[go: up one dir, main page]

CN103875317B - 用于电动车辆逆变器的功率单元、逆变器和包括所述单元的电动车辆 - Google Patents

用于电动车辆逆变器的功率单元、逆变器和包括所述单元的电动车辆 Download PDF

Info

Publication number
CN103875317B
CN103875317B CN201280050673.7A CN201280050673A CN103875317B CN 103875317 B CN103875317 B CN 103875317B CN 201280050673 A CN201280050673 A CN 201280050673A CN 103875317 B CN103875317 B CN 103875317B
Authority
CN
China
Prior art keywords
power unit
power
unit according
control board
electronic control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201280050673.7A
Other languages
English (en)
Chinese (zh)
Other versions
CN103875317A (zh
Inventor
G.特拉梅特
R.德尼奥特
B.莫利尔
F.赫劳尔特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Valeo Systemes de Controle Moteur SAS
Original Assignee
Valeo Systemes de Controle Moteur SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Systemes de Controle Moteur SAS filed Critical Valeo Systemes de Controle Moteur SAS
Publication of CN103875317A publication Critical patent/CN103875317A/zh
Application granted granted Critical
Publication of CN103875317B publication Critical patent/CN103875317B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1422Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427Housings
    • H05K7/1432Housings specially adapted for power drive units or power converters
    • H05K7/14322Housings specially adapted for power drive units or power converters wherein the control and power circuits of a power converter are arranged within the same casing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60LPROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L53/00Methods of charging batteries, specially adapted for electric vehicles; Charging stations or on-board charging equipment therefor; Exchange of energy storage elements in electric vehicles
    • B60L53/20Methods of charging batteries, specially adapted for electric vehicles; Charging stations or on-board charging equipment therefor; Exchange of energy storage elements in electric vehicles characterised by converters located in the vehicle
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/026Multiple connections subassemblies
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484Connecting portions
    • H01L2224/4847Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/13Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304Transistor
    • H01L2924/1305Bipolar Junction Transistor [BJT]
    • H01L2924/13055Insulated gate bipolar transistor [IGBT]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02TCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00Road transport of goods or passengers
    • Y02T10/60Other road transportation technologies with climate change mitigation effect
    • Y02T10/70Energy storage systems for electromobility, e.g. batteries
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02TCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00Road transport of goods or passengers
    • Y02T10/60Other road transportation technologies with climate change mitigation effect
    • Y02T10/7072Electromobility specific charging systems or methods for batteries, ultracapacitors, supercapacitors or double-layer capacitors
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02TCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T90/00Enabling technologies or technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02T90/10Technologies relating to charging of electric vehicles
    • Y02T90/14Plug-in electric vehicles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Transportation (AREA)
  • Mechanical Engineering (AREA)
  • Inverter Devices (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Electric Propulsion And Braking For Vehicles (AREA)
CN201280050673.7A 2011-08-19 2012-07-25 用于电动车辆逆变器的功率单元、逆变器和包括所述单元的电动车辆 Active CN103875317B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1157417 2011-08-19
FR1157417A FR2979177B1 (fr) 2011-08-19 2011-08-19 Bloc de puissance pour onduleur de vehicule electrique
PCT/FR2012/051766 WO2013026969A1 (fr) 2011-08-19 2012-07-25 Bloc de puissance pour onduleur de vehicule electrique, onduleur et véhicule électrique comprenant ce bloc.

Publications (2)

Publication Number Publication Date
CN103875317A CN103875317A (zh) 2014-06-18
CN103875317B true CN103875317B (zh) 2017-08-25

Family

ID=46832463

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280050673.7A Active CN103875317B (zh) 2011-08-19 2012-07-25 用于电动车辆逆变器的功率单元、逆变器和包括所述单元的电动车辆

Country Status (5)

Country Link
US (1) US9648769B2 (fr)
EP (1) EP2745662B1 (fr)
CN (1) CN103875317B (fr)
FR (1) FR2979177B1 (fr)
WO (1) WO2013026969A1 (fr)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2979961B1 (fr) * 2011-09-12 2014-06-20 Valeo Sys Controle Moteur Sas Organe de plaquage d'une piece sur une surface
CN105794096B (zh) * 2013-11-20 2018-08-28 日产自动车株式会社 电力变换装置
EP2947764B1 (fr) * 2014-05-23 2019-06-26 Vacon Oy Dispositif électronique de puissance et ensemble boîtier
US10499514B2 (en) * 2015-05-12 2019-12-03 Mitsubishi Electric Corporation Vehicular control device
US10028409B1 (en) * 2017-01-06 2018-07-17 Hamilton Sundstrand Corporation Immersion cooling arrangements
FR3068841B1 (fr) * 2017-07-07 2019-08-23 Alstom Transport Technologies Dispositif de commutation electrique et coffre de traction electrique associe
US10002821B1 (en) 2017-09-29 2018-06-19 Infineon Technologies Ag Semiconductor chip package comprising semiconductor chip and leadframe disposed between two substrates
FR3074370B1 (fr) * 2017-11-30 2019-12-13 Valeo Siemens Eautomotive France Sas Dispositif electrique pour vehicule electrique ou hybride
FR3076175B1 (fr) * 2017-12-22 2020-01-10 Valeo Siemens Eautomotive France Sas Equipement electrique a paroi deportee
FR3076099B1 (fr) * 2017-12-22 2020-01-10 Valeo Siemens Eautomotive France Sas Barre de connexion electrique pour ensemble electrique
US10464439B2 (en) 2018-01-31 2019-11-05 Galatech, Inc. Casting for motor and gearbox with integrated inverter
JP6627901B2 (ja) * 2018-02-23 2020-01-08 日本電気株式会社 電子機器および電子装置
IT201800007376A1 (it) * 2018-07-20 2020-01-20 Caricabatterie per veicoli e relativo procedimento di realizzazione
WO2020053775A1 (fr) * 2018-09-13 2020-03-19 Meta System S.P.A. Connecteur haute puissance et procédé d'assemblage associé
FR3089750B1 (fr) * 2018-12-11 2021-07-16 Valeo Equip Electr Moteur Convertisseur de tension et procédé de fabrication d’un convertisseur de tension
FR3091139B1 (fr) * 2018-12-21 2020-12-11 Safran Electrical & Power Module de distribution électrique comprenant des socles supportant conjointement des barres de puissance et des composants de puissance

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5657203A (en) * 1991-05-31 1997-08-12 Nippondenso Co., Ltd. Electronic device having a plurality of circuit boards arranged therein
CN1412925A (zh) * 2001-10-12 2003-04-23 三菱电机株式会社 功率变换装置
FR2833802B1 (fr) * 2001-12-13 2004-03-12 Valeo Electronique Module de puissance et ensemble de modules de puissance

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5235494A (en) * 1992-01-16 1993-08-10 The Chamberlain Group, Inc. Electrical controller having pivotally mounted circuit board support
US6147869A (en) * 1997-11-24 2000-11-14 International Rectifier Corp. Adaptable planar module
JP3547333B2 (ja) * 1999-02-22 2004-07-28 株式会社日立産機システム 電力変換装置
JP4142227B2 (ja) * 2000-01-28 2008-09-03 サンデン株式会社 車両用電動圧縮機のモータ駆動用インバータ装置
TW501755U (en) * 2001-01-08 2002-09-01 Micro Star Int Co Ltd Impact-proof and vibration-proof reinforcing structure of a fixed heat dissipation device for computer housing
JP3923258B2 (ja) * 2001-01-17 2007-05-30 松下電器産業株式会社 電力制御系電子回路装置及びその製造方法
DE10161016B4 (de) * 2001-12-12 2004-03-04 Bopla Gehäuse Systeme GmbH Gehäuse zur Aufnahme von elektrischen oder elektronischen Bauteilen
FR2871022B1 (fr) * 2004-05-25 2006-11-03 Valeo Electronique Sys Liaison Boitier pour circuits electriques ou electroniques
JP4475160B2 (ja) * 2005-04-13 2010-06-09 株式会社デンソー 電子装置の製造方法
KR101203466B1 (ko) * 2006-04-20 2012-11-21 페어차일드코리아반도체 주식회사 전력 시스템 모듈 및 그 제조 방법
FR2914531B1 (fr) * 2007-03-27 2009-06-05 Valeo Electronique Sys Liaison Boitier a circuit imprime etanche
US8619434B2 (en) * 2008-02-13 2013-12-31 Cameron International Corporation Arrangement system
JP5419406B2 (ja) * 2008-09-18 2014-02-19 三菱重工業株式会社 インバータ装置
JP5473892B2 (ja) * 2010-12-28 2014-04-16 三菱航空機株式会社 耐雷ファスナ、航空機
US20120175755A1 (en) * 2011-01-12 2012-07-12 Infineon Technologies Ag Semiconductor device including a heat spreader
US8482919B2 (en) * 2011-04-11 2013-07-09 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics card assemblies, power electronics modules, and power electronics devices
US8174235B2 (en) * 2011-07-25 2012-05-08 Lightening Energy System and method for recharging electric vehicle batteries

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5657203A (en) * 1991-05-31 1997-08-12 Nippondenso Co., Ltd. Electronic device having a plurality of circuit boards arranged therein
CN1412925A (zh) * 2001-10-12 2003-04-23 三菱电机株式会社 功率变换装置
FR2833802B1 (fr) * 2001-12-13 2004-03-12 Valeo Electronique Module de puissance et ensemble de modules de puissance

Also Published As

Publication number Publication date
EP2745662B1 (fr) 2015-07-22
US20140192496A1 (en) 2014-07-10
WO2013026969A1 (fr) 2013-02-28
US9648769B2 (en) 2017-05-09
FR2979177B1 (fr) 2014-05-23
FR2979177A1 (fr) 2013-02-22
CN103875317A (zh) 2014-06-18
EP2745662A1 (fr) 2014-06-25

Similar Documents

Publication Publication Date Title
CN103875317B (zh) 用于电动车辆逆变器的功率单元、逆变器和包括所述单元的电动车辆
JP4609504B2 (ja) 電子機器
EP1501133B1 (fr) Boîte de raccordement pour le raccordement à un panneau solaire
JP5715766B2 (ja) 配線材の接続構造
JP5522748B2 (ja) 組電池モジュール
US7297439B2 (en) Battery
US8859122B2 (en) Interconnect device for battery assembly
JP6293112B2 (ja) バスバーモジュール及びその製造方法
JP2001189416A (ja) パワーモジュール
US9780016B2 (en) Lead frame, electronic control device using lead frame, and lead-frame mounting method
US20050094356A1 (en) Circuit assembly, producing method of the same, distribution unit and bus bar substrate
JP6044505B2 (ja) 組電池ユニット
CN113519086B (zh) 母线以及使用母线的电池模块
JP2013080693A (ja) 電池用配線モジュール
CN108292729B (zh) 电池模块和电子设备的连接装置及绝缘罩的制造方法
CN117795756A (zh) 布线模块
JP2023547032A (ja) バッテリセル接触デバイス、及びそのようなバッテリセル接触デバイスを備えるバッテリモジュール
JP4736850B2 (ja) 半導体装置及び半導体装置の外部接続端子と外部電極との接合方法
EP4254645A1 (fr) Module de batterie doté d'une structure améliorée de connexion par liaison filaire entre une plaque de barres omnibus et un ensemble icb, et bloc-batterie comprenant celui-ci
KR101872834B1 (ko) 배터리 전원 측정을 위한 연결 구조
CN116711151A (zh) 配线模块
CN103339743A (zh) 便于多个太阳能模块的电互连接的方法和设备
JP2002320392A (ja) パワーモジュール型インバータ装置
WO2017221854A1 (fr) Structure de montage de composant électrique et compresseur électrique à onduleur intégré la comprenant
WO2016080212A1 (fr) Module de stockage d'électricité

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant