CN103931094A - power conversion device - Google Patents

Abstract

The present invention provides a power conversion device capable of preventing generation of heat accumulation by enhancing natural convection between mounting substrates. The power conversion device (1) includes: a semiconductor power module (11), one surface of the semiconductor power module (11) is bonded to the cooling body (3); and a plurality of mounting substrates (22), (23), the plurality of Mounting substrates (22), (23) are laminated on the other side of the semiconductor power module through an air layer, and are mounted with circuit components including heating circuit components (28) for driving the semiconductor power module, a plurality of The mounting substrate is inclined with respect to a plane perpendicular to the weight direction.

Description

power conversion device

technical field

The present invention relates to a power conversion device. In the power conversion device, a semiconductor power module incorporating a semiconductor switching element for power conversion is supported with a predetermined interval on a semiconductor power module. Circuit components of heating circuit components of semiconductor switching elements.

Background technique

As such a power conversion device, the power conversion device described in Patent Document 1 is known. In this power conversion device, a water-cooling jacket is arranged in the casing, and a semiconductor power module is arranged on the water-cooling jacket to cool the semiconductor power module. The semiconductor power module has a built-in semiconductor switching element as a power conversion the IGBT. In addition, in the casing, a control circuit board is arranged at a predetermined distance on the opposite side of the semiconductor power module to the water-cooling jacket, and the heat generated by the control circuit board is conducted to the supporting control circuit board through the heat dissipation member. The metal bottom plate, and the heat conducted to the metal bottom plate is further conducted to the water-cooled jacket through the side wall of the housing supporting the metal bottom plate.

In addition, Patent Document 2 describes that, in the assembly constituted by mounting a semiconductor power module described therein, the semiconductor modules are arranged in parallel and obliquely, and are mounted in a case.

prior art literature

patent documents

Patent Document 1: Japanese Patent No. 4657329

Patent Document 2: International Publication No. 2004/086836

Contents of the invention

The technical problem to be solved by the invention

However, in the conventional example described in the aforementioned Patent Document 1, the heat generated by the control circuit board is dissipated along the path of the control circuit board→radiation member→metal base plate→casing→water cooling jacket. Therefore, there is an unsolved problem that, since the case is used as a part of the heat conduction path, the case is also required to have good thermal conductivity, so that the material is limited to a metal with high thermal conductivity, so when miniaturization and light weight are required. In lightweight power conversion devices, lightweight materials such as resins cannot be selected, making it difficult to achieve weight reduction.

In addition, for the shell, since it is required to be waterproof and dustproof in most cases, between the metal base plate and the shell, between the shell and the water-cooling jacket, a liquid sealant is generally applied or a rubber filler is sandwiched. things etc. Therefore, there is also an unsolved problem that liquid sealants or fillers made of rubber generally have low thermal conductivity, and sandwiching these materials in the thermal cooling path increases thermal resistance, resulting in a decrease in cooling efficiency.

In addition, if a plurality of mounting boards are arranged in parallel, the heat generated by the heating circuit components of the lower mounting board will be converted into hot gas and rise. The side cannot be diffused, so there is an unsolved problem that heat builds up to adversely affect the circuit components of the mounting substrate on the upper side.

In addition, in the conventional example described in the above-mentioned Patent Document 2, since a plurality of semiconductor power modules are arranged in parallel and obliquely in the case, all the boards for mounting the semiconductor power modules are arranged obliquely, so , while requiring a sufficient space in the casing, it is difficult to separately arrange cooling bodies such as water-cooling jackets for cooling the semiconductor power modules for each semiconductor power module.

Therefore, the present invention has been made focusing on the unsolved problems of the above-mentioned conventional examples, and an object of the present invention is to provide a power conversion device capable of preventing heat accumulation by enhancing natural convection between mounting substrates.

Technical solutions adopted to solve technical problems

In order to achieve the above objects, a first aspect of the power conversion device according to the present invention includes: a semiconductor power module, one side of which is bonded to a cooling body; An air layer is laminated on the other surface side of the semiconductor power module, and circuit components including heat generating circuit components for driving the semiconductor power module are mounted on the plurality of mounting substrates. Furthermore, the plurality of mounting substrates are inclined with respect to a plane perpendicular to the weight direction.

According to this structure, since the mounting substrate is inclined, when the hot air emitted by the heat-generating circuit components mounted on the lower mounting substrate reaches the lower surface of the upper mounting substrate, due to the lower surface of the upper mounting substrate, The surface is sloped, so the hot air rises along the slope. Thereby, the natural convection between the mounting substrates can be enhanced, thereby reliably preventing the generation of heat accumulation.

Furthermore, a second aspect of the power conversion device according to the present invention includes: a semiconductor power module in which a semiconductor switching element for power conversion is built in a housing, and a power conversion device is formed on one surface of the housing. a cooling member in contact with the cooling body; and a plurality of mounting substrates stacked through an air layer and arranged on a side opposite to the cooling member of the semiconductor power module, and on the plurality of mounting substrates A circuit component including a heating circuit component for driving the semiconductor switching element is mounted. Furthermore, the mounting substrate is supported so as to be inclined with respect to a plane perpendicular to the direction of gravity.

According to this structure, since the mounting substrate is inclined, when the hot air emitted by the heat-generating circuit components mounted on the lower mounting substrate reaches the lower surface of the upper mounting substrate, due to the lower surface of the upper mounting substrate, The surface is sloped, so the hot air rises along the slope. Thereby, the natural convection between the mounting substrates can be enhanced, thereby reliably preventing the generation of heat accumulation.

Furthermore, a third aspect of the power conversion device according to the present invention includes: a semiconductor power module in which a semiconductor switching element for power conversion is built in a housing, and a power conversion device is formed on one surface of the housing. A cooling member in contact with the cooling body; a plurality of mounting substrates stacked and arranged on the side opposite to the cooling member of the semiconductor power module through an air layer, and mounted on the plurality of mounting substrates There are a circuit component including a heating circuit component that drives the semiconductor switching element; and a case that surrounds at least the semiconductor power module and the plurality of mounting substrates. Furthermore, the mounting substrate is supported so as to be inclined with respect to a plane perpendicular to the direction of gravity.

According to this structure, similarly to the first embodiment described above, natural convection between the mounting substrates can be enhanced, heat accumulation can be prevented, and temperature unevenness in the housing can be eliminated.

In addition, in a fourth aspect of the power conversion device according to the present invention, the semiconductor power module is arranged parallel to a plane perpendicular to the direction of gravity, and the plurality of mounting substrates are supported by a support member so as to resist gravity. Orthogonal planes are inclined.

According to such a configuration, since the semiconductor power module is arranged in the horizontal plane, the mounting substrate itself is supported obliquely. Therefore, the mounting substrate can be easily supported obliquely by inclining the upper surface of the support member that supports the mounting substrate.

In addition, in a fifth aspect of the power conversion device according to the present invention, the surface of the cooling body that contacts the cooling member of the semiconductor module is formed as an inclined surface that is inclined with respect to a plane perpendicular to the direction of gravity. The semiconductor power module and the plurality of mounting substrates are arranged in parallel on the inclined surface.

According to such a configuration, only the upper surface of the heat sink is formed as an inclined surface, so that the mounting substrate can be inclined, and the structure for inclining the mounting substrate can be simplified.

In addition, according to a sixth aspect of the power conversion device according to the present invention, the case includes an upper case covering an outer peripheral surface of an upper surface of the cooling body, and an outer peripheral surface covering a lower surface of the cooling body. The lower case in which the capacitor is installed is formed. The upper surface of the lower case is formed as an inclined surface inclined with respect to a plane perpendicular to the direction of gravity, and the cooling body, the A semiconductor power module and a plurality of the mounting substrates.

According to such a configuration, only the upper surface of the lower case can be formed as an inclined surface, so that the mounting substrate can be inclined, and the structure for inclining the mounting substrate can be simplified.

In addition, in a seventh aspect of the power conversion device according to the present invention, a heat dissipation portion is formed at a position on the inner wall surface of the housing that faces natural convection from the mounting substrate.

According to this structure, the hot air transported by natural convection reaches the radiating portion, and heat exchange with the outside can be performed by the radiating portion, thereby suppressing a rise in temperature in the casing.

Furthermore, in an eighth aspect of the power conversion device according to the present invention, the heat dissipation portion is constituted by heat dissipation fins formed on the inner wall surface of the housing.

According to such a structure, since the heat dissipation part is comprised by the heat dissipation fin, the surface area can be enlarged, and heat dissipation can be performed efficiently.

In addition, in a ninth aspect of the power conversion device according to the present invention, the heat dissipation portion is constituted by a plurality of groove portions formed on the inner wall surface of the housing.

According to such a configuration, since the heat dissipation portion is constituted by a plurality of groove portions, the surface area can be increased to efficiently dissipate heat, similar to the heat dissipation fins.

In addition, in a tenth aspect of the power conversion device according to the present invention, the plurality of mounting substrates are supported by a heat transfer support plate portion via a heat transfer member, and the case of the semiconductor power module is formed as a flat rectangular parallelepiped having a rectangular plane. shape, the heat conduction support plate part is connected to the cooling body through a heat conduction path independent of the casing surrounding the semiconductor power module and each of the mounting substrates, and the heat conduction path is configured to pass through the box The side of the long side of the body.

According to this configuration, the heat generated by the heating circuit components mounted on the mounting substrate can be dissipated to the cooling body through the heat conducting member, the heat conducting support plate portion, and the heat conduction path, so that the heat generated by the heating circuit components can be effectively dissipated. At this time, since the heat conduction path is independent of the case, it is possible to form the case without considering the thermal conductivity of the case, thereby increasing the degree of freedom in design.

Furthermore, in an eleventh aspect of the power conversion device according to the present invention, the heat conduction path is constituted by a heat conduction support side plate portion connecting the heat conduction support plate portion and the cooling body.

According to this configuration, the width of the heat-supporting side plate portion can be widened, and the heat transfer cross-sectional area can be increased, thereby increasing the amount of heat conduction.

Furthermore, in a twelfth aspect of the power conversion device according to the present invention, the heat transfer support plate portion and the heat transfer support side plate portion are formed of a metal material with high thermal conductivity.

According to this configuration, since the mounting substrate is made of aluminum, aluminum alloy, copper, or the like with high thermal conductivity, heat radiation to the cooling body can be more effectively performed.

In addition, in a thirteenth aspect of the power conversion device according to the present invention, when a pair of upper and lower mounting substrates is supported, the thermally conductive support side plate portion and the thermally conductive support plate portion supporting the lower mounting substrate The upper end side is connected to the upper end side, and is connected to the lower end side of the heat conduction support plate portion supporting the mounting substrate on the upper side.

According to such a structure, the hot air rising along the heat conduction support plate part is not blocked by the heat conduction support side plate part, and natural convection can be effectively formed.

Furthermore, in a fourteenth aspect of the power conversion device according to the present invention, the heat transfer support plate portion is integrally formed with the heat transfer support plate portion.

According to this structure, since the heat conduction support plate portion and the heat conduction support side plate portion are integrally formed, there is no joint between them, thereby reducing thermal resistance and improving heat conduction effect.

Furthermore, a fifteenth aspect of the power conversion device according to the present invention includes: a semiconductor power module in which a semiconductor switching element for power conversion is built in a housing and formed on one surface of the housing. There is a cooling member in contact with the cooling body; a plurality of mounting substrates are stacked and arranged on the side opposite to the cooling member of the semiconductor power module through an air layer, and on the plurality of mounting substrates A circuit component including a heating circuit component for driving the semiconductor switching element is installed; and a case surrounding at least the semiconductor power module and a plurality of the mounting substrates, the case is arranged obliquely, so that the plurality of mounting substrates in the casing are inclined with respect to a plane perpendicular to the direction of gravity.

According to the fifteenth aspect, the mounting board can be tilted only by placing the power conversion device itself in a normal configuration and only disposing the housing itself so that the mounting board can be tilted, thereby further simplifying the structure for tilting the mounting board.

In addition, in a sixteenth aspect of the power conversion device according to the present invention, the case has a heat dissipation portion formed on an inner wall thereof at a position facing natural convection from the mounting substrate.

According to such a configuration, the hot air transported by natural convection reaches the radiating portion, and heat exchange with the outside can be performed by the radiating portion, thereby suppressing a rise in temperature in the housing.

Furthermore, in a seventeenth aspect of the power conversion device according to the present invention, the heat dissipation portion is constituted by heat dissipation fins formed on the inner wall surface of the housing.

According to such a structure, since the heat dissipation part is comprised by the heat dissipation fin, the surface area can be enlarged, and heat dissipation can be performed efficiently.

Furthermore, in an eighteenth aspect of the power conversion device according to the present invention, the heat dissipation portion is formed of a plurality of grooves formed on the inner wall surface of the housing.

According to such a configuration, since the heat dissipation portion is constituted by a plurality of groove portions, the surface area can be increased to efficiently dissipate heat, similar to the heat dissipation fins.

In addition, in a nineteenth aspect of the power conversion device according to the present invention, the plurality of mounting substrates are supported by a heat transfer support plate portion via a heat transfer member, and the case of the semiconductor power module is formed in a flat shape having a rectangular plane. cuboid shape, the heat conduction support plate part is connected to the cooling body through a heat conduction path independent of the casing surrounding both the semiconductor power module and each of the mounting substrates, and the heat conduction path is configured to pass through the The side of the long side of the box.

According to this configuration, the heat generated by the heating circuit components mounted on the mounting substrate can be dissipated to the cooling body through the heat conducting member, the heat conducting support plate portion, and the heat conduction path, so that the heat generated by the heating circuit components can be effectively dissipated. At this time, since the heat conduction path is independent of the case, it is possible to form the case without considering the thermal conductivity of the case, thereby increasing the degree of freedom in design.

Furthermore, in a twentieth aspect of the power conversion device according to the present invention, the heat conduction path is constituted by a heat conduction support side plate portion connecting the heat conduction support plate portion and the cooling body.

According to this configuration, the width of the heat-supporting side plate portion can be widened, and the heat transfer cross-sectional area can be increased, thereby increasing the amount of heat conduction.

Furthermore, in a twenty-first aspect of the power conversion device according to the present invention, the heat transfer support plate portion and the heat transfer support side plate portion are formed of a metal material with high thermal conductivity.

According to this configuration, since the mounting substrate is made of aluminum, aluminum alloy, copper, or the like with high thermal conductivity, heat radiation to the cooling body can be more effectively performed.

In addition, in a twenty-second aspect of the power conversion device according to the present invention, when a pair of upper and lower mounting substrates is supported, the thermally conductive support side plate part and the thermally conductive support plate supporting the lower mounting substrate The upper end side of the portion is connected, and the lower end side of the heat conduction support plate portion supporting the mounting substrate on the upper side is connected.

According to such a structure, the hot air rising along the heat conduction support plate part is not blocked by the heat conduction support side plate part, and natural convection can be effectively formed.

Furthermore, in a twenty-third aspect of the power conversion device according to the present invention, the heat transfer support plate portion is integrally formed with the heat transfer support plate portion.

According to this structure, since the heat conduction support plate portion and the heat conduction support side plate portion are integrally formed, there is no joint between them, thereby reducing thermal resistance and improving heat conduction effect.

Invention effect

According to the present invention, since the mounting board is supported in an inclined state with respect to a plane perpendicular to the direction of gravity, even when a plurality of mounting boards on which heating circuit components are mounted are arranged in parallel, the mounting board from the lower side The generated hot gas rises and reaches the upper mounting substrate. Since the upper mounting substrate is inclined relative to the horizontal plane, which is a plane perpendicular to the direction of gravity, the hot gas rises along the lower surface of the upper mounting substrate. As a result, natural convection can be enhanced, thereby reliably preventing the generation of heat accumulation.

Description of drawings

FIG. 1 is a cross-sectional view showing the overall configuration of Embodiment 1 of a power conversion device according to the present invention.

FIG. 2 is an enlarged cross-sectional view showing a main part of Embodiment 1. FIG.

3 is a front view and a plan view showing a support member for mounting a substrate.

FIG. 4 is a plan view of the mounting substrate without mounting components.

FIG. 5 is a cross-sectional view showing the overall structure of a conventional power conversion device.

FIG. 6 is an enlarged sectional view of a main part of FIG. 5 .

FIG. 7 is an enlarged cross-sectional view corresponding to FIG. 2 showing a modified example of Embodiment 1. FIG.

FIG. 8 is a schematic cross-sectional view showing the overall structure of Embodiment 2 of the present invention.

FIG. 9 is a schematic cross-sectional view showing a convective state in Embodiment 2. FIG.

FIG. 10 is a schematic cross-sectional view showing the overall structure of Embodiment 3 of the present invention.

11 is a schematic cross-sectional view showing the overall structure of a modification example of Embodiment 3 of the present invention.

FIG. 12 is a schematic cross-sectional view showing the overall structure of Embodiment 4 of the present invention.

Fig. 13 is a schematic cross-sectional view showing the overall structure of Embodiment 5 of the present invention.

Fig. 14 is an enlarged sectional view of Embodiment 6 of the present invention.

15 is a schematic cross-sectional view showing the overall structure of Embodiment 7 of the present invention.

Fig. 16 is a schematic cross-sectional view showing the overall structure of Embodiment 8 of the present invention.

17 is a diagram showing the inclination of the mounting substrate and the temperature distribution in the housing in Embodiment 8. FIG.

18 is a bar graph showing the ratio of the inclination of the mounting substrate to the temperature of the upper substrate, the middle substrate, and the lower substrate in Embodiment 8. FIG.

Fig. 19 is an enlarged sectional view showing Embodiment 9 of the present invention.

FIG. 20 is an enlarged cross-sectional view showing a modified example of Embodiments 6 to 9. FIG.

Detailed ways

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a cross-sectional view showing the overall structure of a power conversion device according to the present invention.

In the figure, reference numeral 1 is a power conversion device, and the power conversion device 1 is accommodated in a casing 2 . The case 2 is made of a synthetic resin material or a material with high thermal conductivity, and is composed of a lower case 2A and an upper case 2B divided into upper and lower parts by sandwiching a cooling body 3 having a water-cooled jacket structure.

The lower case 2A is constituted by a bottomed square cylinder. The open upper portion of the lower case 2A is covered with a cooling body 3 , and a filter film capacitor 4 is accommodated therein.

The upper casing 2B includes a square cylinder 2a with open upper and lower ends, and a cover 2b closing the upper end of the square cylinder 2a. Furthermore, the lower end of the square cylinder 2a is closed by the cooling body 3 . Although not shown in the figure, between the lower end of the square cylinder 2 a and the cooling body 3 , there is a seal material coated with a liquid sealant or interposed with a rubber filler or the like.

The cooling body 3 is formed in a flat rectangular parallelepiped shape whose lower surface and upper surface are flat surfaces. In this cooling body 3 , a water inlet 3 a and a water outlet 3 b for cooling water are directly opened to the outside of the housing 2 , and a cooling water passage 3 c is formed between the water inlet 3 a and the water outlet 3 b.

The water inlet 3a and the water outlet 3b are connected to a cooling water supply source (not shown) via a flexible hose, for example. The cooling body 3 is formed, for example, by injection molding aluminum or an aluminum alloy with high thermal conductivity. In addition, an insertion hole 3 d for vertically inserting positive and negative connection terminals 4 a covered with insulation of film capacitor 4 held by lower case 2A is formed in cooling body 3 .

Referring also to FIG. 2 , it can be seen that the power conversion device 1 includes a semiconductor power module 11 incorporating, for example, an insulated gate bipolar transistor (IGBT) as a semiconductor switching element constituting a power conversion such as an inverter circuit.

In this semiconductor power module 11 , an IGBT is built in a flat rectangular parallelepiped insulating box 12 , and a cooling member 13 made of metal is formed on the lower surface of the box 12 . In the case 12 and the cooling member 13 , when viewed from the upper surface, insertion holes 15 for inserting fixing screws 14 as fixing members are formed at four corners. In addition, on the upper surface of the case 12 , board fixing portions 16 having a predetermined height are protrudingly formed at four places inside the insertion hole 15 .

A drive circuit board 21 on which a drive circuit for driving the IGBT built in the semiconductor power module 11 and the like is mounted is fixed to an upper end of the board fixing portion 16 . In addition, above the drive circuit board 21, in order to ensure a predetermined distance therebetween, and at a predetermined angle with respect to a horizontal plane perpendicular to the direction of gravity, an inclination angle θ within a range of, for example, 5 to 20°, For example, the control circuit board 22 is fixed obliquely to the upper left, and the control circuit board 22 is mounted as a control circuit including a heating circuit component that controls a relatively large heat generation or a high heat generation density of the IGBT built in the semiconductor power module 11. and other mounting substrates.

In addition, above the control circuit board 22, in a similar manner to ensure a fixed interval between the two, and in a state parallel to the control circuit board 22, that is, at an angle of, for example, 5 with respect to a horizontal plane perpendicular to the direction of gravity. The inclination angle θ within the range of ° to 20°, for example, tilts upward to the left to support the power circuit board 23, which is mounted as a heating circuit component including a heating circuit component that supplies power to the IGBT built in the semiconductor power module 11. Mounting substrates for power circuits, etc.

Here, a pair of threaded shafts 17a are screwed into the female threaded portion 16a formed at the upper end of the pair of front and rear substrate fixing portions 16 on the left side, and extend in the vertical direction. In addition, a pair of threaded shafts 17b are screwed into the female threaded portion 16b formed at the upper end of the pair of front and rear board fixing portions 16 on the right side, and extend in the vertical direction.

Then, with the four threaded shafts 17 a and 17 b inserted into the insertion holes 21 a formed in the drive circuit board 21 , the lower surface of the drive circuit board 21 contacts the upper end of the board fixing portion 16 .

In this state, the cylindrical spacers 18a and 18b having different lengths are attached to the threaded shafts 17a and 17b so that the threaded shafts 17a and 17b are inserted into the inner peripheral surfaces of the spacers 18a and 18b. These spacers 18a and 18b are shown in FIG. 2, and the length of the spacer 18a is set larger than the length of the spacer 18b. Here, as shown in FIG. 3( a ), the lower end surfaces of the spacers 18 a and 18 b are formed as the horizontal plane Fh, and the upper end surfaces thereof are formed as the inclined surface Fi having the above-mentioned inclination angle θ.

Then, the lower surface of the control circuit board 22 is in contact with the inclined surface Fi of the upper surface of each spacer 18a and 18B. As shown in FIG. 4, at the four corners of the control circuit board 22, long holes 22a and 22b into which the threaded shafts 17a and 17b are inserted are formed. Then, the screw shafts 17a and 17b are inserted into the long holes 22a and 22b by lowering the control circuit board 22 from above the screw shafts 17a and 17b, so that the upper ends of the control circuit board 22 and the spacers 18a and 18b are aligned. The inclined surfaces Fi are in contact with each other. Accordingly, as shown in FIG. 2 , the control circuit board 22 is mounted at an inclination angle θ and tilted upward to the left.

Also, the same spacers 19 a and 19 b as the spacers 18 a and 18 b are attached to the threaded shafts 17 a and 17 b protruding from the control circuit board 22 . These spacers 19a and 19b, as shown in FIG. 3(b), form an inclined surface Fi having an inclination angle θ on their upper and lower surfaces, respectively. In addition, the spacers 19a and 19b are set to have the same height.

Then, the power circuit board 23 is lowered to the threaded shafts 17a and 17b protruding from the spacers 19a and 19b from above the threaded shafts 17a and 17b, so that the threaded shafts 17a and 17b are inserted into the same long holes 23a as the control circuit board 22 described above. and 23b, so that the lower surface of the power circuit board 23 is in contact with the inclined surface Fi of the upper ends of the spacers 19a and 19b. Accordingly, as shown in FIG. 2 , the power circuit board 23 is also mounted at an inclination angle θ and tilted upward to the left so as to be parallel to the control circuit board 22 .

In addition, spacers 20 a and 20 b as support members are attached to the threaded shafts 17 a and 17 b protruding from the power circuit board 23 . As shown in FIG. 3( c ), these spacers 20 a and 20 b are formed in a cylindrical shape, the lower surface thereof is formed as an inclined surface Fi inclined at an inclination angle θ, and the upper surface thereof is formed as a horizontal surface Fh. Then, the horizontal surface Fh of the upper surface becomes horizontal by bringing the inclined surface Fi of the lower surface of the spacers 20a and 20b into contact with the power circuit board 23 .

Then, by screwing and tightening the nuts 24a and 24b on the screw shafts 17a and 17b protruding upward from the spacers 20a and 20b, the drive circuit board 21, the control circuit board 22 and the power circuit board 23 are fixed and supported on the semiconductor substrate. on the substrate fixing portion 16 of the power module 11 .

Here, the supporting member is constituted by threaded shafts 17a, 17b, spacers 18a, 18b, 19a, 19b, 20a, 20b, and nuts 24a, 24b.

In addition, in the above structure, the case where the threaded shafts 17a and 17b are screwed to the female threaded portion 16a of the substrate fixing portion 16 fixed to the case 12 of the semiconductor power module 11 has been described, but the present invention is not limited thereto. The screw shafts 17a and 17b may be integrally formed with the substrate fixing portion 16 . In this case, instead of the threaded shafts 17a and 17b, vertical shafts on which external threaded portions are formed may be integrally formed only at portions protruding from the spacers 20a and 20b.

Next, the operation of the first embodiment described above will be described.

In the above-mentioned first embodiment, the cooling body 3 is arranged in a horizontal state in the housing 2 arranged on the horizontal plane. The semiconductor power module 11 is configured in a state where the surfaces are in contact.

On the upper surface of the case 12 of the semiconductor power module 11 , the drive circuit board 21 is arranged horizontally, and the control circuit board 22 and the power circuit board 23 are arranged at an inclination angle θ and tilted upward to the left. Heating circuit components are mounted on the control circuit board 22 and the power circuit board 23 .

Then, as shown in FIG. 1, the bus bar 50 is connected to the positive and negative DC input terminals 11a of the semiconductor power module 11, and the positive and negative electrodes 4a of the film capacitor 4 passing through the cooling body 3 are connected to the positive and negative electrodes 4a of the bus bar 50 by using fixing screws 51. The other end is connected. Furthermore, the crimping terminal 53 fixed to the tip of a connection wire 52 connected to an external rectifier (not shown) is fixed to the DC input terminal 11 a of the semiconductor power module 11 with a fixing screw 54 .

Furthermore, the bus bar 55 is connected to the three-phase AC output terminal 11 b of the semiconductor power module 11 by fixing screws 56 , and a current sensor 57 is disposed in the middle of the bus bar 55 . Then, the crimp terminal 59 fixed to the front end of the motor connection cable 58 connected to an external three-phase motor (not shown) is fixed and connected to the other end of the bus bar 55 with a fixing screw 60 .

In this state, while DC power is supplied from an external rectifier (not shown), the power circuit mounted on the power circuit board 23 and the control circuit mounted on the control circuit board 22 are in an operating state, and the control circuit is connected via the mounted circuit board. The drive circuit on the drive circuit substrate 21 supplies a gate signal, such as a pulse width modulation signal, to the semiconductor power module 11 . Thereby, the IGBT built in the semiconductor power module 11 is controlled, and DC power is converted into AC power. The converted AC power is supplied from the three-phase AC output terminal 11 b to the motor connection cable 58 via the bus bar 55 to drive and control a three-phase motor (not shown).

At this time, the IGBT built in the semiconductor power module 11 generates heat. Since the cooling member 13 formed on the semiconductor power module 11 is in direct contact with the cooling body 3 , the generated heat is cooled by the cooling water provided by the cooling body 3 .

On the other hand, the control circuit and the power circuit mounted on the control circuit board 22 and the power circuit board 23 include heating circuit components 28 , and these heating circuit components 28 generate heat. At this time, the heating circuit components 28 are mounted on the upper surface sides of the control circuit board 22 and the power circuit board 23 .

Therefore, as shown in FIG. 2, on the control circuit board 22 and the power circuit board 23, the heat generated by the heat generation of the heating circuit components 28 rises, and on the driving circuit board 21, even if the heat generation is small, the circuit The heat generated by the heating of components will also rise. Then, the hot air generated by the heat generated on the drive circuit board 21 and the control circuit board 22 rises and reaches the lower surfaces of the control circuit board 22 and the power circuit board 23 . These control circuit boards 22 and power circuit boards 23 are inclined at an inclination angle θ (for example, 5 to 20°). As a result, the hot air reaching the control circuit board 22 and the power circuit board 23 rises along the lower surfaces of the control circuit board 22 and the power circuit board 23 , thereby enhancing natural convection.

Natural convection is enhanced in the above manner, so that no heat accumulation occurs on the lower surfaces of the control circuit board 22 and the power circuit board 23, and the temperature unevenness in the upper casing 2B is eliminated.

Incidentally, in the conventional example, as shown in FIGS. 5 and 6 , the drive circuit board 21 , the control circuit board 22 , and the power circuit board 23 are arranged in parallel on the upper surface side of the casing 12 of the semiconductor power module 11 . Therefore, the hot gas generated by the heating of the heating circuit boards on the upper surface side of the drive circuit board 21, the control circuit board 22, and the power circuit board 23 rises, and the hot air reaches the control circuit board 22, the power circuit board 23, and the upper case. Cover 2b of 2B.

At this time, the control circuit board 22, the power circuit board 23, and the cover 2b are in a horizontal state. Therefore, the hot air reaching the control circuit board 22 , the power circuit board 23 , and the cover 2 b has nowhere to radiate, causing heat to accumulate, resulting in a decrease in thermal cooling efficiency. Therefore, only the surroundings of the drive circuit substrate 21, the control circuit substrate 22, the power circuit substrate 23, and the cover body 2b become high temperature, while the outside of these parts is at a relatively low temperature due to the cooling of the cooling body 3, so that the upper part Temperature unevenness occurs in the housing 2B.

Thus, even if a plurality of ribs or heat dissipation fins are formed on the inner wall surface of the upper case 2B to form a heat dissipation portion, natural convection does not occur, so the drive circuit board 21, the control circuit board 22, and the power circuit board cannot be heated. 23 and the surrounding high-temperature parts of the cover body 2b are effectively cooled.

However, in Embodiment 1 described above, natural convection can be enhanced by inclining both the control circuit board 22 and the power circuit board 23 at a predetermined angle θ with respect to a plane perpendicular to the direction of gravity. This prevents heat from accumulating on the drive circuit board 21, the control circuit board 22, the power circuit board 23, and the cover 2b, reduces the temperature inside the upper case 2B, and makes the temperature distribution uniform.

In addition, in the first embodiment described above, the case where the drive circuit board 21, the control circuit board 22, and the power circuit board 23 are fixed by screwing the nuts 24a and 24b to the uppermost parts of the threaded shafts 17a and 17b has been described. . However, the present invention is not limited to the above structure, and the structure shown in FIG. 7 may also be adopted.

That is, the same spacers 25a and 25b as the spacers 20a and 20b are installed on the threaded shafts 17a and 17b protruding from the control circuit board 22, and then the nuts 26a and 26b are screwed and fastened on the threaded shafts 17a and 17b from these spacers 25a and 25b. The horizontal plane Fh at the upper end protrudes on the threaded shafts 17a and 17b.

Then, spacers 27a and 27b, which are the same as the spacers 25a and 25b, are mounted on the threaded shafts 17a and 17b protruding from the nuts 26a and 26b in an upside-down manner. The power circuit board 23 is mounted on the threaded shafts 17a and 17b protruding from the horizontal plane Fh of the spacers 27a and 27b, and the spacers 20a and 20b are mounted on the threaded shafts 17a and 17b protruding from the power circuit board 23, Finally, the nuts 24a and 24b are screwed and fastened on the threaded shafts 17a and 17b.

According to the structure of FIG. 7, the control circuit board 22 is temporarily fastened and fixed by the nuts 26a and 26b, and then the power circuit board 23 is fastened and fixed again by the nuts 24a and 24b on the upper side thereof. Thereby, the control circuit board 22 and the power circuit board 23 can be firmly fixed, and the anti-vibration performance with respect to a vertical vibration, a lateral vibration, etc. can be improved.

Next, Embodiment 2 of the present invention will be described using FIG. 8 .

In Embodiment 2, instead of inclining only the control circuit board and the power circuit board, the entire casing 2 is inclined.

That is, in Embodiment 2, similarly to the conventional example shown in FIGS. The drive circuit board 21 , the control circuit board 22 , and the power circuit board 23 are horizontally arranged on the board fixing portion 16 of the semiconductor power module 11 , and a predetermined interval is ensured between the boards.

Then, when the casing 2 having the above-mentioned structure is attached to a fixed part 30 such as a vehicle body as shown in FIG. 31a and 31b are fixed on the fixed housings 32a and 32b, and the fixed housings 32a and 32b are installed on the fixed part 30, and the mounting surface has the inclination angle θ (for example, 5 to 30°) described in the first embodiment. shape extension.

According to this second embodiment, the case 2 is fixed to the fixing portion 30 in a state of being inclined at the inclination angle θ with respect to a horizontal plane perpendicular to the direction of gravity. Accordingly, the drive circuit board 21 , the control circuit board 22 , the power circuit board 23 , and the cover 2 b are all inclined at the inclination angle θ.

Therefore, as shown in FIG. 9, similar to the above-mentioned first embodiment, when the heat generated by the heating circuit components of the drive circuit board 21, the control circuit board 22, and the power circuit board 23 rises, the control circuit board 22 , The power circuit board 23 and the cover 2b are inclined at an inclination angle θ, so the rising hot air rises along the lower surfaces of the control circuit board 22, the power circuit board 23 and the cover 2b, thereby enhancing natural convection.

As a result, natural convection can be enhanced even in the narrow space between the stacked drive circuit board 21, control circuit board 22, and power circuit board 23, thereby reliably preventing heat accumulation between the boards.

Furthermore, circulating air is formed in the entire upper case 2B by circulating among the drive circuit board 21, the control circuit board 22, and the power circuit board 23, thereby reducing the temperature difference of the air in the upper case 2B.

In addition, by enhancing natural convection between laminated substrates, cooling can be performed without using forced circulation using fins, thereby reducing the number of components and reducing the size of the device.

Thus, as in the above-mentioned second embodiment, when the entire casing 2 is tilted, the casing 2 itself can be applied to the conventional example only by providing the mounting casing and the fixing casing, and therefore no special board support is required. Components can simplify the structure.

Next, Embodiment 3 of the present invention will be described using FIG. 10 .

In Embodiment 3, instead of inclining the entire case 2, the bottom surface of the cooling body 3 is formed as an inclined surface inclined upward and rightward.

That is, in Embodiment 3, as shown in FIG. 10 , the bottom surface 3 e of the cooling body 3 is formed as an inclined surface inclined upward and rightward at the aforementioned inclination angle θ. Thus, when the lower casing 2A is arranged on a horizontal plane, the upper casing 2B is inclined at the inclination angle θ, and thus is in the same state as the second embodiment described above.

According to Embodiment 3, since the upper case 2B is inclined in the same manner as in Embodiment 2, the same effect as in Embodiment 2 can be obtained, and the driving circuit board 21, the control circuit board 22, and the power circuit board 23 can be reinforced. natural convection between them. As a result, heat accumulation between the substrates is eliminated, and circulating air can be formed in the casing.

In addition, in the above-mentioned third embodiment, the case where the facing surface of the cooling body 3 is inclined has been described, but it is not limited to this, and the lower surface 2Aa of the lower case 2A may be directed downward to the left as shown in FIG. 11 . tilt. In this case, too, since the upper case 2B is inclined in the same manner as in the second embodiment, the same effects as those in the second and third embodiments can be obtained.

Next, Embodiment 4 of the present invention will be described using FIG. 12 .

This fourth embodiment can exhibit a greater effect of lowering the temperature inside the housing than that of the first embodiment described above.

That is, in Embodiment 4, as shown in FIG. 12 , in the configuration of FIG. 1 in Embodiment 1 described above, except that the hot air from the control circuit board 22 and power circuit board 23 arranged obliquely is transported by natural convection and arrives at The cover body 2b of the upper case 2B has the same structure as that of FIG. 1 except that the radiating fins 41 constituting the radiating portion are arranged at the position of the lower surface forming the inner wall surface. Therefore, in FIG. 12, parts corresponding to those in FIG. 1 are denoted by the same reference numerals, and detailed description thereof will be omitted here.

According to the fourth embodiment, the hot air from the inclined control circuit board 22 and power circuit board 23 is transported by natural convection and reaches the cover body 2b at the highest temperature in the upper case 2B. Part of the cooling fins 41. Therefore, the surface area of the upper space of the upper casing 2B in which relatively light hot air collects can be increased due to the disposition of the heat radiation fins 41 . Therefore, since the radiating fins 41 are arranged, heat exchange with the outside can be actively performed, and the temperature of the internal air in the upper case 2B can be lowered.

Moreover, since the cooling body 3 is connected to the upper casing 2B, the upper casing 2B is cooled to a certain temperature, and the internal air temperature can be lowered more effectively.

In addition, in the above-mentioned Embodiment 4, the case where the heat dissipation fin 41 is used as the heat dissipation portion has been described, but it is not limited to this, and it may also be formed on at least one of the inner wall of the cover body 2b and the square cylinder 2a. A plurality of grooves or protrusions constitute a heat dissipation portion with an increased surface area.

Next, Embodiment 5 of the present invention will be described using FIG. 13 .

This fifth embodiment can exhibit a greater effect of lowering the temperature than that of the second embodiment described above.

That is, in Embodiment 5, as shown in FIG. 13 , in the structure of FIG. 8 of Embodiment 2 above, except for the square cylinder where the hot air from the control circuit board 22 and the power circuit board 23 arrives via natural convection, The body 2a has the same structure as that of FIG. 8 except that the heat dissipation fins 42 constituting the heat dissipation portion are disposed on the inner wall. Therefore, in FIG. 13, parts corresponding to those in FIG. 8 are denoted by the same reference numerals, and detailed description thereof will be omitted here.

According to the fifth embodiment, the hot air from the inclined control circuit board 22 and power circuit board 23 built in the inclined case 2 reaches the square tube at the highest temperature in the upper case 2B through natural convection. Radiation fins 42 serving as heat dissipation portions are arranged above the body 2a.

Therefore, since the radiating fins 42 are arranged, the surface area of the connection position between the upper case 2B and the square cylinder 2a where relatively light hot air collects can be increased. Therefore, since the radiating fins 42 are arranged, heat exchange with the outside can be actively performed, and the temperature of the internal air in the upper casing 2B can be lowered.

Moreover, since the cooling body 3 is connected to the upper casing 2B, the upper casing 2B is cooled to a certain temperature, and the internal air temperature can be lowered more effectively.

In addition, in the above-mentioned fifth embodiment, the case where the cooling fins 42 are connected to the cooling body 3 via the square cylinder 2a has been described, but the present invention is not limited thereto, and a connection between the cooling fins 42 and the cooling body 3 is also possible. The heat conductor is arranged to form a heat conduction path independent from the square cylinder 2a. In this case, since a dedicated heat conduction path is formed for the heat radiation fin 42, the cooling effect of the heat radiation fin 42 can be further improved.

In addition, in the above-mentioned Embodiment 5, the case where the heat dissipation fin 42 is used as the heat dissipation portion has been described, but it is not limited to this, and it may also be formed on at least one of the inner wall of the cover body 2b and the square cylinder 2a. A plurality of grooves or protrusions constitute a heat dissipation portion with an increased surface area.

Next, Embodiment 6 of the present invention will be described using FIG. 14 .

The sixth embodiment can further improve the heat dissipation effect of the heating circuit components mounted on the control circuit board and the power circuit board of the first embodiment.

That is, in Embodiment 6, as shown in FIG. 14 , the control circuit board 22 is supported by a heat conduction support member 62 via a heat conduction member 61 in the configuration of FIG. 2 of the above Embodiment 1. As shown in FIG. The heat conduction support member 62 includes a heat conduction support plate portion 62 a in contact with the heat conduction member 61 , and a heat conduction support side plate portion 62 c connected to the connection portion 62 b on the right end side of the heat conduction support plate portion 62 a. Furthermore, the lower end of the heat transfer support side plate portion 62c is in contact with the cooling body 3 .

Similarly, the power circuit board 23 is also supported by the heat conduction support member 65 via the heat conduction member 64 . The heat conduction support member 65 includes a heat conduction support plate portion 65 a in contact with the heat conduction member 61 , and a heat conduction support side plate portion 65 c connected to the connection portion 65 b on the right end side of the heat conduction support plate portion 65 a. Furthermore, the lower end of the heat transfer support side plate portion 65c is in contact with the cooling body 3 .

Furthermore, the lower ends of the heat transfer support side plate portions 62c and 65c in the heat transfer support members 62 and 65 are integrally connected by a common bottom plate portion 66 . The bottom plate portion 66 is accommodated in a rectangular frame-shaped annular groove 67 formed on the upper surface of the cooling body 3 , and is fixed together with the cooling body 3 by fixing screws 14 .

Here, as the thermally conductive members 61 and 64 , for example, a material that exhibits insulating performance and improves thermal conductivity by sandwiching a metal filler inside silicone rubber, which is an elastic body, can be applied. By compressing these heat conduction members 61 and 64 , for example, by about 5 to 30% in the thickness direction, thermal resistance can be reduced and an efficient heat conduction effect can be exhibited. Accordingly, when the control circuit board 22 sandwiching the heat conduction member 61 and the heat conduction support plate portion 62 a are fixed by the fixing screws 68 , the heat conduction member 61 is compressed and fixed at a compression rate of about 5 to 30%. Similarly, when fixing the power circuit board 23 sandwiching the heat conduction member 64 and the heat conduction support plate portion 65 a with the fixing screws 69 , the heat conduction member 64 is compressed and fixed at a compression rate of about 5 to 30%.

In addition, in the heat transfer support member 65 , it is preferable to form an opening through which natural convection hot air is discharged outside near the connecting portion of the heat transfer support side plate portion 65c to the heat transfer support plate portion 65a.

According to Embodiment 6, the control circuit board 22 and the power circuit board 23 on which the heating circuit components are mounted are supported by the heat conduction support plate portions 62 a and 65 a via the heat conduction members 61 and 64 , respectively, and these heat conduction support plate portions 62 a and 65 a pass through the heat conduction support plate portions 62 a and 65 a. The support side plate portions 62c and 65c are connected to the heat sink 3 . As a result, the heat generated by the heating circuit components mounted on the control circuit board 22 is conducted to the heat conduction support plate portion 62 a through the heat conduction member 61 , and is conducted from the heat conduction support plate portion 62 a to the cooling body 3 via the heat conduction support side plate portion 62 c. To dissipate heat.

Similarly, the heat generated by the heating circuit components mounted on the power circuit board 23 is conducted to the heat conduction support plate portion 65a through the heat conduction member 64, and is conducted from the heat conduction support plate portion 65a to the cooling body 3 via the heat conduction support side plate portion 65c. To dissipate heat.

Therefore, a heat conduction path independent of the upper case 2B is formed to dissipate the heat generated by the heating circuit components of the control circuit board 22 and the power circuit board 23 to the cooler 3, so that the heat generation of the control circuit board 22 and the power circuit board 23 can be controlled For more effective heat dissipation. Thereby, it is possible to effectively reduce the temperature rise in the upper casing 2B. Therefore, hot air from the control circuit board 22 and the power circuit board 23 can be reduced, and the temperature rise in the upper case 2B can be largely suppressed.

Moreover, since the heat conduction support side plate portions 62c and 65c are integrally formed by the common bottom plate portion 66, there is no seam between components between the heat conduction support side plate portions 62c and 65c and the bottom plate portion 66, thereby enabling Suppresses thermal resistance.

And, since the heat dissipation path from the control circuit board 22 on which the heating circuit components are mounted to the cooling body 3 is independent from the upper case 2B, the upper case 2B does not need to use metal such as aluminum with high thermal conductivity, and can be formed by It is made of synthetic resin material, so it can be reduced in weight.

In addition, since the heat dissipation path does not depend on the case 2, the heat dissipation path can be formed in the power conversion device 1 alone, so the power conversion device 1 composed of the semiconductor power module 11, the drive circuit board 21, and the control circuit board 22 can be Applicable to housing 2 and cooling body 3 in various ways.

Next, Embodiment 7 of the present invention will be described using FIG. 15 .

This seventh embodiment is obtained by applying the sixth embodiment described above to the third embodiment described above.

That is, in Embodiment 7, as shown in FIG. 15 , the control circuit board 22 and the power circuit board 23 of Embodiment 3 are supported by heat conduction support members 62 and 65 via heat conduction members 61 and 64 , respectively. These heat conduction support members 62 and 65 include heat conduction support plate portions 62a and 65a in contact with heat conduction members 61 and 64, and heat conduction support side plate portions 62c and 62c connected between the heat conduction support plate portions 62a and 65a and the cooling body 3. 65c, the heat conduction support side plate portions 62c and 65c are connected to each other by a common bottom plate portion 66 .

In Embodiment 8, the heat generated by the heating circuit components mounted on the control circuit board 22 and the power circuit board 23 is conducted to the heat-conducting support plate portions 62a and 65a through the heat-conducting members 61 and 64, and further passes through the heat-conducting support side plate. The portions 62c and 65c are conducted to the cooling body 3 to dissipate heat.

Therefore, hot air from the control circuit board 22 and the power circuit board 23 can be reduced, and the temperature rise in the upper case 2B can be largely suppressed.

Next, Embodiment 8 of the present invention will be described using FIG. 18 .

This eighth embodiment is obtained by applying the sixth embodiment described above to the second embodiment described above.

In Embodiment 8, control circuit board 22 and power circuit board 23 are also supported by heat conduction support members 62 and 65 via heat conduction members 61 and 64 in the structure shown in FIG. 8 of Embodiment 2 above. These heat conduction support members 62 and 65 include heat conduction support plate portions 62a and 65a in contact with heat conduction members 61 and 64, and heat conduction support side plate portions 62c and 62c connected between the heat conduction support plate portions 62a and 65a and the cooling body 3. 65c, the heat conduction support side plate portions 62c and 65c are connected to each other by a common bottom plate portion 66 .

In Embodiment 8, the heat generated by the heating circuit components mounted on the control circuit board 22 and the power circuit board 23 is conducted to the heat-conducting support plate portions 62a and 65a through the heat-conducting members 61 and 64, and further passes through the heat-conducting support side plate. The portions 62c and 65c are conducted to the cooling body 3 to dissipate heat.

Therefore, hot air from the control circuit board 22 and the power circuit board 23 can be reduced, and the temperature rise in the upper case 2B can be largely suppressed.

With regard to Embodiment 2 described above, the results shown in FIG. 17 were obtained after thermal analysis simulation was performed. In this thermal analysis simulation, as shown in FIG. 17 , thermal analysis simulations were performed on horizontal placement in which the entire casing 2 was made horizontal, and inclined placement in which the inclination angle was set to 5°.

The results of this thermal analysis simulation are shown in Fig. 17. In the case of the same horizontal placement as in the conventional example, as shown in Fig. 17(a), heat accumulation occurs between the substrates and a temperature distribution occurs in the case uneven.

On the other hand, when the entire case 2 is tilted with the inclination angle set at 5°, as shown in FIG. K.

Furthermore, when the temperature rise during horizontal placement in the conventional example is set to 100%, the above-mentioned thermal analysis simulation results are expressed as the temperature drop rates of the drive circuit board 21, the control circuit board 22, and the power circuit board 23, As shown in Figure 18.

As can be seen from FIG. 18 , when the entire casing 2 is tilted by 5°, the temperature at each of the drive circuit board 21 , the control circuit board 22 and the power circuit board 23 can be reduced by about 30%.

It can be verified from the results of FIG. 17 and FIG. 18 that by inclining the housing 2 as a whole, the natural convection between the substrates can be enhanced, thereby eliminating heat accumulation between the substrates and uneven temperature distribution in the housing 2 .

Therefore, when only the control circuit board 22 and the power circuit board 23 are tilted as described in Embodiments 1, 4, and 6, when the entire case 2 is tilted as described in Embodiments 2 and 5, Next, when the cooling body 3 or the lower casing 2A is inclined as described in Embodiment 3 and Embodiment 7, since the control circuit board 22 and the power circuit board 23 are supported obliquely, natural convection can be enhanced. Heat accumulation can be eliminated, thereby improving the cooling effect of the control circuit board 22 and the power circuit board 23 .

Next, Embodiment 9 of the present invention will be described using FIG. 19 .

This ninth embodiment is obtained by improving the above-mentioned sixth embodiment.

That is, in Embodiment 9, in the configuration shown in FIG. 14 of Embodiment 6 above, a connection portion 62b is formed at the left end of a heat transfer support plate portion 62a that supports the control circuit board 22 via a heat transfer member 61, and the connection portion 62b is connected to the heat transfer support plate. The side plate portion 62c is connected. Moreover, the connection part 65b connected to the heat transfer support side plate part 65c is formed in the right end of the heat transfer support plate part 65a which supports the power supply circuit board 23 via the heat transfer member 64. This ninth embodiment has the same structure as that of FIG. 14 except for the above-mentioned structure, and the parts corresponding to those in FIG. 14 are given the same reference numerals, and detailed description thereof will be omitted.

According to Embodiment 9, the heat conduction support plate portion 62a supporting the control circuit board 22 on the lower side on which the heat generating circuit components are mounted is connected to the heat conduction support side plate portion 62c at the left end on the upper end side. The heat conduction support plate part 65a of the power supply circuit board 23 on the upper side of the circuit component is connected to the heat conduction support side plate part 65c at the right end which becomes the lower end side. Thereby, the left end side between the control circuit board 22 and the power circuit board 23 is in an open state, and is not closed by the heat conduction support member 65 .

Therefore, the hot air discharged from the control circuit board 22 that generates a large amount of heat can smoothly move to the upper left portion of the upper case 2B. Therefore, it is possible to improve the cooling effect of the control circuit board 22 and the power circuit board 23 , reduce the air resistance, and further intensify the natural convection.

In the sixth to ninth embodiments described above, the case where the heat transfer support plate portions 62a and 65a and the heat transfer support side plate portions 62c and 65c of the heat transfer support members 62 and 65 are separately configured has been described. However, this invention is not limited to the said structure, As shown in FIG. In this case, since no joint is formed between the heat conduction support plate portions 62a and 65a and the heat conduction support side plate portions 62c and 62c, thermal resistance can be reduced to more effectively dissipate heat.

In addition, in Embodiments 1 to 9 described above, a case where the film capacitor 4 is used as a filter capacitor has been described, but the present invention is not limited thereto, and a cylindrical electrolytic capacitor may also be used.

In addition, in the above-mentioned Embodiments 1 to 9, the case where the power conversion device of the present invention is applied to an electric vehicle has been described, but the present invention is not limited thereto, and the present invention can also be applied to a railway vehicle running on a track. Suitable for any electric drive vehicle. In addition, the power conversion device is not limited to electrically driven vehicles, and the power conversion device of the present invention can also be applied when driving actuators such as electric motors in other industrial equipment.

Industrial Applicability

According to the present invention, it is possible to provide a power conversion device capable of enhancing mounting by inclining a plurality of mounting substrates on which circuit components including heating circuit components are mounted relative to a plane perpendicular to the direction of gravity. Natural convection between substrates prevents heat build-up.

Label description

1...power conversion device, 2...casing, 2A...lower casing, 2B...upper casing, 3...cooling body, 4...film capacitor, 11...semiconductor power module, 12...casing body, 13...radiating member, 16 ...Board fixing part, 17a, 17b...Screw shaft, 18a, 18b, 19a, 19b, 20a, 20b...Spacer, 21...Drive circuit board, 22...Control circuit board, 23...Power circuit board, 24a, 24b...Nut , 25a, 25b...spacer, 26a, 26b...nut, 27a, 27b...spacer, 30...fixed part, 31a, 31b...mounting shell, 32a, 32b...fixed shell, 41, 42...radiating fin, 61, 64...heat transfer member, 62...heat transfer support member, 62a...heat transfer support plate part, 62b...connection part, 62c...heat transfer support side plate part, 65...heat transfer support member, 65a...heat transfer support plate part, 65b...connection part , 65c... heat conduction support side plate part, 66... bottom plate part

Claims (23)

1. a power conversion device, is characterized in that, comprising:

Semi-conductor power module, a face of this semi-conductor power module engages with cooling body; And

Multiple installation base plates, the plurality of installation base plate is layered in the another side side of described semi-conductor power module across air layer, and the circuit elements device that comprises the heating circuit components and parts that drive described semi-conductor power module is installed on the plurality of installation base plate,

Multiple described installation base plates are with respect to tilting with the orthogonal plane of weight direction.

2. a power conversion device, is characterized in that, comprising:

Semi-conductor power module, is built-in with the thyristor that power transfer is used in the casing of this semi-conductor power module, and is formed with the cooling component contacting with cooling body on a face of this casing; And

Multiple installation base plates, the plurality of installation base plate is stacked and be configured in the side contrary with cooling component of described semi-conductor power module across air layer, and the circuit elements device that comprises the heating circuit components and parts that drive described thyristor is installed on the plurality of installation base plate

Described installation base plate is to be supported with respect to the mode tilting with the orthogonal plane of gravity direction.

3. a power conversion device, is characterized in that, comprising:

Semi-conductor power module, is built-in with the thyristor that power transfer is used in the casing of this semi-conductor power module, and is formed with the cooling component contacting with cooling body on a face of this casing;

Multiple installation base plates, the plurality of installation base plate is stacked and be configured in the side contrary with cooling component of described semi-conductor power module across air layer, and the circuit elements device that comprises the heating circuit components and parts that drive described thyristor is installed on the plurality of installation base plate; And

Housing, this housing at least surrounds described semi-conductor power module and multiple described installation base plate,

Described installation base plate is to be supported with respect to the mode tilting with the orthogonal plane of gravity direction.

4. power conversion device as claimed in claim 2 or claim 3, is characterized in that,

Described semi-conductor power module is configured to and the plane parallel that is orthogonal to gravity direction, and utilizes supporting member that multiple described installation base plates are supported to respect to tilting with the orthogonal plane of gravity direction.

5. power conversion device as claimed in claim 2 or claim 3, is characterized in that,

The face contacting with cooling component described semiconductor module described cooling body is formed as, with respect to the inclined plane tilting with the orthogonal plane of gravity direction, disposing abreast described semi-conductor power module and multiple described installation base plate on this inclined plane.

6. power conversion device as claimed in claim 3, is characterized in that,

Described housing is by the upper body of outer peripheral face of upper surface that covers described cooling body, and the outer peripheral face and the inner lower case that capacitor is installed that cover the lower surface of described cooling body form,

The upper surface of described lower case is formed as, with respect to the inclined plane tilting with the orthogonal plane of gravity direction, disposing abreast described cooling body, described semi-conductor power module and multiple described installation base plate on this inclined plane.

7. power conversion device as claimed in claim 2 or claim 3, is characterized in that,

The free convection with from described installation base plate of described inner walls face relative to position on be formed with radiating part.

8. power conversion device as claimed in claim 7, is characterized in that,

Described radiating part is made up of the radiating fin being formed on inner walls face.

9. power conversion device as claimed in claim 7, is characterized in that,

Described radiating part is made up of the multiple slot parts that are formed on inner walls face.

10. power conversion device as claimed in claim 2 or claim 3, is characterized in that,

Multiple described installation base plates are supported by heat conduction supporting board across heat conduction member, the casing of described semi-conductor power module is formed as having the flat rectangular shape of rectangular planes, described heat conduction supporting board surrounds the two the heat conduction path of housing of described semi-conductor power module and each described installation base plate and is connected with described cooling body by being independent of, and described heat conduction path is configured to by the side of the long side of described casing.

11. power conversion devices as claimed in claim 10, is characterized in that,

Described heat conduction path is made up of the heat conduction support side board that links described heat conduction supporting board and described cooling body.

12. power conversion devices as claimed in claim 11, is characterized in that,

Described heat conduction supporting board and described heat conduction support side board are made up of the high metal material of pyroconductivity.

13. power conversion devices as claimed in claim 11, is characterized in that,

In the situation that being supported with upper and lower a pair of installation base plate, described heat conduction support side board is connected with the upper end side of heat conduction supporting board of the described installation base plate of supporting downside, and is connected with the lower end side of the heat conduction supporting board of the described installation base plate of supporting upside.

14. power conversion devices as claimed in claim 11, is characterized in that,

Described heat conduction supporting board and heat conduction supporting board form as one.

15. 1 kinds of power conversion devices, is characterized in that, comprising:

Semi-conductor power module, is built-in with the thyristor that power transfer is used in the casing of this semi-conductor power module, and is formed with the cooling component contacting with cooling body on a face of this casing;

Multiple installation base plates, the plurality of installation base plate is stacked and be configured in the side contrary with cooling component of described semi-conductor power module across air layer, and the circuit elements device that comprises the heating circuit components and parts that drive described thyristor is installed on the plurality of installation base plate; And

Housing, this housing at least surrounds described semi-conductor power module and multiple described installation base plate,

Described housing is configured obliquely, to make multiple described installation base plate in this housing with respect to tilting with the orthogonal plane of gravity direction.

16. power conversion devices as claimed in claim 15, is characterized in that,

The free convection with from described installation base plate of described inner walls face relative to position on be formed with radiating part.

17. power conversion devices as claimed in claim 16, is characterized in that,

Described radiating part is made up of the radiating fin being formed on inner walls face.

18. power conversion devices as claimed in claim 16, is characterized in that,

Described radiating part is made up of the multiple slot parts that are formed on inner walls face.

19. power conversion devices as described in any one of claim 15 to 18, is characterized in that,

Multiple described installation base plates are supported by heat conduction supporting board across heat conduction member, the casing of described semi-conductor power module is formed as having the flat rectangular shape of rectangular planes, described heat conduction supporting board surrounds the two the heat conduction path of housing of described semi-conductor power module and each described installation base plate and is connected with described cooling body by being independent of, and described heat conduction path is configured to by the side of the long side of described casing.

20. power conversion devices as claimed in claim 15, is characterized in that,

Described heat conduction path is made up of the heat conduction support side board that links described heat conduction supporting board and described cooling body.

21. power conversion devices as claimed in claim 16, is characterized in that,

Described heat conduction supporting board and described heat conduction support side board are made up of the high metal material of pyroconductivity.

22. power conversion devices as claimed in claim 20, is characterized in that,

In the situation that being supported with upper and lower a pair of installation base plate, described heat conduction support side board is connected with the upper end side of heat conduction supporting board of the described installation base plate of supporting downside, and is connected with the lower end side of the heat conduction supporting board of the described installation base plate of supporting upside.

23. power conversion devices as claimed in claim 20, is characterized in that,

Described heat conduction supporting board and heat conduction supporting board form as one.