CN100432679C - Vertical probe card - Google Patents

Abstract

A vertical probe card includes a circuit board, a guide mechanism, and a plurality of probes; a surface of the circuit board is provided with a plurality of concave conductive slots, each conductive slot has a ring wall, the guide mechanism has a plurality of through holes, the guide mechanism is arranged on the surface of the circuit board with the conductive slot, and each probe has a first end and a second end; the first end is arranged in the conductive slot so that the probe abuts against the ring wall and is electrically connected to the circuit board, and the second end is arranged through the through hole of the guide mechanism.

Description

Vertical Probe Card

technical field

The present invention relates to a probe card, in particular to a vertical probe card.

Background technique

At present, when testing a flip chip (Flip chip) or a chip with high-density contacts, the vertical probe card (Vertical Probe Card) is mainly used for chip testing; the vertical probe card has various The probes are electrically connected vertically to the contacts of the chip to be tested and the test machine, so that each probe is used to transmit test signals between the test machine and the wafer.

The structure of the general vertical probe card, as shown in Figure 4, the vertical probe card (60) includes a circuit board (61), a guide mechanism (62), and a plurality of probes (63); the circuit board ( 61) The bottom surface has several raised pads (64), the guide mechanism (62) is arranged at the position corresponding to the bottom surface of the circuit board (61), and each probe (63) is arranged on the guide mechanism in a movable manner (62), the top of each probe (63) is positioned below the position of each pad (64) of the corresponding circuit board (61), and the bottom extends towards the outside of the guide mechanism (62); when the probe card ( 60) When used to test a chip (not shown in the figure), the bottom ends of each probe (63) are pressed against the contacts of the chip, and the elasticity of each probe (63) makes the top of the probe (63) abut against the contact point of the chip. Each welding pad (64), the chip and the circuit board (61) can be electrically connected to each other.

However, when the two ends of each probe (63) of the above-mentioned probe card (60) are electrically connected to the chip and the circuit board (61) respectively, they are instantly connected between the top of the probe (63) and each pad (64). The high current often causes the temperature between the two to be overheated, and even sparks are emitted, so that the top of the probe (63) produces an oxide layer and carbonization, which affects the conductivity of each probe (63) and increases the resistance value; and After the probe card is used for a long time, the components of the probe card (60) are more likely to be broken, the reliability of the probe card is low, and the service life is also short.

Contents of the invention

The main purpose of the present invention is to provide a vertical probe card. The probes of the probe card are less likely to be carbonized, and the overall probe card has better conductivity and reliability and a longer service life.

In order to achieve the above purpose, the vertical probe card provided by the present invention includes:

A circuit board, a surface of the circuit board is provided with a plurality of concave conductive grooves, each of which has a ring wall;

a guiding mechanism, the guiding mechanism has a plurality of perforations, and the guiding mechanism is arranged on the surface of the circuit board having the conductive grooves; and

A plurality of probes, each of which has a first end and a second end; the first end of each of the probes is arranged in each of the conductive slots, so that each of the probes abuts against the ring wall, and is electrically It is connected to the circuit board, and the second end is passed through the through hole of the guiding mechanism.

Wherein the circuit board has a top surface, a bottom surface, and a positioning portion recessed from the bottom surface toward the top surface, a fixing part is arranged in the positioning part, and the conductive grooves are arranged on the surface of the fixing part.

Wherein each of the conductive grooves has an end surface, and the ring wall is arranged on the end surface; the end surface and the ring wall of each of the conductive grooves have conductive films, and are electrically connected to the circuit board, and the distribution positions of the conductive grooves correspond to At the contact position of a chip under test.

Wherein the guiding mechanism has an upper frame body, a spacer, and a lower frame body stacked on each other, and the perforations are arranged on the upper frame body and the lower frame body.

Wherein the upper frame is arranged in the circuit board, and the perforation positions of the upper frame correspond to the positions of the conductive grooves of the circuit board.

Wherein the guide mechanism has an upper frame body, a spacer, and a lower frame body stacked on each other, the perforations are arranged on the upper frame body and the lower frame body, and the guide mechanism is arranged on the upper frame body within the positioning portion of the circuit board.

Wherein the perforation positions of the upper frame correspond to the positions of the conductive slots.

Each of the probes has an integrally formed upright section and an elastic section; the elastic section is curved, the first end is formed on the upright section, and the second end is formed on the elastic section.

Each of the conductive slots has an end surface, the ring wall is arranged around the end surface, and the first end is separated from the end surface by a predetermined distance.

Description of drawings

Fig. 1 is a schematic sectional view of a preferred embodiment of the present invention;

Figure 2 is a partial schematic view of a preferred embodiment of the present invention; and

Fig. 3 is similar to Fig. 2, mainly showing the condition that the probe abuts against the end face of the conductive slot;

FIG. 4 is a schematic cross-sectional view of a conventional vertical probe card.

Detailed ways

A preferred embodiment is given below in conjunction with the accompanying drawings, in order to further illustrate the structure and effect of the present invention:

Please refer to Fig. 1 and shown in Fig. 2, for the vertical probe card provided by a preferred embodiment of the present invention, the probe card (10) includes a circuit board (20), a guide mechanism (30), and Most probes (40); the circuit board (20) has a top surface (21), a bottom surface (22), and a positioning portion (23) recessed from the bottom surface (22) toward the top surface (21), the positioning portion (23) is provided with a fixed part (24), and the surface of the fixed part (24) is provided with a plurality of conductive grooves (25), and each of the conductive grooves (25) is recessed in the fixed part (24), and then forms an end face (26 ) and a ring wall (27); the end face (26) and the ring wall (27) of each conductive groove (25) all have a conductive film, and are electrically connected with the circuit board (20), and the conductive grooves (25) The distribution positions of correspond to the contact positions of a chip to be tested (not shown in the figure).

The guide mechanism (30) has an upper frame (31), a spacer (32), and a lower frame (33) stacked on each other; the upper frame (31) and the lower frame (33) are all made of ceramics. Material is made, and upper frame body (31) and lower frame body (33) have the perforation (34,35) that most are penetrating shapes respectively, and guide mechanism (30) is that above frame body (31) is located at circuit board (20 ), and each perforation (34) position of the upper frame body (31) corresponds to each conductive groove (25) of the circuit board (20).

Each of the probes (40) is made of conductive material, and each probe (40) is provided with an integrally formed upright section (41) and an elastic section (42); the elastic section (42) is curved, and the upright section (41) forms a first end (43), and the elastic section (42) forms a second end (44), and the upright section (41) of each probe (40) is located on the guide mechanism (30) The perforation (34) of the frame body (31) makes the first end (43) protrude from the upper frame body (31), and is embedded in each conductive groove (25) of the circuit board (20); the first end (43) ) abuts against the ring wall (27), so that each probe (40) is electrically connected to the circuit board (20), and the first end (43) is separated from the end surface (26) of the conductive groove (25) by a predetermined distance. distance; the elastic section (42) of each probe (40) then extends toward the lower frame (33) from the upright section (41), and passes through the perforation (34) of the lower frame (33), so that the second end (44) protrudes from the lower frame body (33).

Through the above description, since the first end (43) of each probe (40) is directly abutting against the ring wall (27) of the conductive groove (25), the gap between each probe (40) and the circuit board (20) All in an electrically conductive state at any time, when the probe card (10) is used to test the chip, and the second end (44) of each probe (40) is pressed against the contact of the chip, the probe (40) The first end (43) and the circuit board (20) can conduct the current between the two through the conductive groove (25), and the current will not be conducted to the first end (43) and the circuit board (20) in an instant, Thereby the temperature between probe (40) and circuit board (20) is lower, and the first end (43) of probe (40) also just can not produce carbonization phenomenon; In addition, as shown in Figure 2, when each When the second end (44) of the probe (40) is pressed against the chip, the first end (43) of the probe (40) can slide towards the end surface (26) of the conductive groove (25) due to force, Even as shown in Figure 3, the first end (43) is made to abut against the end surface (26), so that each probe (40) of the probe card (10) can be abutted against each contact point of the chip .

Because no carbonization phenomenon will occur between each probe (40) and the circuit board (20), the current value that each probe (40) can load is higher, and the first end of each probe (40) ( 43) is that the outer peripheral surface and the ring wall (27) of the conductive groove (25) abut against each other, so the contact area between the two is relatively large, the resistance value of each probe (40) is small, and the conductivity is better. At the same time, it can also be applied to higher frequency test work; in addition, because the upper and lower frames (31, 33) of the guide mechanism (30) are made of ceramic materials, their structural strength is better, and there will be no structural damage. Cracked condition.

Therefore, the present invention can achieve the goals that each probe will not generate carbonization phenomenon, the conductivity and reliability of the whole probe card are better, and the service life is longer.

Claims (8)

1. A vertical probe card, comprising: A circuit board, a surface of the circuit board is provided with a plurality of concave conductive grooves, each of which has a ring wall; a guiding mechanism, the guiding mechanism has a plurality of perforations, and the guiding mechanism is arranged on the surface of the circuit board having the conductive grooves; and A plurality of probes, each of which has a first end and a second end; the first end of each of the probes is arranged in each of the conductive slots, so that each of the probes abuts against the ring wall, and is electrically connected to the circuit board, and the second end is passed through the through hole of the guiding mechanism; The probe is stuck under the untested chip, the conductive groove has an end face, the ring wall is arranged on the end face, and the first end of the probe is separated from the end face by a predetermined distance. 2. The vertical probe card according to claim 1, wherein the circuit board has a top surface, a bottom surface, and a positioning portion recessed from the bottom surface toward the top surface, the positioning portion A fixing part is provided, and the surface of the fixing part is provided with the conductive grooves. 3. The vertical probe card according to claim 1, wherein each of the conductive grooves has an end surface, and the ring wall is arranged around the end surface; the end surface and the ring wall of each of the conductive grooves have conductive films , and is electrically connected with the circuit board, and the distribution positions of the conductive grooves correspond to the contact positions of a chip to be tested. 4. The vertical probe card according to claim 1, wherein the guiding mechanism has an upper frame, a spacer, and a lower frame stacked on each other, and the perforations are arranged in the upper frame body and the lower frame. 5 . The vertical probe card according to claim 4 , wherein the upper frame is disposed in the circuit board, and the positions of the perforations of the upper frame correspond to the positions of the conductive grooves of the circuit board. 5 . 6. The vertical probe card according to claim 2, wherein the guiding mechanism has an upper frame, a spacer, and a lower frame stacked on each other, and the perforations are arranged in the upper frame Body and the lower frame body, the guide mechanism is set in the positioning part of the circuit board with the upper frame body. 7 . The vertical probe card according to claim 6 , wherein the positions of the holes on the upper frame correspond to the positions of the conductive slots. 7 . 8. The vertical probe card according to claim 1, wherein each of the probes has an integrally formed upright section and an elastic section; the elastic section is curved, and the first end is formed on the The upright segment, the second end is formed on the elastic segment.

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