CN103823089A - Probe card - Google Patents
Probe card Download PDFInfo
- Publication number
- CN103823089A CN103823089A CN201310613092.6A CN201310613092A CN103823089A CN 103823089 A CN103823089 A CN 103823089A CN 201310613092 A CN201310613092 A CN 201310613092A CN 103823089 A CN103823089 A CN 103823089A
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- CN
- China
- Prior art keywords
- probe
- identification chip
- probe card
- read
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000000523 sample Substances 0.000 title claims abstract description 83
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 238000012360 testing method Methods 0.000 abstract description 13
- 239000002184 metal Substances 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 2
- 239000003292 glue Substances 0.000 abstract description 2
- 230000002159 abnormal effect Effects 0.000 abstract 2
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- -1 projection Substances 0.000 description 1
Images
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- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a probe card which comprises a substrate. A number of probes are arranged on the surface of the substrate. A metal contact is arranged on the surface of the substrate. An identification chip is arranged in the probe card. The identification chip is electrically connected with the metal contact. The probe card further comprises a read-write device. The read-write device is used for reading the identification chip arranged on the probe card. The probe card is characterized in that an elastic contact pin is arranged at a position corresponding to the metal contact on the read-write device; and the read-write device is electrically connected with the identification chip through the elastic contact pin. According to the invention, the identification chip is directly prepared or inlaid in the probe card, which can avoid abnormal pin connection between a test head and the probe card, wherein the abnormal pin connection is caused by arrangement deviation of the identification chip; through a novel contact type design, the effect of signal interference on information reading and writing of the probe card can be excluded; and by using contact type connection, the complicated action that every time the identification chip of the probe card falls off from the surface of the probe card, the identification chip needs to be sticked onto the surface of the probe card again through glue can be avoided.
Description
Technical field
The present invention relates to a kind of microelectronics electric performance test field, relate in particular to a kind of probe.
Background technology
In daily wafer testing electrical property, can use probe, and before testing at every turn, surveying instrument can first be confirmed the essential information of probe, these information are all stored in probe identification chip, card reader is carried out read-write operation by wireless signal to identification chip, but there is potential safety hazard in such design, if the position that identification chip is installed is slightly offset, the stitch that will have influence between measuring head and probe is connected, can affect the normal literacy of identification chip, transmission of wireless signals also can be subject to signal and disturb, this also can be on the impact of probe Card read/write.
Patent (publication number: CN101191801A) discloses a kind of probe, and it comprises substrate, projection, probe and bonded block.Described projection is formed in above-mentioned substrate.Described probe comprises the tip that brace summer and the first end from described brace summer protrude.Described projection is electrically connected to described probe by described bonded block.Described bonded block comprises the first bound fraction and surrounds the second bound fraction of described the first bound fraction outside surface.Thereby the probe of probe can firmly fix to make probe can have improved structural stability.
Patent (publication number: CN101971037A) discloses a kind of probe, even described probe in burn-in test, expose with high temperature after, also there is the good stability of the connection between test electrode and tested electrode, even and reusing after probe, also for cheaply more insensitive with the contact position between electrode and conductive part or between conductive part and probe or tested electrode in test.Probe comprises the probe of test circuit board and anisotropic conductive member, and test has formation test electrode with circuit board is with corresponding to tested electrode, and anisotropic conductive member is electrically connected tested electrode and test electrode.Make test electrode be formed as making at least end of this test electrode to give prominence to from the surface of test circuit board, and anisotropic conductive member is the member with dielectric base and multiple conductive paths of being made up of conductive material, dielectric base is made up of the anodic alumina films wherein with micropore, multiple conductive paths are insulated from each other, and extend through dielectric base at the thickness direction of dielectric base.
Summary of the invention
In view of this, the present invention proposes a kind of probe, is slightly offset with the position that solves above-mentioned identification chip installation, affects the normal literacy of identification chip and is subject to the problem that signal disturbs.
For achieving the above object, technical scheme of the present invention is achieved in that
A kind of probe, described probe comprises substrate, is provided with some probes in the surface of described substrate, wherein, the surface of described substrate is also provided with hard contact;
Inside in described probe is also provided with identification chip, and this identification chip is electrically connected with described hard contact.
Above-mentioned a kind of probe, wherein, described probe also comprises a circuit board, described identification chip is arranged in the region between described substrate and described circuit board.
Above-mentioned a kind of probe, wherein, the number of described hard contact is two, and each described hard contact is the contact of ring-type.
Above-mentioned a kind of probe, wherein, described identification chip be shaped as flat rectangle.
Above-mentioned a kind of probe, wherein, described identification chip is installed on ten two directions of probe.
A kind of read-write equipment, described read-write equipment is for reading the identification chip arranging in probe described in above-mentioned any one, wherein, the corresponding described hard contact of described read-write equipment position is provided with elasticity contact pilotage, and described read-write equipment is electrically connected with described identification chip by described elasticity contact pilotage.
The present invention is owing to having adopted above-mentioned technology, and the good effect of generation is:
By use of the present invention, adopt read-write equipment and the probe identification chip mode that elastic force stitch contact is connected to replace wireless signal mode handed down from ancient times in the past, identification chip is directly made or is embedded in probe inside, can avoid like this stitch departing between measuring head and the probe causing is installed is connected extremely due to identification chip, remove signal with stylish contact designing and arranging and disturb the impact on probe Card read/write, connect and can also save the loaded down with trivial details action that each probe identification chip needs again to be glued go back to glue probe surface from probe surface comes off by contact.
Accompanying drawing explanation
The accompanying drawing that forms a part of the present invention is used to provide a further understanding of the present invention, and schematic description and description of the present invention is used for explaining the present invention, does not form inappropriate limitation of the present invention.?
In accompanying drawing:
Fig. 1 is structural representation of the present invention;
Fig. 2 is identification chip of the present invention installation site schematic diagram;
Fig. 3 is side view of the present invention;
Fig. 4 is identification chip of the present invention and annular contact connected mode schematic diagram;
Fig. 5 is the side view of Fig. 4;
Fig. 6 is read-write equipment of the present invention and annular contact way of contact schematic diagram.
1 probe
2 identification chips
3 wires
4 hard contacts
5 read-write equipments
6 elasticity contact pilotages
7 base plates
8 circuit boards
9 substrates
10 probes
Embodiment
Below in conjunction with the drawings and specific embodiments, the invention will be further described, but not as limiting to the invention.
Embodiment:
Shown in Fig. 1-6, a kind of probe, probe 1 comprises substrate 9, is provided with some probes 10 in the surface of substrate 9, it is characterized in that, the surface of substrate 9 is also provided with hard contact 4;
Inside in probe 1 is also provided with identification chip 2, and identification chip 2 is electrically connected with hard contact 4.
It is embodiment that the present invention also has following on the basis of the above, please continue referring to shown in Fig. 1-5:
In further embodiment of the present invention, probe 1 also comprises a circuit board 8, and identification chip 2 is arranged in the region between substrate 9 and circuit board 8.
In further embodiment of the present invention, the number of hard contact 4 is two, and each hard contact 4 is the contact of ring-type.
In further embodiment of the present invention, identification chip 2 be shaped as flat rectangle.
In further embodiment of the present invention, identification chip 2 is installed on ten two directions of probe 1.
In further embodiment of the present invention, also there is a kind of read-write equipment 5, read-write equipment 5 is for reading the identification chip 2 arranging in above-mentioned any one probe 1, it is characterized in that, the corresponding hard contact of read-write equipment 54 positions are provided with elasticity contact pilotage 6, and read-write equipment 5 is electrically connected with identification chip 2 by elasticity contact pilotage 6.
User can further be familiar with characteristic of the present invention and function according to following explanation:
In design of the present invention, replace to be directly made in probe 1 inside or to be embedded in this design in probe 1 identification chip that sticks to probe surface, the twelve-hour direction of probe is directly made or be embedded in to identification chip 2, it is still a mini chip, but from original cylindric rectangular shape that become, and be flat rectangular shape, can inlay easily or directly be produced in probe 1 like this.There is the metal ring contact 4 of two ring-types on probe 1 surface, have respectively wire 3 to be connected to two metal ring contacts 4 on probe 1 surface at the two ends of mini identification chip 2.And having two metallic elastic contact pilotages 6, the read-write equipment 5 that is arranged in measuring head can contact with the metal ring contact 4 in probe 1, after probe 1 is in place by board, the stitch of elasticity contact pilotage 6 just can contact with the metal ring contact 4 under it automatically, thereby the identification chip 2 in probe 1 is connected with read-write equipment 5, and realizes the read-write editor of read-write equipment 5 to the identification chip 2 in probe 1.
The foregoing is only preferred embodiment of the present invention; not thereby limit embodiments of the present invention and protection domain; to those skilled in the art; the scheme that being equal to of should recognizing that all utilizations instructions of the present invention and diagramatic content done replaces and apparent variation obtains, all should be included in protection scope of the present invention.
Claims (6)
1. a probe, described probe comprises substrate, is provided with some probes in the surface of described substrate, it is characterized in that, the surface of described substrate is also provided with hard contact;
Inside in described probe is also provided with identification chip, and this identification chip is electrically connected with described hard contact.
2. probe according to claim 1, is characterized in that, described probe also comprises a circuit board, and described identification chip is arranged in the region between described substrate and described circuit board.
3. probe according to claim 1, is characterized in that, the number of described hard contact is two, and each described hard contact is the contact of ring-type.
4. probe according to claim 1, is characterized in that, described identification chip be shaped as flat rectangle.
5. the probe identification chip mount scheme of novelty according to claim 1, is characterized in that, described identification chip is installed on ten two directions of probe.
6. a read-write equipment, described read-write equipment is for reading the identification chip arranging in probe described in the claims 1～5 any one, it is characterized in that, the corresponding described hard contact of described read-write equipment position is provided with elasticity contact pilotage, and described read-write equipment is electrically connected with described identification chip by described elasticity contact pilotage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310613092.6A CN103823089A (en) | 2013-11-26 | 2013-11-26 | Probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310613092.6A CN103823089A (en) | 2013-11-26 | 2013-11-26 | Probe card |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103823089A true CN103823089A (en) | 2014-05-28 |
Family
ID=50758247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310613092.6A Pending CN103823089A (en) | 2013-11-26 | 2013-11-26 | Probe card |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103823089A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110412321A (en) * | 2019-07-17 | 2019-11-05 | 上海华力微电子有限公司 | The matrix probe card of contact point unit structure and its composition |
| CN110504000A (en) * | 2019-08-26 | 2019-11-26 | 上海华力集成电路制造有限公司 | The method that wafer-level test identifies probe card information with test machine |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6900649B1 (en) * | 2003-09-23 | 2005-05-31 | Keithley Instruments, Inc. | High frequency RF interconnect for semiconductor automatic test equipment |
| JP2006128452A (en) * | 2004-10-29 | 2006-05-18 | Seiko Epson Corp | Probe card, prober device, and semiconductor device manufacturing method |
| CN101191801A (en) * | 2006-11-28 | 2008-06-04 | 高美科株式会社 | Probe card |
| KR20090020135A (en) * | 2007-08-22 | 2009-02-26 | 에스에프텍(주) | Probe card and management system with RFID tag |
| CN101963646A (en) * | 2009-07-23 | 2011-02-02 | 瑞萨电子株式会社 | Semiconductor device testing equipment and testing method thereof |
| CN102208045A (en) * | 2011-06-03 | 2011-10-05 | 上海铭源数码股份有限公司 | Split-type passive electronic tag and printed circuit board using same |
| CN103336935A (en) * | 2013-06-03 | 2013-10-02 | 上海华力微电子有限公司 | Probe card identification device and probe card identification method |
-
2013
- 2013-11-26 CN CN201310613092.6A patent/CN103823089A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6900649B1 (en) * | 2003-09-23 | 2005-05-31 | Keithley Instruments, Inc. | High frequency RF interconnect for semiconductor automatic test equipment |
| JP2006128452A (en) * | 2004-10-29 | 2006-05-18 | Seiko Epson Corp | Probe card, prober device, and semiconductor device manufacturing method |
| CN101191801A (en) * | 2006-11-28 | 2008-06-04 | 高美科株式会社 | Probe card |
| KR20090020135A (en) * | 2007-08-22 | 2009-02-26 | 에스에프텍(주) | Probe card and management system with RFID tag |
| CN101963646A (en) * | 2009-07-23 | 2011-02-02 | 瑞萨电子株式会社 | Semiconductor device testing equipment and testing method thereof |
| CN102208045A (en) * | 2011-06-03 | 2011-10-05 | 上海铭源数码股份有限公司 | Split-type passive electronic tag and printed circuit board using same |
| CN103336935A (en) * | 2013-06-03 | 2013-10-02 | 上海华力微电子有限公司 | Probe card identification device and probe card identification method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110412321A (en) * | 2019-07-17 | 2019-11-05 | 上海华力微电子有限公司 | The matrix probe card of contact point unit structure and its composition |
| CN110412321B (en) * | 2019-07-17 | 2021-08-13 | 上海华力微电子有限公司 | Contact unit structure and matrix probe card formed by same |
| CN110504000A (en) * | 2019-08-26 | 2019-11-26 | 上海华力集成电路制造有限公司 | The method that wafer-level test identifies probe card information with test machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140528 |
|
| RJ01 | Rejection of invention patent application after publication |