CN110540820A - Simple glue for UV (ultraviolet) anti-adhesive tape - Google Patents
Simple glue for UV (ultraviolet) anti-adhesive tape Download PDFInfo
- Publication number
- CN110540820A CN110540820A CN201910880924.8A CN201910880924A CN110540820A CN 110540820 A CN110540820 A CN 110540820A CN 201910880924 A CN201910880924 A CN 201910880924A CN 110540820 A CN110540820 A CN 110540820A
- Authority
- CN
- China
- Prior art keywords
- glue
- methacrylate
- poly
- percent
- mixing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003292 glue Substances 0.000 title claims abstract description 44
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 24
- 230000000181 anti-adherent effect Effects 0.000 title description 3
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 43
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 claims abstract description 42
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 19
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000011347 resin Substances 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 12
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000006243 chemical reaction Methods 0.000 claims abstract description 10
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000004132 cross linking Methods 0.000 claims abstract description 9
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims abstract description 6
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims abstract description 5
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000002156 mixing Methods 0.000 claims description 18
- 238000003756 stirring Methods 0.000 claims description 12
- 229920000196 poly(lauryl methacrylate) Polymers 0.000 claims description 5
- ZNAOFAIBVOMLPV-UHFFFAOYSA-N hexadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCOC(=O)C(C)=C ZNAOFAIBVOMLPV-UHFFFAOYSA-N 0.000 claims description 3
- HMZGPNHSPWNGEP-UHFFFAOYSA-N octadecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C(C)=C HMZGPNHSPWNGEP-UHFFFAOYSA-N 0.000 claims description 3
- 229920001483 poly(ethyl methacrylate) polymer Polymers 0.000 claims description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims description 3
- 239000004926 polymethyl methacrylate Substances 0.000 claims description 3
- ATZHWSYYKQKSSY-UHFFFAOYSA-N tetradecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCOC(=O)C(C)=C ATZHWSYYKQKSSY-UHFFFAOYSA-N 0.000 claims description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 2
- 230000009471 action Effects 0.000 claims description 2
- 239000012952 cationic photoinitiator Substances 0.000 claims description 2
- 239000012949 free radical photoinitiator Substances 0.000 claims description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 2
- 229920000205 poly(isobutyl methacrylate) Polymers 0.000 claims description 2
- 150000003254 radicals Chemical class 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 claims 1
- 230000009977 dual effect Effects 0.000 claims 1
- CFBXDFZIDLWOSO-UHFFFAOYSA-N icosyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCCCOC(=O)C(C)=C CFBXDFZIDLWOSO-UHFFFAOYSA-N 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000009467 reduction Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 20
- 238000000034 method Methods 0.000 description 5
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 150000002170 ethers Chemical class 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- RICKKZXCGCSLIU-UHFFFAOYSA-N 2-[2-[carboxymethyl-[[3-hydroxy-5-(hydroxymethyl)-2-methylpyridin-4-yl]methyl]amino]ethyl-[[3-hydroxy-5-(hydroxymethyl)-2-methylpyridin-4-yl]methyl]amino]acetic acid Chemical group CC1=NC=C(CO)C(CN(CCN(CC(O)=O)CC=2C(=C(C)N=CC=2CO)O)CC(O)=O)=C1O RICKKZXCGCSLIU-UHFFFAOYSA-N 0.000 description 1
- CMVNWVONJDMTSH-UHFFFAOYSA-N 7-bromo-2-methyl-1h-quinazolin-4-one Chemical compound C1=CC(Br)=CC2=NC(C)=NC(O)=C21 CMVNWVONJDMTSH-UHFFFAOYSA-N 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- OCDWICPYKQMQSQ-UHFFFAOYSA-N docosyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCCCCCOC(=O)C(C)=C OCDWICPYKQMQSQ-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005525 hole transport Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005580 one pot reaction Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920001490 poly(butyl methacrylate) polymer Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/10—Homopolymers or copolymers of methacrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention discloses simple glue for a UV (ultraviolet) viscosity-reducing adhesive tape, which performs a cross-linking reaction with a glue main agent through a dual-curing type UV resin curing agent, and realizes UV viscosity reduction by adding unsaturated bonds in the curing agent, wherein the glue comprises the following components in percentage by weight: 20 to 60 percent of polyacrylic resin with the molecular weight of 50000-200000, 30 to 60 percent of dissolving agent, 5 to 30 percent of dual-curing type UV resin curing agent and 0.5 to 3 percent of photoinitiator; the dissolving agent is one or more of ethyl acetate, toluene, butanone, butyl acetate, propylene glycol monomethyl ether and cyclohexanone. The invention has good adhesiveness and UV viscosity-reducing effect, and can effectively simplify the production process and reduce the production cost due to simple formula.
Description
Technical Field
The invention relates to the field of glue for a protective film, in particular to simple glue for a UV (ultraviolet) anti-adhesive tape.
Background
The UV visbreaking film has ultrahigh viscosity, can ensure that the pasted object keeps stable, does not fall off or have no flash in the processing process, and protects the unprocessed part. After the processing is finished, the adhesive force can be reduced by only irradiating enough UV rays, so that the support body can be easily torn off, and the attached object can be normally used in the next production procedure.
The traditional UV viscosity-reducing glue has two types, one type is that unsaturated bonds are integrated on a glue main agent through reaction, the UV viscosity-reducing glue produced by the method has excellent performance and is not easy to glue residue, but the cost is high due to the addition of one-step reaction and high price of raw materials; and the other is to add a light-cured resin into the glue, and the UV visbreaking glue produced in the way is relatively low in cost, but has undesirable performance and is easy to residue on an object to be pasted.
Application No.: 201811550094.4 relates to a removable adhesive tape and its preparation method, which comprises a pressure sensitive adhesive tape layer, a conductive layer, a hole transport layer, a light-emitting layer, a hole barrier layer, an interface buffer layer and a cathode layer arranged in sequence from bottom to top; the pressure-sensitive adhesive tape layer is a pressure-sensitive adhesive tape layer which is subjected to de-bonding through UV (ultraviolet) illumination; the light-emitting layer is a PLED light-emitting thin film layer; and the conductive layer is PEDOT, namely a PSS conductive layer. The principle of the adhesive tape is that after the conducting layer and the cathode layer form a passage, the luminous layer emits light to initiate polymerization, crosslinking and curing of a glue coating in the pressure-sensitive adhesive tape layer, so that the glue coating loses viscosity; the adhesive tape can be widely applied to the field of electronic and electric appliances, such as the application to the sticking and installation of a mobile phone battery, and plays a role in convenient disassembly.
disclosure of Invention
in order to overcome the defects of the prior art, the invention provides the simple glue for the UV viscosity-reducing adhesive tape, the double-curing type UV resin curing agent is used for carrying out cross-linking reaction with a glue main agent, and unsaturated bonds are added in the curing agent to realize UV viscosity reduction.
In order to achieve the above object, the present invention provides a simple glue for a UV viscosity-reducing adhesive tape, which performs a cross-linking reaction with a main agent of the glue by using a dual-curing type UV resin curing agent, and realizes UV viscosity reduction by adding an unsaturated bond in the curing agent, wherein the glue comprises, by weight: 20 to 60 percent of polyacrylic resin with the molecular weight of 50000-200000, 30 to 60 percent of dissolving agent, 5 to 30 percent of dual-curing type UV resin curing agent and 0.5 to 3 percent of photoinitiator; wherein the dissolving agent is one or more of ethyl acetate, toluene, butanone, butyl acetate, propylene glycol monomethyl ether and cyclohexanone; the dual-curing type UV resin curing agent contains more than two isocyanate groups, can perform thermosetting crosslinking reaction with acrylic glue, contains unsaturated bonds, and can perform crosslinking reaction under the action of free radicals.
On the basis of the scheme, the polyacrylic resin is one or a combination of any several of polymethyl methacrylate, polyethyl methacrylate, poly (n-isobutyl methacrylate), poly (n-isooctyl methacrylate), poly (n-isodecyl methacrylate), poly (lauryl methacrylate), poly (dodecyl methacrylate), poly (tetradecyl methacrylate), poly (hexadecyl methacrylate), poly (octadecyl methacrylate) and poly (docosyl methacrylate), and the addition amount of the polyacrylic resin is any natural number between 20 and 60 percent by weight percentage.
The dual-curing type UV resin curing agent is any natural number between 5% and 30%.
The dissolving agent is one or more of organic solvents such as esters, ethers, aromatic/aliphatic hydrocarbons, ketones and the like, such as ethyl acetate, toluene, butanone, butyl acetate, propylene glycol monomethyl ether, cyclohexanone and the like, and the adding amount of the dissolving agent is any natural number between 30% and 60%.
On the basis of the scheme, the photoinitiator is a free radical photoinitiator or a cationic photoinitiator, and the addition amount is 0.5, 1, 2.5, 2, 2.5 or 3 percent.
The simple glue for the UV visbreaking adhesive tape provided by the invention has good adhesiveness to plastic film base materials such as PET, PE, PC and the like. The UV anti-adhesion protective film manufactured by the invention can be used in the directions of semiconductor, wafer, glass cutting and the like, and can also be used for process protection in the manufacturing of OLED screen products.
The invention has the following beneficial effects:
The simple glue for the UV visbreaking adhesive tape provided by the invention uses the dual-curing type UV resin curing agent, substitutes the original method of integrating unsaturated bonds into a main glue agent of the UV visbreaking adhesive by reaction by substituting the curing agent into the main chain of the UV visbreaking adhesive, reduces one-step synthesis reaction on the basis of achieving the same performance, and greatly reduces the production cost.
Detailed Description
The present invention is described in further detail below.
The molecular weight of the polyacrylic resin for the protective film is 50000-200000, and the polyacrylic resin is one or a combination of any of the following substances: polymethyl methacrylate, polyethyl methacrylate, poly (n-isobutyl methacrylate), poly (n-isooctyl methacrylate), poly (n-isodecyl methacrylate), poly (lauryl methacrylate), poly (tetradecyl methacrylate), poly (hexadecyl methacrylate), poly (octadecyl methacrylate), poly (behenyl methacrylate), etc.
The dissolving agent is one or more of esters, ethers, aromatic/aliphatic hydrocarbons, ketones and other organic solvents, such as ethyl acetate, toluene, butanone, butyl acetate, propylene glycol methyl ether, cyclohexanone and the like.
Example 1
The simple glue for the UV visbreaking adhesive tape comprises the following components in percentage by weight:
50 percent of polyacrylic resin
The dissolvent ethyl acetate is 39%
Allnex EB4250 curing agent 10%
184D photoinitiator agent 1% of IGM,
Firstly, fully mixing 50% of polyacrylic resin and 39% of ethyl acetate as a dissolving agent, adding 10% of Allnex EB4250 curing agent, fully stirring and mixing, then adding 1% of IGM 184D photoinitiator, fully stirring and mixing to obtain the simple glue for the UV visbreaking adhesive tape.
Example 2
The simple glue for the UV visbreaking adhesive tape comprises the following components in percentage by weight:
60 percent of polyacrylic resin
24 percent of ethyl acetate
Allnex EB4150 curative 15%
IGM 651 photoinitiator 1%,
Firstly, fully mixing 60% of polyacrylic resin and 24% of ethyl acetate, then adding 15% of Allnex EB4150 curing agent, fully stirring and mixing, then adding 1% of IGM 651 photoinitiator, fully stirring and mixing to obtain the simple glue for the UV visbreaking adhesive tape.
Example 3
the simple glue for the UV visbreaking adhesive tape comprises the following components in percentage by weight:
30 percent of polyacrylic resin
38 percent of ethyl acetate
Allnex EB4150 curative 30%
127% of the photoinitiator IGM,
Firstly, fully mixing 30% of polyacrylic resin and 38% of ethyl acetate dissolving agent, adding 30% of Allnex EB4150 curing agent, fully stirring and mixing, then adding 2% of IGM 127 photoinitiator, fully stirring and mixing to obtain the simple glue for the UV visbreaking adhesive tape.
The polyacrylic resin in this example is composed of polyisobutyl methacrylate and polybutyl methacrylate.
The above embodiments of the present invention are merely preferred embodiments of the present invention, and it should not be understood that the specific embodiments of the present invention are limited thereto, and those skilled in the art can make various modifications and variations based on the above embodiments under the above teaching of the present invention, and these modifications and variations fall within the scope of the present invention.
Claims (7)
1. the utility model provides a simple and easy UV subtracts glues glue for sticky tape which characterized in that: through the cross-linking reaction of dual curing type UV resin curing agent and glue principal agent, realize UV visbreaking through increasing unsaturated bond in the curing agent, glue is counted according to weight percent, includes: 20 to 60 percent of polyacrylic resin with the molecular weight of 50000-200000, 30 to 60 percent of dissolving agent, 5 to 30 percent of dual-curing type UV resin curing agent and 0.5 to 3 percent of photoinitiator; wherein the dissolving agent is one or more of ethyl acetate, toluene, butanone, butyl acetate, propylene glycol monomethyl ether and cyclohexanone; the dual-curing type UV resin curing agent contains more than two isocyanate groups, carries out thermosetting crosslinking reaction with acrylic glue, contains unsaturated bonds, and can carry out crosslinking reaction under the action of free radicals.
2. The simple UV detackifying glue of claim 1, further comprising: the polyacrylic resin is one or the combination of any several of polymethyl methacrylate, polyethyl methacrylate, poly (n-isobutyl methacrylate), poly (n-isooctyl methacrylate), poly (n-isodecyl methacrylate), poly (lauryl methacrylate), poly (dodecyl methacrylate), poly (tetradecyl methacrylate), poly (hexadecyl methacrylate), poly (octadecyl methacrylate) and poly (eicosyl methacrylate).
3. The simple UV detackifying glue of claim 1, further comprising: the photoinitiator is a free radical photoinitiator or a cationic photoinitiator.
4. The simple UV visbreaking glue for adhesive tapes according to any one of claims 1 to 3, characterized in that: fully mixing 50 wt% of polyacrylic resin and 39 wt% of ethyl acetate as a dissolving agent, adding 10 wt% of Allnex EB4250 curing agent, fully stirring and mixing, then adding 1 wt% of IGM 184D photoinitiator, fully stirring and mixing to obtain the simple glue for the UV visbreaking adhesive tape.
5. the simple UV visbreaking glue for adhesive tapes according to any one of claims 1 to 3, characterized in that: fully mixing 60 weight percent of polyacrylic resin and 24 weight percent of ethyl acetate, adding 15 weight percent of Allnex EB4150 curing agent, fully stirring and mixing, then adding 1 weight percent of IGM 651 photoinitiator, fully stirring and mixing to obtain the simple glue for the UV visbreaking adhesive tape.
6. The simple UV visbreaking glue for adhesive tapes according to any one of claims 1 to 3, characterized in that: fully mixing 30 wt% of polyacrylic resin and 38 wt% of ethyl acetate dissolving agent, adding 30 wt% of Allnex EB4150 curing agent, fully stirring and mixing, then adding 2 wt% of IGM 127 photoinitiator, fully stirring and mixing to obtain the simple glue for the UV visbreaking adhesive tape.
7. The simple UV visbreaking glue for adhesive tapes according to claim 6, characterized in that: the polyacrylic resin is a mixture of polyisobutyl methacrylate and poly-n-butyl methacrylate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910880924.8A CN110540820A (en) | 2019-09-18 | 2019-09-18 | Simple glue for UV (ultraviolet) anti-adhesive tape |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910880924.8A CN110540820A (en) | 2019-09-18 | 2019-09-18 | Simple glue for UV (ultraviolet) anti-adhesive tape |
Publications (1)
Publication Number | Publication Date |
---|---|
CN110540820A true CN110540820A (en) | 2019-12-06 |
Family
ID=68714038
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910880924.8A Pending CN110540820A (en) | 2019-09-18 | 2019-09-18 | Simple glue for UV (ultraviolet) anti-adhesive tape |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN110540820A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111117523A (en) * | 2020-01-08 | 2020-05-08 | 南京工业大学 | Emulsion type diene-based copolymer UV visbreaking adhesive and preparation method thereof |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013163819A (en) * | 2007-11-13 | 2013-08-22 | Toagosei Co Ltd | Method for producing urethane (meth)acrylate |
CN108276923A (en) * | 2018-02-02 | 2018-07-13 | 苏州城邦达力材料科技有限公司 | A kind of UV visbreakings composition, UV visbreaking films and preparation method thereof |
CN108659734A (en) * | 2018-03-30 | 2018-10-16 | 东莞市澳中电子材料有限公司 | A kind of cured high just viscous stripping tapes and preparation method thereof again of antistatic UV |
-
2019
- 2019-09-18 CN CN201910880924.8A patent/CN110540820A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013163819A (en) * | 2007-11-13 | 2013-08-22 | Toagosei Co Ltd | Method for producing urethane (meth)acrylate |
CN108276923A (en) * | 2018-02-02 | 2018-07-13 | 苏州城邦达力材料科技有限公司 | A kind of UV visbreakings composition, UV visbreaking films and preparation method thereof |
CN108659734A (en) * | 2018-03-30 | 2018-10-16 | 东莞市澳中电子材料有限公司 | A kind of cured high just viscous stripping tapes and preparation method thereof again of antistatic UV |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111117523A (en) * | 2020-01-08 | 2020-05-08 | 南京工业大学 | Emulsion type diene-based copolymer UV visbreaking adhesive and preparation method thereof |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI632217B (en) | Semiconductor bonded bonding sheet and method of manufacturing semiconductor device | |
JP5027321B2 (en) | Semiconductor processing tape | |
CN103923572B (en) | UV (ultraviolet) peelable adhesive and preparation method thereof | |
CN1912038A (en) | Adhesive sheet and process for preparing it and method for processing the product | |
KR102083399B1 (en) | Adhesive composition for optical use, adhesive for optical use and adhesive film comprising the same | |
TWI445786B (en) | Adhesive composition for masking tape for mold underfill process and masking tape using the same | |
CN103305159A (en) | Adhesive composition, an adhesive sheet and a production method of a semiconductor device | |
TWI738661B (en) | Photocurable resin composition and manufacturing method of image display device | |
TWI836931B (en) | Film adhesive and semiconductor processing sheet | |
CN110093115A (en) | A kind of UV visbreaking protective film and preparation method thereof for lithium battery packaging | |
TW200536918A (en) | Adhesive sheet for light-emitting diode device and light-emitting diode device | |
CN101638566A (en) | Re-releasable adhesive agent and re-releasable adhesive sheet | |
CN103305160A (en) | Adhesive composition, adhesive sheet and method for manufacturing semiconductor device | |
TWI791544B (en) | Method of manufacturing image display device, photocurable resin composition and photo-transparent cured resin layer | |
TWI791135B (en) | Photocurable resin composition and a method of producing the display device | |
TWI642738B (en) | Adhesive composition for optical use and adhesive film for optical use | |
CN114644900A (en) | UV tack-reducing composition, UV tack-reducing tape, and method for preparing UV tack-reducing tape | |
JP7155245B2 (en) | Die bonding film, dicing die bonding sheet, and method for manufacturing semiconductor chip | |
CN110540820A (en) | Simple glue for UV (ultraviolet) anti-adhesive tape | |
CN108350108B (en) | Protective film-forming film and composite sheet for forming protective film | |
WO2023100861A1 (en) | Pressure-sensitive adhesive and/or adhesive | |
KR20120082129A (en) | Adhesive tape for manufacturing electronic component | |
CN108701640A (en) | Protective film formation film and protective film formation composite sheet | |
CN103384706A (en) | Dicing die-bonding film | |
CN113667428A (en) | UV reduced adhesive film for chip cutting |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191206 |
|
RJ01 | Rejection of invention patent application after publication |