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CN103890933A - 用于嵌入式裸片封装的高精度自对准裸片 - Google Patents

用于嵌入式裸片封装的高精度自对准裸片 Download PDF

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CN103890933A
CN103890933A CN201280045215.4A CN201280045215A CN103890933A CN 103890933 A CN103890933 A CN 103890933A CN 201280045215 A CN201280045215 A CN 201280045215A CN 103890933 A CN103890933 A CN 103890933A
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substrate
parts
pad
temperature
pads
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戴维·克拉克
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FlipChip International LLC
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Abstract

公开了一种用于形成嵌入式裸片封装件的自对准部件的装置和方法。该过程包括：提供具有配准焊盘的平面印刷线路板（PWB）以及具有接触焊盘和间隔的对准焊盘的部件，其中，每个对准焊盘都具有焊帽；将部件置于基板上，使得对准焊盘与配准焊盘粗略对准；对对准焊盘和配准焊盘施加热，使焊帽回流以精确地对准所述焊盘；以及将温度降低到回流温度以下。该方法还包括施加背面外层层压件，形成第一过孔，在基板的相对表面上形成连接至过孔的再分布导体，以及将正面外层层压件施加在基板的相对表面上方，所有的操作都在回流温度以下的温度下进行。

Description

用于嵌入式裸片封装的高精度自对准裸片
相关申请的交叉引用
本申请要求于2011年9月15日提交的名为High Precision SelfAligning Die for Embedded Die Packaging（用于嵌入式裸片封装的高精度自对准裸片）的美国临时专利申请第61/535,308号的优先权的权益，其全部内容通过引证方式结合于此。
公开背景
公开领域
本公开大致涉及一种用于封装半导体装置的结构和方法，并且更具体地，涉及一种用于印刷线路板（PWB）内的电子嵌入式器件封装和组装的结构和方法。
技术背景
通常来说，可嵌入的部件（多个部件）与任何需要的另外的有源、无源或分立（discrete）部件被置于PWB层压基板的内层上。在放置好这些部件后，在内层的顶部上模制或层压另外的外部PWB层压层和介电层，从而嵌入这些部件。可在内层压基板上板上组装（populate）单个或多个模块点。将部件置于内PWB层压基板上可使用可购得的的拾取与放置生产组装设备来实现。
以一步式且重复化的形式组装具有多个嵌入式裸片PWB的大型PWB基板是理想的，以便提高规模经济。还期望的是增加部件密度以减小总的封装件区域（footprint）。
在常见的嵌入式裸片制造过程中，部件位置难以保持放置后状态（post placement）。例如，在封装件形成过程步骤中，外层层压和热固化步骤可能导致部件位置的偏移。
在嵌入式裸片应用中，通常采用激光烧蚀工艺穿过PWB内建（build-up，构建）层以露出接触焊盘来形成PWB和部件互连过孔，然后通常通过附加的镀铜过程形成互连件。因此，部件接触焊盘的尺寸必须达到由与SMT（表面安装技术）设备相关的部件位置公差和激光光斑大小所限定的最小尺寸（通常为150μm）。
因此，需要一种用于在执行内建工艺操作前精确地对准裸片部件的装置和方法。
附图的简要说明
在了解了下面的详细说明的情况下将更好地理解本公开及本公开的特征和目的（包括上述的特征和目的）。该说明参考附图，其中：
图1示出了根据本公开的用于内建嵌入式裸片封装件的典型工艺流程的顺序图。
图2为根据本公开的用在PWB嵌入式裸片组装中的部件的平面图，示出了对准焊盘在接触焊盘外面。
图3为沿着图2中的线3-3截取的部件的截面图。
图4为根据本公开的PWB核心基板的一部分的平面图，图1中的部件附接至该部分。
图5为最终的嵌入式裸片封装件的示意性截面图。
具体描述
在下面的说明中，对许多具体的细节进行阐述，以便提供更全面地公开内容。但是，对于本领域的技术人员来说将显而易见的是，在不提供这些具体的细节的情况下也可实践公开的技术。在一些情况下，可能未详细描述熟知的特征，以免公开的技术难以理解。
根据本公开的实施例通过用于嵌入式PWB（印刷线路板）电子封装应用的高精度部件布置能够提高封装件的集成化和密度。在嵌入式PWB应用中，单个部件或多个部件嵌入在多层PWB内建结构内。根据本公开的该嵌入式裸片PWB能显著减小总的封装件高度，并且提供增加的部件密度并减小封装件区域。
通过该嵌入的创新方式增加的部件密度使得互连路径的长度缩短，这可有助于减少寄生现象（parasitics）并最终促使提高整体封装件和系统的性能。部件布置的准确性对于增加嵌入式裸片PWB中的部件密度和最终的封装密度来说是限制因素。
将部件准确地布置在内部层压件上对于确保与形成封装件或系统互连件所涉及的后续过程步骤（尤其是PWB盲激光过孔的形成）相关的高制造成品率来说是至关重要的。生产SMT（表面安装技术）拾取与放置组装设备的部件布置准确度通常为±25μm。在布置速度与设备生产率折中的情况下可实现布置准确度的提高。
通过在部件1的安装面上设置一组优选地设有边界的对准焊盘210（定位在部件1的有源接触焊盘200周围）而有助于根据本公开的在PWB核心基板100上精确地布置部件1。只要对准焊盘精确地限定部件1在核心基板100上的位置，对准焊盘可以是2、3、4个或任意数量。对于矩形形状的部件封装件来说，优选地是一组4个，每个边角均邻近一个。图2为平面图形式的部件1的单独的底部视图，该部件用在根据本公开的图1和图5所示的PWB嵌入式裸片组装中。
部件1具有接触焊盘200，该接触焊盘用于电互连并还在激光过孔形成过程中用作端部止挡件（end-stop）。要注意的是，这些焊盘200不具有焊帽。另外的对准焊盘210示出为位于部件的边角中，这些对准焊盘210的每个均具有焊帽。
图3以截面图形式示出了相同的部件1。用于部件1与PWB之间的电互连的焊盘200示出为实体的。如图所示，用于促进自对准过程的焊盘210覆盖有焊料并且位于部件1的边角中。这种边角位置是优选的，但是应该理解的是，还可以采用其他的布局构造。用于电互连和部件对准的所有焊盘200和210均限定在部件1的区域内。
图4以平面图形式示出了PWB核心基板100的一部分，部件1最终附接至该部分。接收的PWB核心基板100具有铜OSP（铜有机可焊性保护剂）或Ni/Au配准（registration，对位）焊盘410，这些焊盘与图2和图3所示的部件1上的对准焊盘210在绝对位置上相对应。还通过虚线420示出了在PWB核心基板100上的最终组装部件位置。
根据本公开的方法的第一组装操作为将对准焊盘210设置在部件1上，并将配准焊盘410设置在PWB核心基板100上。当将部件1置于PWB的核心基板100上并且焊帽的温度升高到焊帽的熔点时，通过焊料回流来浸润对准焊盘210和配准焊盘410使得部件1在核心基板100上精确对准。通过SMT拾取与放置设备首先实现粗略的布置准确度。然后通过对准焊盘210与配准焊盘410之间的焊料回流粘合来实现精细的布置准确度。通过这样来对准部件1，精确布置实现为在±5μm的公差内，先前这样的公差在这种过程中未实现过。根据使用的特定焊料合金，回流温度通常在约180℃到约230℃的范围内。当温度随后降低到回流范围以下的水平时（在嵌入过程的剩余过程期间一直保持该温度），通过这些焊接连接件来维持这种精度对准。
图1示出了根据本公开的用于嵌入式裸片封装构造的典型工艺流程。在图1a中，嵌入式部件1已通过STM和焊接的对准连接件210和410安装至PWB核心基板100上。
通过过孔4和布线5形成穿过PWB核心基板100到达部件1的电互连件。在下面的过程中，由于采用的温度低于焊料回流温度，因此如上所述通过对准焊盘210与配准焊盘410之间的实心焊料连接来维持部件1和核心基板100的精确配准。
图1示出了嵌入过程中涉及的一序列的步骤或操作。在图1a中，首先将SMT裸片或部件1附接至PWB核心基板100。应该注意的是，对准Cu焊盘210（图2中单独示出）定位于裸片1周围的边角位置处。这些对准Cu焊盘在图1a中用虚线示出。
然后，如图1b所示，在PWB核心基板上的部件1的上方层压背面外层3。层压的外层3为真空沉积的，使得其在每个互连焊盘200中和周围回流，并且填充所有的间隙空间。该外层3在互连焊盘200中和周围流动，并同时在倒装芯片附接至上述核心基板100后嵌入部件或裸片1，从而将裸片1永久结合在嵌入式裸片结构中。然后，如图1c所示，形成穿过PWB核心基板100的正面内层过孔4，以便接近部件互连焊盘200。
图1d示出了随后的操作，在该操作中，正面再分布引线5形成在位，根据具体的设计从过孔4扇出或扇入。图1e示出了在PWB核心基板100的正面上形成正面外层层压件6和过孔7。
最后，在图1f中，形成附接至过孔7的焊球9和下凸起金属化帽8。这样则完成了封装件500的组装。
图5为穿过最终的嵌入式封装件500的截面示意图。嵌入式部件1已通过SMT安装在PWB核心基板100上。在上述焊料回流过程中，部件1已自对准。焊料连接形成为露出PWB铜OSP焊盘530，该焊盘焊接至互连对准焊盘210中的一个。通过过孔7和布线5形成穿过PWB到达部件的电互连件。
根据本公开的方法提供了用于PWB或其他基板中的嵌入式裸片封装件的部件高精度自对准。该方法能实现±5μm或更好的范围内的部件布置准确度。该方法还能降低在SMT布置之后通常在后续封装内建操作过程中观察到的部件移动的风险。
根据本公开的方法提供了部件布置的局部和整体准确度的提高，并且可适用于柔性或刚性PWB基板。铜柱对准互连焊盘530用作增强的散热器。此外，覆盖对准互连焊盘的焊料可用作物理冲击或热冲击或在温度循环过程中的应力缓冲器。
对于本领域的技术人员来说，对公开的实施例的各种修改和替换是显而易见的。例如，对准互连件可以是或者可以不是电互连件，并且可置于或可不置于如图所示的部件边角中。该过程可用于正面朝上或正面朝下的嵌入式组装过程顺序。可通过镍而不是铜来形成用于隔开（standoff）的柱。另外，可在上述模块内封装一个或多个分立、无源或有源的部件。因此，所有的这种替换、变型和修改都旨在包含在由以下权利要求所限定的范围内或如以下权利要求所限定。

Claims (10)

1.一种嵌入式裸片封装的方法，包括：
提供一平面印刷线路板（PWB）基板，在所述基板的一个表面上具有间隔开的部件配准焊盘基板；
提供一部件，所述部件包括以预定间隔布置的多个接触焊盘并包括多个对准焊盘，每个所述对准焊盘上均具有焊帽；
将所述部件置于所述基板上，使得所述对准焊盘与所述配准焊盘粗略地对准；
对所述基板施加热，以便将所述基板的温度上升到所述焊帽的回流温度以使所述焊帽回流，从而精确地对准所述对准焊盘与所述配准焊盘；
将所述温度降低到所述回流温度以下；以及
将背面外层层压件施加在所述基板的所述一个表面上的所述部件上方。
2.根据权利要求1所述的方法，还包括：
形成穿过所述基板的第一过孔；
在所述基板的相对表面上形成再分布导体，所述再分布导体连接至所述过孔；以及
将正面外层层压件施加在所述基板的所述相对表面上方，从而完成所述嵌入式裸片封装。
3.根据权利要求2所述的方法，还包括形成穿过所述正面外层层压件的第二过孔。
4.根据权利要求2所述的方法，还包括将凸起金属化件和焊球施加至所述第二过孔。
5.根据权利要求1所述的方法，其中，在所述回流温度以下的温度下施加所述背面层压件。
6.根据权利要求4所述的方法，其中，在所述回流温度以下的温度下施加所述正面层压件层和所述背面层压件层。
7.一种嵌入式裸片封装的方法，包括：
提供一平面印刷线路板（PWB）基板，在所述基板的一个表面上具有间隔的部件配准焊盘；
提供一部件，所述部件包括以预定间隔布置的多个接触焊盘并包括多个对准焊盘，每个所述对准焊盘上均具有焊帽；
将所述部件置于所述基板上，使得所述对准焊盘与所述配准焊盘粗略地对准；
对所述基板施加热，以便将所述基板的温度上升到所述焊帽的回流温度以使所述焊帽回流，从而精确地对准所述对准焊盘与所述配准焊盘；
将所述温度降低到所述回流温度以下；
将背面外层层压件施加在所述基板的所述一个表面上的所述部件上方；
形成穿过所述基板的第一过孔；
在所述基板的相对表面上形成再分布导体，所述再分布导体连接至所述第一过孔；
形成穿过所述外层层压件的第二过孔；以及
将凸起金属化件和焊球施加至所述第二过孔。
8.根据权利要求7所述的方法，其中，在所述回流温度以下的温度下施加所述背面外层压件。
9.根据权利要求7所述的方法，还包括将正面外层层压件施加在所述基板的所述相对表面上方，从而完成所述嵌入式组件封装。
10.根据权利要求9所述的方法，其中，在所述回流温度以下的温度下施加所述正面层压件层和所述背面层压件层。
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