixtures | |
TWI408307B (en) | Led lamp | |
JP4492472B2 (en) | lighting equipment | |
KR101298576B1 (en) | A led lighting lens having a reflection surface and a led lighting device having thereof | |
JP6238199B2 (en) | lighting equipment | |
JP2014013706A (en) | Luminaire | |
CN103912804B (en) | Large angle light emitting diode (LED) lamp | |
CN102927458A (en) | Luminous lamp tube |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C12 | Rejection of a patent application after its publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140806 |