CN103607859A - Manufacturing method of printed circuit board - Google Patents
Manufacturing method of printed circuit board Download PDFInfo
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- CN103607859A CN103607859A CN201310496259.5A CN201310496259A CN103607859A CN 103607859 A CN103607859 A CN 103607859A CN 201310496259 A CN201310496259 A CN 201310496259A CN 103607859 A CN103607859 A CN 103607859A
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Abstract
The invention discloses a manufacturing method of a printed circuit board. The method comprises the following steps that: (1) a substrate is provided; (2) a plurality of first conductive patterns are formed on the substrate (3); the plurality of first conductive patterns are coated with a first dielectric layer which can be cured by light; (4) light irradiation curing is performed on the plurality of first conductive patterns; and (5) laser drilling is performed on the first dielectric layer on the plurality of first conductive patterns until the plurality of first conductive patterns are exposed; and (6) a plurality of second conductive patterns are formed.
Description
Technical field
The invention belongs to art of printed circuit boards, particularly relate to a kind of manufacture method of multilayer line circuit board that forms as insulating barrier by light-cured resin.
Background technology
Printed circuit board (PCB) adopts Layer increasing method to carry out the manufacture of wire line conventionally.The step of Layer increasing method comprises: get one and comprise and run through the conductive through hole of substrate and the substrate of circuit pattern layer, in conductive through hole, insert afterwards filling material, and then unify dielectric layer as increasing layer insulating in the surface pressure of substrate, wherein this dielectric layer covers aforesaid circuit pattern layer and its gap, after overcuring, on dielectric layer, carry out again laser drill, then carry out surface coarsening, and cover crystal seed layer, with photoresistance, form line pattern again, then carry out the plating of conductive layer, the crystal seed layer of finally removing photoresist layer and exposing forms so-called build-up circuit layer.But along with the circuit on circuit board is done thinner and thinner, for the requirement of substrate surface flatness also so increasingly strict.The dielectric layer using in tradition Layer increasing method is when curing, because its solvent comprising can volatilize along with Baking out, after solidifying, in dielectric layer surface, can form cave in abnormal, the not good phenomenon of surface flatness, have influence on the yield that manufacture on follow-up fine rule road.
For this reason, Chinese patent literature CN101389189B discloses a kind of circuit board, and it leads to and on substrate, forms the first wire pattern; On this substrate, cover the first dielectric layer, make this first dielectric layer cover this first wire pattern; Solidify this first dielectric layer; In this first dielectric layer surface, cover the second dielectric layer; Solidify this second dielectric layer, thereby via the covering of two-layer dielectric layer, to form depression abnormal thereby reduce dielectric layer surface, to realize the planarization of dielectric layer.If the document has also further proposed two-layer dielectric layer, cannot realize good planarization, continue to adopt the stacked structure of the 3rd layer of even more multi-layered dielectric layer, until form satisfied flatness.
Although above-mentioned document can finally be realized the planarization of dielectric layer, but because the dielectric layer of the document adopts the mode of Baking out to be cured, therefore, in some cases, probably only adopt two-layer dielectric layer cannot reach satisfied flatness, and have to continue to adopt more multi-layered dielectric layer to reach the object of planarization.This structure generates in application in reality, cannot improve formation efficiency.
Summary of the invention
The problems referred to above in view of prior art existence, the invention provides a kind of manufacture method of printed circuit board (PCB), the printed circuit board (PCB) that the method makes not only can obtain being satisfied with the dielectric layer of flatness, and can effectively reduce the complexity of manufacture process, can make fast printed circuit board (PCB), enhance productivity.
The manufacture method of the printed circuit board (PCB) that the present invention proposes in turn includes the following steps:
(1) provide substrate;
(2) on substrate, form a plurality of the first conductive patterns;
(3) on a plurality of the first conductive patterns, apply photo curable the first dielectric layer;
(4) the first dielectric layer is carried out to illumination curing;
(5) on a plurality of the first conductive patterns, the first dielectric layer is carried out to laser drill, until expose a plurality of the first conductive patterns;
(6) form a plurality of the second conductive patterns;
Wherein, between a plurality of the first conductive patterns on substrate, there are a plurality of the first openings; The first dielectric layer covers a plurality of the first openings completely; After laser drill, the first dielectric layer being positioned on a plurality of the first conductive patterns is formed with a plurality of the second openings; A part in described a plurality of the second conductive pattern covers the second opening completely and part covers the first dielectric layer, and another part is positioned on the first dielectric layer.
Wherein, the first dielectric layer is photocuring insualtion resin composition layer; Wherein, this photocuring insualtion resin composition layer is mixed by the material of following component: the light-cured resin of 22wt%-58wt%, the organic solvent of 33wt%-78wt%, the light trigger of 0.2wt-4wt%, the levelling agent of 0.8wt%-1.5wt%;
Wherein, light-cured resin is mixed by styrene and copolymer-maleic anhydride, epoxy resin and maleimide;
Wherein, organic solvent is the acid flux material such as formic acid or acetic acid; Or basic solvents such as ketone, ester or ether; Or neutral solutions such as aliphatic hydrocarbon, cycloalkane compound or some aromatic hydrocarbon solvent, such as specifically can be the neutral fluxes such as fatty alcohol, glycol ether, ethyl acetate, methylethylketone, gamma-butyrolacton, propionic acid-3-ether ethyl ester, butyl carbitol, butyl carbitol acetate, propylene glycol monomethyl ether, cyclohexane, dimethylbenzene or isopropyl alcohol;
Wherein, light trigger is to ethoxy ether phenylacetone, 2 such as 1-hydroxy cyclohexyl phenylketone, 2-hydroxy-2-methyl-1-, 4,6-trimethylbenzoyl ethoxyl phenenyl phosphine oxide, 2,4,6-trimethylbenzoyl diphenyl phosphine oxide, 4-methyldiphenyl ketone, 4,4 '-bis-(dimethylamino) benzophenone, 4,4 '-bis-(lignocaine) benzophenone or isopropyl thioxanthone;
Wherein, levelling agent is polyacrylate or organic siliconresin.
Accompanying drawing explanation
Fig. 1-3rd, the present invention proposes the schematic flow sheet of the manufacture method of printed circuit board (PCB).
Embodiment
Referring to Fig. 1 and 2, the invention provides manufacture method and in turn include the following steps:
(1) provide substrate 1;
(2) on substrate 1, form a plurality of the first conductive patterns 2;
(3) on a plurality of the first conductive patterns 2, apply photo curable the first dielectric layer 3;
(4) the first dielectric layer 3 is carried out to illumination curing;
(5) on a plurality of the first conductive patterns 2, the first dielectric layer is carried out to laser drill, until expose a plurality of the first conductive patterns 2;
(6) form a plurality of the second conductive patterns 5;
Wherein, between a plurality of the first conductive patterns 2 on substrate 1, there are a plurality of the first openings 11; The first dielectric layer 3 covers a plurality of the first openings 11 completely; After laser drill, the first dielectric layer 3 being positioned on a plurality of the first conductive patterns 2 is formed with a plurality of the second openings 12; A part in described a plurality of the second conductive pattern 5 covers the second opening 12 completely and part covers the first dielectric layer 3, and another part is positioned on the first dielectric layer 3.
Wherein, the first dielectric layer 3 is photocuring insualtion resin composition layer; Wherein, this photocuring insualtion resin composition layer is mixed by the material of following component: the light-cured resin of 22wt%-58wt%, the organic solvent of 33wt%-78wt%, the light trigger of 0.2wt-4wt%, the levelling agent of 0.8wt%-1.5wt%;
Wherein, light-cured resin is mixed by styrene and copolymer-maleic anhydride, epoxy resin and maleimide;
Wherein, organic solvent is the acid flux material such as formic acid or acetic acid; Or basic solvents such as ketone, ester or ether; Or neutral solutions such as aliphatic hydrocarbon, cycloalkane compound or some aromatic hydrocarbon solvent, such as specifically can be the neutral fluxes such as fatty alcohol, glycol ether, ethyl acetate, methylethylketone, gamma-butyrolacton, propionic acid-3-ether ethyl ester, butyl carbitol, butyl carbitol acetate, propylene glycol monomethyl ether, cyclohexane, dimethylbenzene or isopropyl alcohol;
Wherein, light trigger is to ethoxy ether phenylacetone, 2 such as 1-hydroxy cyclohexyl phenylketone, 2-hydroxy-2-methyl-1-, 4,6-trimethylbenzoyl ethoxyl phenenyl phosphine oxide, 2,4,6-trimethylbenzoyl diphenyl phosphine oxide, 4-methyldiphenyl ketone, 4,4 '-bis-(dimethylamino) benzophenone, 4,4 '-bis-(lignocaine) benzophenone or isopropyl thioxanthone;
Wherein, levelling agent is polyacrylate or organic siliconresin.
The present invention, by adopting photocuring insualtion resin composition to be used as the first dielectric layer, is enough to form the dielectric layer that flatness meets the demands in general application.For example, after photocuring insualtion resin composition is spin-coated on substrate, via irradiation, photocuring insualtion resin composition is hardened, thereby form the first dielectric layer, this first dielectric layer can be controlled in 0.8 micron in the depression above the first opening.
Referring to Fig. 1 and 3, the invention provides manufacture method and in turn include the following steps:
(1) provide substrate 1;
(2) on substrate 1, form a plurality of the first conductive patterns 2;
(3) on a plurality of the first conductive patterns 2, apply photo curable the first dielectric layer 3;
(4) the first dielectric layer 3 is carried out to illumination curing;
(5) on the first dielectric layer 3, after spin coating the second dielectric layer 4, carry out illumination curing;
(6) on a plurality of the first conductive patterns 2, the first dielectric layer 3 and the second dielectric layer 4 are carried out to laser drill, until expose a plurality of the first conductive patterns 2;
(7) form a plurality of the second conductive patterns 5;
Wherein, between a plurality of the first conductive patterns 2 on substrate 1, be formed with a plurality of the first openings 11; The first dielectric layer 3, it covers a plurality of the first openings 11 completely, is formed with the second opening 12 completely between the first dielectric layer 3 of laminating and the second dielectric layer 4 via laser drill; A part in a plurality of the second conductive patterns 5 covers the second opening 12 completely and part covers the second dielectric layer 4, and another part is formed on the second dielectric layer 3.
Wherein the first dielectric layer 3 and the second dielectric layer 4 are all formed by photocuring insualtion resin composition layer, and described photocuring insualtion resin composition is identical with record in embodiment 1;
In this embodiment 2, described printed circuit board arrangement can be applicable to the occasion higher to required precision.Because if only apply the first dielectric layer, cannot meet precision machined requirement, can be after the first dielectric layer be cured, adopt same photocuring insualtion resin composition to continue to be spin-coated on the first dielectric layer, after illumination curing, form the second dielectric layer, now form the dual layer dielectric layer structure jointly being formed by the first dielectric layer and the second dielectric layer, in the depression above opening, further can be controlled in 0.3 micron.The structure adopting with respect to previously described patent documentation, the present invention only needs one deck dielectric layer can reach the technique effect that it just can reach by two-layer dielectric layer.If it is such to be similar to described patent documentation, adopt two-layer dielectric layer structure, the flatness that the present invention obtains just can be far superior to the scheme of above-mentioned document.
Above execution mode is described in detail the present invention, but above-mentioned execution mode is not intended to limit scope of the present invention, and protection scope of the present invention is defined by the appended claims.
Claims (4)
1. a manufacture method for printed circuit board (PCB), is characterized in that, described method in turn includes the following steps:
(1) provide substrate;
(2) on substrate, form a plurality of the first conductive patterns;
(3) on a plurality of the first conductive patterns, apply photo curable the first dielectric layer;
(4) the first dielectric layer is carried out to illumination curing;
(5) on a plurality of the first conductive patterns, the first dielectric layer is carried out to laser drill, until expose a plurality of the first conductive patterns;
(6) form a plurality of the second conductive patterns.
2. the method for claim 1, is characterized in that:
Between a plurality of the first conductive patterns on substrate, there are a plurality of the first openings 11; The first dielectric layer covers a plurality of the first openings completely; After laser drill, the first dielectric layer being positioned on a plurality of the first conductive patterns is formed with a plurality of the second openings; A part in described a plurality of the second conductive pattern covers the second opening completely and part covers the first dielectric layer, and another part is positioned on the first dielectric layer.
3. a manufacture method for printed circuit board (PCB), is characterized in that, described method in turn includes the following steps:
(1) provide substrate 1;
(2) on substrate 1, form a plurality of the first conductive patterns 2;
(3) on a plurality of the first conductive patterns 2, apply photo curable the first dielectric layer 3;
(4) the first dielectric layer 3 is carried out to illumination curing;
(5) on the first dielectric layer 3, after spin coating the second dielectric layer 4, carry out illumination curing;
(6) on a plurality of the first conductive patterns 2, the first dielectric layer 3 and the second dielectric layer 4 are carried out to laser drill, until expose a plurality of the first conductive patterns 2;
(7) form a plurality of the second conductive patterns 5.
4. method as claimed in claim 3, is characterized in that:
Wherein, the first dielectric layer is photocuring insualtion resin composition layer; This photocuring insualtion resin composition layer is mixed by the material of following component: the light-cured resin of 22wt%-58wt%, the organic solvent of 33wt%-78wt%, the light trigger of 0.2wt-4wt%, the levelling agent of 0.8wt%-1.5wt%;
Wherein, light-cured resin is mixed by styrene and copolymer-maleic anhydride, epoxy resin and maleimide;
Wherein, organic solvent is the acid flux material such as formic acid or acetic acid; Or basic solvents such as ketone, ester or ether; Or neutral solutions such as aliphatic hydrocarbon, cycloalkane compound or some aromatic hydrocarbon solvent, such as specifically can be the neutral fluxes such as fatty alcohol, glycol ether, ethyl acetate, methylethylketone, gamma-butyrolacton, propionic acid-3-ether ethyl ester, butyl carbitol, butyl carbitol acetate, propylene glycol monomethyl ether, cyclohexane, dimethylbenzene or isopropyl alcohol;
Wherein, light trigger is to ethoxy ether phenylacetone, 2 such as 1-hydroxy cyclohexyl phenylketone, 2-hydroxy-2-methyl-1-, 4,6-trimethylbenzoyl ethoxyl phenenyl phosphine oxide, 2,4,6-trimethylbenzoyl diphenyl phosphine oxide, 4-methyldiphenyl ketone, 4,4 '-bis-(dimethylamino) benzophenone, 4,4 '-bis-(lignocaine) benzophenone or isopropyl thioxanthone;
Wherein, levelling agent is polyacrylate or organic siliconresin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310496259.5A CN103607859A (en) | 2013-10-21 | 2013-10-21 | Manufacturing method of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310496259.5A CN103607859A (en) | 2013-10-21 | 2013-10-21 | Manufacturing method of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103607859A true CN103607859A (en) | 2014-02-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310496259.5A Pending CN103607859A (en) | 2013-10-21 | 2013-10-21 | Manufacturing method of printed circuit board |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1124912A (en) * | 1994-07-27 | 1996-06-19 | 株式会社日立制作所 | Photosensitive resin composition and method of using it in the manufacture of circuit boards |
| US20060102383A1 (en) * | 2004-11-15 | 2006-05-18 | Samsung Electro-Mechanics Co., Ltd. | Method of fabricating high density printed circuit board |
| CN101015369A (en) * | 2007-03-09 | 2007-08-15 | 刘平 | Quick-frozen three delicacies pie and making method thereof |
| CN101290473A (en) * | 2008-05-26 | 2008-10-22 | 京东方科技集团股份有限公司 | Photosensitive resin composition and method of making the same |
| CN101389189A (en) * | 2007-09-10 | 2009-03-18 | 南亚电路板股份有限公司 | Method for manufacturing circuit board |
-
2013
- 2013-10-21 CN CN201310496259.5A patent/CN103607859A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1124912A (en) * | 1994-07-27 | 1996-06-19 | 株式会社日立制作所 | Photosensitive resin composition and method of using it in the manufacture of circuit boards |
| US20060102383A1 (en) * | 2004-11-15 | 2006-05-18 | Samsung Electro-Mechanics Co., Ltd. | Method of fabricating high density printed circuit board |
| CN101015369A (en) * | 2007-03-09 | 2007-08-15 | 刘平 | Quick-frozen three delicacies pie and making method thereof |
| CN101389189A (en) * | 2007-09-10 | 2009-03-18 | 南亚电路板股份有限公司 | Method for manufacturing circuit board |
| CN101290473A (en) * | 2008-05-26 | 2008-10-22 | 京东方科技集团股份有限公司 | Photosensitive resin composition and method of making the same |
Non-Patent Citations (1)
| Title |
|---|
| 徐菲: "含氟光引发剂的合成及性能研究", 《中国优秀硕士学位论文全文数据库工程科技I辑》 * |
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Application publication date: 20140226 |