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CN103563497A - Connection method, connected-body production method and connected body - Google Patents

Connection method, connected-body production method and connected body Download PDF

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Publication number
CN103563497A
CN103563497A CN201280027638.3A CN201280027638A CN103563497A CN 103563497 A CN103563497 A CN 103563497A CN 201280027638 A CN201280027638 A CN 201280027638A CN 103563497 A CN103563497 A CN 103563497A
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China
Prior art keywords
mentioned
adhesive
light
illumination
intensity
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Granted
Application number
CN201280027638.3A
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Chinese (zh)
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CN103563497B (en
Inventor
林慎一
田中祐治
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Dexerials Corp
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Dexerials Corp
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Publication of CN103563497A publication Critical patent/CN103563497A/en
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Publication of CN103563497B publication Critical patent/CN103563497B/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/27001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H01L2224/83868—Infrared [IR] curing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H01L2224/83874—Ultraviolet [UV] curing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00013—Fully indexed content
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

In order to decrease mounting temperature and ensure connection reliability, a connected-body production method is provided with a step for bonding a connecting body and a body to be connected to one another using a photo-curable adhesive, hardening the adhesive by irradiating the same with light, and connecting the connecting body and the body to be connected. Therein, the level of illumination by light is increased continuously or stepwise.

Description

The manufacture method of method of attachment, connector and connector
Technical field
The manufacture method of the connector that the method for attachment of the adhesive of light-cured type, the adhesive by light-cured type connect and the connector of manufacturing by the adhesive of light-cured type have been the present invention relates to use.
The application be take and at the Japanese patent application No. Patent 2011-126642 of Japanese publication, as basis, required priority on June 6th, 2011, and by with reference to this application, is applied at the application.
Background technology
Up to the present, as the adhesive that substrate is connected with the electronic unit of IC chip, flexible flat cable etc., use the adhesive of ultraviolet hardening.The adhesive of ultraviolet hardening is to apply between substrate and electronic unit, and by irradiation ultraviolet radiation, is cured to realize the adhesive being connected of substrate and electronic unit.The adhesive of this ultraviolet hardening, different from the adhesive of thermohardening type, owing to substrate, electronic unit not being heated to the operation of pressing, so there is not the bending that the heating by substrate causes, be suitable for the connection to the substrate of slimming in recent years.In addition, the adhesive of ultraviolet hardening is not also by the damage that the thermal conductance of substrate, electronic unit is caused.
On the other hand, use the connector of the adhesive connection of ultraviolet hardening, have the deteriorated situation of connection reliability.For example, inferior in the situation that continues to be chronically exposed to hot and humid environment, the contact resistance of substrate and electronic unit rises.
Prior art document
Patent documentation
Patent documentation 1: JP 2000-597378 communique.
Summary of the invention
Technical problem to be solved by this invention
So, the object of the invention is to, provide a kind of adhesive that uses light-cured type can guarantee the method for attachment of connection reliability, the manufacture method of connector and the connector manufactured by this method of attachment.
Technical scheme for technical solution problem
In order to solve above-mentioned technical problem, relate to method of attachment of the present invention, have linking objective thing and be connected object, adhesive via light-cured type is fitted, and by above-mentioned adhesive is irradiated to light, above-mentioned adhesive is solidified, above-mentioned linking objective thing is connected to the operation that object is connected with above-mentioned, the intensity of illumination that makes above-mentioned light continuously or grade rise.
In addition, the manufacture method that relates to connector of the present invention, have linking objective thing and be connected object, adhesive via light-cured type is fitted, and by above-mentioned adhesive is irradiated to light, above-mentioned adhesive is solidified, above-mentioned linking objective thing is connected to the operation that object is connected with above-mentioned, the intensity of illumination that makes above-mentioned light continuously or grade rise.
In addition, relate to connector of the present invention, have linking objective thing and be connected object, adhesive via light-cured type is fitted, and by above-mentioned adhesive is irradiated to light, above-mentioned adhesive is solidified, above-mentioned linking objective thing is connected to the operation that object is connected with above-mentioned, the intensity of illumination that makes above-mentioned light continuously or grade rise and be connected.
Invention effect
According to the present invention, by making the exposure of light increase gradually, at light-struck initial stage, make adhesive resin curing reaction carry out slowly, in light-struck later stage, the curing reaction of adhesive resin is carried out hastily.This be because, when implementing strong intensity of illumination from light-struck initial stage, the reaction starting point that the becomes adhesive resin deteriorated solidfied material of the short thermal endurance of too much molecular link that becomes.In the present invention, owing to irradiating with more weak intensity of illumination at light-struck initial stage, at later stage intensity of illumination grow, thus can make the solidfied material that thermal endurance is strong, and can improve connection reliability.
Accompanying drawing explanation
Fig. 1 means the erecting device that has related to method of attachment of the present invention by being suitable for, and the cutaway view of the operation of IC chip and flexible base, board is installed on glass substrate;
Fig. 2 means the cutaway view of anisotropic conducting film.
Embodiment
Below, to being suitable for manufacture method and the connector of method of attachment of the present invention, connector, with reference to accompanying drawing on one side at length describe on one side.In addition, the present invention is not the invention that is only defined in following execution mode, and within not departing from the scope of main points of the present invention, various changes is possible certainly.
Below, as linking objective thing and be connected object, although take the situation of connecting electronic parts, describing as example, present technique also can be applicable to outside the connection of electronic unit.For example, carry out installing the so-called COG(chip on glass of the IC chip that liquid crystal drive uses on the glass substrate of display panels) install.As this display panels 10, as shown in Figure 1, the transparency carrier of two pieces 11,12 that arranged opposite consists of glass substrate etc., and by sealing device 13 these transparency carriers 11,12 bonded to each other of frame shape.And then, as display panels 10, by by transparency carrier 11,12 around space in enclose liquid crystal 14 and form Display panel portion 15.
As transparency carrier 11,12, at mutual opposed two inner surfaces, by ITO(tin indium oxide) etc. a pair of transparency electrode 16,17 of striated of formation in cross one another mode, form.
And then, as two transparency electrodes 16,17, by this crossover sites of these two transparency electrodes 16,17, form the pixel as the least unit of liquid crystal display.
In two transparency carriers 11,12, transparency carrier 12 on one side forms greatlyr than the transparency carrier of another side 11 planar dimensions, edge part 12a at the transparency carrier 12 that forms greatly, be provided with the COG installation portion 20 of the electronic unit 18 of IC etc. for liquid crystal drive is installed, in addition, near the outside of COG installation portion 20, be provided with the FOG installation portion 22 that the flexible base, board 21 that has formed liquid crystal display drive circuit is installed.
In addition, IC for liquid crystal drive, liquid crystal display drive circuit by pixel selection apply liquid crystal drive voltage, can make liquid crystal alignment portion the liquid crystal display that changes to stipulate.
In each installation portion 20,22, be formed with the portion of terminal 17a of transparency electrode 17.On portion of terminal 17a, as the adhesive of conductivity, with anisotropic conducting film 1, connect electronic unit 18, the flexible base, board 21 of IC etc. for liquid crystal drive.Anisotropic conducting film 1 contains electroconductive particle 4, and is the portion of terminal 17a of transparency electrode 17 that makes the electrode of electronic unit 18, flexible base, board 21 and be formed at the edge part 12a of transparency carrier 12, the film being electrically connected to via electroconductive particle 4.This anisotropic conducting film 1 is the adhesive of ultraviolet hardening and thermohardening type, by by heating press head described later 30 hot pressing time by ultraviolet radiation device 31 irradiation ultraviolet radiations, electroconductive particle 4 solidifies with the state crushing between each electrode of portion of terminal 17a and electronic unit, flexible base, board 21, and transparency carrier 12 is connected with electronic unit 18, flexible base, board 21.
In addition, in two transparency electrodes 16,17, be formed with the alignment films 24 of the friction treatment of having implemented regulation, and be orientated the initial stage of limiting liquid crystal molecules by this alignment films 24.And then, in the outside of two transparency carriers 11,12, be equipped with a pair of Polarizer 25,26, and by 25,26 restrictions of these two Polarizers the direction of vibration that sees through light from the light source (not shown) of backlight etc.
[anisotropic conducting film]
Anisotropic conducting film 1, as shown in Figure 2, is normally formed with the film that electroconductive particle contains layer 3 becoming on the stripping film 2 of base material.Anisotropic conducting film 1, as shown in Figure 1, be used in by electroconductive particle is contained between layer 3 transparency electrode 17 on the transparency carrier 12 that is formed at display panels 10 and electronic unit 18, flexible base, board 21, display panels 10 be connected to also conducting with electronic unit 18 or flexible base, board 21.
As stripping film 2, can use in anisotropic conducting film (ACF) base material such as polyethylene terephthalate film etc. generally using.
It is layers that dispersed electro-conductive particle 4 forms in adhesive that electroconductive particle contains layer 3.Adhesive is the adhesive that contains film-forming resin, curable resin, curing agent, silane coupling agent etc., identical with the adhesive using in common anisotropic conducting film.
As film-forming resin, preferably mean molecule quantity is the resin of 10000～80000 left and right.As film-forming resin, can list the various resins of phenoxy resin, epoxy resin, Shape-changeable ring epoxy resins, polyurethane resin etc.Wherein, from becoming the viewpoint of membrane stage, connection reliability etc., particularly preferably phenoxy resin.
As curable resin, be not particularly limited, can list epoxy resin, acrylic resin etc.
As epoxy resin, restriction especially, can suitably not select according to object.As concrete example, for example, can list naphthalene type epoxy resin, connection (two) benzene type epoxy resin, phenol novolac type epoxy resin, bisphenol-type epoxy resin, all hexichol generation alkene type epoxy resin, triphenylmenthane type epoxy resin, benzene aralkyl-type epoxy resin, naphthol type epoxy resin, dicyclopentadiene type epoxy resin, triphenyl methane type epoxy resin etc.These can be both separately, can be also combinations of more than two kinds.
As acrylic resin, not restriction especially, can suitably select according to object, as concrete example, for example, can list methacrylate, ethyl acrylate, isopropylacrylic acid ester, isobutyl group acrylate, epoxy acrylate, EDIA, diethylene glycol (DEG) 3, 4-acrylate, trimethylolpropane triacrylate, dimethylol urea tricyclohexyl phosphate acrylate, tetraethylene glycol diacrylate, 2-hydroxyl-1, 3-bis-acryloxy propane, 2, 2-bis-[4-(acryloyl methoxyl group) phenyl ］ propane, 2, 2-bis-[4-(acryloyl ethyoxyl) phenyl ］ propane, tricyclo decenyl propionate acrylate, tricyclohexyl phosphate acrylate, three (acryloyl ethyl group) cyanurate, urethane acrylate, epoxy acrylate etc.These can be both separately, can be also combinations of more than two kinds.
As curing agent, restriction especially, can suitably not select according to object, but in the situation that curable resin is epoxy resin, preferred cationic class curing agent, in the situation that curable resin is acrylic resin, preferred radical type curing agent.
As cationic curing agent, not restriction especially, you suitably select according to object, for example, can list sulfonium salt, salt etc., among these, optimization aromatic sulfonium salt.As radical type curing agent, restriction especially, can suitably not select according to object, for example, can list organic peroxide.
As silane coupling agent, can list epoxies, amino, sulfydryl sulphur class, ureide derivative etc.By adding silane coupling agent, can improve the adhesiveness in the interface of organic material and inorganic material.
As electroconductive particle 4, can list known any electroconductive particle using in anisotropic conducting film.As electroconductive particle 4, for example can list, the particle of the various metal or metal alloy of nickel, iron, copper, aluminium, tin, lead, chromium, cobalt, silver, gold etc., the particle forming at the surface clad of the particle of metal oxide, carbon, graphite, glass, pottery, plastics etc., or, at the particle of the further coated insulation film in the surface of these particles.In the situation that be the particle that the surface clad of resin particle forms, as resin particle, for example can list, epoxy resin, phenol aldehyde resin, acrylic resin, the son of the third second light benzene ethene (AS) resin, benzoguanamine resin, divinylbenzene resinoid, styrene resin etc.
[method of attachment]
Next, operation electronic unit 18, flexible base, board 21 being connected in the transparency electrode 17 of transparency carrier 12 via anisotropic conducting film 1 is described.First, anisotropic conducting film 1 is carried out in transparency electrode 17 temporarily bonding.As the method for interim bonding anisotropic conducting film 1, in the transparency electrode 17 of the transparency carrier 12 of display panels 10, with electroconductive particle, contain the mode that layer 3 becomes transparency electrode 17 sides, configuration anisotropic conducting film 1.
And then, in transparency electrode 17, configured electroconductive particle contain layer 3 after, by from stripping film 2 sides, for example with heating press head 30, electroconductive particle being contained to layer 3 heats and pressurizes, heating press head 30 leaves from stripping film 2, electroconductive particle by stripping film 2 transparency electrode 17 contains layer 3 to be peeled off, and only electroconductive particle is contained to layer 3 temporarily bonding in transparency electrode 17.As based on heating the temporarily bonding of press head 30, small pressure for the upper surface of stripping film 2 (for example 0.1MPa～2MPa left and right) when pressing, transparency electrode 17 sides is heated.For example, but the thermosetting resin that heating-up temperature is made as to epoxy resin in anisotropic conducting film 1, acrylic resin etc. is the temperature of state of cure (70～100 ℃ of left and right) not.
Next, with the transparency electrode 17 of transparency carrier 12 and the electrode terminal of electronic unit 18, via electroconductive particle, contain layer 3 opposed mode, configuration electronic unit 18.
Next, utilize the heating press head 30 of the heating-up temperature that is warmed up to regulation, the upper surface of electronic unit 18 is carried out to heat heating with the temperature of regulation and the pressure of regulation.The temperature (for example, 120 ℃ of front and back) of temperature ± 10～20 of the regulation of the viscosity (lowest melt viscosity) when electroconductive particle contains layer 3 melting before the hot pressed temperature based on heating press head 30 is set to relative expression and solidify starts ℃.Thus, the bending of transparency carrier 12 is suppressed to minimum, in addition, increases the damage causing based on heat also can to electronic unit 18.
Heating is after press head 30 presses electronic unit 18, and the ultraviolet radiation device 31 of rear side by being arranged at transparency carrier 12 is to anisotropic conducting film 1 irradiation ultraviolet radiation.By the luminous ultraviolet ray of ultraviolet radiation device 31, see through to support the transparent support platform of glass etc. of transparency carrier 12 and the transparency carrier 12 that supported by this brace table and to electroconductive particle, contain layer 3 and irradiate.As this ultraviolet radiation device 31, can use mercury vapor lamp, metal halide mercury vapor lamp, LED lamp etc.
By heating and the ultraviolet ray based on ultraviolet radiation device 31 based on this heating press head 30, there is curing reaction in anisotropic conducting film 1, thus, via anisotropic conducting film 1, electronic unit 18 is carried out on portion of terminal 17a formally bonding.Heat pressurization based on heating press head 30 and the ultraviolet ray based on ultraviolet radiation device 31 are irradiated and are finished simultaneously or one in front and one in back finish.
In this technique, when pressing electronic unit 18 by heating press head 30, by ultraviolet radiation device 31 irradiation ultraviolet radiations.Now, ultraviolet radiation device 31, makes to grade formula exposure rise.In addition, in this technique, be preferably, after having pressed electronic unit 18 by heating press head 30, after having passed through the stipulated time, start irradiation ultraviolet radiation.
By by ultraviolet radiation device 31 grade formulas make exposure increase, carrying out of the curing reaction of the initial stage adhesive resin irradiating in ultraviolet ray is slow, the later stage of irradiating in ultraviolet ray is carried out the curing reaction of adhesive resin hastily.This be because, when the initial stage of irradiating from ultraviolet ray is implemented strong intensity of illumination, the reaction starting point that will the become adhesive resin deteriorated solidfied material of the short thermal endurance of too much molecular link that becomes.In this technique, because the initial stage of irradiating in ultraviolet ray irradiates with more weak intensity of illumination, at later stage intensity of illumination grow, thus can make the outstanding solidfied material of thermal endurance, and can realize the low temperature that temperature is installed in limit, connection reliability is improved on limit.In addition, ultraviolet intensity of illumination be divided into a plurality of grades and increase progressively, and can suitably set number of degrees according to ultraviolet total exposure, irradiation time etc., preferably, being set as 2～10 grades.
By making the heat pressurization based on heating press head 30, in ultraviolet ray, irradiate in advance, make the electroconductive particle of anisotropic conducting film 1 contain layer 3 liquidation, and from making adhesive resin flow out between the transparency electrode 17 of transparency carrier 12 and the electrode terminal of electronic unit 18, can clamp electroconductive particle 4.Make under the state of adhesive resin liquidation pressurizeing by heat, irradiation ultraviolet radiation when continuing by further making heat pressurize can make electroconductive particle contain layer 3 and solidify under the state of the transparency electrode 17 of transparency carrier 12 and the electrode terminal of electronic unit 18 clamping electroconductive particle 4.
In addition, after the heating of electronic unit based on heating press head 30 is pressed, passed through the stipulated time, preferably about 1～10 second after, irradiation ultraviolet radiation.In addition, during irradiation ultraviolet radiation, also can be continuously or heat intermittently pressing of press head 30.
As the irradiation time based on ultraviolet radiation device 31, irradiation grade and exposure, total exposure, from the composition of adhesive resin, hot pressed temperature, pressure and time based on heating press head 30, set the condition that the curing reaction of adhesive carries out the most efficiently.
For example, the preferred scope of exposure is 500～3000mJ/sec, and the preferred scope of irradiating grade is set to 2～10 grades.In addition, be preferably, (exposure of final grade)/(exposure of the first estate) is made as to 4～10.
After in the transparency electrode 17 that electronic unit 18 is connected in to transparency carrier 12, similarly carry out installing the so-called FOG(film on glass of flexible base, board 21 in the transparency electrode 17 of transparency carrier 12) install.Now, ultraviolet radiation device 31, presses flexible base, board 21 by heating press head 30, and for example, starts afterwards irradiation ultraviolet radiation from having passed through the stipulated time (about 1～10 second).In addition, during irradiation ultraviolet radiation, also can be continuously or heat intermittently pressing of press head 30.In addition, ultraviolet radiation device 31 grade formulas rise exposure.
Thus, can manufacture the connector that has connected transparency carrier 12 and electronic unit 18, flexible base, board 21 via anisotropic conducting film 1.In addition, these COG install and FOG installs, and also can carry out in the lump by heat pressurization and ultraviolet irradiation once.
Above, although the FOG that the COG of liquid crystal drive with IC is directly installed on the glass substrate of display panels installs and directly install flexible base, board on the substrate of display panels is installed and is illustrated as an example, present technique can be used that COG installs, other the various connections outside FOG installation.
Particularly, in the situation that substrate is connected with the electronic unit of IC chip, flexible flat cable etc., in order to ensure connection reliability, at present also there is and uses the method for attachment of ultraviolet curing and hot curing, in this case, need to prevent that the bending of substrate based on heat pressurization is, the damage of electronic unit.
For example, in the situation that COG installs IC chip on the glass substrate using in LCD panel, easily there is narrow and smallization of the installation region of glass substrate peripheral part, by the slimming of glass substrate, the bending of the glass substrate based on heat pressurization easily occurs.When bending in glass substrate, will be at the liquid crystal panel generation irregular colour of COG installation region periphery.The bending of this glass substrate is because result from coefficient of thermal expansion poor of IC chip and glass substrate, thus require the low temperature of installation temperature, but also need to prevent the reduction of connection reliability.
According to present technique, by making the exposure of light increase monotonously, the curing reaction of light-struck initial stage adhesive resin carry out slowly, in light-struck later stage, the curing reaction of adhesive resin is carried out hastily, can make thus the outstanding solidfied material of thermal endurance.That is, according to present technique, do not need the required high-temperature heating of hot curing, and only in the melting with anisotropic conducting film required MIN heating realize the low temperature that temperature is installed, when can prevent thus substrate crooked, guarantee connection reliability.
[other]
In addition, present technique, except using the conductive adhesive of above-mentioned ultraviolet hardening, also can be used the conductive adhesive of the light-cured type that the light such as other wavelength by infrared light etc. is cured.
In above-mentioned record, although as the adhesive of conductivity, to thering is the anisotropic conducting film 1 of film shape, be illustrated, even if be that pasty state is also no problem.In this application, the bonding paste of conductivity of the laminar conductivity bonding film of the anisotropic conducting film that contains electroconductive particle 41 grade or pasty state is defined as to " adhesive ".
In addition, in above-mentioned record, although used under normal temperature, be solid phase, by the conductive adhesive of heating and melting, also can use the conductive adhesive under normal temperature with mobility.In this case, heating is not necessary condition, and at COG installation portion 20, FOG installation portion coating electrically conductive adhesive, and after having configured electronic unit 18, flexible base, board 21, while realize connection by the irradiation ultraviolet radiation that pressurizes of the pressure suitably to stipulate.
In addition, in above-mentioned record, although be many grades by ultraviolet irradiation quantitative change and make ultraviolet irradiation amount increase, also can make ultraviolet irradiation amount based on ultraviolet radiation device 31 with linear rising.In this case, also consider that total exposure sets the intensity of illumination of each irradiation time, and rise in linear mode.As ultraviolet radiation device 31, by using LED lamp, can make irradiation time and intensity of illumination easier grade ground or linear rising.
[embodiment]
Next, the embodiment of present technique is described.As the present embodiment, conduction resistance value (Ω) after the curing reaction rate (%), initial stage conduction resistance value (Ω), high temperature and humidity test (85 ℃/85%RH 500hr) that makes the different and adhesive resin in each sample of manufacturing of ultraviolet irradiation condition and the amount of bow (μ m) of substrate have been measured.
Electroconductive particle contain layer with
Phenoxy resin (YP-50: Nippon Steel Chemical Co., Ltd's system); 45 Quality Mgmt Dept
Epoxy resin (EP-828: Mitsubishi chemical Co., Ltd's system); 50 Quality Mgmt Dept
Silane coupling agent (KBM-403: Shin-Etsu Chemial Co., Ltd's system); 1 Quality Mgmt Dept
Curing agent (SI-60L: San Xin chemical industry Co., Ltd. system); 4 Quality Mgmt Dept
Electroconductive particle; (AUL704: Sekisui Chemical Co., Ltd's system): 50000/mm2, dispersion is mixed and adjust resin combination, be made into the cationic curing class electrode adhesion thin slice of thickness 20 μ m.
As evaluating element, used
Profile; 1.8mm * 20mm
Bulge height; 15 μ m
Evaluation IC.
As evaluating the evaluation base material connecting with IC, having used glass thick is the ITO coating glass of 0.5mm.
At this ITO coating glass, formed the connector sample that contains layer and pass through to be connected with suitable ultraviolet ray irradiation with the pressurization of IC heat evaluating via electroconductive particle.As ultraviolet radiation device, used UV irradiator ZUV-C30H(Omron Corp system).In addition, in carrying out each connector sample of ultraviolet ray irradiation, total exposure is made as to 900mJ, in irradiation time is the connector sample of 3 seconds, based on heating press head 30, to evaluating with the beginning of the heat pressurization of IC, start ultraviolet irradiation after latter 1 second, in irradiation time is the connector sample of 4 seconds, with based on heating press head 30 to evaluating with the beginning of the heat pressurization of IC simultaneously, start ultraviolet ray and irradiate.In addition, except comparative example 1, the scope of the temperature (120 ℃) of the viscosity (lowest melt viscosity) when electroconductive particle contains layer melting before the heating-up temperature of heating press head is set in to relative expression and solidify starts ±～40 ℃.
In embodiment 1, the heating-up temperature based on heating press head is made as to 120 ℃, pressure is made as 60MPa, and be made as 4 seconds hot pressing time.In addition, ultraviolet ray is irradiated and is divided into 2 grades and carries out between 3 seconds, in the first estate, with UV intensity of illumination 100mJ, carried out 2 seconds, in the second grade, with UV intensity of illumination 700mJ, carried out 1 second.
In embodiment 2, the heating condition based on heating press head is made as identical with embodiment 1.In addition, ultraviolet ray is irradiated and is divided into 2 grades and carries out between 3 seconds, in the first estate, with UV intensity of illumination 50mJ, carried out 2 seconds, in the second grade, with UV intensity of illumination 800mJ, carried out 1 second.
In embodiment 3, the heating condition based on heating press head is made as identical with embodiment 1.In addition, ultraviolet ray is irradiated and is divided into 2 grades and carries out between 3 seconds, in the first estate, with UV intensity of illumination 100mJ, carried out 1 second, in the second grade, with UV intensity of illumination 400mJ, carried out 2 seconds.
In embodiment 4, the heating condition based on heating press head is made as identical with embodiment 1.In addition, ultraviolet ray is irradiated and is divided into 3 grades and carries out between 3 seconds, at the first estate, with UV intensity of illumination 100mJ, carried out 1 second, in the second grade, with UV intensity of illumination 300mJ, carried out 1 second, in the tertiary gradient, with UV intensity of illumination 500mJ, carried out 1 second.
In embodiment 5, the heating condition based on heating press head is made as identical with embodiment 1.In addition, ultraviolet ray is irradiated and is divided into 2 grades and carries out between 3 seconds, in the first estate, with UV intensity of illumination 50mJ, carried out 1 second, in the second grade, with UV intensity of illumination 425mJ, carried out 2 seconds.
In embodiment 6, the heating condition based on heating press head is made as identical with embodiment 1.In addition, ultraviolet ray is irradiated and is divided into 3 grades and carries out between 3 seconds, in the first estate, with UV intensity of illumination 50mJ, carried out 1 second, in the second grade, with UV intensity of illumination 300mJ, carried out 1 second, in the tertiary gradient, with UV intensity of illumination 550mJ, carried out 1 second.
In embodiment 7, the heating condition based on heating press head is made as identical with embodiment 1.In addition, ultraviolet ray is irradiated and is divided into 3 grades and carries out between 4 seconds, in the first estate, with UV intensity of illumination 50mJ, carried out 1 second, in the second grade, with UV intensity of illumination 200mJ, carried out 2 seconds, in the tertiary gradient, with UV intensity of illumination 450mJ, carried out 1 second.
In embodiment 8, the heating condition based on heating press head is made as identical with embodiment 1.In addition, ultraviolet ray is irradiated and is divided into 3 grades and carries out between 3 seconds, in the first estate, with UV intensity of illumination 100mJ, carried out 1 second, in the second grade, with UV intensity of illumination 200mJ, carried out 1 second, in the tertiary gradient, with UV intensity of illumination 600mJ, carried out 1 second.
In embodiment 9, the heating condition based on heating press head is set as, from representing-40 ℃, 80 ℃ of the temperature (120 ℃) of the lowest melt viscosity of adhesive resin, other condition being made as identical with embodiment 8.
In embodiment 10, the heating condition based on heating press head is set as, from representing-30 ℃, 90 ℃ of the temperature (120 ℃) of the lowest melt viscosity of adhesive resin, other condition being made as identical with embodiment 8.
In embodiment 11, the heating condition based on heating press head is set as to temperature (120 ℃) from representing the lowest melt viscosity of adhesive resin+20 ℃, 140 ℃, other condition is made as identical with embodiment 8.
In embodiment 12, the heating condition based on heating press head is set as to temperature (120 ℃) from representing the lowest melt viscosity of adhesive resin+30 ℃, 150 ℃, other condition is made as identical with embodiment 8.
In comparative example 1, the heating-up temperature based on heating press head is made as to 170 ℃, pressure is made as 60MPa, and be made as 4 seconds hot pressing time.In addition, not carrying out ultraviolet ray irradiates.
In comparative example 2, the heating condition based on heating press head is made as identical with embodiment 1.In addition, not carrying out ultraviolet ray irradiates.
In comparative example 3, the heating condition based on heating press head is made as identical with embodiment 1.In addition, as ultraviolet illuminate condition, with UV intensity of illumination 300mJ, carried out 3 seconds.
In comparative example 4, the heating condition based on heating press head is made as identical with embodiment 1.In addition, ultraviolet ray is irradiated and is divided into 2 grades and carries out between 3 seconds, in the first estate, with UV intensity of illumination 200mJ, carried out 2 seconds, in the second grade, with UV intensity of illumination 500mJ, carried out 1 second.
In comparative example 5, the heating condition based on heating press head is made as identical with embodiment 1.In addition, ultraviolet ray is irradiated and is divided into 2 grades and carries out between 3 seconds, in the first estate, with UV intensity of illumination 150mJ, carried out 2 seconds, in the second grade, with UV intensity of illumination 600mJ, carried out 1 second.
In comparative example 6, the heating condition based on heating press head is made as identical with embodiment 1.In addition, ultraviolet ray is irradiated and is divided into 2 grades and carries out between 3 seconds, in the first estate, with UV intensity of illumination 200mJ, carried out 1 second, in the second grade, with UV intensity of illumination 350mJ, carried out 2 seconds.
In comparative example 7, the heating condition based on heating press head is made as identical with embodiment 1.In addition, ultraviolet ray is irradiated and is divided into 2 grades and carries out between 3 seconds, in the first estate, with UV intensity of illumination 150mJ, carried out 1 second, in the second grade, with UV intensity of illumination 375mJ, carried out 2 seconds.
Each connector sample to above embodiment and comparative example, the minimizing that contains the epoxide ring in layer by measuring electroconductive particle, has measured the reactivity (%) that electroconductive particle contains layer.In addition, to each connector sample, use digital multimeter to determine the contact resistance while having flow through electric current 2mA by 4 terminal methods.In addition, to each connector sample, use contact pin type surface roughness meter (SE-3H: the little slope institute system of Co., Ltd.), from evaluating the ITO coating lower glass surface scanning of base material, determine the amount of bow (μ m) of evaluating with the glass substrate face of the ITO coating glass after the connection of IC.Measurement result is illustrated in table 1, table 2.
[table 1]
Figure 2012800276383100002DEST_PATH_IMAGE001
[table 2]
Figure 30453DEST_PATH_IMAGE002
As shown in table 1, table 2, reactivity except comparative example 2, becomes more than 95% in whole connector samples.This is based in embodiment 1～12, comparative example 3～7, with reactivity, become that more than 90% mode has been set hot pressurized conditions (80 ℃～150 ℃, 60MPa, 4 seconds), ultraviolet illuminate condition (900mJ, 3 seconds or 4 seconds) and the result that obtains, in comparative example 1, only with heat pressurization, make reactivity become more than 90% mode and set hot pressurized conditions (170 ℃, 60MPa, 4 seconds).
On the other hand, in comparative example 2, because be with the identical hot pressurized conditions of the embodiment 1～8 with ultraviolet ray being irradiated and be used as prerequisite setting, and do not carry out ultraviolet ray irradiation, so reactivity step-down is 41%.For this reason, in comparative example 2, initial stage conduction resistance value uprises the Ω into 1.8(), in the conduction resistance value after high temperature and humidity test, surpassed 100(Ω).
When embodiment 1～12 is compared with comparative example 1, any electroconductive particle contains layer more than 91% reactivity is shown, and initial stage conduction resistance value is lower than 0.2(Ω), the conduction resistance value after high temperature and humidity test is lower than 9.6(Ω) below.On the other hand, in embodiment 1～12, by also the hot pressed temperature based on heating press head being suppressed with ultraviolet irradiation, be low 80 ℃～150 ℃, the bending of glass substrate can be suppressed to 12.4(μ m) below.In comparative example 1, owing to and with ultraviolet ray not irradiating and high reactivity (%) in order to show that electroconductive particle contains layer, the hot pressed temperature that heats press head is set as high 170 ℃, so the bending of glass substrate becomes large 16.2(μ m).
When embodiment 1～12 is compared with comparative example 3, in comparative example 3, do not carry out to grade formula ultraviolet ray and irradiate, run through full irradiation time (3 seconds) and carried out ultraviolet irradiation with high intensity of illumination (300mJ/sec).
In such comparative example 3, the conduction resistance value after high temperature and humidity test rises to 20.2(Ω), connection reliability is deteriorated.On the other hand, embodiment 1～12, due to grade formula make the mode that UV intensity of illumination rises carry out ultraviolet irradiation, so the conduction resistance value after high temperature and humidity test is also 9.6(Ω) below.Thus, the known deteriorated solidfied material of thermal endurance that becomes in comparative example 3.Think that this is because the initial stage of irradiating from ultraviolet ray irradiates with strong UV intensity of illumination, so just become the reaction starting point of the adhesive resin deteriorated solidfied material of the short thermal endurance of too much molecular link that becomes.
When embodiment 1～12 is compared with comparative example 4～comparative example 7, in comparative example 4～comparative example 7, because the initial stage of irradiating from ultraviolet ray irradiates with strong UV intensity of illumination (200mJ/sec, 150mJ/sec), so become the deteriorated solidfied material of the short thermal endurance of molecular link, conduction resistance value after high temperature and humidity test rises to 13.5(Ω), it is deteriorated that known and embodiment 1～12 compare connection reliability.
On the other hand, embodiment 1～12, the conduction resistance value after high temperature and humidity test also can be suppressed to 9.6(Ω) below.This be because, because the initial stage of irradiating in ultraviolet ray irradiates with the UV intensity of illumination lower than 150mJ/sec, so just become the solidfied material that the outstanding electroconductive particle of thermal endurance contains layer.
Hence one can see that, be preferably, UV intensity of illumination in the initial grade that UV irradiates, under the ultraviolet illuminate condition of regulation (be in the present embodiment 900mJ, 3 seconds or 4 seconds), is approximately less than 150mJ/sec with the 17%(that is approximately less than of total exposure (900mJ)) intensity of illumination irradiate.
In addition we know, be preferably, the irradiation time of the UV intensity of illumination in the initial grade of irradiating based on UV, under the ultraviolet illuminate condition of regulation (be in the present embodiment 900mJ, 3 seconds or 4 seconds), is made as approximately 20～40% left and right (approximately 1 second～2 seconds) of total irradiation time (3 seconds or 4 seconds).
About the heating condition based on heating press head, when comparing with embodiment 8～embodiment 12, in embodiment 9, because heating-up temperature is relatively to represent temperature (120 ℃) low-40 ℃ of the lowest melt viscosity of adhesive resin, so compare with other embodiment, due to the mobility variation of resin, can not be from getting rid of fully adhesive resin between terminal, so the conduction resistance value after high temperature and humidity test becomes higher 9.6(Ω).
In addition, from embodiment 11, embodiment 12, when heating-up temperature represents that the temperature (120 ℃) of the lowest melt viscosity of adhesive resin is set highly relatively, compare with other embodiment, it is large that the bending of substrate becomes.
As from the foregoing, as the heating condition based on heating press head, although can use in the scope (80 ℃～150 ℃) of-40 ℃～+ 30 ℃ of temperature (120 ℃) that relatively represents the lowest melt viscosity of adhesive resin, but, be preferably, near the scope (90 ℃～120 ℃) till-30 ℃ of left and right of temperature (120 ℃) of lowest melt viscosity that relatively represent adhesive resin is used.
The explanation of Reference numeral
1 anisotropic conducting film
2 stripping films
3 electroconductive particles contain layer
4 electroconductive particles
10 display panels
11 transparency carriers
12 transparency carriers
13 sealing devices
14 liquid crystal
15 Display panel portions
16 transparency electrodes
17 transparency electrodes
17a portion of terminal
18 electronic units
20 COG installation portions
21 flexible base, boards
22 FOG installation portions
23 anisotropic conducting films
24 alignment films
25 Polarizers
26 Polarizers
30 heating press heads
31 ultraviolet radiation devices.

Claims (9)

1. a method of attachment, has:
By linking objective thing be connected object, via the adhesive of light-cured type, fit,
And by above-mentioned adhesive is irradiated to light, above-mentioned adhesive is solidified, above-mentioned linking objective thing is connected to the operation that object is connected with above-mentioned,
The intensity of illumination that makes above-mentioned light continuously or grade rise.
2. according to the method for attachment described in claim 1, wherein,
By heating press head, above-mentioned linking objective thing is carried out to heat pressurization with the temperature of regulation and the pressure of regulation,
The temperature of afore mentioned rules is in 40 ℃ with the difference of the temperature of the lowest melt viscosity of the above-mentioned adhesive of expression.
3. according to the method for attachment described in claim 2, wherein,
After the heat pressurization having started based on above-mentioned heating press head, irradiate above-mentioned light.
4. according to the method for attachment described in any one of claim 1～3, wherein,
The irradiation of above-mentioned light is undertaken by 3 grades,
In initial grade, use above-mentioned light total exposure be less than 17% exposure.
5. according to the method for attachment described in claim 4, wherein,
Initial grade is 20～40% irradiation time of total irradiation time of above-mentioned light.
6. according to the method for attachment described in any one of claim 1～3, wherein,
The irradiation of above-mentioned light is undertaken by many grades,
(exposure of final grade)/(exposure of the first estate) is made as to 4～10.
7. according to the method for attachment described in any one of claim 1～6, wherein,
Above-mentioned adhesive contains electroconductive particle, and is the anisotropic-electroconductive adhesive being electrically connected to being each other arranged at respectively above-mentioned linking objective thing and the above-mentioned electrode that is connected object,
Above-mentioned only ultraviolet ray.
8. a manufacture method for connector, has:
By linking objective thing be connected object, via the adhesive of light-cured type, fit,
And by above-mentioned adhesive is irradiated to light, above-mentioned adhesive is solidified, above-mentioned linking objective thing is connected to the operation that object is connected with above-mentioned,
The intensity of illumination that makes above-mentioned light continuously or grade rise.
9. a connector, has:
By linking objective thing be connected object, via the adhesive of light-cured type, fit,
And by above-mentioned adhesive is irradiated to light, above-mentioned adhesive is solidified, above-mentioned linking objective thing is connected to the operation that object is connected with above-mentioned,
The intensity of illumination that makes above-mentioned light continuously or grade rise and be connected.
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