CN103923572A - UV (ultraviolet) peelable adhesive and preparation method thereof - Google Patents
UV (ultraviolet) peelable adhesive and preparation method thereof Download PDFInfo
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- CN103923572A CN103923572A CN201410180484.2A CN201410180484A CN103923572A CN 103923572 A CN103923572 A CN 103923572A CN 201410180484 A CN201410180484 A CN 201410180484A CN 103923572 A CN103923572 A CN 103923572A
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- 239000000853 adhesive Substances 0.000 title claims abstract description 17
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 17
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000003292 glue Substances 0.000 claims abstract description 33
- 239000011347 resin Substances 0.000 claims abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 239000000203 mixture Substances 0.000 claims abstract description 20
- 229920002725 thermoplastic elastomer Polymers 0.000 claims abstract description 12
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 54
- 239000003795 chemical substances by application Substances 0.000 claims description 18
- 238000003756 stirring Methods 0.000 claims description 17
- 229920006132 styrene block copolymer Polymers 0.000 claims description 13
- 239000002904 solvent Substances 0.000 claims description 10
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims description 8
- VSKJLJHPAFKHBX-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 VSKJLJHPAFKHBX-UHFFFAOYSA-N 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 3
- 229920001577 copolymer Polymers 0.000 claims description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 3
- 125000000524 functional group Chemical group 0.000 claims description 2
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 claims 2
- SSOONFBDIYMPEU-UHFFFAOYSA-N [3-hydroxy-2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propyl] prop-2-enoate Chemical compound OCC(CO)(CO)COCC(CO)(CO)COC(=O)C=C SSOONFBDIYMPEU-UHFFFAOYSA-N 0.000 claims 2
- 150000003254 radicals Chemical class 0.000 claims 2
- 239000012965 benzophenone Substances 0.000 claims 1
- 239000000178 monomer Substances 0.000 claims 1
- 239000005012 oleoresinous Substances 0.000 claims 1
- 239000004575 stone Substances 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
- 229920002554 vinyl polymer Polymers 0.000 claims 1
- 239000000084 colloidal system Substances 0.000 abstract description 6
- 238000005286 illumination Methods 0.000 abstract description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 51
- FDSUVTROAWLVJA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)COCC(CO)(CO)CO FDSUVTROAWLVJA-UHFFFAOYSA-N 0.000 description 15
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 description 15
- 239000012949 free radical photoinitiator Substances 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 10
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 9
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 9
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 9
- 239000007788 liquid Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 229920001971 elastomer Polymers 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 3
- 229920006267 polyester film Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- TUOBEAZXHLTYLF-UHFFFAOYSA-N [2-(hydroxymethyl)-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(CC)COC(=O)C=C TUOBEAZXHLTYLF-UHFFFAOYSA-N 0.000 description 1
- INXWLSDYDXPENO-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CO)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C INXWLSDYDXPENO-UHFFFAOYSA-N 0.000 description 1
- -1 acyl phosphine oxide Chemical compound 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
本发明为一种UV可剥离胶的制备方法，其组成及质量百分比为热塑性弹性体为5—60、改性树脂为10—80、光敏成分为2—40和光引发剂为0.1—4。本发明制备的UV可剥离胶在光照之前有较强的粘结力，180°剥离强度达到8～15N/25mm；光照后胶体从被粘物表面能够很容易地实现剥离，剥离强度不超过2～3N/25mm，且剥离后被粘物表面无残胶。The invention relates to a preparation method of UV peelable adhesive. The composition and mass percentage are 5-60% of thermoplastic elastomer, 10-80% of modified resin, 2-40% of photosensitive component and 0.1-4% of photoinitiator. The UV peelable adhesive prepared by the present invention has strong cohesive force before illumination, and the 180° peel strength reaches 8-15N/25mm; after illumination, the colloid can be easily peeled off from the surface of the adherend, and the peel strength does not exceed 2 ~3N/25mm, and there is no residual glue on the surface of the adherend after peeling off.
Description
技术领域：Technical field:
本发明涉及一种UV可剥离胶的制备方法，主要应用于单晶硅材料、集成电路、印刷线路板等半导体器件与投影仪、望远镜、光学显微镜等光学仪器的制造加工过程。The invention relates to a preparation method of UV peelable adhesive, which is mainly used in the manufacturing process of semiconductor devices such as monocrystalline silicon materials, integrated circuits, printed circuit boards, and optical instruments such as projectors, telescopes, and optical microscopes.
背景技术：Background technique:
在大规模集成电路的制造和半导体器件的制造加工过程中，必不可少的基础材料是半导体芯片，半导体芯片是以单晶硅片加工而成的。单晶硅片简称晶圆。在对晶圆材料进行切割、磨削加工时，需要用一种特殊的压敏胶带进行粘结固定。加工完毕后，需要把加工好的晶圆切片从固定胶上能轻易的完全剥离下来，不影响晶圆材料本身。这种使用时具有高粘结强度而通过紫外光照后又可以迅速彻底的失去粘性的特殊胶带称之为UV可剥离胶。In the manufacturing of large-scale integrated circuits and the manufacturing and processing of semiconductor devices, the essential basic material is semiconductor chips, which are processed from single crystal silicon wafers. Monocrystalline silicon wafers are referred to as wafers. When cutting and grinding wafer materials, a special pressure-sensitive adhesive tape is required for bonding and fixing. After processing, the processed wafer slices need to be easily and completely peeled off from the adhesive without affecting the wafer material itself. This special adhesive tape, which has high bonding strength during use and can quickly and completely lose its stickiness after being exposed to ultraviolet light, is called UV peelable adhesive.
目前UV可剥离胶大都是丙烯酸酯类的，文献UV Curable Pressure-Sensitive Adhesivesfor Fabricating Semiconductors.II.The Effect of Functionality of Acrylate Monomerson the Adhesive Properties中提到一种由丙烯酸丁酯(80％mmol)、甲基丙烯酸甲酯(9.7％mmol)、丙烯酸羟乙酯(5％mmol)、丙烯酸(5.3％mmol)组成的丙烯酸酯共聚物(基胶)，其分子量可达65万。通过向制得的丙烯酸酯共聚物中加入二季戊四醇五/六丙烯酸酯、交联剂三羟甲基丙烷二丙烯酸酯以及光引发剂1-羟基环己基苯基甲酮制得的UV可剥离胶，光照前180°剥离强度仅有1.4N/25mm,不足以提供光照前晶圆材料加工时所需的粘结强度。At present, most of the UV peelable adhesives are acrylic esters. The document UV Curable Pressure-Sensitive Adhesives for Fabricating Semiconductors.II. Acrylate copolymer (base rubber) composed of methyl acrylate (9.7% mmol), hydroxyethyl acrylate (5% mmol), acrylic acid (5.3% mmol), its molecular weight can reach 650,000. UV peelable adhesive prepared by adding dipentaerythritol penta/hexaacrylate, crosslinker trimethylolpropane diacrylate and photoinitiator 1-hydroxycyclohexyl phenyl ketone to the prepared acrylate copolymer , the 180°peel strength before light is only 1.4N/25mm, which is not enough to provide the bonding strength required for wafer material processing before light.
中国专利CN1560166A中也提到了类似的做法，其光照前的180°剥离强度也只有3～4N/25mm。A similar method is also mentioned in Chinese patent CN1560166A, and its 180° peel strength before light is only 3-4N/25mm.
发明内容：Invention content:
本发明针对上述问题提供了一种UV可剥离胶的制备方法。当前市场上的这种UV可剥离胶其基胶大都是丙烯酸酯类的，本发明采用的是热塑性弹性体与改性树脂的混合制得，与丙烯酸酯类的基胶相比，热塑性弹性体相对分子量很大，柔性好，结构规整，稳定性好，极性小，与聚酯薄膜的粘结性更好，有利于剥离，可长时间放置并且不易掉胶。通过热塑性弹性体与改性树脂的混合制得的基胶有很好的粘接力，加入光敏成分后形成的胶体，在紫外光照射前仍具有较强的粘结强度，光照前其180°剥离强度可达到8～15N/25mm，足以使晶圆材料很好的固定在基材上，便于划切加工，紫外光照射后，剥离强度骤降，被粘物可以不费力的从基材上剥离开来，并且被粘物表面无残胶。The present invention provides a kind of preparation method of UV peelable glue aiming at the above problems. Most of the base glues of this UV peelable glue on the market are acrylic esters. What the present invention uses is a mixture of thermoplastic elastomers and modified resins. Compared with acrylic base glues, thermoplastic elastomers Relatively large molecular weight, good flexibility, regular structure, good stability, low polarity, better adhesion with polyester film, easy to peel off, can be placed for a long time and is not easy to fall off. The base rubber prepared by mixing thermoplastic elastomer and modified resin has good adhesion. The colloid formed after adding photosensitive components still has strong bonding strength before ultraviolet light irradiation, and its 180° The peel strength can reach 8-15N/25mm, which is enough to fix the wafer material on the substrate well, which is convenient for scribing and cutting. Peel off, and there is no residual glue on the surface of the adherend.
本发明的技术方案为：Technical scheme of the present invention is:
一种UV可剥离胶的制备方法，其组成及配比包括：A preparation method of UV peelable adhesive, its composition and proportioning comprise:
所述的制备方法包括如下步骤：按照上面的配比，The preparation method comprises the following steps: according to the above proportioning,
(1)，分别将热塑性弹性体与改性树脂溶解于溶剂中，将上述两种溶液混合，搅拌均匀，即得到基胶；其中，各自所需的溶剂量为质量比：热塑性弹性体：溶剂＝1:1～4；改性树脂：溶剂＝2:2～3；(1), respectively dissolve the thermoplastic elastomer and the modified resin in the solvent, mix the above two solutions, and stir evenly to obtain the base rubber; wherein, the amount of solvent required for each is the mass ratio: thermoplastic elastomer: solvent ＝1:1～4; modified resin: solvent＝2:2～3;
(2)，向基胶中加入光敏成分以及自由基光引发剂，搅拌均匀后制得UV可剥离胶；(2), add photosensitive component and free radical photoinitiator in base glue, make UV peelable glue after stirring evenly;
本发明涉及的百分比为质量百分比。The percentages involved in the present invention are mass percentages.
所述的热塑性弹性体为苯乙烯/丁二烯/苯乙烯嵌段共聚物和苯乙烯/异戊二烯/苯乙烯嵌段共聚物中的一种或两种。The thermoplastic elastomer is one or both of styrene/butadiene/styrene block copolymer and styrene/isoprene/styrene block copolymer.
所述改性树脂为C5系石油树脂或松香树脂。The modified resin is C5 series petroleum resin or rosin resin.
(2)步中所述光敏成分为二季戊四醇五丙烯酸酯/二季戊四醇六丙烯酸酯两者的混合物，体积比为二季戊四醇五丙烯酸酯/二季戊四醇六丙烯酸酯＝20～40：60～80，或者是九官能团的聚氨酯丙烯酸酯。(2) The photosensitive component described in the step is a mixture of dipentaerythritol pentaacrylate/dipentaerythritol hexaacrylate, and the volume ratio is dipentaerythritol pentaacrylate/dipentaerythritol hexaacrylate=20～40:60～80, or It is a nine-functional urethane acrylate.
所述的溶剂具体是体积比为1:1的甲苯/醋酸乙酯剂。The solvent is specifically a toluene/ethyl acetate agent with a volume ratio of 1:1.
所述自由基光引发剂为a-羟烷基苯酮或者酰基膦氧化物。The free radical photoinitiator is a-hydroxyalkyl phenone or acyl phosphine oxide.
本发明的有益效果为：1、制备的UV可剥离胶在光照之前有较强的粘结力，180°剥离强度达到8～15N/25mm；2、光照后胶体从被粘物表面能够很容易地实现剥离，剥离强度不超过2～3N/25mm，且剥离后被粘物表面无残胶；3、制备的UV可剥离胶粘贴在被保护材料表面后,通过光照的方式使之迅速失去粘性，快速且操作简便，照射时间没有严格的限制，功率为1000w的高压汞灯下照射时间不低于20～30s范围内皆可；4、丙烯酸酯类基胶的性能特点是硬、脆、不稳定，由热塑性弹性体与改性树脂的混合制得的基胶柔性好性能稳定，耐老化性能好，便于长时间放置。The beneficial effects of the present invention are as follows: 1. The prepared UV peelable adhesive has strong cohesive force before illumination, and the 180° peel strength reaches 8-15N/25mm; 2. After illumination, the colloid can be easily removed from the adherend surface. The peeling can be realized in a perfect way, the peeling strength is not more than 2-3N/25mm, and there is no residual glue on the surface of the adherend after peeling; 3. After the prepared UV peelable adhesive is pasted on the surface of the protected material, it is quickly lost by light Viscous, fast and easy to operate, there is no strict limit on the irradiation time, and the irradiation time under a high-pressure mercury lamp with a power of 1000w is not less than 20-30s; 4. The performance characteristics of acrylic base glue are hard, brittle, Unstable, the rubber base prepared by mixing thermoplastic elastomer and modified resin has good flexibility, stable performance, good aging resistance, and is easy to place for a long time.
具体实施方式Detailed ways
本发明涉及的苯乙烯/丁二烯/苯乙烯嵌段共聚物具体为中国巴陵石化的SBS1401；苯乙烯/异戊二烯/苯乙烯嵌段共聚物具体为中国岳阳石化的SIS1105；九官能团的聚氨酯丙烯酸酯具体为沙多玛的CN9013NS。The styrene/butadiene/styrene block copolymer involved in the present invention is specifically SBS1401 of China Baling Petrochemical; the specific styrene/isoprene/styrene block copolymer is SIS1105 of China Yueyang Petrochemical; nine functional groups The specific urethane acrylate is Sartomer's CN9013NS.
实例1：Example 1:
15g苯乙烯/丁二烯/苯乙烯嵌段共聚物溶解于45g体积比为1:1的甲苯/醋酸乙酯剂中，25g松香树脂溶解于40g体积比为1:1的甲苯/醋酸乙酯剂中，将上述两种液体混合后搅拌均匀，制得基胶。将10g二季戊四醇五丙烯酸酯/二季戊四醇六丙烯酸酯两者的混合物(质量比为二季戊四醇五丙烯酸酯：二季戊四醇六丙烯酸酯＝30：70)、2g自由基光引发剂双酰基氧化膦加至基胶中，搅拌均匀。15g styrene/butadiene/styrene block copolymer is dissolved in the toluene/ethyl acetate agent that 45g volume ratio is 1:1, and 25g rosin resin is dissolved in 40g volume ratio is the toluene/ethyl acetate of 1:1 In the agent, mix the above two liquids and stir evenly to prepare the base gum. The mixture of 10g dipentaerythritol pentaacrylate/dipentaerythritol hexaacrylate (mass ratio is dipentaerythritol pentaacrylate: dipentaerythritol hexaacrylate=30:70), 2g free radical photoinitiator bisacylphosphine oxide are added to In the base glue, stir well.
将制得的胶体涂布到聚脂薄膜上，60°烘干，将烘干后涂布有胶体的聚脂薄膜与被粘物粘在一起后放置于1000w的高压汞灯下，距离15cm，照射20s后取出，胶体与被粘物轻易地实现剥离，并且被粘物表面无残胶。(以下实施例同)The prepared colloid is coated on the polyester film, and dried at 60 °. After drying, the polyester film coated with the colloid and the adherend are stuck together and placed under the high-pressure mercury lamp of 1000w, with a distance of 15cm. Take it out after 20s of irradiation, the colloid and the adherend can be easily peeled off, and there is no residual glue on the surface of the adherend. (The following examples are the same)
实例2：Example 2:
15g苯乙烯/丁二烯/苯乙烯嵌段共聚物溶解于45g体积比为1:1的甲苯/醋酸乙酯剂中，25g松香树脂溶解于40g体积比为1:1的甲苯/醋酸乙酯剂中，将上述两种液体混合后搅拌均匀，制得基胶。将15g二季戊四醇五丙烯酸酯/二季戊四醇六丙烯酸酯两者的混合物(质量比为二季戊四醇五丙烯酸酯：二季戊四醇六丙烯酸酯＝30：70)、2g自由基光引发剂双酰基氧化膦加至基胶中，搅拌均匀即制得UV可剥离胶。15g styrene/butadiene/styrene block copolymer is dissolved in the toluene/ethyl acetate agent that 45g volume ratio is 1:1, and 25g rosin resin is dissolved in 40g volume ratio is the toluene/ethyl acetate of 1:1 In the agent, mix the above two liquids and stir evenly to prepare the base gum. Add the mixture of 15g dipentaerythritol pentaacrylate/dipentaerythritol hexaacrylate (mass ratio is dipentaerythritol pentaacrylate: dipentaerythritol hexaacrylate=30:70), 2g free radical photoinitiator bisacylphosphine oxide to In the base glue, stir evenly to obtain UV peelable glue.
实例3：Example 3:
15g苯乙烯/丁二烯/苯乙烯嵌段共聚物溶解于45g体积比为1:1的甲苯/醋酸乙酯剂中，25g松香树脂溶解于40g体积比为1:1的甲苯/醋酸乙酯剂中，将上述两种液体混合后搅拌均匀，制得基胶。将20g二季戊四醇五丙烯酸酯/二季戊四醇六丙烯酸酯两者的混合物(质量比为二季戊四醇五丙烯酸酯：二季戊四醇六丙烯酸酯＝30：70)、2g自由基光引发剂双酰基氧化膦加至基胶中，搅拌均匀即制得UV可剥离胶。15g styrene/butadiene/styrene block copolymer is dissolved in the toluene/ethyl acetate agent that 45g volume ratio is 1:1, and 25g rosin resin is dissolved in 40g volume ratio is the toluene/ethyl acetate of 1:1 In the agent, mix the above two liquids and stir evenly to prepare the base gum. The mixture of 20g dipentaerythritol pentaacrylate/dipentaerythritol hexaacrylate (mass ratio is dipentaerythritol pentaacrylate: dipentaerythritol hexaacrylate=30:70), 2g free radical photoinitiator bisacylphosphine oxide are added to In the base glue, stir evenly to obtain UV peelable glue.
实例4：Example 4:
20g苯乙烯/丁二烯/苯乙烯嵌段共聚物溶解于45g体积比为1:1的甲苯/醋酸乙酯剂中，25g松香树脂溶解于40g体积比为1:1的甲苯/醋酸乙酯剂中，将上述两种液体混合后搅拌均匀，制得基胶。将20g二季戊四醇五丙烯酸酯/二季戊四醇六丙烯酸酯两者的混合物(质量比为二季戊四醇五丙烯酸酯：二季戊四醇六丙烯酸酯＝30：70)、2g自由基光引发剂双酰基氧化膦加至基胶中，搅拌均匀即制得UV可剥离胶。20g styrene/butadiene/styrene block copolymer is dissolved in the toluene/ethyl acetate agent that 45g volume ratio is 1:1, and 25g rosin resin is dissolved in the toluene/ethyl acetate that 40g volume ratio is 1:1 In the agent, mix the above two liquids and stir evenly to prepare the base glue. The mixture of 20g dipentaerythritol pentaacrylate/dipentaerythritol hexaacrylate (mass ratio is dipentaerythritol pentaacrylate: dipentaerythritol hexaacrylate=30:70), 2g free radical photoinitiator bisacylphosphine oxide are added to In the base glue, stir evenly to obtain UV peelable glue.
实例5：Example 5:
25g苯乙烯/丁二烯/苯乙烯嵌段共聚物溶解于45g体积比为1:1的甲苯/醋酸乙酯剂中，25g松香树脂溶解于40g体积比为1:1的甲苯/醋酸乙酯剂中，将上述两种液体混合后搅拌均匀，制得基胶。将20g二季戊四醇五丙烯酸酯/二季戊四醇六丙烯酸酯两者的混合物(质量比为二季戊四醇五丙烯酸酯：二季戊四醇六丙烯酸酯＝30：70)、2g自由基光引发剂双酰基氧化膦加至基胶中，搅拌均匀即制得UV可剥离胶。25g styrene/butadiene/styrene block copolymer is dissolved in the toluene/ethyl acetate agent that 45g volume ratio is 1:1, and 25g rosin resin is dissolved in the toluene/ethyl acetate that 40g volume ratio is 1:1 In the agent, mix the above two liquids and stir evenly to prepare the base glue. The mixture of 20g dipentaerythritol pentaacrylate/dipentaerythritol hexaacrylate (mass ratio is dipentaerythritol pentaacrylate: dipentaerythritol hexaacrylate=30:70), 2g free radical photoinitiator bisacylphosphine oxide are added to In the base glue, stir evenly to obtain UV peelable glue.
实例6：Example 6:
10g苯乙烯/异戊二烯/苯乙烯嵌段共聚物溶解于30g体积比为1:1的甲苯/醋酸乙酯剂中，15g松香树脂溶解于30g体积比为1:1的甲苯/醋酸乙酯剂中，将上述两种液体混合后搅拌均匀，制得基胶。将15g二季戊四醇五丙烯酸酯/二季戊四醇六丙烯酸酯两者的混合物(质量比为二季戊四醇五丙烯酸酯：二季戊四醇六丙烯酸酯＝30：70)、2g自由基光引发剂双酰基氧化膦加至基胶中，搅拌均匀即制得UV可剥离胶。10g of styrene/isoprene/styrene block copolymer is dissolved in 30g of toluene/ethyl acetate agent with a volume ratio of 1:1, and 15g of rosin resin is dissolved in 30g of toluene/ethyl acetate with a volume ratio of 1:1 In the ester agent, the above two liquids are mixed and then stirred evenly to obtain the base gum. Add the mixture of 15g dipentaerythritol pentaacrylate/dipentaerythritol hexaacrylate (mass ratio is dipentaerythritol pentaacrylate: dipentaerythritol hexaacrylate=30:70), 2g free radical photoinitiator bisacylphosphine oxide to In the base glue, stir evenly to obtain UV peelable glue.
实例7：Example 7:
15g苯乙烯/异戊二烯/苯乙烯嵌段共聚物溶解于60g体积比为1:1的甲苯/醋酸乙酯剂中，20g松香树脂溶解于40g体积比为1:1的甲苯/醋酸乙酯剂中，将上述两种液体混合后搅拌均匀，制得基胶。将20g二季戊四醇五丙烯酸酯/二季戊四醇六丙烯酸酯两者的混合物、2g自由基光引发剂双酰基氧化膦加至基胶中，搅拌均匀即制得UV可剥离胶。15g of styrene/isoprene/styrene block copolymer is dissolved in 60g of toluene/ethyl acetate agent with a volume ratio of 1:1, and 20g of rosin resin is dissolved in 40g of toluene/ethyl acetate with a volume ratio of 1:1 In the ester agent, the above two liquids are mixed and then stirred evenly to obtain the base gum. Add 20g of a mixture of dipentaerythritol pentaacrylate/dipentaerythritol hexaacrylate and 2g of a free radical photoinitiator bisacylphosphine oxide into the base glue, and stir evenly to prepare a UV peelable glue.
实例8：Example 8:
10g苯乙烯/异戊二烯/苯乙烯嵌段共聚物溶解于30g体积比为1:1的甲苯/醋酸乙酯剂中，15g松香树脂溶解于30g体积比为1:1的甲苯/醋酸乙酯剂中，将上述两种液体混合后搅拌均匀，制得基胶。将10g九官能团的聚氨酯丙烯酸酯、2g自由基光引发剂双酰基氧化膦加至基胶中，搅拌均匀即制得UV可剥离胶。10g of styrene/isoprene/styrene block copolymer is dissolved in 30g of toluene/ethyl acetate agent with a volume ratio of 1:1, and 15g of rosin resin is dissolved in 30g of toluene/ethyl acetate with a volume ratio of 1:1 In the ester agent, the above two liquids are mixed and then stirred evenly to obtain the base gum. Add 10g of nine-functional polyurethane acrylate and 2g of free radical photoinitiator bisacylphosphine oxide to the base glue, and stir evenly to prepare a UV peelable glue.
UV可剥离胶的性能评定指标有三个：初粘力、持粘力、180°剥离强度。比较的结果列于下表中。There are three performance evaluation indicators for UV peelable adhesives: initial adhesion, holding strength, and 180°peel strength. The results of the comparison are listed in the table below.
注：Note:
初粘的测试采用滚球斜坡停止实验法。标准：GB∕T4852-2002The initial stickiness test adopts the rolling ball ramp stop test method. Standard: GB∕T4852-2002
持粘力测试采用持粘力测试仪。标准：GB∕T4851-1998The holding force test adopts holding force tester. Standard: GB∕T4851-1998
180°剥离强度的测试。标准：GB∕T2792-1998180°peel strength test. Standard: GB∕T2792-1998
本发明所制备的UV可剥离胶，其基胶是由热塑性弹性体与改性树脂的混合制得，相对分子量大，稳定性好，加入多官能团光敏树脂后形成的胶体，其光照前180°剥离强度达到8～15N/25mm，足以使晶圆材料很好的固定在基材上，满足晶圆材料的加工使用过程，便于切割、磨削，紫外光照射后，剥离强度骤降，被粘物可以不费力的从基材上剥离开来，并且被粘物表面无残胶。The UV peelable glue prepared by the present invention, its base glue is made by mixing thermoplastic elastomers and modified resins, has a large relative molecular weight and good stability. The peel strength reaches 8-15N/25mm, which is enough to fix the wafer material on the substrate well, which meets the processing and use process of the wafer material, and is convenient for cutting and grinding. The object can be easily peeled off from the substrate, and there is no residual glue on the surface of the adherend.
本发明未尽事宜为公知技术。Matters not covered in the present invention are known technologies.
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