CN103533809B - The radiator of a kind of heat sink material and making thereof - Google Patents
The radiator of a kind of heat sink material and making thereof Download PDFInfo
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- CN103533809B CN103533809B CN201310450195.5A CN201310450195A CN103533809B CN 103533809 B CN103533809 B CN 103533809B CN 201310450195 A CN201310450195 A CN 201310450195A CN 103533809 B CN103533809 B CN 103533809B
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Abstract
The invention provides a kind of heat sink material, comprises following raw material and obtains through being mixed with: Graphene: 70-99 part; Graphite fibre: 5-25 part; Adhesive: 2-3 part; Above-mentioned number is parts by weight, and above each raw material weight number sum is 100 parts.The radiator made by the heat sink material in the present invention, be provided with multiple groove on the surface of graphene fiber brick and form radiator air duct, the column corresponding with groove is fin.Overcome the coarse shortcoming with heat-delivery surface loose contact of metal material surface, take full advantage of the feature that the plane thermal conductivity of Graphene is high, and lightweight, thermal resistance is little, surface is carried out smooth processing and is easier to, hardness is strong.
Description
Technical field
The invention relates to a kind of electronic heat sink, the radiator of particularly a kind of graphene radiation material and making thereof.
Background technology
Along with high-tech flourish, the volume of electronic component is tending towards microminiaturization, and closeness in unit are is also more and more high, its usefulness can not strengthen, under these factors, the gross calorific power of electronic component then almost raises year by year, if there is no the heat that good radiating mode produces to get rid of electron institute, these too high temperature will cause electronic component produce electronics free with thermal stress etc. phenomenon, overall stability is caused to reduce, and shorten the life-span of electronic component itself, therefore these heats how are got rid of to avoid the overheated of electronic component, always be the problem that can not be ignored.
But along with semiconductor and Electronic Packaging are to more high power and more highdensity trend development, it is problem faced by developer needs to continue that the row of heat falls apart.The high density energy that current electronic component is sent at work brings amount of heat, current conventional radiating mode is the basic material using copper as thermal diffusion, further by heat pipe buried foundation material, to accelerate the speed of thermal diffusion, but this kind of mode too increases cost, along with progress and the improvement of electronic component, closeness in unit are is also more and more high, make to allow the speed of thermal diffusion also accelerate thereupon, and because of copper, the conductive coefficient of aluminium is about 400W/mk and 200W/mk, on the electronic component that caloric value constantly raises, can not meet the demands gradually, and the density of copper and aluminium is quite high, so when electronic component and copper, after combination of radiating device made by aluminium, the weight of heat abstractor often destroys the structure of electronic component, and then cause the life-span tip of electronic component or damage.
Therefore, adopt heat conduction efficiency higher and be easy to process material be present stage problem demanding prompt solution as heat sink material.
Summary of the invention
The problem that the invention will solve is to provide the radiator of a kind of heat sink material and making thereof, overcome the coarse shortcoming with heat-delivery surface loose contact of metal material surface, take full advantage of the feature that the plane thermal conductivity of Graphene is high, and lightweight, thermal resistance is little, surface is carried out smooth processing and is easier to, hardness is strong.
For solving the problems of the technologies described above, the technical scheme that the invention adopts is: said composition obtains through being mixed with by comprising following raw material: Graphene: 70-99 part; Graphite fibre: 5-25 part; Adhesive: 2-3 part; Above-mentioned number is parts by weight, and above each raw material weight number sum is 100 parts.
Further, comprise following raw material and obtain through being mixed with: Graphene: 73-90 part, preferably 80 parts; Graphite fibre: 7-17.5 part; Adhesive: 2.5 parts; Above-mentioned number is parts by weight, and above each raw material weight number sum is 100 parts.
Further, the particle diameter of described Graphene is between 1 μm-15 μm.
Further, described adhesive is epoxy adhesive or acrylic based binders.Preferably epoxy or acrylic based resin.
The present invention utilizes heat sink material to make the method for radiator, comprises the steps:
1) hot pressed sintering: the Graphene of mixing, graphite fibre and adhesive temperature be 800-2000 DEG C, pressure is 300-700 ㎏/㎝
2condition under hot pressed sintering form graphene fiber brick, the density of described graphene fiber brick is 1.65-2.25g/cm
3;
2) turning: go out multiple tracks groove in the surface turning of graphene fiber brick;
3) encapsulate: use meteorological suspension method under temperature is the condition of 500-1200 DEG C, use the reeded graphene fiber brick of encapsulating material packaging belt, wherein encapsulating material uses the material not affecting graphene fiber brick heat transfer, thermal diffusion, is preferably one or more in Graphene, carbon fiber, carborundum, copper powder, silver powder; And the thickness of encapsulating film is 1 μm-10 μm.
Further, the encapsulating material in step 3) is one or more in Graphene, carbon fiber and carborundum.
The present invention adopts heat sink material to tie up the radiator made, and be provided with multiple groove on the surface of graphene fiber brick and form radiator air duct, the column corresponding with groove is fin.
Further, the longitudinal cross-section of described fin can be rectangle, trapezoidal, triangle.
The radiator that heat sink material of the present invention makes can be applied in any portable, portable, electronic equipment, cloud computing server and high power heating electric subset.
Radiator function is that the heat conduction assembled in electronic device is carried out heat exchange to larger heat conductor by huge area of dissipation and air.Radiating element is generally divided into two parts, i.e. the base of radiator and fin, and the base of radiator contacts with electronic device and assembles the place of heat, and fin is then the terminal of heat conduction, and heat loss is in air the most at last.Foot of radiator needs at short notice can the heat of absorption electronic device as much as possible release, namely moment heat absorption capacity, the material only possessing high heat-conduction coefficient could be competent at.Next is that radiator body should possess enough heat storage capacity, namely larger thermal capacity, and what usually bear this task is fin.Therefore, the performance of radiator is not only relevant to the structure of radiator, and be more decided by that the material of radiator is selected, radiator material refers to the concrete material that radiator body uses.
The advantage that the invention has and good effect are: the present invention adopts Graphene as the main material of radiator, are because the conductive coefficient of Graphene can up to 5300W/mK.It is 1.65-2.25g/cm that raw graphite alkene and graphite fibre are formed density by hot pressed sintering
3graphene fiber brick.Fin can be lathed the various shape such as column or single-grain-shaped by the requirement according to client, and the space between fin is radiator air duct, realizes the heat radiation of radiator transverse direction and longitudinal both direction, and radiating efficiency is 2.5-3 times of existing radiator.Do not powder away after adopting one or more the package cooling devices in Graphene, carbon fiber, carborundum, copper powder, silver powder.Electronic component focus by with foot of radiator plane contact, utilize the directivity of the heat conduction of radiator own to be transmitted on radiating fin by focus rapidly and dispel the heat, the conductive coefficient on the best heat conduction direction of radiator can reach 1200-1500W/mK.Radiator in use the present invention and common aluminum based heatsink give the chip cooling of 3W respectively, are testing, are utilizing the temperature of the chip of radiator of the present invention to be 58-60 DEG C, utilize the temperature of the chip of aluminum based heatsink to be 85-90 DEG C after the identical time.
Accompanying drawing explanation
Fig. 1 is the structural representation of radiator in the present invention;
Fig. 2 be in the present invention radiator at the schematic diagram of the heat generating core on-chip testing of invariable power 3W.
In figure:
1. air duct 2. fin 3. radiator temperature 4. chip temperature to be measured
Embodiment
The present invention will be further described with the following Examples.
Embodiment 1, step is as follows:
The Graphene of 73 parts, the graphite fibre of 25 parts and the adhesive of 2 parts being mixed, is 1000 DEG C in temperature, and pressure is 400 ㎏/㎝
2condition under hot pressed sintering formed density be 1.76g/cm
3graphene fiber brick.Then multiple tracks rectangular recess is gone out in the surperficial turning of the graphene fiber brick made.Finally, use the mixture of Graphene and carbon fiber when the temperature of 600 DEG C, adopt meteorological suspension method to encapsulate the reeded graphene fiber brick of car and make radiator, the thickness of encapsulating film is 3 μm.The base of radiator is smooth, and fin is cylindric, and the space between fin is radiator air duct.
Embodiment 2, step is as follows:
The Graphene of 80 parts, the graphite fibre of 17.5 parts and the adhesive of 2.5 parts being mixed, is 1450 DEG C in temperature, and pressure is 500 ㎏/㎝
2condition under hot pressed sintering formed density be 1.96g/cm
3graphene fiber brick.Then multiple tracks rectangular recess is gone out in the surperficial turning of the graphene fiber brick made.Finally, use the mixture of Graphene and carbon fiber when the temperature of 800 DEG C, adopt meteorological suspension method to encapsulate the reeded graphene fiber brick of car and make radiator, the thickness of encapsulating film is 6 μm.The base of radiator is smooth, and fin is cylindric, and the space between fin is radiator air duct.
Embodiment 3, step is as follows:
The Graphene of 90 parts, the graphite fibre of 7 parts and the adhesive of 3 parts being mixed, is 1900 DEG C in temperature, and pressure is 650 ㎏/㎝
2condition under hot pressed sintering formed density be 2.18g/cm
3graphene fiber brick.Then multiple tracks rectangular recess is gone out in the surperficial turning of the graphene fiber brick made.Finally, use the mixture of Graphene and carbon fiber when the temperature of 1000 DEG C, adopt meteorological suspension method to encapsulate the reeded graphene fiber brick of car and make radiator, the thickness of encapsulating film is 9 μm.The base of radiator is smooth, and fin is cylindric, and the space between fin is radiator air duct.
Under enclosed environment, in the present invention, the deck watch of the temperature of radiator and the temperature of 3W chip is as follows:
The deck watch of the temperature of radiator temperature and 3W chip under table 1 enclosed environment.
Claims (7)
1. a heat sink material, is characterized in that: comprise following raw material and obtain through being mixed with:
Graphene: 73-90 part;
Graphite fibre: 7-25 part;
Adhesive: 2-3 part;
Above-mentioned number is parts by weight, and above each raw material weight number sum is 100 parts;
The particle diameter of described Graphene is between 1 μm-15 μm.
2. heat sink material according to claim 1, is characterized in that: described adhesive is epoxy adhesive or acrylic based binders.
3. adopt the heat sink material according to any one of claim 1-2 to make the method for radiator, it is characterized in that: comprise the steps:
1) hot pressed sintering: the Graphene of mixing, graphite fibre and adhesive temperature be 800-2000 DEG C, pressure be the condition of 300-700 ㎏/㎝ 2 under hot pressed sintering form graphene fiber brick;
2) turning: go out multiple tracks groove in the surface turning of graphene fiber brick;
3) encapsulate: use meteorological suspension method under temperature is the condition of 500-1200 DEG C, use the reeded graphene fiber brick of encapsulating material packaging belt, wherein encapsulating material is one or more in Graphene, carbon fiber, carborundum, copper powder, silver powder; And the thickness of encapsulating film is 1 μm-10 μm.
4. heat sink material according to claim 3 makes the method for radiator, it is characterized in that: step 3) in encapsulating material be one or more in Graphene, carbon fiber and carborundum.
5. the radiator adopting the heat sink material according to any one of claim 1-2 to make, is characterized in that: be provided with multiple groove on the surface of graphene fiber brick and form radiator air duct, the column corresponding with groove is fin.
6. the radiator of heat sink material making according to claim 5, is characterized in that: the longitudinal cross-section of described fin can be rectangle, trapezoidal, triangle.
7. the application of the radiator that makes of heat sink material according to claim 5 in any portable, portable, electronic equipment, cloud computing server and high power heating electric subset.
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| CN201310450195.5A CN103533809B (en) | 2013-09-26 | 2013-09-26 | The radiator of a kind of heat sink material and making thereof |
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| CN201310450195.5A CN103533809B (en) | 2013-09-26 | 2013-09-26 | The radiator of a kind of heat sink material and making thereof |
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| CN103533809A CN103533809A (en) | 2014-01-22 |
| CN103533809B true CN103533809B (en) | 2016-03-30 |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109863117B (en) * | 2016-10-19 | 2023-04-18 | 创业发展联盟技术有限公司 | Graphite/graphene composite material, heat collector, heat transfer body, heat radiator and heat radiation system |
| CN108800079B (en) * | 2017-04-27 | 2024-04-02 | 国家能源投资集团有限责任公司 | Radiator |
| CN108538891B (en) * | 2018-04-23 | 2020-10-27 | 北京蜃景光电科技有限公司 | Micro-display device, display system and cooling fin manufacturing method |
| CN108909007B (en) * | 2018-07-03 | 2021-10-01 | 厦门泰启力飞科技有限公司 | Graphene die-casting forming process |
| CN108841362A (en) * | 2018-07-23 | 2018-11-20 | 无锡市铝泰新材料股份有限公司 | Composition metal heat sink material and its manufacturing process |
| TWI745774B (en) * | 2019-11-01 | 2021-11-11 | 宏碁股份有限公司 | Remote heat exchanging module and composite thin-layered heat conduction structure |
| CN112852389A (en) * | 2021-03-23 | 2021-05-28 | 依润特工业智能科技(苏州)有限公司 | High-strength heat conduction material for 5G communication and preparation method thereof |
| CN117896955B (en) * | 2024-01-23 | 2024-08-06 | 广东工业大学 | Laser-induced graphene heat sink and processing method thereof |
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