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CN103562632A - 具有led作为发光器件并且具有由玻璃或塑料制成的灯罩的led灯 - Google Patents

具有led作为发光器件并且具有由玻璃或塑料制成的灯罩的led灯 Download PDF

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CN103562632A
CN103562632A CN201280017157.4A CN201280017157A CN103562632A CN 103562632 A CN103562632 A CN 103562632A CN 201280017157 A CN201280017157 A CN 201280017157A CN 103562632 A CN103562632 A CN 103562632A
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carrier element
pedestal
led
lamp
carrier
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A·多恩
R·莱奈斯
A·蒂姆
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Ceramtec GmbH
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    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/86—Ceramics or glass
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    • F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
    • F21V3/0615—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass the material diffusing light, e.g. translucent glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
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    • F21V3/12—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings the coatings comprising photoluminescent substances
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    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
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    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
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    • F21V29/89—Metals
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    • F21Y2105/00—Planar light sources
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    • F21Y2107/20—Light sources with three-dimensionally disposed light-generating elements on convex supports or substrates, e.g. on the outer surface of spheres
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Abstract

本发明涉及一种LED灯(10)，包括：至少一个LED(3)作为发光器件；陶瓷基座(1)和布置在基座(1)上的陶瓷载体主体(2)，所述载体主体具有用于容纳LED(3)的载体面(2a)；和固定在载体主体(2)上并且套在载体面(2a)上方的透光灯罩(5)；其中将形成电路板的烧结金属化区布置在载体面(2a)上，用于焊接LED(3)并且必要时用于施加所属的电路(7)。为了能够利用简单的装置影响和引导LED的发射光，根据本发明建议，灯罩(5)被构造成圆顶、穹顶或者顶罩，并且由玻璃或者塑料制成。

Description

具有LED作为发光器件并且具有由玻璃或塑料制成的灯罩的LED灯
本发明涉及一种根据权利要求1的前序部分所述的LDE灯。
在未在先公开的DE102010047030A1中描述了一种具有至少一个LED作为发光器件的LED灯。所述灯包括陶瓷基座和布置在基座上的陶瓷载体主体，所述载体主体具有用于容纳LED的载体面。此外将形成电路板的烧结金属化区布置在载体面上。金属化区用于焊上具有必要时所属电路的LED。通过将金属化区烧结，确保从LED到载体主体的陶瓷中的极好的散热。由透光灯罩盖住载体主体的载体面，在所述载体面上布置LED。
本发明所基于的任务在于，如此改进根据权利要求1的前序部分所述的LED灯，使得能够利用简单的装置影响和引导LED的发射光。
按照本发明通过以下方式来解决该任务，即灯罩被构造成圆顶、穹顶或者顶罩，并且由玻璃或者塑料制成。这种圆顶、穹顶或者顶罩能够利用简单的装置引导和影响由LED产生的光。
在本发明的—种实施方式中，将邻接载体主体的灯罩区域构造成圆柱形的，并且该区域整体地过渡为球形罩。由此使得球形罩距离LED略微远一些，从而使得焦点向外移动。
灯罩的内面优选地配备有改变LED发射光颜色的光活性层，由此能够出现每种所期望的颜色。
在—种实施方式中，将载体主体的载体面构造成凸状或者凹状的，由此发射光被散射或者集束。
在—种实施方式中，基座和载体主体整体地来构造，由此加强从LED经由金属化区到载体主体和基座的陶瓷中的热量传递。
在另一种实施方式中，基座和载体主体以两部分的方式构造，其中载体主体由与基座的陶瓷相比具有相同或者更好的导热的陶瓷组成，并且载体主体以导热的方式与基座相连接。载体主体的陶瓷因此可以不同于基座的陶瓷地被选出。通过载体主体与基座的导热连接，要排出的热量到达基座中。基座可以在其外面上具有散热片。
为了改善排热，载体主体可以由导热性高的氮化铝AlN构成。
基座优选地由氧化铝或者氮化铝构成。在一种较简单的实施方式中，载体主体和基座由氧化铝构成。
电连接线优选地穿过基座中的空腔被引导直至载体主体，并且在那里与形成电路板的烧结金属化区电连接或者直接与LED电连接。如此受保护地在基座中布置连接线。
可以将诸如E27的灯座或者诸如GU10的插接器布置在基座的下端面处。这使安装变得容易。
以下根据四个图对本发明进行进一步阐述。
图1所示为根据本发明的LED灯10的一种实施方式。灯10由单件的或整体的陶瓷基座载体6构成，该陶瓷基座载体同时是灯座或基座1以及包括所需电气/电子电路7的LED3的载体主体2。载体主体2的表面形成载体面2a，在该载体面上布置LED。陶瓷基座载体6(例如由氧化铝或者氮化铝构成)可以具有传统灯座9(参见图3白炽灯泡基座)或诸如E27的灯座，或者也可以具有诸如GU10的插接灯座或插接器4(参见图2或4)。从这里将电连接线8向上引向LED3。基座载体6也可以以两部分的方式构造，具有基座1和布置在该基座上的具有载体面2a的载体主体2，在该载体面上布置LED3和必要时电路7。
在图1所示的本发明LED灯10的实施方式中，其中灯体由整体的由陶瓷制成的基座载体6构成，载体主体2的载体面2a被构造成平坦的或平整的，其中在所述载体面上布置LED3和电路7。
单件的陶瓷基座载体6也可以被构造为空心的。在需要时，可以将用于任意LED3的驱动器安置在该空腔中。在陶瓷基座载体6的外侧处而或者仅仅在基座1的外侧上可以布置散热片。
灯罩5(这里是玻璃圆顶或玻璃穹顶或者玻璃顶罩)被套在具有其载体面2a的载体主体2上方，并且通过优选焊接或者粘接被固定。也将载体主体2描述成陶瓷LED平台。该灯罩5或玻璃穹顶在—侧保护LED3，可以引导光(例如扩张光锥)，并且也可在需要时通过所施加的光活性材料或层在颜色方面改变光，并且从而产生更令人愉快的光色调(发光管的原理)。
灯罩5的邻接载体主体2的区域5c优选地如图1-4中所示地被构造为圆柱形，并且该区域5c整体地过渡为球形罩5a。
灯罩5的内面5b优选地配备有改变LED3的发射光颜色的光活性层。
本发明的一个重要特征是，将基座载体2构造为电路板。这可以通过以下方式来实现，即将烧结金属化区施加在载体主体2的载体面2a上。为此参阅WO2007107601A2，这在其中得以描述。可以将LED3和电路7直接焊接到这些金属化区上。优点此外在于，由于高导热性，将由LED3产生的热量直接导入到载体主体2的陶瓷中。
图2和图3所示为本发明的—种替代实施方式，与根据图1的实施方式的区别在于，载体主体2的载体面2a被构造为凸状的(图2)或者凹状的(图3)。由此将光散射或者集束地发射。图2示出插接器4GU10，并且图3示出诸如E27的灯座9。此外，根据图2和3的实施方式均与图1的实施方式相同。
可以将陶瓷基座载体1的上终端(Abschluss)、也就是用于LED3和电路7的载体主体2的载体面2a构造为用于LED3(一个或多个)的平整的(图1)或者弯曲的(凸状的，图2)或者凹状的，图3)、优选外部圆形的载体主体2，在这里可以将所述LED3焊接到诸如Ag或者AgPt的常见厚膜金属化部上。除此之外，以厚膜技术印刷的或者作为SMT电阻被焊接的串联电阻也还有位置。也可以将具有用于容纳LED3和电路7的其载体面2a的载体主体2构造成整体的盘形构件(参见图4)，其中将所述构件导热地与基座1相连接。于是该载体主体2优选地是载体盘，并且于是可以由例如比较昂贵的陶瓷材料诸如AlN制造，以便更好地导热，而基座1可以由诸如Al2O3的便宜的陶瓷构成。在这种情况下，载体主体2的热导性于是大于基座1的热导性。在图4中作为示例示出插接器4GU10。
也可以在合适的印制导线结构(载体面2a上的烧结金属化部)上将确定的LED3直接连接到220-230V交流家用电网。所述确定的LED3为此不再需要驱动器，两个振幅(+/-)使二极管或者LED3发光。当然也可以装入于是具有驱动器作为电路的其它LED3。
如已经根据图1所述的那样，灯罩5或者玻璃圆顶(玻璃穹顶)被套在陶瓷LED平台或者载体主体2上方，并且通过焊接或者粘接被固定在载体主体上。该灯罩5在一侧保护LED3，可以引导光线(例如扩张光锥)，并且也可在需要时通过所施加的光活性材料或层在颜色方面改变光，产生更令人愉快的光色调(发光管的原理)。
具有其载体面2a和要么作为整体的基座载体6(图1、2、3)要么作为单独的构件(图4)的基座1的载体主体2原则上是特殊的陶瓷冷却体。在载体面2a上通过烧结金属化部实现电路板，该电路板是LED3和电路7的载体。由于选择陶瓷，可以实现极高的导热性，使得根据本发明的灯一方面简单地制造，并且另一方面具有长的寿命，因为由LED产生的热量被排出。
在—种用于本发明灯的所有变型方案的替代实施方式中，灯罩5可以由特殊的透光塑料构成，而不是由玻璃制成，所述透光塑料例如无需转换层地滤除诸如紫外或者蓝色的光颜色，而要忍受较少的光输出。利用通常更好地可穿透的和被涂层的玻璃，能在光总输出类似的情况下转换不希望的光颜色。
在具有单独的载体主体2和单独的基座1的实施方式中，两者均由陶瓷构成，也可以将基座1构造成空心的。在需要时，可以将用于任意LED3的驱动器安置在空腔中。可以将散热片布置在基座1的外侧上。同样也可以将整体的或单件的基座载体6构造成空心的，以便在需要时安置用于任意LED3的驱动器。

Claims (10)

1.LED灯(10)，包括：至少一个LED(3)作为发光器件；陶瓷基座(1)和布置在基座(1)上的陶瓷载体主体(2)，所述载体主体具有用于容纳LED(3)的载体面(2a)；和固定在载体主体(2)上并且套在载体面(2a)上方的透光灯罩(5)；其中将形成电路板的烧结金属化区布置在载体面(2a)上，用于焊接LED(3)并且必要时可用于施加所属的电路(7)，其特征在于，灯罩(5)被构造成圆顶、穹顶或者项罩，并且由玻璃或者塑料制成。
2.根据权利要求1所述的灯，其特征在于，灯罩(5)的邻接载体主体(2)的区域(5c)被构造为圆柱形的，并且该区域整体过渡为球形罩(5a)。
3.根据权利要求1或2所述的灯，其特征在于，灯罩(5)的内面(5b)配备有改变LED(3)的发射光颜色的光活性层。
4.根据权利要求1至3中任一项所述的灯，其特征在于，载体主体(2)的载体面(2a)被构造为凸状或者凹状的。
5.根据权利要求1至4中任一项所述的灯，其特征在于，整体地构造基座(1)和载体主体(2)。
6.根据权利要求1至4中任一项所述的灯，其特征在于，基座(1)和载体主体(2)以两部分的方式来构造，其中载体主体(2)由与基座(1)的陶瓷相比具有相同或者更好的导热的陶瓷制成，并且载体主体(2)与基座(1)以导热的方式相连接。
7.根据权利要求1至6中任一项所述的灯，其特征在于，载体主体(2)由导热性高的氮化铝AlN构成。
8.根据权利要求1至7中任一项所述的灯，其特征在于，基座(1)由氧化铝或者氮化铝构成。
9.根据权利要求1至8中任一项所述的灯，其特征在于，电连接线(8)穿过基座(1)中的空腔被引导直至载体主体(2)，并且在那里与形成电路板的烧结金属化区电连接或者直接与LED(3)电连接。
10.根据权利要求1至9中任一项所述的灯，其特征在于，将诸如E27的灯座(9)或者诸如GU10的插接器(4)布置在基座(1)的下端面处。
CN201280017157.4A 2011-04-04 2012-03-30 具有led作为发光器件并且具有由玻璃或塑料制成的灯罩的led灯 Pending CN103562632A (zh)

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