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CN103568097A - Low-density plate containing natural wood fibers - Google Patents

Low-density plate containing natural wood fibers Download PDF

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Publication number
CN103568097A
CN103568097A CN201310498843.4A CN201310498843A CN103568097A CN 103568097 A CN103568097 A CN 103568097A CN 201310498843 A CN201310498843 A CN 201310498843A CN 103568097 A CN103568097 A CN 103568097A
Authority
CN
China
Prior art keywords
natural wood
low
wood fiber
weight ratio
polyamide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310498843.4A
Other languages
Chinese (zh)
Inventor
黄宣斐
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CN201310498843.4A priority Critical patent/CN103568097A/en
Publication of CN103568097A publication Critical patent/CN103568097A/en
Pending legal-status Critical Current

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Abstract

The invention relates to a low-density plate containing natural wood fibers. The low-density plate comprises the following components in percentage by weight: 82% of natural wood fibers, 12% of styrene and polyamide, 4.5% of a bonder and 1.5% of an additive.

Description

A kind of low-density plank that contains natural wood fiber
Technical field
The invention belongs to polymeric material field, specifically refer to a kind of low-density plank that contains natural wood fiber.
Background technology
Low-density sheet material is widely used in field of furniture or office field, but the existing low-density plank using because of its intensity and constant intensity not high, easily in connector, get loose, and cross section is coarse and cannot use widely.
But from utilization of resources aspect, particularly for the utilization of clout after the processing of timber and the high problem of price of existing oil product, effectively utilizing the low-density plank of being produced by the combination of timber and oil product is the problem that needs solution.
Summary of the invention
The object of this invention is to provide a kind of technical scheme that can improve the low-density plank that contains natural wood fiber, the intensity of the low-density plank of producing by the technical program improves, and can improve the tightness with attaching parts.
The present invention is achieved by the following technical solutions:
A low-density plank that contains natural wood fiber, includes natural wood fiber, styrene, polyamide, adhesive and additive; The weight ratio of described natural wood fiber is 82%, and styrene and polyamide weight ratio are 12%, and the weight ratio of adhesive is 4.5%, and the weight ratio of additive is 1.5%.
Described natural wood fiber is grain shape, and its average grain diameter is lower than 0.2mm.
The grain diameter of described styrene and polyamide is lower than 0.2mm.
The weight ratio of described styrene and polyamide is 5:1.
The invention has the beneficial effects as follows:
The transverse tensile strength of the low-density plank that contains natural wood fiber of producing by the technical program is greater than 1.0N/mm 2, and be greatly improved with the tightness of attaching parts.
The specific embodiment
Describe by the following examples technical scheme of the present invention in detail, should be understood that, following embodiment is only exemplary, only can be used for explaining and technical scheme of the present invention being described, and can not to be interpreted as is the restriction to the technology of the present invention.
In the present invention, natural wood fiber is conventional poplar and pine, and other timber also can be suitable for.
Adhesive and additive are those skilled in the art's conventional technology aborning, select which kind of adhesive and additive not to explicitly call in the technical program.
A low-density plank that contains natural wood fiber, includes natural wood fiber, styrene, polyamide, adhesive and additive; The weight ratio of described natural wood fiber is 82%, and styrene and polyamide weight ratio are 12%, and the weight ratio of adhesive is 4.5%, and the weight ratio of additive is 1.5%.
Described natural wood fiber is grain shape, and its average grain diameter is lower than 0.2mm.
The grain diameter of described styrene and polyamide is lower than 0.2mm.
The weight ratio of described styrene and polyamide is 5:1.
Above-mentioned material can be produced to the product of the technical program through pushing and suppress the conventional means in this field.
Although illustrated and described embodiments of the invention, for the ordinary skill in the art, be appreciated that without departing from the principles and spirit of the present invention and can carry out multiple variation, modification and replacement to these embodiment, scope of the present invention is by claims and be equal to and limit.

Claims (4)

1. a low-density plank that contains natural wood fiber, is characterized in that: include natural wood fiber, styrene, polyamide, adhesive and additive; The weight ratio of described natural wood fiber is 82%, and styrene and polyamide weight ratio are 12%, and the weight ratio of adhesive is 4.5%, and the weight ratio of additive is 1.5%.
2. the low-density plank that contains natural wood fiber according to claim 1, is characterized in that: described natural wood fiber is grain shape, and its average grain diameter is lower than 0.2mm.
3. the low-density plank that contains natural wood fiber according to claim 1, is characterized in that: the grain diameter of described styrene and polyamide is lower than 0.2mm.
4. the low-density plank that contains natural wood fiber according to claim 1, is characterized in that: the weight ratio of described styrene and polyamide is 5:1.
CN201310498843.4A 2013-10-21 2013-10-21 Low-density plate containing natural wood fibers Pending CN103568097A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201310498843.4A CN103568097A (en) 2013-10-21 2013-10-21 Low-density plate containing natural wood fibers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201310498843.4A CN103568097A (en) 2013-10-21 2013-10-21 Low-density plate containing natural wood fibers

Publications (1)

Publication Number Publication Date
CN103568097A true CN103568097A (en) 2014-02-12

Family

ID=50041228

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310498843.4A Pending CN103568097A (en) 2013-10-21 2013-10-21 Low-density plate containing natural wood fibers

Country Status (1)

Country Link
CN (1) CN103568097A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104927374A (en) * 2015-05-19 2015-09-23 苏州德翔装饰工程有限公司 Compression-resistant bending-resistant enhanced fiber board material and preparation method thereof
CN109880351A (en) * 2019-03-12 2019-06-14 严勇 A kind of preparation method of the modified polyamide resin for density board

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH370229A (en) * 1956-12-17 1963-06-30 Max Dipl Ing Himmelheber Compression molding material and process for its manufacture
GB2193503A (en) * 1986-08-04 1988-02-10 Bohuslav Vaclav Kokta Bonded composites of cellulose based fibers in polystyrene polymers characterized by a bonding agent
WO2002038676A1 (en) * 2000-11-10 2002-05-16 Balmoral Technologies (Proprietary) Limited Method of making a finished product
CN101049709A (en) * 2007-03-01 2007-10-10 赵永生 Nano composite woody material, and preparation method
CN101541488A (en) * 2006-10-19 2009-09-23 巴斯夫欧洲公司 Light wood-based materials
CN101802104A (en) * 2007-09-19 2010-08-11 巴斯夫欧洲公司 Light wood-based materials having good mechanical properties and low formaldehyde emission
CN102343602A (en) * 2010-08-06 2012-02-08 上海昱龄环保科技有限公司 Production process of formaldehyde-free laminated wood board
CN103052686A (en) * 2010-08-06 2013-04-17 汉高股份有限及两合公司 Composite material containing natural fibers

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH370229A (en) * 1956-12-17 1963-06-30 Max Dipl Ing Himmelheber Compression molding material and process for its manufacture
GB2193503A (en) * 1986-08-04 1988-02-10 Bohuslav Vaclav Kokta Bonded composites of cellulose based fibers in polystyrene polymers characterized by a bonding agent
WO2002038676A1 (en) * 2000-11-10 2002-05-16 Balmoral Technologies (Proprietary) Limited Method of making a finished product
CN101541488A (en) * 2006-10-19 2009-09-23 巴斯夫欧洲公司 Light wood-based materials
CN101049709A (en) * 2007-03-01 2007-10-10 赵永生 Nano composite woody material, and preparation method
CN101802104A (en) * 2007-09-19 2010-08-11 巴斯夫欧洲公司 Light wood-based materials having good mechanical properties and low formaldehyde emission
CN102343602A (en) * 2010-08-06 2012-02-08 上海昱龄环保科技有限公司 Production process of formaldehyde-free laminated wood board
CN103052686A (en) * 2010-08-06 2013-04-17 汉高股份有限及两合公司 Composite material containing natural fibers

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104927374A (en) * 2015-05-19 2015-09-23 苏州德翔装饰工程有限公司 Compression-resistant bending-resistant enhanced fiber board material and preparation method thereof
CN109880351A (en) * 2019-03-12 2019-06-14 严勇 A kind of preparation method of the modified polyamide resin for density board

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WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140212