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CN103777127A - Light-emitting diode photoelectric characteristic measurement device - Google Patents

Light-emitting diode photoelectric characteristic measurement device Download PDF

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Publication number
CN103777127A
CN103777127A CN201210402060.7A CN201210402060A CN103777127A CN 103777127 A CN103777127 A CN 103777127A CN 201210402060 A CN201210402060 A CN 201210402060A CN 103777127 A CN103777127 A CN 103777127A
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emitting diode
light emitting
light
measuring equipment
container
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黄明宏
曾培翔
施佩秀
尤家鸿
黄泯舜
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Epistar Corp
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Epistar Corp
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Abstract

本发明揭露一发光二极管光电特性的量测装置,包括:一容器,具有一光输入口及一光输出口;一量测模块,与容器的光输出口连接;一试片承载台,位于容器下方且可承载待测的发光二极管;及一光聚集单元,位于容器与试片承载台之间。

The present invention discloses a device for measuring the photoelectric characteristics of a light emitting diode, comprising: a container having a light input port and a light output port; a measuring module connected to the light output port of the container; a test piece carrier located below the container and capable of carrying a light emitting diode to be measured; and a light focusing unit located between the container and the test piece carrier.

Description

发光二极管光电特性量测装置Light-emitting diode photoelectric characteristic measurement device

技术领域technical field

本发明揭露一发光二极管光电特性的量测装置,特别是关于一种量测一晶圆型式(wafer form)或晶粒型式(chip form)发光二极管光电特性的装置。The invention discloses a device for measuring the photoelectric characteristics of a light emitting diode, in particular to a device for measuring the photoelectric characteristics of a wafer form or chip form light emitting diode.

背景技术Background technique

积分球是一个中空球体单元,球体上可依需求开设数量不等的光输入孔及光输出孔,球体内壁为具有漫射及反射性质的涂层。当待测的发光二极管所产生的光通量从光输入口射入积分球,经过积分球体内壁复杂的漫射及反射后,依内壁涂层的材料决定被积分球体内壁吸收的光通量,其余从光输出口射出。积分球的作用就是收集此种由四面八方反射的光通量,通过特殊的设计,可取样光输出口处的光功率、光波形和光通量,换算后即可得到发光二极管的相应参数。Integrating sphere is a hollow spherical unit, on which a number of light input holes and light output holes can be opened according to requirements, and the inner wall of the sphere is coated with diffusion and reflection properties. When the luminous flux generated by the light-emitting diode to be tested is injected into the integrating sphere from the light input port, after complex diffusion and reflection on the inner wall of the integrating sphere, the luminous flux absorbed by the inner wall of the integrating sphere is determined according to the material of the inner wall coating, and the rest is output from the light. Mouth ejaculation. The function of the integrating sphere is to collect the luminous flux reflected from all directions. Through a special design, the optical power, optical waveform and luminous flux at the light output port can be sampled, and the corresponding parameters of the light-emitting diode can be obtained after conversion.

目前业界使用量测发光二极管的光功率等参数的商用设备IS(instrument system),其所使用的积分球直径至少为10英寸,并具有一试片座2(其示意图如图2所示)直接固定于积分球的光输入口(图未示),其设计只适用于发光二极管封装体的量测。将待测的发光二极管TO封装体61的接脚62直接插入试片座本体60,试片座本体60底端连接电源供应器(图未示)以提供电流或电压使得待测的发光二极管TO封装体61产生的光通量射入积分球体内。At present, the industry uses a commercial equipment IS (instrument system) for measuring parameters such as the optical power of light-emitting diodes. The light input port (not shown) fixed on the integrating sphere is designed only for the measurement of the LED package. The pins 62 of the LED TO package 61 to be tested are directly inserted into the test piece holder body 60, and the bottom end of the test piece holder body 60 is connected to a power supply (not shown) to provide current or voltage so that the LED TO under test The luminous flux generated by the package body 61 enters the integrating sphere.

发明内容Contents of the invention

本发明提供一发光二极管光电特性的量测装置,包括:一容器,此容器具有一光输入口及一光输出口;一量测模块,此量测模块与容器的光输出口连接;一试片承载台,位于容器下方且可承载待测的发光二极管,其中试片承载台表面具有相对于待测发光二极管所产生的光通量大于50%的反射率;及一光聚集单元,位于容器与试片承载台之间,其中光聚集单元内壁具有相对于待测发光二极管所产生的光通量大于50%的反射率。The invention provides a measuring device for photoelectric characteristics of light-emitting diodes, comprising: a container, the container has a light input port and a light output port; a measurement module, the measurement module is connected with the light output port of the container; The chip carrier is located under the container and can carry the light-emitting diode to be tested, wherein the surface of the test chip carrier has a reflectivity greater than 50% relative to the luminous flux generated by the light-emitting diode to be tested; and a light gathering unit is located between the container and the test Between the sheet-carrying platforms, the inner wall of the light-gathering unit has a reflectivity greater than 50% relative to the luminous flux generated by the light-emitting diode to be tested.

根据本发明的一个实施例,其中试片承载台包括一承载体及形成于承载体之上的一薄层,且此薄层是由对待测发光二极管所产生的光通量具有大于50%反射率的材料所组成。According to one embodiment of the present invention, wherein the test piece carrier includes a carrier and a thin layer formed on the carrier, and the thin layer is made of a light flux produced by the light-emitting diode to be tested and has a reflectivity greater than 50%. composed of materials.

根据本发明的一个实施例,其中光聚集单元包括一本体及形成于本体内壁的一薄层,且此薄层是由对待测发光二极管所产生的光通量具有大于50%反射率的材料所组成。According to an embodiment of the present invention, the light concentrating unit includes a body and a thin layer formed on the inner wall of the body, and the thin layer is composed of a material having a reflectivity greater than 50% of the luminous flux generated by the LED to be tested.

上述说明仅是本发明技术方案的概述,为了能够更清楚了解本发明的技术手段,而可依照说明书的内容予以实施,并且为了让本发明的上述和其他目的、特征和优点能够更明显易懂,以下特举较佳实施例,并配合附图,详细说明如下。The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable , the following preferred embodiments are specifically cited below, and are described in detail as follows in conjunction with the accompanying drawings.

附图说明Description of drawings

图1所示为本发明发光二极管光电特性量测装置的结构图。FIG. 1 is a structural diagram of a light-emitting diode photoelectric characteristic measuring device of the present invention.

图2所示为目前业界使用的商用设备IS(instrument system)试片座的示意图。Fig. 2 is a schematic diagram of a commercial equipment IS (instrument system) test piece holder currently used in the industry.

具体实施方式Detailed ways

为更进一步阐述本发明为达成预定发明目的所采取的技术手段及功效,以下结合附图及较佳实施例,对本发明的具体实施方式、结构、特征及其功效,详细说明如后。In order to further explain the technical means and effects adopted by the present invention to achieve the intended invention purpose, the specific implementation, structure, features and effects of the present invention will be described in detail below in conjunction with the accompanying drawings and preferred embodiments.

图1所示为本发明所揭示的发光二极管光电特性量测装置,其包括:一容器10,例如为一中空球体单元,具有一光输入口10A及一光输出口10B;一量测模块11,此量测模块11与容器10的光输出口10B连接;一试片承载台12,位于容器10的下方且可承载待测的发光二极管13;一光聚集单元14,位于容器10与试片承载台12之间;及一电源供应器15,位于试片承载台12之下。Fig. 1 shows the light-emitting diode photoelectric property measuring device disclosed by the present invention, which includes: a container 10, such as a hollow spherical unit, with a light input port 10A and a light output port 10B; a measurement module 11 , the measurement module 11 is connected to the light output port 10B of the container 10; a test piece carrier 12 is located under the container 10 and can carry the light-emitting diode 13 to be tested; a light gathering unit 14 is located between the container 10 and the test piece between the carrying platforms 12 ; and a power supply 15 located under the test piece carrying platforms 12 .

于本实施例中,容器10为一直径至少为2英寸的积分球(IntegratingSphere)。试片承载台12可承载待测的发光二极管13,其中发光二极管13较佳地为尚未经封装的晶圆型式或晶粒型式。试片承载台12表面具有相对于待测发光二极管13所产生的光通量大于50%的反射率。于另一实施例中,试片承载台12包括一承载体及形成于承载体上的一薄层(图未示),其中此薄层是由对待测发光二极管13所产生的光通量具有大于50%反射率的材料所组成;例如:铝、铜、镍、银、铬、金或至少包括铁、钛、硅、钡的陶瓷材料。另外,本装置具有一提供发光二极管13量测时所需电流或电压的电源供应器15,借由两只具折角的探针17点测时将电流或电压传输至发光二极管13的表面;其中探针的折角θ较佳为30度到150度,最佳则约为120度。此外,为了增加将待测发光二极管13所产生的光通量导入容器10的效果,于容器10的光输入口10A与试片承载台12之间设置一光聚集单元14,其中光聚集单元14内壁具有相对于待测发光二极管13所产生的光通量大于50%的反射率。于另一实施例中,光聚集单元包括一本体14A及形成于本体14A内壁的一薄层14B,其中此薄层14B是由对待测发光二极管13所产生的光通量具有大于50%反射率的材料所组成;例如:铝、铜、镍、银、铬、金或至少包括铁、钛、硅、钡的陶瓷材料。为了使待测发光二极管13所产生的光通量能全部导入容器10内,在量测发光二极管13光电特性时,光聚集单元14须完全包覆试片承载台12或完全包覆待测的发光二极管13。光聚集单元14更包括两个开孔16,可使具折角的探针17穿过此开孔16进入光聚集单元14中以量测发光二极管13。In this embodiment, the container 10 is an integrating sphere with a diameter of at least 2 inches. The test piece carrier 12 can carry the light emitting diodes 13 to be tested, wherein the light emitting diodes 13 are preferably in the form of unpackaged wafers or dies. The surface of the test piece carrier 12 has a reflectivity greater than 50% relative to the luminous flux generated by the light emitting diode 13 to be tested. In another embodiment, the test piece carrier 12 includes a carrier and a thin layer (not shown) formed on the carrier, wherein the thin layer is produced by the light emitting diode 13 to be tested with a light flux greater than 50 % reflectivity of materials; for example: aluminum, copper, nickel, silver, chromium, gold or ceramic materials including at least iron, titanium, silicon, barium. In addition, the device has a power supply 15 that provides the current or voltage required for measuring the light-emitting diode 13, and transmits the current or voltage to the surface of the light-emitting diode 13 when measuring with two angled probes 17; The bending angle θ of the probe is preferably 30 degrees to 150 degrees, and most preferably about 120 degrees. In addition, in order to increase the effect of introducing the luminous flux produced by the light-emitting diode 13 to be tested into the container 10, a light-gathering unit 14 is arranged between the light input port 10A of the container 10 and the test piece carrier 12, wherein the inner wall of the light-gathering unit 14 has a Relative to the luminous flux generated by the light emitting diode 13 to be tested, the reflectivity is greater than 50%. In another embodiment, the light concentrating unit includes a body 14A and a thin layer 14B formed on the inner wall of the body 14A, wherein the thin layer 14B is made of a material having a reflectivity greater than 50% for the luminous flux generated by the light emitting diode 13 to be tested Composition; for example: aluminum, copper, nickel, silver, chromium, gold or ceramic materials including at least iron, titanium, silicon, barium. In order to make the luminous flux generated by the light-emitting diode 13 to be tested be fully guided into the container 10, when measuring the photoelectric characteristics of the light-emitting diode 13, the light-gathering unit 14 must completely cover the test piece carrier 12 or completely cover the light-emitting diode to be tested. 13. The light gathering unit 14 further includes two openings 16 , through which the angled probe 17 can pass through the openings 16 and enter the light gathering unit 14 to measure the LED 13 .

当待测的发光二极管13产生的光通量从光输入口10A射入容器10,经过容器10内壁复杂的漫射及反射后,依内壁涂层的材料决定被容器内壁吸收的光通量,其余从光输出口10B射出,进而进入一量测模块11,其中量测模块更包括一分光仪(图未示)。经由量测模块11换算后即可得到待测的发光二极管13的光电特性,其中电性特性例如:正向偏压(forward bias voltage,Vf),逆向崩溃电压,反向电流(reversed current,IR),加热前后正向偏压的差值及正向偏压瞬时峰值;其中光学特性例如:光强度(luminous intensity,Iv),峰值波长(peak length,λp),波长半高宽(fullwidth at half maximun,FWHM),色度坐标(CIE),主要波长(dominatedlength,λd),颜色纯度(purity),及色温(color temperature)。When the luminous flux produced by the light-emitting diode 13 to be tested enters the container 10 from the light input port 10A, after the complex diffusion and reflection of the inner wall of the container 10, the luminous flux absorbed by the inner wall of the container is determined according to the material of the inner wall coating, and the rest is output from the light. The port 10B is emitted, and then enters a measurement module 11, wherein the measurement module further includes a spectrometer (not shown in the figure). After being converted by the measurement module 11, the photoelectric characteristics of the light emitting diode 13 to be measured can be obtained, wherein the electrical characteristics such as: forward bias voltage (forward bias voltage, Vf), reverse breakdown voltage, reverse current (reversed current, IR ), the difference of forward bias voltage before and after heating and the instantaneous peak value of forward bias voltage; the optical properties such as: light intensity (luminous intensity, Iv), peak wavelength (peak length, λp), wavelength half maximum width (fullwidth at half maximum, FWHM), chromaticity coordinates (CIE), dominant wavelength (dominated length, λd), color purity (purity), and color temperature (color temperature).

量测待测发光二极管光电特性的方法如下:提供一如图1所示的发光二极管光电特性量测装置1,将一发光二极管晶圆或晶粒13放置在试片承载台12上,借由两只具折角的探针17穿过开孔16进入光聚集单元14中以点测发光二极管13,于量测时将电源供应器15提供的电流或电压传输至发光二极管晶圆或发光二极管晶粒的表面,使其发光。所产生的光通量经光聚集单元14聚光后由光输入口10A进入容器10内,经过容器内壁复杂的漫射及反射后,最后剩余光通量从光输出口10B射出。将所射出光通量的信号传导至一量测模块11,经由量测模块11内的一分光仪将所射出的光通量进行特定程序换算后,进而得到此发光二极管的光电特性之值。The method for measuring the photoelectric characteristics of the light emitting diode to be measured is as follows: provide a light emitting diode photoelectric characteristic measuring device 1 as shown in FIG. Two angled probes 17 pass through the opening 16 and enter the light-gathering unit 14 to measure the light-emitting diode 13, and transmit the current or voltage provided by the power supply 15 to the light-emitting diode wafer or light-emitting diode wafer during measurement. The surface of the particle makes it glow. The generated luminous flux enters the container 10 through the light input port 10A after being concentrated by the light concentrating unit 14 , and after complicated diffusion and reflection on the inner wall of the container, the remaining luminous flux is emitted from the light output port 10B. The signal of the emitted luminous flux is transmitted to a measurement module 11, and the emitted luminous flux is converted by a specific program through a spectrometer in the measurement module 11 to obtain the value of the photoelectric characteristic of the light emitting diode.

于一对照组实验中,使用另一发光二极管光电特性量测装置量测一发光二极管,其中此另一量测装置与本实施例图1所示的量测装置的差异为:此另一量测装置没有光聚集单元14且试片承载台12表面不具有反射效果。量测数据显示:发光二极管所产生的光通量进入另一量测装置容器的光输入口时,其光通量衰减率为9.2%;但使用本实施例图1所示的量测装置量测同一发光二极管,发光二极管所产生的光通量穿过光聚集单元14并进入容器的光输入口时,其光通量衰减率为0.3%。由此可知:量测装置的试片承载台表面具有相对于待测发光二极管所产生的光通量大于50%的反射率及光聚集单元内壁具有相对于待测发光二极管所产生的光通量大于50%反射率,可有效降低发光二极管所产生光通量进入容器的光输入口时的衰减率,进而增加发光二极管光电特性量测的准确性。In a control group experiment, another light-emitting diode photoelectric characteristic measurement device was used to measure a light-emitting diode, wherein the difference between this other measurement device and the measurement device shown in Figure 1 of this embodiment is: this other quantity The measuring device does not have a light gathering unit 14 and the surface of the test piece carrying table 12 does not have a reflection effect. The measurement data show that: when the luminous flux generated by the light-emitting diode enters the light input port of the container of another measuring device, the attenuation rate of the luminous flux is 9.2%; , when the luminous flux generated by the light-emitting diode passes through the light gathering unit 14 and enters the light input port of the container, its luminous flux attenuation rate is 0.3%. It can be known from this that the surface of the test piece carrying table of the measuring device has a reflectivity greater than 50% relative to the luminous flux produced by the light-emitting diode to be measured and the inner wall of the light gathering unit has a reflection greater than 50% relative to the luminous flux produced by the light-emitting diode to be measured. The rate can effectively reduce the attenuation rate when the luminous flux generated by the light-emitting diode enters the light input port of the container, thereby increasing the accuracy of the photoelectric characteristic measurement of the light-emitting diode.

依据本发明的实施例中所述的待测发光二极管13常用的材料如磷化铝镓铟(AlGaInP)系列、氮化铝镓铟(AlGaInN)系列、氧化锌(ZnO)系列等。活性层(未显示)的结构如:单异质结构(single heterostructure;SH)、双异质结构(double heterostructure;DH)、双侧双异质结构(double-side double heterostructure;DDH)、或多层量子井(multi-quantumwell;MQW)。再者,其发光频谱可以借由改变半导体单层或多层的物理或化学要素进行调整,调整量子井的对数也可以改变发光波长。Materials commonly used for the light-emitting diode 13 to be tested in the embodiments of the present invention include aluminum gallium indium phosphide (AlGaInP) series, aluminum gallium indium nitride (AlGaInN) series, zinc oxide (ZnO) series, and the like. The structure of the active layer (not shown) such as: single heterostructure (single heterostructure; SH), double heterostructure (double heterostructure; DH), double-side double heterostructure (double-side double heterostructure; DDH), or multiple Layer quantum well (multi-quantumwell; MQW). Furthermore, its luminescence spectrum can be adjusted by changing the physical or chemical elements of semiconductor monolayer or multilayer, and the luminescence wavelength can also be changed by adjusting the logarithm of quantum wells.

以上所述,仅是本发明的较佳实施例而已,并非对本发明作任何形式上的限制,虽然本发明已以较佳实施例揭露如上,然而并非用以限定本发明,任何熟悉本专业的技术人员,在不脱离本发明技术方案范围内,当可利用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例,但凡是未脱离本发明技术方案内容,依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本发明技术方案的范围内。The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this field Those skilled in the art, without departing from the scope of the technical solution of the present invention, may use the technical content disclosed above to make some changes or modify them into equivalent embodiments with equivalent changes, but as long as they do not depart from the technical solution of the present invention, the Technical Essence Any simple modifications, equivalent changes and modifications made to the above embodiments still fall within the scope of the technical solution of the present invention.

Claims (13)

1. the measuring equipment of a light emitting diode photoelectric characteristic, is characterized in that, the measuring equipment of this light emitting diode photoelectric characteristic comprises:
One container, this container has an optical input and a smooth delivery outlet;
One measurement module, this measurement module is connected with the light delivery outlet of this container;
One test piece plummer, is positioned at this container below and can carries light emitting diode to be measured, and wherein this test piece carrier-table surface has the reflectivity that is greater than 50% with respect to the luminous flux of light emitting diode generation to be measured; And
One smooth accumulation unit, between this container and this test piece plummer, wherein this light accumulation unit inwall has the reflectivity that is greater than 50% with respect to the luminous flux of light emitting diode generation to be measured.
2. the measuring equipment of light emitting diode photoelectric characteristic as claimed in claim 1, is characterized in that: more comprise a power supply unit, to provide this light emitting diode to be measured required curtage.
3. the measuring equipment of light emitting diode photoelectric characteristic as claimed in claim 1, it is characterized in that: this test piece plummer comprises a supporting body and be formed at the skim on supporting body, wherein this thin layer has by the luminous flux that light emitting diode to be measured is produced the material that is greater than 50% reflectivity and is formed.
4. the measuring equipment of light emitting diode photoelectric characteristic as claimed in claim 1, it is characterized in that: this light accumulation unit comprises a body and be formed at the skim of inner body wall, wherein this thin layer has by the luminous flux that light emitting diode to be measured is produced the material that is greater than 50% reflectivity and is formed.
5. the measuring equipment of light emitting diode photoelectric characteristic as claimed in claim 1, is characterized in that: this container is a hollow sphere unit.
6. the measuring equipment of light emitting diode photoelectric characteristic as claimed in claim 1, is characterized in that: this light emitting diode to be measured is wafer form or the crystal grain form not encapsulating.
7. the measuring equipment of light emitting diode photoelectric characteristic as claimed in claim 1, is characterized in that: two probes that more comprise measuring this light emitting diode to be measured.
8. the measuring equipment of light emitting diode photoelectric characteristic as claimed in claim 7, is characterized in that: this light accumulation unit more comprises two perforates through the use of measurement for this probe.
9. the measuring equipment of light emitting diode photoelectric characteristic as claimed in claim 7, is characterized in that: this probe is angled from a fixed angle.
10. the measuring equipment of light emitting diode photoelectric characteristic as claimed in claim 9, is characterized in that: this probe knuckle angle is between 30 degree to 150 degree.
The measuring equipment of 11. light emitting diode photoelectric characteristics as claimed in claim 1, is characterized in that: this measurement module more comprises a spectroscope.
The measuring equipment of 12. light emitting diode photoelectric characteristics as claimed in claim 1, is characterized in that: this light accumulation unit is completely coated this test piece plummer in the time measuring.
The measuring equipment of 13. light emitting diode photoelectric characteristics as claimed in claim 1, is characterized in that: this light accumulation unit is completely coated this light emitting diode to be measured in the time measuring.
CN201210402060.7A 2012-10-19 2012-10-19 Light-emitting diode photoelectric characteristic measurement device Pending CN103777127A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104075879A (en) * 2014-06-06 2014-10-01 致茂电子(苏州)有限公司 Light emitting diode measurement device
CN105044583A (en) * 2015-06-05 2015-11-11 江苏理工学院 Test apparatus for LED junction temperature K coefficient
CN111289227A (en) * 2020-03-20 2020-06-16 江西照世科技有限公司 LED lamp string detector based on Internet of things
CN113324738A (en) * 2021-06-02 2021-08-31 深圳市长方集团股份有限公司 Flip LED chip testing arrangement

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5369481A (en) * 1992-05-08 1994-11-29 X-Rite, Incorporated Portable spectrophotometer
TW201038928A (en) * 2009-04-24 2010-11-01 Epistar Corp Measurement apparatus for light-emitting diode
CN102326090A (en) * 2009-02-20 2012-01-18 Qmc株式会社 LED chip testing device
CN102735982A (en) * 2011-03-29 2012-10-17 三星Led株式会社 Inspection apparatus and method of light emitting device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5369481A (en) * 1992-05-08 1994-11-29 X-Rite, Incorporated Portable spectrophotometer
CN102326090A (en) * 2009-02-20 2012-01-18 Qmc株式会社 LED chip testing device
TW201038928A (en) * 2009-04-24 2010-11-01 Epistar Corp Measurement apparatus for light-emitting diode
CN102735982A (en) * 2011-03-29 2012-10-17 三星Led株式会社 Inspection apparatus and method of light emitting device

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104075879A (en) * 2014-06-06 2014-10-01 致茂电子(苏州)有限公司 Light emitting diode measurement device
CN105044583A (en) * 2015-06-05 2015-11-11 江苏理工学院 Test apparatus for LED junction temperature K coefficient
CN111289227A (en) * 2020-03-20 2020-06-16 江西照世科技有限公司 LED lamp string detector based on Internet of things
CN111289227B (en) * 2020-03-20 2021-10-08 江西照世科技有限公司 LED lamp string detector based on Internet of things
CN113324738A (en) * 2021-06-02 2021-08-31 深圳市长方集团股份有限公司 Flip LED chip testing arrangement
CN113324738B (en) * 2021-06-02 2024-02-13 深圳市长方集团股份有限公司 Flip LED chip testing device

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Application publication date: 20140507