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CN103779286A - 一种封装结构、封装方法及在封装方法中使用的模板 - Google Patents

一种封装结构、封装方法及在封装方法中使用的模板 Download PDF

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CN103779286A
CN103779286A CN201410037714.XA CN201410037714A CN103779286A CN 103779286 A CN103779286 A CN 103779286A CN 201410037714 A CN201410037714 A CN 201410037714A CN 103779286 A CN103779286 A CN 103779286A
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template
substrate
leads
cavity
chip
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王谦
谭琳
蔡坚
陈瑜
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Tsinghua University
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Tsinghua University
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Priority to CN201811459526.0A priority Critical patent/CN109742034A/zh
Priority to CN201410037714.XA priority patent/CN103779286A/zh
Priority to PCT/CN2014/071564 priority patent/WO2015109596A1/zh
Priority to US15/113,639 priority patent/US9960093B2/en
Publication of CN103779286A publication Critical patent/CN103779286A/zh
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Abstract

本发明公开了一种封装结构、封装方法及在封装方法中使用的模板，其中，该封装结构包括：基板；芯片，贴装在所述基板上；引线，用于将所述基板与所述芯片电连接；以及保护层，形成在所述基板上，用于覆盖所述芯片、所述引线以及与所述引线连接的焊盘，所述保护层的尺寸小于所述基板的尺寸。上述的封装结构、封装方法及在封装方法中使用的模板能够解决现有技术中模塑腔体设计难度大、模塑工艺复杂、造价高以及模塑材料量消耗大的问题。

Description

一种封装结构、封装方法及在封装方法中使用的模板
技术领域
本发明涉及半导体领域，尤其涉及一种封装结构、封装方法及在封装方法中使用的模板。
背景技术
传统的窄节距焊球阵列（FBGA）产品的封装流程如图1所示：S100，芯片贴装；S102，引线键合；S104，模塑、固化；S106，植球；S108，切割。其中步骤S104中模塑工艺是将模塑料在高温高压下注入模塑腔，模塑料覆盖整个基板上表面，经过聚合物的交联反应再经固化成形，起到保护引线提高器件可靠性的目的。图2示出了现有技术的封装结构的侧视图，图3示出了现有技术的封装结构的俯视图，其中，标号10表示基板，12表示芯片，14表示引线，16表示模塑料，18表示焊球阵列。但此工艺过程复杂耗时，模塑腔体的设计难度大、模塑工艺复杂、造价高，模塑材料量消耗大。
发明内容
本发明的目的是提供一种封装结构、封装方法及在封装方法中使用的模板，以解决现有技术中模塑腔体设计难度大、模塑工艺复杂、造价高以及模塑材料量消耗大的问题。
为了实现上述目的，本发明提供一种封装结构，其中，该封装结构包括：基板；芯片，贴装在所述基板上；引线，用于将所述基板与所述芯片电连接；以及保护层，形成在所述基板上，用于覆盖所述芯片、所述引线以及与所述引线连接的焊盘，所述保护层的尺寸小于所述基板的尺寸。
优选地，所述保护层由环氧塑封料形成。
本发明还提供了一种封装方法，其中，该方法包括：提供基板；在所述基板上贴装芯片；使用引线键合工艺通过引线将所述基板与所述芯片电连接；在所述基板上放置模板，所述模板具有使所述芯片、所述引线以及与所述引线连接的焊盘暴露的空腔，且所述模板的高度高于所述引线的高度；在所述空腔内形成保护层；以及去除所述模板。
优选地，该方法还包括：在所述基板上放置所述模板之前，在所述模板的下表面涂敷表面涂料；通过使用有机溶剂清洗所述表面涂料来去除所述模板。
优选地，所述保护层由环氧塑封料形成。
优选地，在所述空腔内形成保护层包括：在所述空腔内填充所述环氧塑封料；对所述环氧塑封料执行固化工艺形成所述保护层。
优选地，通过点胶工艺或印刷工艺在所述空腔内填充所述环氧塑封料。
优选地，通过点胶工艺在所述空腔内填充所述环氧塑封料的情况下，所述模板除所述空腔之外的部分还形成有多个孔。
本发明还提供了一种在上述的封装方法中使用的模板，其中，该模板具有使所述芯片、所述引线以及与所述引线连接的焊盘暴露的空腔，且所述模板的高度高于所述引线的高度。
优选地，所述模板除所述空腔之外的部分还形成有多个孔。
通过上述技术方案，在器件封装过程中设置了具有使芯片、引线以及与引线连接的焊盘暴露的空腔的模板，由此保护层可以在模板空腔中形成以实现对芯片、引线以及与引线连接的焊盘的保护，避免了大型模塑设备的使用和复杂的模塑腔体的设计，简化了制作工艺，节约了制作成本。并且，由于保护层不需要覆盖整个基板表面，所以可以节省材料，同时减轻器件重量。此外，通过使用模板，还可以降低/控制器件的整体高度。
本发明的其他特征和优点将在随后的具体实施方式部分予以详细说明。
附图说明
附图是用来提供对本发明的进一步理解，并且构成说明书的一部分，与下面的具体实施方式一起用于解释本发明，但并不构成对本发明的限制。在附图中：
图1是现有技术的封装方法的流程图；
图2示出了现有技术的封装结构的侧视图；
图3示出了现有技术的封装结构的俯视图；
图4是根据本发明的封装结构的一个示例性剖面图；
图5是根据本发明的封装结构的俯视图；
图6是根据本发明的封装方法的流程图；
图7是根据本发明的在封装方法中使用的模板的俯视图；
图8是根据本发明的在封装方法中使用的具有多个孔的模板的俯视图；
图9是根据本发明的封装方法中使用的点胶工艺的示意图；以及
图10是根据本发明的封装方法中使用的印刷工艺的示意图。
具体实施方式
以下结合附图对本发明的具体实施方式进行详细说明。应当理解的是，此处所描述的具体实施方式仅用于说明和解释本发明，并不用于限制本发明。在本发明中，相同的标号用于表示相同的元件。
图4是根据本发明的封装结构的一个示例性剖面图。
如图4所示，本发明提供的封装结构包括：基板100；芯片102，贴装在所述基板100上；引线104，用于将所述基板100与所述芯片102电连接；以及保护层106，形成在所述基板100上，用于覆盖所述芯片102、所述引线104以及与所述引线104连接的焊盘（未示出），所述保护层106的尺寸小于所述基板100的尺寸。
本发明的封装结构还可以包括焊球阵列108，形成在基板100的下表面。
根据本发明的封装结构形成有保护层106，从而可以保护芯片、所述引线以及与引线连接的焊盘；且该保护层106的尺寸小于所述基板100的尺寸，即保护层106不需要覆盖整个基板表面，由此可以减少保护层的用料量，同时可以减轻器件的重量。
根据本发明一种实施方式，保护层106由环氧塑封料形成。环氧塑封料可以具有良好的流动性，能够抵抗机械冲击、化学腐蚀、高温高湿等，并且不会影响引线的线形和结合力，因而由环氧塑封料形成的保护层106可以对芯片、引线以及与引线连接的焊盘提供足够强的保护。本领域技术人员应当理解，上述的环氧塑封料仅仅是示例性的，并非用于限定本发明。
图5是根据本发明的封装结构的俯视图。如图5所示，环氧塑封料形成的保护层106未覆盖基板外围部分。
图6是根据本发明的封装方法的流程图。
如图6所示，本发明提供的封装方法包括：
S300，提供基板；
S302，在所述基板上贴装芯片；
S304，使用引线键合工艺通过引线将所述基板与所述芯片电连接；
S306，在所述基板上放置模板，所述模板具有使所述芯片、所述引线以及与所述引线连接的焊盘暴露的空腔，且所述模板的高度高于所述引线的高度；
S308，在所述空腔内形成保护层；以及
S310，去除所述模板。
通过在器件封装过程中设置具有使芯片、引线以及与引线连接的焊盘暴露的空腔的模板，由此保护层可以在模板空腔中形成以实现对芯片、引线以及与引线连接的焊盘的保护，避免了大型模塑设备的使用和复杂的模塑腔体的设计，简化了制作工艺，节约了制作成本。并且，由于保护层不需要覆盖整个基板表面，所以可以节省材料，同时减轻器件重量。此外，通过使用模板，还可以降低/控制器件的整体高度。
其中，在步骤S310之后，该方法还包括：
S312，通过植球工艺在所述基板的下表面形成焊球阵列；
S314，通过切割工艺对所述基板进行切割。
在本方法中，在步骤S306之前，在所述模板的下表面涂敷表面涂料，以使所述模板的下表面与所述基板的上表面紧密结合，从而在形成保护层的过程中可以防止保护层材料溢出。其中，该表面涂料可以具有耐高温性能。
在模板的下表面涂覆了表面涂料的情况下，在步骤S310之前，使用有机溶剂清洗所述表面涂料，以便于所述模板的去除。通过使用有机溶剂清洗表面涂料，可以使得所述模板易于脱离，同时防止了表面涂料的残留，由此可以实现对该模板进行重复使用，提高模板利用率。
本领域技术人员可以根据实际需要进行表面涂料和有机溶剂的选取，本发明对此不作限定。
根据本发明一种实施方式，保护层由环氧塑封料形成。环氧塑封料具有良好的流动性，能够抵抗机械冲击、化学腐蚀、高温高湿等，并且不会影响引线的线形和结合力，因而由环氧塑封料形成的保护层可以对芯片、引线以及与引线连接的焊盘提供足够强的保护。本领域技术人员应当理解，上述的环氧塑封料仅仅是示例性的，并非用于限定本发明。
在本方法中，步骤S308包括：
在所述空腔内填充所述环氧塑封料；
对所述环氧塑封料执行固化工艺形成所述保护层。
在填充环氧塑封料的过程中，可以对基板和环氧塑封料进行加热，以加快环氧塑封料的填充。通过向空腔内填充环氧塑封料的方式，可以避免传统模塑工艺中空气残留产生的空洞问题。
根据本发明的一种实施方式，通过点胶工艺或印刷工艺在所述空腔内填充所述环氧塑封料。图9和图10分别示出了在本发明中使用的点胶工艺和印刷工艺。其中，斜线部分表示模板，方格部分表示正在填充的环氧塑封料（即，正在向空腔中填充的环氧塑封料）。
通过点胶工艺在所述空腔内填充所述环氧塑封料的情况下，所述模板除所述空腔之外的部分还可以形成有多个孔。通过在模板上设置多个孔，可以去除无效材料，同时减轻模板重量。所述模板上的孔的位置、形状和数量可以根据实际需要进行设定，本发明不作限定。
在本发明中，可以采用图6所示的封装方法制造图4所示的封装结构。
图7是根据本发明的在封装方法中使用的模板的俯视图。图7中的斜线部分表示模板的外层。
本发明还提供了一种在上述实施方式中描述的封装方法中使用的模板。其中，如图7所示，该模板具有使所述芯片、所述引线以及与所述引线连接的焊盘暴露的空腔400，且所述模板的高度高于所述引线的高度。
其中，模板的材料可以为不锈钢（即，可以选用与丝网印刷的网板类似的材料），由此该模板可以具有强度高、不易变形的优点。并且，去除后的模板还可以被重复利用。本领域技术人员应当理解，上述对模板材料的描述仅仅是示例性的，并非用于限定本发明。
当通过点胶工艺在所述空腔内形成保护层的情况下，所述模板除所述空腔400之外的部分还可以形成有多个孔402（如图8所示，在所述模板的外层形成有多个孔，图8是根据本发明的在封装方法中使用的具有多个孔的模板的俯视图）。通过在模板上设置多个孔402，可以去除无效材料，同时减轻模板重量。
根据本发明的一种实施方式，可以在图6所示的封装方法中使用上述的模板制造图4所示的封装结构。
本发明可以适用于需要对芯片、引线以及与引线连接的焊盘进行保护的封装器件（例如，FBGA、方形扁平无引脚封装（QFN）、方形扁平式封装（QFP）等基板或引线框架等封装形式）。
以上结合附图详细描述了本发明的优选实施方式，但是，本发明并不限于上述实施方式中的具体细节，在本发明的技术构思范围内，可以对本发明的技术方案进行多种简单变型，这些简单变型均属于本发明的保护范围。
另外需要说明的是，在上述具体实施方式中所描述的各个具体技术特征，在不矛盾的情况下，可以通过任何合适的方式进行组合。为了避免不必要的重复，本发明对各种可能的组合方式不再另行说明。
此外，本发明的各种不同的实施方式之间也可以进行任意组合，只要其不违背本发明的思想，其同样应当视为本发明所公开的内容。

Claims (10)

1.一种封装结构，其中，该封装结构包括：
基板；
芯片，贴装在所述基板上；
引线，用于将所述基板与所述芯片电连接；以及
保护层，形成在所述基板上，用于覆盖所述芯片、所述引线以及与所述引线连接的焊盘，所述保护层的尺寸小于所述基板的尺寸。
2.根据权利要求1所述的封装结构，其中，所述保护层由环氧塑封料形成。
3.一种封装方法，其中，该方法包括：
提供基板；
在所述基板上贴装芯片；
使用引线键合工艺通过引线将所述基板与所述芯片电连接；
在所述基板上放置模板，所述模板具有使所述芯片、所述引线以及与所述引线连接的焊盘暴露的空腔，且所述模板的高度高于所述引线的高度；
在所述空腔内形成保护层；以及
去除所述模板。
4.根据权利要求3所述的封装方法，其中，该方法还包括：
在所述基板上放置所述模板之前，在所述模板的下表面涂敷表面涂料；
在去除所述模板之前，使用有机溶剂清洗所述表面涂料。
5.根据权利要求3所述的封装方法，其中，所述保护层由环氧塑封料形成。
6.根据权利要求5所述的封装方法，其中，在所述空腔内形成保护层包括：
在所述空腔内填充所述环氧塑封料；
对所述环氧塑封料执行固化工艺形成所述保护层。
7.根据权利要求6所述的封装方法，其中，通过点胶工艺或印刷工艺在所述空腔内填充所述环氧塑封料。
8.根据权利要求7所述的封装方法，其中，通过点胶工艺在所述空腔内填充所述环氧塑封料的情况下，所述模板除所述空腔之外的部分还形成有多个孔。
9.一种在权利要求3-8中任一项权利要求所述的封装方法中使用的模板，其中，该模板具有使所述芯片、所述引线以及与所述引线连接的焊盘暴露的空腔，且所述模板的高度高于所述引线的高度。
10.根据权利要求9所述的模板，其中，所述模板除所述空腔之外的部分还形成有多个孔。
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