CN103851600A - Heat dissipation module and light emitting device - Google Patents

Abstract

A heat dissipation module and a light emitting device are provided. The heat dissipation module comprises a bearing device and a plurality of heat sources. The bearing device is provided with a main body part and a plurality of penetrating parts, and the penetrating parts penetrate through the main body part. The heat source is arranged on the body part and is positioned relative to the through parts, so that air flows between the heat sources through the through parts, and the heat dissipation efficiency of the heat sources is improved.

Description

Heat dissipation module and light emitting device

technical field

The invention relates to a heat dissipation module and a light emitting device, in particular, to a heat dissipation module and a light emitting device capable of improving heat dissipation efficiency.

Background technique

A conventional light emitting device includes a plurality of light emitting units and a housing, wherein the light emitting units are accommodated in the housing. Although the casing covers the light-emitting unit and can protect the light-emitting unit, however, this will hinder air convection and affect heat dissipation efficiency. Since the light-emitting unit usually generates a large amount of heat during operation, if the heat energy cannot be removed in a timely manner, the performance of the light-emitting unit will be damaged, resulting in poor working efficiency. If the light-emitting unit is a light-emitting diode , there is also the problem of color drift. Furthermore, the conventional light-emitting units are generally monolithic, or connected to each other by heat sinks, so that there are likely to be disadvantages such as heat concentration and mutual influence due to mutual heat exchange.

In addition, when the size of the housing is fixed, the number of light-emitting units it can accommodate is determined immediately, so it cannot be expanded to accommodate more light-emitting units; if you want to accommodate more light-emitting units, you can only replace the larger-sized shell body. In this way, the application range of the conventional light-emitting device is limited, and its manufacturing cost is relatively high.

Therefore, it is necessary to provide an innovative heat dissipation module and light emitting device to solve the above problems.

Contents of the invention

The invention provides a heat dissipation module, which includes a carrying device and multiple heat sources. The carrying device has a body part and a plurality of through parts, and the through parts pass through the body part. The heat source is located on the body part, and the position of the heat source is relative to the through part, so that air flows between the heat sources through the through part, so as to improve the heat dissipation efficiency of the heat source. Thus, the operating temperature of the heat source can be effectively reduced.

The invention also provides a light emitting device, which includes a plurality of light emitting elements, a carrying device and a plurality of heat dissipation devices. The carrying device has a body part, a plurality of through parts and a plurality of connection parts, and the through parts pass through the body part. Each of the light-emitting elements is attached to a first end of each of the heat sinks, the first end of each of the heat sinks is attached to the body portion, and the heat sink is located on the connecting portion, so that The light emitting element corresponds to the connection part, and the position of the heat dissipation device is relative to the through part, so that air flows between the heat sink devices through the through part, so as to improve the heat dissipation The cooling efficiency of the device. Thus, the operating temperature of the light emitting element can be effectively reduced.

Description of drawings

FIG. 1 shows a schematic perspective view of an embodiment of the heat dissipation module of the present invention;

Figure 2 shows a schematic bottom view of an embodiment of the heat dissipation module of the present invention;

Figure 3 shows a schematic bottom view of the carrying device in the heat dissipation module of the present invention;

FIG. 4 shows a schematic perspective view of another embodiment of the heat dissipation module of the present invention;

FIG. 5 shows a schematic cross-sectional view of an embodiment of the heat dissipation device in the heat dissipation module of the present invention;

6 shows a schematic cross-sectional view of another embodiment of the heat dissipation device in the heat dissipation module of the present invention;

7 shows a schematic cross-sectional view of another embodiment of the heat dissipation device in the heat dissipation module of the present invention;

FIG. 8 shows a schematic perspective view of another embodiment of the heat dissipation module of the present invention;

FIG. 9 shows a schematic perspective view of another embodiment of the heat dissipation module of the present invention;

FIG. 10 shows a schematic bottom view of another embodiment of the heat dissipation module of the present invention;

FIG. 11 shows a perspective exploded schematic diagram of the heat dissipation module of FIG. 9;

FIG. 12 shows a schematic perspective view of another embodiment of the heat dissipation module of the present invention;

Fig. 13 shows a schematic bottom view of another embodiment of the carrying unit in the heat dissipation module of the present invention;

Fig. 14 shows a schematic bottom view of the carrying device constituted by the carrying unit of Fig. 13;

Fig. 15 shows a schematic bottom view of another embodiment of the carrying unit in the heat dissipation module of the present invention;

Fig. 16 shows a schematic bottom view of a carrying device constituted by the carrying unit of Fig. 15;

Figure 17 shows a schematic bottom view of another embodiment of the carrying unit in the heat dissipation module of the present invention; and

FIG. 18 shows a schematic bottom view of the carrying device constituted by the carrying unit in FIG. 17 .

Description of main component symbols

1 An embodiment of the heat dissipation module of the present invention

1a Another embodiment of the heat dissipation module of the present invention

1b Another embodiment of the heat dissipation module of the present invention

1c Another embodiment of the heat dissipation module of the present invention

1d Another embodiment of the heat dissipation module of the present invention

2 cooling device

2a Another embodiment of the heat sink of the present invention

2b Another embodiment of the heat sink of the present invention

10 carrying device

10a carrying device

10b carrying device

10c carrying device

12 heat sources

14 trunk

16 carrying units

18 carrying units

Another embodiment of 18a carrying unit

Another embodiment of 18b carrying unit

Another embodiment of 18c carrying unit

20 hollow tube

21 side wall

22 cooling fins

24 first sealing cap

26 second sealing cap

28 coolant

32 substrates

34 grains

36 wires

38 sealing material

101 Body Department

101a body part

101b body part

101c body part

102 Penetration

102a Penetration

102b Penetration

102c Penetration

103 connection part

181 carrying part

182 extension

211 hollow cavity

212 first opening

213 second opening

261 pits

262 through holes

321 first surface

322 second surface.

Detailed ways

Please refer to FIG. 1 and FIG. 2 , which respectively show a three-dimensional view and a schematic bottom view of an embodiment of the heat dissipation module of the present invention. The heat dissipation module 1 includes a carrying device 10 , a plurality of heat sources 12 and a plurality of heat dissipation devices 2 .

Please refer to FIG. 3 , which shows a schematic bottom view of the carrying device in the heat dissipation module of the present invention. The carrying device 10 has a body portion 101 , a plurality of through portions 102 and a plurality of connecting portions 103 . In this embodiment, the connecting portion 103 is a plurality of carrying through holes, and the connecting portion 103 (carrying through hole) and the through portion 102 pass through the main body portion 101 . In this embodiment, the main body 101 of the carrying device 10 is a flat plate made of thermally conductive metal or non-thermally conductive plastic. The penetrating portion 102 is a plurality of through holes, and both the penetrating portion 102 and the connecting portion 103 (carrying through hole) are arranged in an array. Preferably, there is a through portion 102 between every two connecting portions 103 (carrying through holes), the connecting portion 103 (carrying through hole) is circular, and the through portion 102 is rectangular.

Please refer to FIG. 1 and FIG. 2 again, the heat source 12 is an optoelectronic semiconductor element or a light-emitting element, such as at least including a light-emitting diode, a photodiode, a photovoltaic cell, a solar cell, an electroluminescent diode, a laser diode, a power amplifier, or an integrated circuit element. . In this embodiment, the heat source 12 is a light-emitting element, such as a light-emitting diode (LED), so the heat dissipation module 1 is a light-emitting device.

Each heat source (light emitting element) 12 is attached to a first end (lower end) of each heat sink 2 , and the first end (lower end) of each heat sink 2 is attached to the body portion 101 . That is, the heat source (light emitting element) 12 is located on the main body 101 through the heat sink 2 . Each heat sink 2 is located on each connecting portion 103 (carrying through hole), so that each of the heat sources (light emitting elements) 12 corresponds (exposed) to each connecting portion 103 (carrying through hole). ) without being covered by the body portion 101 . Therefore, in this embodiment, the heat dissipation devices 2 are arranged in an array.

The position of the heat sink 2 and the heat source (light-emitting element) 12 is relative to the through portion 102, so that the air flows through the through portion 102 between the heat sink 2 or the heat source (light emitting element). elements) 12 to improve the heat dissipation efficiency of the heat dissipation device 2 and the heat source (light emitting element) 12 . In other words, the through portion 102 is a channel for air circulation to increase heat convection.

Please refer to FIG. 4 , which shows a schematic perspective view of another embodiment of the heat dissipation module of the present invention. The heat dissipation module 1 a of this embodiment is substantially the same as the heat dissipation module 1 of FIG. 1 , and the same elements are given the same numbers. The difference between the heat dissipation module 1a of this embodiment and the heat dissipation module 1 of FIG. The upper connecting portion 103 forms a hanging structure. Therefore, the connecting portion 103 of this embodiment is not a carrying through hole.

Please refer to FIG. 5 , which shows a schematic cross-sectional view of an embodiment of the heat dissipation device in the heat dissipation module of the present invention. The heat dissipation device 2 is a heat pipe, which includes a hollow pipe 20 , a first sealing cover 24 , a second sealing cover 26 and a cooling liquid 28 . The hollow tube 20 has a side wall 21 and a plurality of cooling fins 22 . The side wall 21 is an outer shell defining a hollow cavity 211 . The hollow cavity 211 has a first opening 212 and a second opening 213 . The heat dissipation fins 22 radially extend from the outer side of the side wall 21 to increase heat dissipation efficiency. The sidewall 21 and the heat dissipation fins 22 are integrally formed by aluminum extrusion or aluminum die-casting. However, in other embodiments, the cooling fins 22 are connected to the sidewall 21 of the hollow tube 20 . The material of the side wall 21 and the heat dissipation fins 22 is aluminum or copper, preferably, it can be doped with iron alloy, magnesium alloy, other metals or materials with high thermal conductivity.

The first sealing cover 24 seals the first opening 212, and the second sealing cover 26 seals the second opening 213, so that the hollow cavity 211 forms a completely closed space, preferably, the closed hollow cavity 211 is a vacuum environment. The first sealing cover 24 and the second sealing cover 26 are affixed to the inside of the side wall 21 of the hollow tube 20, and the joining method can be tight fit, welding (such as argon welding or laser spot welding), dispensing or locking. Together and so on. In this embodiment, the material of the first sealing cover 24 and the second sealing cover 26 is aluminum or copper, preferably, it can be doped with iron alloy, magnesium alloy, other metals or materials with high thermal conductivity. In this embodiment, the second sealing cover 26 further includes a cavity 261 for placing the cooling liquid 28 .

Flourinert或

Novec的冷却液体，其中任二者或更多的混合物。该冷却液28吸热后所形成的蒸发气体可以在该中空腔体211内流动，进而隔着该侧壁21及所述散热鳍片22与外界环境形成热交换，最终冷凝成液态冷却液28。该冷凝而成的液态冷却液28沿着该侧壁21流回该第二密封盖26。The cooling liquid 28 is located in the closed hollow cavity 211 . The coolant 28 contains at least water, methanol, ethanol, acetone, ammonia, paraffin, oil, chlorofluorocarbons (CFCs) or other such as

Flourinert or

Novec cooling liquid, any mixture of two or more of them. The evaporated gas formed after the cooling liquid 28 absorbs heat can flow in the hollow cavity 211 , and then form heat exchange with the external environment through the side wall 21 and the heat dissipation fins 22 , and finally condense into a liquid cooling liquid 28 . The condensed liquid coolant 28 flows back to the second sealing cover 26 along the side wall 21 .

In this embodiment, the heat dissipation device 2 further includes a capillary structure. The capillary structure is located on the inner side of the side wall 21 (outer shell) to define the hollow cavity 211, so that the evaporated gas can flow in the hollow cavity 211, and then communicate with the outside world through the side wall 21 (outer shell). The environment forms a heat exchange, which eventually condenses into a liquid coolant. The capillary structure is metal mesh, metal powder burnt or grooves. In this embodiment, the capillary structure is a plurality of grooves located inside the side wall 21 of the hollow tube 20 and arranged along the axial direction of the hollow tube 20 for the cooling liquid 28 inside. flow.

In this embodiment, the heat dissipation module (light emitting device) 1 further includes a plurality of substrates 32 , which are metal core printed circuit boards (Metal Core PCB, MCPCB), and have a first surface 321 and a second surface 322 . The heat source (LED element) 12 is located on the second surface 322 of the substrate 32 , and includes a die 34 , a plurality of wires 36 and a sealing material 38 . The die 34 is adhered to the second surface 322 of the substrate 32, the wire 36 is electrically connected to the die 34 and the second surface 322 of the substrate 32, and the sealing material 38 covers the die 34 and the second surface 322 of the substrate 32. The wire 36.

The first surface 321 of the substrate 32 is attached to the second sealing cover 26, therefore, the cooling liquid 28 can absorb the heat of the die 34 of the heat source (LED element) 12 to form an evaporated gas in the hollow cavity Flow within 211. In other words, the heat generated by the die 34 of the heat source (LED element) 12 can be quickly dissipated by the heat sink 2 .

The working mode of the cooling device 2 is as follows. The lower side of the second sealing cover 26 contacts the heat source (light emitting diode element) 12. When the heat source (light emitting diode element) 12 generates heat, the lower part of the hollow tube 20 is at a higher temperature, while the upper part of the hollow tube 20 for lower temperatures. At this moment, the cooling liquid 28 absorbs the heat of the heat source (LED element) 12 to form an evaporated gas. The boil-off gas flows in the hollow cavity 211 to the top of the hollow tube 20 . Since the top of the hollow tube 20 is in contact with a lower temperature place, when the evaporating gas reaches this end, condensation begins to occur. At this time, the heat is passed by the evaporating gas through the side wall 21 and the heat dissipation fins. 22 and spread to the lower temperature outside. At the same time, the evaporated gas will condense into liquid, and the liquid cooling liquid 28 produced by the condensation flows back to the second sealing cover 26 through the action of capillary pumping of the capillary structure. Such a cycle will continue to improve the heat dissipation effect.

Please refer to FIG. 6 , which shows a schematic cross-sectional view of another embodiment of the heat dissipation device in the heat dissipation module of the present invention. The heat sink 2 a of this embodiment is substantially the same as the heat sink 2 of FIG. 5 , and the same elements are assigned the same numbers. The difference between the heat dissipation device 2a of this embodiment and the heat dissipation device 2 of FIG. The concave hole 261 . The substrate 32 is located in the through hole 262 and seals the through hole 262 so that the cooling liquid 28 can directly contact the first surface 321 of the substrate 32 . In this embodiment, a bonding substance (not shown in the figure) is located between the first surface 321 and the side surface of the substrate 32 and the second sealing cover 26 for bonding the substrate 32 and the second sealing cover 26, And the bonding substance is cold solder for filling pores, ceramic cold solder, adhesive or glue with high thermal conductivity. In addition to the bonding function, the bonding substance also has a sealing function to prevent the cooling liquid 28 from seeping out. In addition, in other embodiments, the substrate 32 also has a hole connected to the through hole 262 of the second sealing cover 26 and the concave hole 261 , so that the cooling liquid 28 can enter the hole of the substrate 32 . Preferably, the hole is a through hole, which penetrates the substrate 32 and exposes the heat source (LED element) 12 , so that the cooling liquid 28 can directly contact the heat source (LED element) 12 .

Please refer to FIG. 7 , which shows a schematic cross-sectional view of another embodiment of the heat dissipation device in the heat dissipation module of the present invention. The heat dissipation device 2 b of this embodiment is not a heat pipe, but includes a hollow pipe 20 . The hollow tube 20 has a side wall 21 and a plurality of cooling fins 22 . The side wall 21 is an outer shell defining a hollow cavity 211 . The hollow cavity 211 has a first opening 212 and a second opening 213 for accommodating electronic components or structural components, but does not contain cooling liquid. The heat dissipation fins 22 radially extend from the outer side of the side wall 21 to increase heat dissipation efficiency. The sidewall 21 and the heat dissipation fins 22 are integrally formed by aluminum extrusion or aluminum die-casting. The material of the sidewall 21 and the heat dissipation fins 22 is aluminum or copper, preferably, it can be doped with iron alloy, magnesium alloy, other metals or materials with high thermal conductivity. The first surface 321 of the substrate 32 is attached to the hollow tube 20 . Therefore, the heat generated by the die 34 of the heat source (light emitting diode element) 12 can be quickly dissipated by the heat sink 2 .

Please refer to FIG. 8 , which shows a perspective view of another embodiment of the heat dissipation module of the present invention. The heat dissipation module 1b of this embodiment is substantially the same as the heat dissipation module 1 of FIG. 1 , and the same elements are given the same numbers. The difference between the heat dissipation module 1 b of this embodiment and the heat dissipation module 1 of FIG. 1 is that, in this embodiment, the carrying device 10 a includes a main body 14 and a plurality of carrying units 16 . Each of the carrying units 16 carries each of the heat sinks 2 and each of the heat sources (LED elements) 12 , and has a connecting portion 103 (carrying through hole) to expose the heat sources (LED elements) 12 . The carrying units 16 are detachably connected to the trunk portion 14 to form a dendritic module, and the carrying units 16 are spaced apart from each other by a gap. The carrying unit 16 and the trunk portion 14 form the main body portion 101a of the carrying device 10a, and the gap between the carrying units 16 forms the through portion 102a.

Please refer to FIG. 9 and FIG. 10 , which respectively show a perspective view and a schematic bottom view of another embodiment of the heat dissipation module of the present invention. The heat dissipation module 1 c of this embodiment is substantially the same as the heat dissipation module 1 of FIG. 1 , and the same elements are given the same numbers. The differences between the heat dissipation module 1c of this embodiment and the heat dissipation module 1 of FIG. 1 are as follows. In this embodiment, the carrying device 10b has a body portion 101b, a plurality of through portions 102b and a plurality of connecting portions 103 (carrying through holes), and the connecting portions 103 (carrying through holes) and the through portions 102b penetrate The main body portion 101b. In this embodiment, the main body portion 101b is a flat plate, and the through portion 102b is a plurality of through holes, which and the connecting portion 103 (carrying through holes) both pass through the flat plate. The through portion 102b, the connecting portion 103 (carrying through hole) and the heat sink 2 are not arranged in an array. Every four adjacent connecting parts 103 (carrying through holes) are arranged in a parallelogram, and there is a through part 102b between the four connecting parts 103 (carrying through holes). The connection portion 103 (carrying through hole) is circular, and the through portion 102b is parallelogram.

Please refer to FIG. 11 , which shows an exploded perspective view of the heat dissipation module in FIG. 9 . The heat source (light emitting element) 12 is attached to the first end (lower end, ie the second sealing cover 26 ) of the heat sink 2 , and the first end (lower end) of the heat sink 2 is attached to the body portion 101b. At the same time, the heat source (light emitting element) 12 is located in the connecting portion 103 (carrying through hole). Therefore, the substrate 32 is circular like the connecting portion 103 (carrying through hole), and the outer diameter of the substrate 32 is slightly smaller than the diameter of the connecting portion 103 (carrying through hole).

Please refer to FIG. 12 , which shows a schematic perspective view of another embodiment of the heat dissipation module of the present invention. The heat dissipation module 1d of this embodiment is substantially the same as the heat dissipation module 1c shown in FIG. 9 and FIG. 10 , and the same components are assigned the same numbers. The difference between the heat dissipation module 1 d of this embodiment and the heat dissipation module 1 c of FIG. 9 and FIG. 10 is that, in this embodiment, the carrying device 10 c includes a plurality of carrying units 18 . Each of the carrying units 18 has a carrying portion 181 and a plurality of extension portions 182 , and the carrying portion 181 carries the heat source (LED element) 12 . The extension portion 182 is connected to the carrying portion 181 and radially extends outward from the carrying portion 181 . The carrying units 18 are detachably connected to each other by using the extension portion 182 to form the main body portion 101c of the carrying device 10c, and the extension portion 182 surrounds the through portion 102c. The extension parts 182 are connected mechanically and electrically. The way of the mechanism connection includes but not limited to snap-fit, lock-fit, fastener fit and slide groove fit and so on. In addition, in this embodiment, the appearances of the carrying units 18 are not completely the same.

Please refer to FIG. 13 , which shows a schematic bottom view of another embodiment of the carrying unit in the heat dissipation module of the present invention. The carrying unit 18a of this embodiment is substantially the same as the carrying unit 18 of FIG. 12 , wherein the same elements are assigned the same numbers. The difference between the bearing unit 18a of this embodiment and the bearing unit 18 of FIG. The portion 181 extends radially outward, and the angles between the extending portions 182 are equal (90 degrees).

Please refer to FIG. 14 , which shows a schematic bottom view of the carrying device constituted by the carrying unit in FIG. 13 . The carrying device 10c of this embodiment is substantially the same as the carrying device 10c of FIG. 12 , wherein the same elements are assigned the same numbers. The difference between the bearing device 10c of this embodiment and the bearing device 10c of FIG. part 102c, and the through part 102c is substantially quadrilateral. As shown in the figure, the carrying unit 18a can be connected with other carrying units to expand to form a modular structure, and increase the number of the heat source (LED element) 12 to increase the lumen output of the light source. In addition, during expansion, the heat sinks 2 will not affect each other due to thermal connections.

Please refer to FIG. 15 , which shows a schematic bottom view of another embodiment of the carrying unit in the heat dissipation module of the present invention. The carrying unit 18b of this embodiment is substantially the same as the carrying unit 18a of FIG. 13, wherein the same elements are given the same numbers. The difference between the bearing unit 18b of this embodiment and the bearing unit 18a of FIG. The portion 181 extends radially outward, and the angles between the extending portions 182 are equal (120 degrees).

Please refer to FIG. 16 , which shows a schematic bottom view of the carrying device constituted by the carrying unit in FIG. 15 . The carrying device 10c of this embodiment is substantially the same as the carrying device 10c of FIG. 14 , wherein the same elements are assigned the same numbers. The carrying device 10c of this embodiment is different from the carrying device 10c of FIG. 14 in that, in this embodiment, six connected carrying units 18b enclose a through portion 102c, and the through portion 102c is substantially hexagonal. . As shown in the figure, the carrying unit 18b can be connected to other carrying units to form a modular structure.

Please refer to FIG. 17 , which shows a schematic bottom view of another embodiment of the carrying unit in the heat dissipation module of the present invention. The carrying unit 18c of this embodiment is substantially the same as the carrying unit 18a of FIG. 13, and the same elements are assigned the same numbers. The difference between the bearing unit 18c of this embodiment and the bearing unit 18a of FIG. The portion 181 extends radially outward, and the angles between the extending portions 182 are equal (60 degrees).

Please refer to FIG. 18 , which shows a schematic bottom view of the carrying device constituted by the carrying unit in FIG. 17 . The carrying device 10c of this embodiment is substantially the same as the carrying device 10c of FIG. 14 , wherein the same elements are assigned the same numbers. The carrying device 10c of this embodiment differs from the carrying device 10c of FIG. 14 in that in this embodiment, three connected carrying units 18c enclose a through portion 102c, and the through portion 102c is substantially triangular. . As shown in the figure, the carrying unit 18c can be connected to other carrying units to form a modular structure.

However, the above-mentioned embodiments are only for illustrating the principles and effects of the present invention, rather than limiting the present invention. Therefore, those skilled in the art can modify and change the above embodiments without departing from the spirit of the present invention. The scope of rights of the present invention should be listed in the claims of this application.

Claims (21)

1. a radiating module, comprising:

One bogey, has a body and multiple portion of running through, described in the portion of running through run through this body; And

Multiple thermals source, are positioned on this body, and the position of described thermal source is for to run through between portion with respect to described, thereby air is flowed through between described thermal source via the described portion of running through, to promote the radiating efficiency of described thermal source.

2. radiating module according to claim 1, wherein said thermal source is multiple optoelectronic semiconductor components, and it is light emitting diode, photodiode, photovoltaic cell, solar cell, electroluminescent diode, laser diode, power amplifier or integrated circuit component.

3. radiating module according to claim 1, also comprises:

Multiple heat abstractors, described in each, thermal source is attached to a first end of heat abstractor described in each, described in each, the first end of heat abstractor is attached on this body, and described in each, heat abstractor has a hollow cavity, and wherein said heat abstractor is a radiating fin.

4. radiating module according to claim 3, wherein said heat abstractor further comprises a cooling fluid, is positioned at this hollow cavity, flows to form a boil-off gas in order to the heat that absorbs this thermal source in this heat abstractor.

5. radiating module according to claim 4, also comprises multiple radiating fins, is connected to heat abstractor described in each.

6. radiating module according to claim 4, wherein described in each, heat abstractor is a heat pipe, it comprises a shell body and a capillary structure, this capillary structure is positioned at the madial wall of this shell body to define this hollow cavity, described boil-off gas can be flowed in this hollow cavity, and then form heat exchange across this shell body and external environment, be finally condensed into liquid coolant.

7. radiating module according to claim 6, wherein the material of this shell body is metal, and this capillary structure is that wire netting, metal powder burn solution or groove.

8. radiating module according to claim 1, wherein the body of this bogey is a flat board, described in the portion of running through be multiple open-works, described open-work runs through this flat board.

9. radiating module according to claim 1, wherein this bogey comprises a stem portion and multiple load bearing unit, described in each, load bearing unit carries thermal source described in each, described load bearing unit is connected to this stem portion, and described load bearing unit each interval one gap, described load bearing unit and this stem portion form the body of this bogey, and portion is run through described in forming in gap between described load bearing unit.

10. radiating module according to claim 1, wherein this bogey comprises multiple load bearing units, described in each, load bearing unit has a supporting part and multiple extension, described supporting part carries this thermal source, described extension is connected to this supporting part and by the outside radiated entends of this supporting part, described load bearing unit utilizes described extension to be connected to each other to form the body of this bogey, and described extension runs through portion described in crossing.

11. radiating modules according to claim 10, the wherein said portion of running through is triangle, quadrangle or other polygons.

12. 1 kinds of light-emitting devices, comprising:

Multiple light-emitting components;

One bogey, has a body, multiple portion and multiple connecting portion of running through, and described in the portion of running through run through this body; And

Multiple heat abstractors, described in each, light-emitting component is attached to a first end of heat abstractor described in each, described in each, the first end of heat abstractor is attached on this body, described heat abstractor is positioned on described connecting portion, to make described light-emitting component corresponding to described connecting portion, and the position of described heat abstractor is for to run through between portion with respect to described, thereby air is flowed through between described heat abstractor via the described portion of running through, to promote the radiating efficiency of described heat abstractor.

13. light-emitting devices according to claim 12, also comprise a cooling fluid, described in each, heat abstractor has a hollow cavity, and this ECL, in this hollow cavity, flows to form a boil-off gas in order to the heat that absorbs this light-emitting component in this heat abstractor.

14. light-emitting devices according to claim 13, wherein described in each, heat abstractor is a heat pipe, it comprises a shell body and a capillary structure, this capillary structure is positioned at the madial wall of described shell body to define this hollow cavity, this boil-off gas can be flowed in this hollow cavity, and then form heat exchange across this shell body and external environment, be finally condensed into liquid coolant.

15. light-emitting devices according to claim 12, wherein said connecting portion is multiple carrying open-works, it runs through this body, and described light-emitting component is emerging in described carrying open-work.

16. light-emitting devices according to claim 13, also comprise multiple substrates, described in each, substrate has a first surface and a second surface, and this light-emitting component is positioned at the second surface of this substrate, and the first surface of this substrate is attached to the first end of this heat abstractor.

17. light-emitting devices according to claim 16, wherein the first end of this heat abstractor has a through hole, and this through hole of this base plate seals, thereby makes this cooling fluid be contacted this substrate.

18. light-emitting devices according to claim 17, wherein this substrate also has a hole, is communicated to this through hole, thereby makes this cooling fluid be entered the hole of this substrate.

19. light-emitting devices according to claim 12, wherein the body of this bogey is a flat board, described in the portion of running through be multiple open-works, it runs through this flat board.

20. light-emitting devices according to claim 12, wherein this bogey comprises a stem portion and multiple load bearing unit, described in each, load bearing unit carries described in each thermal source and has connecting portion described in each, described load bearing unit is connected to this stem portion, and described load bearing unit each interval one gap, described load bearing unit and this stem portion form the body of this bogey, and portion is run through described in forming in gap between described load bearing unit.

21. light-emitting devices according to claim 12, wherein this bogey comprises multiple load bearing units, described in each, load bearing unit has a supporting part and multiple extension, this supporting part carries this thermal source and has this connecting portion, described extension is connected to this supporting part and by the outside radiated entends of this supporting part, described load bearing unit utilizes described extension to be connected to each other to form the body of this bogey, and described extension runs through portion described in crossing.

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