CN103947095A - Power converter - Google Patents

Abstract

The present invention provides a power conversion device in which the heat dissipation path of the heat-generating circuit components mounted on the substrate can be separated from the casing, and the heat can be efficiently dissipated to the cooling body, and the insulation of the heat-conducting member can be ensured. performance. The power conversion device includes: a semiconductor power module (11), one surface of the semiconductor power module (11) is bonded to the cooling body (3); The circuit components of the heating circuit components of the semiconductor power module; the heat conduction support member (33a), the heat conduction support member (33a) supports the mounting substrate through the heat conduction member (37); and the heat conduction path (33c), the The heat conduction path (33c) conducts the heat of the mounting substrate to the cooling body via the heat conducting support member, and the circuit components mounted on the mounting substrate are surface mount connection type circuit components (39).

Description

power conversion device

technical field

The present invention relates to a power conversion device. In the power conversion device, a semiconductor power module incorporating a semiconductor switching element for power conversion is supported with a predetermined interval on a semiconductor power module. Circuit components of heating circuit components of semiconductor switching elements. the

Background technique

As such a power conversion device, a power varying device described in Patent Document 1 is known. In this power conversion device, a water-cooling jacket is arranged in the casing, and a semiconductor power module is arranged on the water-cooling jacket to cool the semiconductor power module. The semiconductor power module has a built-in semiconductor switching element as a power conversion the IGBT. In addition, in the casing, a control circuit board is arranged at a predetermined distance on the opposite side of the semiconductor power module to the water-cooling jacket, and the heat generated by the control circuit board is conducted to the supporting control circuit board through the heat dissipation member. The metal bottom plate, and the heat conducted to the metal bottom plate is further conducted to the water-cooled jacket through the side wall of the housing supporting the metal bottom plate. the

Prior art literature

Patent Documents

Patent Document 1: Japanese Patent No. 4657329

Contents of the invention

The technical problem to be solved by the invention

However, in the conventional example described in the aforementioned Patent Document 1, the heat generated by the control circuit board is dissipated along the path of the control circuit board→radiation member→metal base plate→casing→water cooling jacket. Therefore, there is the following unsolved problem: that is, since the case is used as a part of the heat conduction path, the case is also required to have good thermal conductivity, so that the material is limited to a metal with high thermal conductivity, so when the small size is required In a power conversion device that reduces weight, it is difficult to achieve weight reduction because it is impossible to select a lighter material such as resin. the

In addition, for the shell, since it is required to be waterproof and dustproof in most cases, between the metal base plate and the shell, between the shell and the water-cooling jacket, a liquid sealant is generally applied or a rubber filler is sandwiched. things etc. Therefore, there is also an unsolved problem that liquid sealants or fillers made of rubber generally have low thermal conductivity, and sandwiching these materials in the thermal cooling path increases thermal resistance, resulting in a decrease in cooling efficiency. In order to solve this unresolved problem, it is also necessary to dissipate the heat generated by the substrate or the mounting components from the housing or the housing cover through natural convection. In order to increase the surface area of the housing or the housing cover, the housing or The outer shape of the case cover becomes larger, and the size of the power conversion device becomes larger. the

Also, since the heat of the control circuit board is transferred to the metal base plate via the heat dissipation member, there is an unsolved problem that the insulation performance of the heat dissipation member is lowered due to the influence of the lead wires of the circuit components mounted on the control circuit board. . the

Therefore, the present invention has been made focusing on the unsolved problems of the above-mentioned conventional examples, and an object of the present invention is to provide a cooling body capable of efficiently dissipating the heat of a heating circuit component mounted on a substrate and ensuring A power conversion device with insulating properties of a thermally conductive member. the

Technical solutions adopted to solve technical problems

In order to achieve the above object, a first aspect of the power conversion device according to the present invention includes: a semiconductor power module, one surface of which is bonded to a cooling body; A circuit component of a device, the heating circuit component drives the semiconductor power module; a heat conduction support member, which supports the mounting substrate through a heat conduction member; and a heat conduction path, which makes the mounting substrate The heat is conducted to the cooling body via the heat conducting support member. Furthermore, the circuit components mounted on the mounting substrate are surface mount connection type circuit components. the

According to such a configuration, heat generated by the heating circuit component mounted on the mounting substrate can be dissipated to the cooling body via the heat conduction support member through the heat conduction path, so that the heating circuit component can be efficiently dissipated. the

Furthermore, since the circuit component mounted on the mounting substrate is a surface mount connection type circuit component, no protrusions such as leads protrude toward the heat conduction member, and the insulation of the heat conduction member can be ensured. the

Furthermore, in a second aspect of the power conversion device according to the present invention, the heat transfer support member is formed of a metal material with high thermal conductivity. the

According to this configuration, since the heat transfer support member is made of a metal material such as aluminum, aluminum alloy, or copper with high thermal conductivity, it is possible to more effectively dissipate heat to the cooling body. the

Furthermore, in a third aspect of the power conversion device according to the present invention, the heat conduction member is formed of any one of a thermally conductive insulator and a thermally conductive stretchable elastic body. the

According to such a structure, since a thermally-transfer member consists of an insulator, it can reliably perform insulation between a mounting board|substrate and a thermally-transfer supporting member. In addition, since the heat conduction member is made of a thermally conductive and stretchable elastic body, the heat conduction member has stretchability, so the heat conduction member can be brought into contact with the surroundings of the heating components mounted on the mounting board, thereby increasing the temperature. The contact area improves the heat dissipation effect. the

In addition, in a fourth aspect of the power conversion device according to the present invention, the heat transfer member is formed of a thermally conductive elastic body that is compressed by the mounting substrate and the heat transfer support plate portion. fixed in the state. the

According to such a configuration, the heat conduction member is formed of a thermally conductive stretchable elastic body, and the elastic body is fixed while being compressed by the mounting substrate and the heat conduction support plate portion. the

Furthermore, in a fifth aspect of the power conversion device according to the present invention, a gap adjustment member for determining a compressibility of the elastic body is provided between the mounting substrate and the heat transfer support plate portion. the

According to such a configuration, the compressibility of the elastic body can be determined by the gap adjusting member, and the compressibility of the elastic body can be easily adjusted to a predetermined value. the

In addition, a sixth aspect of the power conversion device according to the present invention includes: a semiconductor power module in which one surface of the semiconductor power module is bonded to a heat sink; and a mounting board on which a circuit including a heating circuit component is mounted. a component, the heating circuit component drives the semiconductor power module; a thermally conductive support member, which supports the mounting substrate through a thermally conductive member; and a heat conduction path, which allows heat of the mounting substrate to pass through The heat conduction supporting member conducts conduction to the cooling body. In addition, the circuit component mounted on the mounting substrate is a circuit component having a soldering lead and the soldering lead is soldered, at least between the heat conduction member and the heat conduction support member and the solder lead The part corresponding to the insertion position holds the electrical insulation member. the

According to such a configuration, heat generated by the heating circuit component mounted on the mounting substrate can be dissipated to the cooling body via the heat conduction support member through the heat conduction path, so that the heating circuit component can be efficiently dissipated. the

Also, even when the soldering leads of the circuit components protrude from the mounting substrate into the heat conduction member, insert and form an opening, and the opening expands due to vibration, etc., and further forms a space in the heat conduction member, resulting in a decrease in insulation performance , since the electric insulating member is sandwiched at least in the region corresponding to the insertion region of the soldering lead of the circuit component, the electric insulating member can be used to compensate for the decline in the insulating performance of the heat conducting member, and finally the required insulation can also be ensured performance. the

Furthermore, a seventh aspect of the power conversion device according to the present invention includes: a semiconductor power module in which a semiconductor switching element for power conversion is built in a casing, and a power conversion device is formed on one surface of the casing. a cooling member in contact with the cooling body; a mounting substrate mounted with circuit components including a heating circuit component that drives the semiconductor switching element; and a heat-conducting support member having at least It has a heat conduction support plate portion that supports the mounting substrate via a heat conduction member, forms a heat conduction path independent of a case surrounding both the semiconductor power module and the mounting substrate, and is in contact with the cooling body. In addition, the circuit component mounted on the mounting substrate is a circuit component having a soldering lead and the soldering lead is soldered, at least between the heat conduction member and the heat conduction support plate part and the soldering The portion corresponding to the insertion position of the lead wire holds the electrical insulation member. the

According to this configuration, as in Embodiment 1 above, the heat generated by the heating circuit components mounted on the mounting board can be dissipated to the cooling body via the heat conduction supporting member independent of the case, so that the heating circuit components can be effectively dissipated. . In this case, since a plurality of heat conduction paths are formed between the mounting substrate and the cooling body independently of the casing surrounding both the semiconductor power module and each mounting substrate, it is possible to form heat transfer paths without considering the thermal conductivity of the casing. housing, which can increase the degree of freedom in design. the

Also, even when the soldering leads of the circuit components protrude from the mounting substrate into the heat conduction member, are inserted to form an opening, and the opening expands due to vibration, etc., thereby forming a space in the heat conduction member, resulting in a decrease in insulation performance. , since at least the electrical insulation member is clamped on the area corresponding to the insertion area of the soldering lead of the circuit component, the electrical insulation member can be used to compensate for the decline in the insulation performance of the heat-conducting member, and finally the required insulation can also be ensured performance. the

Furthermore, in an eighth aspect of the power conversion device according to the present invention, the electrical insulating member is formed in a region opposite to a soldering lead insertion region of the circuit component in a range wider than the soldering lead insertion region. the

According to this configuration, since the electrical insulation member is formed over a larger range than the soldering lead insertion range of the circuit component, it is possible to compensate for a decrease in insulation performance due to insertion of the soldering lead into the heat conducting member, thereby reliably ensuring necessary insulation performance. the

In addition, in a ninth aspect of the power conversion device according to the present invention, the heat transfer support member is formed of a metal material with high thermal conductivity. the

According to such a configuration, since the heat transfer support member is made of a metal material such as aluminum, aluminum alloy, or copper having high thermal conductivity, heat radiation to the cooling body can be more effectively performed. the

Furthermore, in a tenth aspect of the power conversion device according to the present invention, the heat conduction member is formed of any one of a thermally conductive insulator and a thermally conductive stretchable elastic body. the

According to such a structure, if a heat conduction member is comprised with an insulator, insulation can be reliably performed between a mounting board|substrate and a heat conduction support member. In addition, if the heat conduction member is made of a thermally conductive and stretchable elastic body, so that the heat conduction member has stretchability, the heat conduction member can be brought into contact with the surroundings of the heat-generating components and the like mounted on the mounting substrate, thereby increasing the temperature. The contact area improves the heat dissipation effect. the

Furthermore, according to an eleventh aspect of the power conversion device according to the present invention, the heat transfer member is formed of a thermally conductive elastic body that is supported by the mounting substrate and the heat transfer support plate portion. Fixed in compressed state. the

According to this structure, since the elastic body is fixed in a state where the elastic body is compressed by the mounting substrate and the heat-conducting support plate, it can be in better contact with the heat-generating components mounted on the mounting substrate, thereby improving heat dissipation. Effect. the

Furthermore, in a twelfth aspect of the power conversion device according to the present invention, a gap adjusting member for determining a compressibility of the elastic body is provided between the mounting substrate and the heat transfer support plate portion. the

According to such a configuration, the compressibility of the elastic body can be determined by the gap adjusting member, and the compressibility of the elastic body can be easily adjusted to a predetermined value. the

Invention effect

According to the present invention, since the heat generated by the mounting board on which the circuit components including the heat-generating circuit components are mounted is dissipated to the cooling body through the heat-conducting path through the heat-conducting support plate portion, thermal resistance can be suppressed and thermal cooling with high cooling efficiency can be performed. the

Comparing domestic products, by setting the circuit components mounted on the mounting substrate as surface mount connection type circuit components, it is possible to reliably prevent protrusions such as leads from being inserted into the heat-conducting member, thereby reliably ensuring the contact between the heat-conducting member and the heat-conducting support plate. Insulation properties between. the

In addition, even in the case where the circuit components mounted on the mounting board are configured to have soldering leads, by sandwiching the electrical insulating member between the heat-conducting member and the heat-conducting support plate portion, even if protrusions such as soldering leads are inserted into the heat-conducting member, the When the insulation performance of the heat conduction member is lowered, the electrical insulation member can also compensate for the decline in the insulation performance, so that the required insulation performance can be ensured. the

Description of drawings

FIG. 1 is a cross-sectional view showing the overall configuration of Embodiment 1 of a power conversion device according to the present invention. the

FIG. 2 is an enlarged cross-sectional view showing a main part of Embodiment 1. FIG. the

3 is a cross-sectional view showing an example of a control circuit unit mounted with circuit components. the

4 is an enlarged cross-sectional view showing a specific structure in a state where a mounting substrate is mounted. the

FIG. 5 is a diagram illustrating a method of mounting a mounting substrate on a heat transfer support member. the

6 is a cross-sectional view showing a state in which a mounting substrate is mounted on a heat transfer support member. the

FIG. 7 is a cross-sectional view showing a modified example of the heat transfer plate portion. the

FIG. 8 is a diagram illustrating a heat dissipation path of a heating circuit component. the

Fig. 9 is a diagram showing a state where vertical vibration or lateral shaking is applied to the power conversion device. the

10 is a cross-sectional view showing another example of a control circuit unit mounted with circuit components. the

11 is a cross-sectional view showing a modified example of the cooling member of the semiconductor module. the

Detailed ways

Hereinafter, embodiments of the present invention will be described with reference to the drawings. the

FIG. 1 is a cross-sectional view showing the overall structure of a power conversion device according to the present invention. the

In the figure, reference numeral 1 is a power conversion device, and the power conversion device 1 is accommodated in a casing 2 . The casing 2 is molded from a synthetic resin material, and is composed of a lower casing 2A and an upper casing 2B that are vertically divided across a cooling body 3 having a water-cooling jacket structure. the

The lower case 2A is constituted by a bottomed square cylinder. The open upper portion of the lower case 2A is covered with a cooling body 3 , and a film capacitor 4 is accommodated therein. the

The upper casing 2B includes a square cylinder 2a with open upper and lower ends, and a cover 2b closing the upper end of the square cylinder 2a. Furthermore, the lower end of the square cylinder 2a is closed by the cooling body 3 . Although not shown in the figure, between the lower end of the square cylinder 2 a and the cooling body 3 , there is a seal material coated with a liquid sealant or interposed with a rubber filler or the like. the

The cooling water supply port 3 a and the drain port 3 b of the cooling body 3 are opened to the outside of the casing 2 . The water supply port 3a and the water discharge port 3b are connected to a cooling water supply source (not shown) via a flexible hose, for example. The cooling body 3 is formed, for example, by injection molding aluminum or an aluminum alloy having high thermal conductivity. In addition, the lower surface of the cooling body 3 is a flat surface, and a square frame-shaped peripheral groove 3d is formed on the remaining portion of the upper surface except the central portion 3c. Furthermore, an insertion hole 3 e for vertically inserting positive and negative connection terminals 4 a covered with insulation of film capacitor 4 held by lower case 2A is formed in cooling body 3 . the

Referring also to FIG. 2 , it can be seen that the power conversion device 1 includes a semiconductor power module 11 incorporating, for example, an insulated gate bipolar transistor (IGBT) as a semiconductor switching element constituting a power conversion such as an inverter circuit. In this semiconductor power module 11 , an IGBT is built in a flat rectangular parallelepiped insulating box 12 , and a cooling member 13 made of metal is formed on the lower surface of the box 12 . In the case 12 and the cooling member 13 , when viewed from the upper surface, insertion holes 15 for inserting fixing screws 14 as fixing members are formed at four corners. In addition, on the upper surface of the case 12 , board fixing portions 16 having a predetermined height are protrudingly formed at four places inside the insertion hole 15 . the

On the upper end of the substrate fixing portion 16, a drive circuit substrate 21 on which a drive circuit and the like for driving the IGBT built in the semiconductor power module 11 are mounted is fixed. Further, above the drive circuit board 21, a control circuit board 22, which is a mounting board, is fixed at a predetermined interval. The control circuit board 22 includes a heating circuit component that controls the IGBT built in the semiconductor power module 11 and is mounted thereon. For control circuits, etc., the heating circuit components generate relatively large amounts of heat, or have relatively high heat generation densities. Further, above the control circuit board 22, a power circuit board 23 serving as a mounting board on which power supply is mounted to the IGBT built in the semiconductor power module 11 and including heating circuit components is fixed at a predetermined interval. power circuit, etc. the

And, as shown in FIG. 2, the drive circuit substrate 21 is fixed by inserting the external thread portion 24a of the engaging screw 24 into the insertion hole 21a formed at the position facing the substrate fixing portion 16, and then The external thread portion 24 a is screwed to the internal thread portion 16 a formed on the upper surface of the substrate fixing portion 16 . the

In addition, the control circuit board 22 is fixed by inserting the external thread portion 25a of the engaging screw 25 into the insertion hole 22a formed at the upper end of the engaging screw 24 at a position opposite to the internal thread portion 24b, and then The externally threaded portion 25 a is screwed into the internally threaded portion 24 b of the joint screw 24 . the

And, the power circuit board 23 is fixed by inserting the fixing screw 26 into the insertion hole 23a formed at the position facing the internal thread portion 25b at the upper end of the engaging screw 25, and then engaging the fixing screw 26 with the screw 25. The internal thread portion 25b of the screw 25 is screwed together. the

As shown in FIG. 4 , a heating circuit component 27 a is installed on the lower surface side of the control circuit board 22 that is in contact with the heat-conducting member 35 described later, and a surface mount connection is installed on the upper surface side opposite to the heat-conducting member 35 . Type circuit components 27b. This surface mount connection type circuit component 27b is electrically connected to the control circuit board 22 through the solder layer 28 formed on the lower surface. Therefore, in the surface mount connection type circuit component 27b, there is no soldering lead as a protrusion protruding to the lower surface side through the through hole formed in the control circuit board 22 as in the lead connection type circuit component described later. Therefore, as will be described later, it is possible to prevent the following problem: that is, when the heat transfer member 35 is compressed at a compression rate of 5 to 30% as described later, protrusions are inserted into the heat transfer member 35 and appear on the heat transfer member 35. Open holes, which are enlarged due to vibration, etc., and spaces are formed on the layer of the thermally conductive member, resulting in a decrease in insulation performance. the

Similarly, heating circuit components 39 a are mounted on the lower surface side of the power circuit board 23 that is in contact with the heat conduction member 37 described later, and a surface mount connection type circuit is mounted on the upper surface side opposite to the heat conduction member 37 . Component 39b. the

In addition, the control circuit board 22 and the power circuit board 23 are supported such that heat dissipation paths for heat dissipation to the cooling body 3 are formed by the heat conduction support members 32 and 33 . These thermally conductive support members 32 and 33 are formed of a metal having high thermal conductivity such as aluminum, aluminum alloy, copper, or the like. the

The heat conduction support member 32 is composed of a heat conduction support plate portion 32a on a flat plate and a heat conduction support side plate portion 32c. As seen from FIG. The right end side of the long side of the semiconductor power module 11 . Furthermore, the heat transfer support side plate portion 32 c is connected to a common square frame-shaped bottom plate portion 34 arranged in the circumferential groove 3 d of the cooling body 3 . the

The control circuit board 22 is fixed to the heat conduction support plate portion 32 a with a fixing screw 36 via a plate-shaped heat conduction member 35 . The heat conduction member 35 is made of a stretchable elastic body and has the same external dimensions as the power circuit board 23 . As the thermally conductive member 35 , a material having improved thermal conductivity by sandwiching a metal filler inside the silica gel can be used. the

In addition, as shown in FIG. 2 , the heat conduction support side plate portion 32c is a connecting plate portion that is integrally connected with the outer edge of the long side of the common bottom plate portion 34 disposed in the peripheral groove 3d of the cooling body 3 and extends upward. 32d, and an upper plate portion 32e extending leftward from the upper end of the connecting plate portion 32d, the heat conduction support side plate portion 32c has a reverse L-shaped cross section. The connection plate portion 32 d extends upward through the right side surface on the long side of the semiconductor power module 11 . the

The heat conduction support member 33 is composed of a heat conduction support plate portion 33a on a flat plate and a heat conduction support side plate portion 33c. As seen from FIG. The left end side of the long side of the semiconductor power module 11 . Furthermore, the heat conduction support side plate portion 33c is connected to the common bottom plate portion 34 . the

The power supply circuit board 23 is fixed to the heat conduction support plate portion 33 a with a fixing screw 38 via the same heat conduction member 37 as the heat conduction member 35 described above. the

In addition, as shown in FIGS. 2 and 3 , the heat conduction support side plate portion 33 c is integrally connected with the outer edge of the long side of the common bottom plate portion 34 arranged in the peripheral groove 3 d of the cooling body 3 and extends upward. The connecting plate portion 33d and the upper plate portion 33e extending leftward from the upper end of the connecting plate portion 33d are formed, and the heat conduction support side plate portion 33c has a reverse L-shaped cross section. The connection plate portion 33 d extends upward through the left side surface on the long side of the semiconductor power module 11 . the

Then, the connection part which connects the bottom plate part 34 and the upper plate part 33e of the connection plate part 33d is formed in the cylindrical curved surface. Thus, by forming the connecting portion between the connecting plate portion 33d and the bottom plate portion 34 and the upper plate portion 33e as a cylindrical curved surface, it is possible to relax the connection between the connecting plate portion 33d and the connecting plate portion 33d when vertical vibration or lateral vibration is transmitted to the power conversion device 1 . The stress generated at the connecting portion of the bottom plate portion 34 and the upper plate portion 33e is concentrated, so that the vibration resistance against vertical vibrations, lateral vibrations, and the like can be improved. the

And, by forming the connecting portion of the connecting plate portion 33d, the bottom plate portion 34, and the upper plate portion 33e as a cylindrical curved surface, the connecting portion of the connecting plate portion 33d, the bottom plate portion 34, and the upper plate portion 33e is formed at right angles. Compared with the L-shaped case, the heat conduction path can be shortened. Thus, efficient heat cooling can be realized by shortening the heat conduction path from the heat conduction support plate portion 33 a to the cooling body 3 . the

In addition, as shown in FIGS. 4 and 5 , heating circuit components 39 a are mounted on the lower surfaces of the control circuit board 22 and the power circuit board 23 . the

And, as shown in FIG. 4 , the control circuit board 22 and the power circuit board 23 are connected to the heat transfer members 35 , 37 and the heat transfer support plate portions 32 a , 33 a. The connections between the control circuit board 22 and the power circuit board 23 and the heat conduction support plate parts 32a and 33a are substantially the same except that the left and right sides are reversed. Therefore, the power circuit board 23 and the heat conduction support plate part 33a are represented. to explain. the

In the connection between the power circuit board 23 and the heat transfer support plate portion 33a, as shown in FIGS. 40. The washer 40 is temporarily fixed by adhesion or the like to the outer peripheral side of the female thread portion 41 formed on the heat transfer support plate portion 33 a and into which the fixing screw 38 is screwed. Here, the heat transfer plate portion management height H of the gasket 40 is set so that the compression ratio of the heat transfer member 37 becomes about 5 to 30%. Thus, by compressing the heat transfer member 37 to about 5 to 30%, it is possible to reduce thermal resistance and exhibit an efficient heat transfer effect. the

On the other hand, an insertion hole 37 a into which the joint screw 25 can be inserted and an insertion hole 37 b into which the washer 40 can be inserted are formed in the heat conduction member 37 . the

And, the heat conduction member 37 is placed on the heat conduction support plate portion 33a so that the gasket 40 temporarily fixed to the heat conduction support plate portion 33a is inserted into the insertion hole 37b, and the power circuit board 23 is placed on the heat conduction support plate portion 33a , so that the heating circuit component 39a is in contact with the heat conducting member 37 . the

In this state, the fixing screw 38 is passed through the insertion hole 23 b of the power circuit board 23 , and further passed through the center opening of the washer 40 to be screwed to the internal thread portion 41 of the heat transfer support plate portion 33 a. Then, tighten the fixing screw 38 until the upper surface of the heat conducting member 37 is substantially consistent with the upper surface of the washer 40 . the

Therefore, by compressing the heat transfer member 37 at a compression rate of about 5 to 30%, the thermal resistance can be reduced, and an efficient heat transfer effect can be exhibited. At this time, since the compressibility of the heat conduction member 37 is managed according to the height H of the gasket 40 , fastening can be appropriately performed without occurrence of insufficient fastening or excessive fastening. the

Furthermore, the heat-generating circuit component 39 a mounted on the lower surface side of the power circuit board 23 is embedded in the heat-conducting member 37 by utilizing the elasticity of the heat-conducting member 37 . Therefore, the contact between the heating circuit components 39a and the heat conduction member 37 can be neither insufficient nor excessive, so that the heat conduction member 37 can be in good contact with the power circuit board 23 and the heat conduction support plate portion 33a, thereby enabling The thermal resistance between the heat conduction member 37 and the power circuit board 23 and the heat conduction support plate part 33a is reduced. the

In addition, since the surface mount type circuit components 39b are mounted on the upper surface side of the power circuit board 23 opposite to the heat conduction member 37, there is no via formed on the power circuit board 23 like the wire connection type circuit components. through-holes and protrude to the solder leads on the bottom surface side. Thereby, there will be no problem that the soldering wire is inserted into the heat conduction member 37 to cause a hole, and the opening is enlarged due to the influence of vibration or the like, and a space is formed in the layer of the heat conduction member 37, thereby deteriorating the insulation performance. the

The control circuit board 22 and the heat conduction support plate part 32a are also connected via the heat conduction member 35 similarly to the above. the

In addition, as shown in FIGS. 2 and 3 , on the common bottom plate portion 34 of the heat conduction support members 32 and 33 , a fixing member is formed at a position opposite to the insertion hole 15 of the semiconductor power module 11 where the fixing screw 14 is inserted. Insert the hole 34a. Furthermore, an elastic member 45 is interposed between the upper surface of the bottom plate portion 34 and the lower surface of the cooling member 13 formed in the semiconductor power module 11 . the

Next, the fixing screw 14 is inserted into the insertion hole 15 of the semiconductor power module 11 and the cooling member 13 and the fixing member insertion hole 34a of the bottom plate portion 34, and the fixing screw 14 is screwed to the internal thread portion 3f formed on the cooling body 3. Together, the semiconductor power module 11 and the bottom plate portion 34 are fixed on the cooling body 3 . the

Next, a method of assembling the power conversion device 1 of the above-mentioned embodiment will be described. the

First, in FIG. 5, as described above, the power supply circuit board 23 is overlapped with the heat conduction support plate portion 33a of the heat conduction support member 33 via the heat conduction member 37, and the heat conduction member 37 is compressed at a compression rate of about 5 to 30%. In this state, the power supply circuit board 23 , the heat conduction member 37 , and the heat conduction support plate portion 33 a are fixed with the fixing screws 38 , whereby the power supply circuit unit U3 is formed in advance. At this time, since the surface mount connection type circuit component 39 b is mounted on the upper surface side of the power circuit board 23 as described above, there are no soldering leads protruding to the lower surface side of the power circuit board 23 . Accordingly, when the thermally conductive member 37 is compressed at a compression ratio of about 5 to 30%, it is possible to reliably prevent the insulation performance of the thermally conductive member 37 from being reduced due to the conductive elongated protrusions. When an object is inserted into the heat conduction member 37 , openings appear, and the openings are enlarged due to the influence of vibration or the like, and space portions are formed in the layers of the heat conduction member, thereby reducing the insulation performance of the heat conduction member 37 . the

Similarly, the control circuit board 22 is overlapped with the heat conduction support plate portion 32a of the heat conduction support member 32 through the heat conduction member 35, and the heat conduction member 35 is controlled by the fixing screw 36 in a state where the heat conduction member 35 is compressed at a compression ratio of about 5 to 30%. The circuit board 22, the heat conduction member 35, and the heat conduction support plate part 32a are fixed, and the control circuit unit U2 is previously formed by this. At this time, since the surface mount connection type circuit component 27 b is mounted on the upper surface side of the control circuit board 22 as described above, there are no soldering leads protruding to the lower surface side of the control circuit board 22 . Accordingly, when the heat transfer member 35 is compressed at a compression ratio of about 5 to 30%, it is possible to reliably prevent the insulation performance of the heat transfer member 37 from being lowered due to the conductive elongated protrusions. When an object is inserted into the heat conduction member 35 , openings appear, and the openings are enlarged due to the influence of vibration or the like, and space portions are formed in the layers of the heat conduction member, thereby reducing the insulation performance of the heat conduction member 37 . the

On the other hand, with the elastic member 45 sandwiched between the upper surface of the bottom plate portion 34 shared by the heat conduction support members 32 and 33 and the lower surface of the cooling member 13 formed in the semiconductor power module 11, by the fixing screw 14, The bottom plate portion 34 is fixed together with the semiconductor power module 11 in the circumferential groove 3 d of the heat sink 3 . the

In addition, before or after fixing the semiconductor power module 11 to the heat sink 3 , the drive circuit board 21 is placed on the board fixing portion 16 formed on the upper surface of the semiconductor power module 11 . Then, the drive circuit board 21 is fixed to the board fixing portion 16 from above the drive circuit board 21 with four fastening screws 24 . Then, the heat conduction support plate part 32a and the heat conduction support side plate part 32c are connected with the fixing screw 32b. the

Then, the control circuit board 22 of the control circuit unit U2 is placed on the upper surface of the joint screws 24 and fixed by four joint screws 25 . Next, the power circuit board 23 of the power circuit unit U3 is placed on the upper surface of the joint screw 25 and fixed by four fixing screws 26 . Then, the heat conduction support plate portion 33a is connected to the heat conduction support side plate portion 33c with the fixing screw 33b. the

Afterwards, as shown in FIG. 1 , the bus bar 50 is connected to the positive and negative DC input terminals 11 a of the semiconductor power module 11 , and the positive and negative connection terminals 4 a of the film capacitor 4 passing through the cooling body 3 are connected to the other terminal of the bus bar 50 by fixing screws 51 . connected at one end. Furthermore, the crimp terminal 53 fixed to the tip of the connection wire 52 connected to the external rectifier (not shown) is fixed to the DC input terminal 11 a of the semiconductor power module 11 . the

Furthermore, the bus bar 55 is connected to the three-phase AC output terminal 11 b of the semiconductor power module 11 by fixing screws 56 , and a current sensor 57 is disposed in the middle of the bus bar 55 . Then, the crimp terminal 59 fixed to the tip of a motor cable 58 connected to an external three-phase motor (not shown) is fixed and connected to the other end of the bus bar 55 with a fixing screw 60 . the

Thereafter, the lower case 2A and the upper case 2B are fixed to the lower surface and the upper surface of the cooling body 3 through a sealing material, and the assembly of the power conversion device 1 is completed. the

In this state, while DC power is supplied from an external rectifier (not shown), the power circuit mounted on the power circuit board 23 and the control circuit mounted on the control circuit board 22 are in an operating state, and the control circuit is connected via the mounted circuit board. The drive circuit on the drive circuit substrate 21 supplies a gate signal, such as a pulse width modulation signal, to the semiconductor power module 11 . Thereby, the IGBT built in the semiconductor power module 11 is controlled, and the DC power is converted into AC power. The converted AC power is supplied from the three-phase AC output terminal 11 b to the motor cable 58 via the bus bar 55 to drive and control a three-phase motor (not shown). the

At this time, the IGBT built in the semiconductor power module 11 generates heat. Since the cooling member 13 formed on the semiconductor power module 11 is in direct contact with the central portion 3 c of the cooling body 3 , the generated heat is cooled by cooling water supplied from the cooling body 3 . the

On the other hand, the control circuit and the power circuit mounted on the control circuit board 22 and the power circuit board 23 include heating circuit components 27a and 39a, and these heating circuit components 27a and 39a generate heat. At this time, the heating circuit components 27 a and 39 a are mounted on the lower surface sides of the control circuit board 22 and the power circuit board 23 . the

And, on the lower surface side of the control circuit board 22 and the power circuit board 23, the thermally conductive support plate portions 32a and 33a of the thermally conductive supporting members 32 and 33 are provided via the thermally conductive members 35 and 37 having high thermal conductivity and elasticity. the

Therefore, the contact area between heating circuit components 27a and 39a and heat conducting members 35 and 37 becomes large and they are in close contact with each other, so the thermal resistance between heating circuit components 27a and 39a and heat conducting members 35 and 37 becomes small. Therefore, the heat generated by the heating circuit components 27 a and 39 a can be efficiently conducted to the heat conduction members 35 and 37 . In addition, since the thermal conduction members 35 and 37 are compressed at a compression rate of about 5 to 30%, the thermal conductivity of the thermal conduction members 35 and 37 themselves is improved, and therefore, as shown in FIG. The heat at 37 is efficiently conducted to the heat conduction support plate portions 32 a and 33 a of the heat conduction support members 32 and 33 . the

Moreover, since the heat conduction support plate portions 32a and 33a are connected to the heat conduction support plate portions 32c and 33c, the heat conducted to the heat conduction support plate portions 32a and 33a can be conducted to the common heat conduction support plate portions 32c and 33c. Bottom plate portion 34 . Since the bottom plate portion 34 is in direct contact with the inside of the peripheral groove 3 d of the cooling body 3 , the conducted heat is dissipated to the cooling body 3 . the

Then, the heat transferred to the bottom plate portion 34 is conducted from the upper surface side of the bottom plate portion 34 to the cooling member 13 of the semiconductor power module 11 via the elastic member 45, and is conducted to the central portion 3c of the cooling body 3 via the cooling member 13, and then Heat dissipation. the

Therefore, according to the above-mentioned embodiment, since the heat generated by the heating circuit components 27a and 39a mounted on the control circuit board 22 and the power circuit board 23 can be directly transferred to the heat conducting members 35 and 37 without passing through the control circuit with a large thermal resistance. Therefore, the substrate 22 and the power circuit substrate 23 can efficiently dissipate heat. the

Then, the heat conducted to the heat conduction members 35 and 37 is conducted to the heat conduction support plate portions 32a and 33a, and further to the heat conduction support side plate portions 32c and 33c. At this time, the heat conduction support side plate portions 32 c and 33 c are provided along the long sides of the semiconductor power module 11 . the

Therefore, the heat transfer area can be increased, and a wide heat dissipation path can be ensured. Furthermore, since the curved portions of the heat transfer support side plate portions 32c and 33c are cylindrical curved portions, the heat transfer distance to the cooling body 3 can be shortened compared to the case where the curved portions are L-shaped. the

In addition, since the heat conduction support side plate portions 32c and 33c of the heat conduction support members 32 and 33 are integrated through the common bottom plate portion 34, there is no gap between the heat conduction support side plate portions 32c and 33c and the bottom plate portion 34. The seam between them can suppress the thermal resistance. the

And, since the heat dissipation path from the control circuit board 22 and the power circuit board 23 on which the heating circuit components 27a and 39a are mounted to the cooling body 3 does not include the housing 2, it is not necessary to use aluminum with high conductivity. Instead of a metal such as a synthetic resin, the case 2 can be made of a synthetic resin, so that weight can be reduced. the

In addition, since the heat dissipation path does not depend on the housing 2, the heat dissipation path can be formed in the power conversion device 1 alone. Therefore, the semiconductor power module 11, the drive circuit board 21, the control circuit board 22, and the power circuit board 23 can be combined. The power conversion device 1 is applied to the casing 2 and cooling body 3 in various ways. the

In addition, since the metal heat conduction support plate portions 32 a and 33 a are fixed to the control circuit board 22 and the power circuit board 23 , the rigidity of the control circuit board 22 and the power circuit board 23 can be increased. Therefore, even when the power conversion device 1 is used as a motor drive circuit for driving a motor for driving a vehicle, as shown in FIG. Rigidity can be improved by utilizing the thermally conductive support members 32 and 33 . Therefore, it is possible to provide the power conversion device 1 that is less affected by vertical vibrations, lateral vibrations, and the like. the

And, since the surface mount connection type circuit components 27b and 39b are mounted on the upper surface side of the control circuit board 22 and the power circuit board 23 opposite to the heat conduction members 35 and 37, these surface mount connection type circuit components 27b and 39b do not have conductive elongated protrusions such as soldering wires protruding toward the heat conduction members 35 and 37 on the lower surface side, so it is possible to reliably prevent damage caused by conduction of the metal fillers of the heat conduction members 35 and 37. decline in insulation performance. the

In addition, in the above-mentioned embodiment, the surface mount connection type circuit components 27b and 39b is described. However, the present invention is not limited to the above structure, and as shown in FIG. In this case, the electrical insulating member 47 is arranged between the heat conduction members 35 and 37 facing the protruding area of the soldering lead 46a protrudingly formed on the wire bonding type circuit component 46 and the heat conduction support plate portions 32a and 33a. It is preferable that the electrical insulating member 47 is formed in a region wider than the protruding region of the bonding lead 46a. the

In the structure of FIG. 10, the soldering lead 46a of the lead-wire connection type circuit component 46 protrudes to the lower surface side through the through-hole formed in the control circuit board 22 and the power circuit board 23, and this lead-wire connection type circuit component 46 is mounted on The upper surface on the side opposite to the heat conducting members 35 and 37 on the control circuit substrate 22 and the power circuit substrate 23. Furthermore, the soldering leads 46 a are soldered and fixed to the lower surfaces of the control circuit board 22 and the power circuit board 23 . the

As described in the above-mentioned embodiment, when the control circuit board 22 and the power circuit board 23 and the heat transfer support plate parts 32a and 33a are compressed by the fixing screws 36 and 38, as shown in FIG. In the heat conduction members 35 and 37 , openings are formed on the heat conduction members 35 and 37 , and the openings are enlarged due to the influence of vibration or the like, thereby forming spaces on the layers of the heat conduction members 35 and 37 , resulting in a decrease in insulation performance. the

However, as described above, the electrical insulating member 47 is disposed between the heat conduction members 35 and 37 corresponding to the protruding regions of the soldering lead 46a and the heat conduction support plate portions 32a and 33a. Thus, the electric insulation member 47 can make up for the decrease in the insulation resistance of the heat conduction members 35 and 37 caused by the soldering of the lead wire 46a, thereby ensuring that the control circuit board 22 and the power circuit board 23 are in contact with the heat conduction support plate portions 32a and 33a. The required insulating properties between. the

In addition, in the above embodiment, the case where the outer shapes of the heat conduction members 35 and 37 are the same as those of the control circuit board 22 and the power circuit board 23 in the control circuit unit U2 and the power circuit unit U3 has been described. However, the present invention is not limited to the above configuration, and as shown in FIG. 6 , the heat conduction members 35 and 37 may be provided only at the locations where the heating circuit components 27a and 39a exist. the

In addition, in the above-mentioned embodiment, the case where the cooling member 13 of the semiconductor power module 11 is in contact with the cooling body 3 has been described, but the present invention is not limited thereto, and the configuration shown in FIG. 11 may be employed. That is, the cooling member 13 formed on the semiconductor power module 11 is provided with the cooling fins 61 that are in direct contact with the cooling water flowing through the cooling body 3 , and accordingly, the cooling fins 61 are formed in the center of the cooling body 3 . The immersion part 62 immersed in the cooling water passage. Furthermore, a sealing member 66 such as an O-ring is disposed between the peripheral wall 63 including the intrusion portion 62 and the cooling member 13 . the

In this case, since the cooling fins 61 are formed in the cooling member 13 of the semiconductor power module 11, and the cooling fins 61 are immersed in cooling water by the immersion portion 62, the semiconductor power module 11 can be more efficiently cooled. cool down. the

In addition, in the said embodiment, the case where the heat-transfer support plate parts 32a and 33a and the heat-transfer support side plate parts 32c and 33c of the heat-transfer support members 32 and 33 were comprised separately was demonstrated. However, the present invention is not limited to the above structure, and the heat conduction support plate portions 32a and 33a and the heat conduction support side plate portions 32c and 33c may also be integrally formed. In this case, since no joint is formed between the heat conduction support plate portions 32a and 33a and the heat conduction support side plate portions 32c and 32c, thermal resistance can be reduced to more efficiently dissipate heat. the

In addition, in the above-mentioned embodiment, the case where the power conversion device of the present invention is applied to an electric vehicle has been described, but it is not limited to this, and the present invention can also be applied to a railway vehicle running on a track, and can also be applied to any electric drive vehicles. In addition, the power conversion device is not limited to electrically driven vehicles, and the power conversion device of the present invention can also be applied when driving actuators such as electric motors in other industrial equipment. the

Industrial Applicability

According to the present invention, it is possible to provide a power conversion device capable of efficiently dissipating heat from a heating circuit component mounted on a substrate to a cooling body and ensuring insulation performance of a heat transfer member. the

Label description

1...power conversion device, 2...casing, 3...cooling body, 4...film capacitor, 5...battery storage unit, 11...semiconductor power module, 12...casing body, 13...radiating member, 21...drive circuit board, 22 ...Control circuit board, 23...Power circuit board, 24, 25...Joint screws, 27a...Heater circuit components, 27b...Surface mount connection type circuit components, 32...Heat transfer support member, 32a...Heat transfer support plate part, 32b... Fixing screw, 32c...heat conduction support side plate, 33...heat conduction support member, 33a...heat conduction support plate, 33b...fixing screw, 33c...heat conduction support side plate, 34...bottom plate, 35, 37...heat conduction member, 39a ...heat-conducting circuit components, 39b...surface mount connection type circuit components, 40...gaskets (interval adjustment members), 61...cooling fins.

Claims (12)

1. a power conversion device, is characterized in that, comprising:

Semi-conductor power module, a face of this semi-conductor power module engages with cooling body;

Installation base plate, this installation base plate is provided with the circuit elements device that comprises heating circuit components and parts, and described heating circuit components and parts drive described semi-conductor power module;

Heat conduction supporting member, this heat conduction supporting member supports described installation base plate by heat conduction member; And

Heat conduction path, this heat conduction path makes the heat of described installation base plate conduct to described cooling body via described heat conduction supporting member,

The circuit elements device being arranged on described installation base plate is that connecting-type circuit elements device is installed on surface.

2. power conversion device as claimed in claim 1, is characterized in that,

Described heat conduction supporting member consists of the higher metal material of pyroconductivity.

3. power conversion device as claimed in claim 1 or 2, is characterized in that,

Described heat conduction member by have heat conductivity insulator and there is heat conductivity and have retractility elastomeric any one form.

4. power conversion device as claimed in claim 1 or 2, is characterized in that,

Described heat conduction member consists of the elastomer that has heat conductivity and have a retractility, and this elastomer is fixed under by the state of described installation base plate and the compression of described heat conduction supporting board.

5. power conversion device as claimed in claim 4, is characterized in that,

Between described installation base plate and described heat conduction supporting board, be provided with the interval adjustment member of determining described elastomeric compression ratio.

6. a power conversion device, is characterized in that, comprising:

Semi-conductor power module, a face of this semi-conductor power module engages with cooling body;

Installation base plate, this installation base plate is provided with the circuit elements device that comprises heating circuit components and parts, and described heating circuit components and parts drive described semi-conductor power module;

Heat conduction supporting member, this heat conduction supporting member supports described installation base plate by heat conduction member; And

Heat conduction path, this heat conduction path makes the heat of described installation base plate conduct to described cooling body via described heat conduction supporting member,

Be arranged on circuit elements device on described installation base plate and be and there is the circuit elements device that welding lead and this welding lead have been carried out welding, at least at the described heat conduction member position corresponding with the insertion position with described welding lead between described heat conduction supporting member, clamp and have electric insulation component.

7. a power conversion device, is characterized in that, comprising:

Semi-conductor power module, is built-in with the thyristor that power transfer is used in the casing of this semi-conductor power module, and is formed with the cooling component contacting with cooling body on a face of this casing;

Installation base plate, this installation base plate is provided with the circuit elements device that comprises heating circuit components and parts, and described heating circuit components and parts drive described thyristor; And

Heat conduction supporting member, this heat conduction supporting member at least has the heat conduction supporting board described installation base plate being supported by heat conduction member, and be formed with the heat conduction path that is independent of the housing that surrounds described semi-conductor power module and described installation base plate both sides, and contact with described cooling body

Be arranged on circuit elements device on described installation base plate and be and there is the circuit elements device that welding lead and this welding lead have been carried out welding, at least at the described heat conduction member position corresponding with the insertion position with described welding lead between described heat conduction supporting board, clamp and have electric insulation component.

8. the power conversion device as described in claim 6 or 7, is characterized in that,

Described electric insulation component be formed on the welding lead of described circuit elements device insert in relative region, region than in the wealthy scope of this welding lead insert district field width.

9. the power conversion device as described in claim 6 or 7, is characterized in that,

Described heat conduction supporting member consists of the higher metal material of pyroconductivity.

10. the power conversion device as described in claim 6 or 7, is characterized in that,

Described heat conduction member by have heat conductivity insulator and there is heat conductivity and have retractility elastomeric any one form.

11. power conversion devices as described in claim 6 or 7, is characterized in that,

Described heat conduction member consists of the elastomer that has heat conductivity and have a retractility, and this elastomer is fixed under by the state of described installation base plate and the compression of described heat conduction supporting board.

12. power conversion devices as claimed in claim 11, is characterized in that,

Between described installation base plate and described heat conduction supporting board, be provided with the interval adjustment member of determining described elastomeric compression ratio.